IC card type circuit module

Huang , et al. June 29, 2

Patent Grant D492314

U.S. patent number D492,314 [Application Number D/192,300] was granted by the patent office on 2004-06-29 for ic card type circuit module. This patent grant is currently assigned to Siliconware Precision Industries Co., Ltd.. Invention is credited to Lien-Chi Chan, Jui-Yu Chuang, Cheng-Hsu Hsiao, Chien-Ping Huang, Chih-Ming Huang.


United States Patent D492,314
Huang ,   et al. June 29, 2004

IC card type circuit module

Claims

The ornamental design for an IC card type circuit module, as shown and described.
Inventors: Huang; Chih-Ming (Taichung, TW), Huang; Chien-Ping (Taichung, TW), Chuang; Jui-Yu (Taichung, TW), Chan; Lien-Chi (Taichung, TW), Hsiao; Cheng-Hsu (Taichung, TW)
Assignee: Siliconware Precision Industries Co., Ltd. (Taiwan, CN)
Appl. No.: D/192,300
Filed: October 21, 2003

Current U.S. Class: D14/436; D14/437
Current International Class: 1402
Field of Search: ;D14/432-438,478-480 ;361/736,737,686,752 ;257/678,679 ;235/487-495,441,442,443,375 ;283/75,76,901 ;439/135,140,76.1 ;D8/347

References Cited [Referenced By]

U.S. Patent Documents
4532419 July 1985 Takeda
D434396 November 2000 Iwasaki
D453934 February 2002 Wallace et al.
D459355 June 2002 Shimoda et al.
D467586 December 2002 Shimoda et al.
D474473 May 2003 Fischer et al.
Primary Examiner: Chin; Kay H.
Attorney, Agent or Firm: Corless; Peter F. Jensen; Steven M. Edwards & Angell, LLP

Description



FIG. 1 is a front elevation view of an IC card type circuit module showing our new design;

FIG. 2 is a left side elevation view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a right side elevation view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a rear elevation view thereof;

FIG. 7 is a top perspective view thereof; and,

FIG. 8 is a bottom perspective view thereof.

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