SSD storage module

Description

FIG. 1 is a front perspective view of the SSD storage module of a first embodiment;

FIG. 2 is a rear perspective view of the SSD storage module of the first embodiment;

FIG. 3 is a front view of the SSD storage module of the first embodiment;

FIG. 4 is a rear view of the SSD storage module of the first embodiment;

FIG. 5 is a left side view of the SSD storage module of the first embodiment;

FIG. 6 is a right side view of the SSD storage module of the first embodiment;

FIG. 7 is a top view of the SSD storage module of the first embodiment;

FIG. 8 is a bottom view of the SSD storage module of the first embodiment;

FIG. 9 is a front perspective view of the SSD storage module of a second embodiment;

FIG. 10 is a rear perspective view of the SSD storage module of the second embodiment;

FIG. 11 is a front view of the SSD storage module of the second embodiment;

FIG. 12 is a rear view of the SSD storage module of the second embodiment;

FIG. 13 is a left side view of the SSD storage module of the second embodiment;

FIG. 14 is a right side view of the SSD storage module of the second embodiment;

FIG. 15 is a top view of the SSD storage module of the second embodiment;

FIG. 16 is a bottom view of the SSD storage module of the second embodiment;

FIG. 17 is a front perspective view of the SSD storage module of a third embodiment;

FIG. 18 is a rear perspective view of the SSD storage module of the third embodiment;

FIG. 19 is a front view of the SSD storage module of the third embodiment;

FIG. 20 is a rear view of the SSD storage module of the third embodiment;

FIG. 21 is a left side view of the SSD storage module of the third embodiment;

FIG. 22 is a right side view of the SSD storage module of the third embodiment;

FIG. 23 is a top view of the SSD storage module of the third embodiment; and,

FIG. 24 is a bottom view of the SSD storage module of the third embodiment.

Claims

CLAIM We claim the ornamental design for an SSD storage module, as shown and described.

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Inventors:	Li; Zhixiong (Shenzhen, CN), Pang; Weiwen (Shenzhen, CN), Li; Xiaoqiang (Shenzhen, CN), Hu; Honghui (Shenzhen, CN), Qin; Jinmou (Shenzhen, CN)
Applicant:	Name City State Country Type SHENZHEN LONGSYS ELECTRONICS CO., LTD. Shenzhen N/A CN
Assignee:	Shenzhen Longsys Electronics Co., Ltd. (Shenzhen, CN)
Appl. No.:	D/571,410
Filed:	July 18, 2016

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Foreign Application Priority Data

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Jan 22, 2016 [CN]			2016 3 0023366
Feb 19, 2016 [CN]			2016 3 0047571

Current U.S. Class:	D14/436
Current International Class:	1402
Field of Search:	;D14/435-438,478-480 ;235/441,443,487,492,493,495 ;361/737,679,752,736,728,796,797,729,730,725-727,679.31,679.32 ;257/678,679,693,E23.064 ;439/946,948,159 ;174/250,260,52.1,52.2 ;710/300-303 ;438/121 ;D13/182,162,184,199

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References Cited [Referenced By]

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Primary Examiner: Lee; Susan Moon
Attorney, Agent or Firm: Calfee, Halter & Griswold LLP