Chuang; Jui-Yu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chuang; Jui-Yu.The latest application filed is for "semiconductor package with lead frame as chip carrier and method for fabricating the same".

Company Profile

0.10.6

Chuang; Jui-Yu - Taichung TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package with lead frame as chip carrier and method for fabricating the same Grant 7,339,280 - Chuang , et al. March 4, 2	2008-03-04
IC card type circuit module Grant D529,031 - Huang , et al. September 26, 2	2006-09-26
Heat sink with collapse structure for semiconductor package Grant 6,858,931 - Huang , et al. February 22, 2	2005-02-22
Window-type ball grid array semiconductor package with lead frame as chip carrier and method for fabricating the same Grant 6,847,104 - Huang , et al. January 25, 2	2005-01-25
Semiconductor package having vertically mounted passive devices under a chip and a fabricating method thereof Grant 6,781,222 - Wu , et al. August 24, 2	2004-08-24
IC card type circuit module Grant D492,314 - Huang , et al. June 29, 2	2004-06-29
Semiconductor package with lead frame as chip carrier and method for fabricating the same App 20040084758 - Chuang, Jui-Yu ; et al.	2004-05-06
Window-type ball grid array semiconductor package with lead frame as chip carrier and method for fabricating the same App 20040080031 - Huang, Chien Ping ; et al.	2004-04-29
Method of mounting a passive component over an integrated circuit package substrate Grant 6,673,690 - Chuang , et al. January 6, 2	2004-01-06
Heat sink with collapse structure and semiconductor package with heat sink App 20030089976 - Huang, Chien-Ping ; et al.	2003-05-15
Heat sink with collapse structure and semiconductor package with heat sink Grant 6,538,321 - Huang , et al. March 25, 2	2003-03-25
Semiconductor device package structure Grant 6,483,178 - Chuang November 19, 2	2002-11-19
Semiconductor package with heat dissipating structure Grant 6,472,743 - Huang , et al. October 29, 2	2002-10-29
Heat sink with collapse structure and semiconductor package with heat sink App 20020135076 - Huang, Chien-Ping ; et al.	2002-09-26
Semiconductor Package With Heat Dissipating Structure App 20020113308 - Huang, Chien-Ping ; et al.	2002-08-22
Method of mounting a passive component over an integrated circuit package substrate App 20020098621 - Chuang, Jui Yu ; et al.	2002-07-25

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.