Flexible printed circuit
Yokoo May 31, 2
U.S. patent number D757,666 [Application Number D/522,610] was granted by the patent office on 2016-05-31 for flexible printed circuit. This patent grant is currently assigned to Japan Aviation Electronics Industry, Limited. The grantee listed for this patent is Japan Aviation Electronics Industry, Limited. Invention is credited to Hiroyuki Yokoo.
| United States Patent | D757,666 |
| Yokoo | May 31, 2016 |
Flexible printed circuit
Claims
CLAIM The ornamental design for a flexible printed circuit, as shown.
| Inventors: | Yokoo; Hiroyuki (Tokyo, JP) | ||||||||||
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| Applicant: |
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| Assignee: | Japan Aviation Electronics
Industry, Limited (Tokyo, JP) |
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| Appl. No.: | D/522,610 | ||||||||||
| Filed: | April 1, 2015 |
Foreign Application Priority Data
| Oct 16, 2014 [JP] | 2014-023142 | |||
| Current U.S. Class: | D13/182 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/182,155 ;174/68.1,68.2,68.3,250,253,254,255,256,257,258,260 |
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Attorney, Agent or Firm: Cermak Nakajima & McGowan LLP Nakajima; Tomoko
Description
FIG. 1 is a front elevational view of a flexible printed circuit showing my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a right side elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a front, top perspective view thereof; and,
FIG. 8 is a front, bottom perspective view thereof.
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