IC card type circuit module

Huang , et al. September 26, 2

Patent Grant D529031

U.S. patent number D529,031 [Application Number D/210,201] was granted by the patent office on 2006-09-26 for ic card type circuit module. This patent grant is currently assigned to Siliconware Precision Industries Co., Ltd.. Invention is credited to Lien-Chi Chan, Jui-Yu Chuang, Cheng-Hsu Hsiao, Chien-Ping Huang, Chih-Ming Huang.


United States Patent D529,031
Huang ,   et al. September 26, 2006

IC card type circuit module

Claims

CLAIM The ornamental design for an IC card type circuit module, as shown and described.
Inventors: Huang; Chih-Ming (Taichung, TW), Huang; Chien-Ping (Taichung, TW), Chuang; Jui-Yu (Taichung, TW), Chan; Lien-Chi (Taichung, TW), Hsiao; Cheng-Hsu (Taichung, TW)
Assignee: Siliconware Precision Industries Co., Ltd. (TW)
Appl. No.: D/210,201
Filed: July 27, 2004

Current U.S. Class: D14/436; D13/182
Current International Class: 1402
Field of Search: ;D13/182 ;D14/436 ;257/678,679 ;361/728,737,760

References Cited [Referenced By]

U.S. Patent Documents
D434396 November 2000 Iwasaki
6381143 April 2002 Nakamura
D456814 May 2002 Pentz
6410355 June 2002 Wallace
D460456 July 2002 Shimoda et al.
D492314 June 2004 Huang et al.
6970359 November 2005 Gochnour et al.
2002/0131251 September 2002 Corisis et al.
2003/0184978 October 2003 LoBianco et al.
Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Corless; Peter F. Jensen; Steven M. Edwards Angell Palmer & Dodge, LLP

Description



FIG. 1 is a front elevation view of the IC card type circuit module showing our new design;

FIG. 2 is a left side elevation view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a right side elevation view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a rear elevation view thereof;

FIG. 7 is a top perspective view thereof; and,

FIG. 8 is a bottom perspective view thereof.

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