Chan; Lien-Chi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chan; Lien-Chi.The latest application filed is for "semiconductor package with lead frame as chip carrier and method for fabricating the same".

Company Profile

0.6.4

Chan; Lien-Chi - Taichung TW
Chan; Lien-Chi - Lien-Chi Chan TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package with lead frame as chip carrier and method for fabricating the same Grant 7,339,280 - Chuang , et al. March 4, 2	2008-03-04
IC card type circuit module Grant D529,031 - Huang , et al. September 26, 2	2006-09-26
Heat sink with collapse structure for semiconductor package Grant 6,858,931 - Huang , et al. February 22, 2	2005-02-22
Window-type ball grid array semiconductor package with lead frame as chip carrier and method for fabricating the same Grant 6,847,104 - Huang , et al. January 25, 2	2005-01-25
IC card type circuit module Grant D492,314 - Huang , et al. June 29, 2	2004-06-29
Semiconductor package with lead frame as chip carrier and method for fabricating the same App 20040084758 - Chuang, Jui-Yu ; et al.	2004-05-06
Window-type ball grid array semiconductor package with lead frame as chip carrier and method for fabricating the same App 20040080031 - Huang, Chien Ping ; et al.	2004-04-29
Heat sink with collapse structure and semiconductor package with heat sink App 20030089976 - Huang, Chien-Ping ; et al.	2003-05-15
Heat sink with collapse structure and semiconductor package with heat sink Grant 6,538,321 - Huang , et al. March 25, 2	2003-03-25
Heat sink with collapse structure and semiconductor package with heat sink App 20020135076 - Huang, Chien-Ping ; et al.	2002-09-26

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