| Patent | Date |
|---|
Speed-command Generating Unit Of Electric Vehicle, And Speed-command Generating Method Used For The Same
App 20220281326 - TSAO; Chun-Chia ; et al. | 2022-09-08 |
Method for fabricating carrier-free semiconductor package
Grant 11,289,409 - Tsai , et al. March 29, 2 | 2022-03-29 |
Electric motor controlling system and vibration suppression method for using the same
Grant 11,228,268 - Tsao , et al. January 18, 2 | 2022-01-18 |
Electric Motor Controlling System And Vibration Suppression Method For Using The Same
App 20210265935 - TSAO; Chun-Chia ; et al. | 2021-08-26 |
System And Method For Compensating Acceleration Of Electrical Motorbike
App 20200307388 - HUANG; Chien-Ping ; et al. | 2020-10-01 |
Method For Fabricating Carrier-free Semiconductor Package
App 20200144167 - Tsai; Yueh-Ying ; et al. | 2020-05-07 |
Carrier-free semiconductor package and fabrication method
Grant 10,566,271 - Tsai , et al. Feb | 2020-02-18 |
Carrier-free Semiconductor Package And Fabrication Method
App 20170200671 - Tsai; Yueh-Ying ; et al. | 2017-07-13 |
Method for fabricating semiconductor package with stator set formed by circuits
Grant 9,679,826 - Huang June 13, 2 | 2017-06-13 |
Method For Fabricating Semiconductor Package With Stator Set Formed By Circuits
App 20160284625 - Huang; Chien-Ping | 2016-09-29 |
Method for fabricating EMI shielding package structure
Grant 9,425,152 - Yao , et al. August 23, 2 | 2016-08-23 |
Cleaning Apparatus For Semiconductor Equipment
App 20160233115 - HUANG; Chien-Ping ; et al. | 2016-08-11 |
Semiconductor package with stator set formed by circuits
Grant 9,390,959 - Huang July 12, 2 | 2016-07-12 |
Heat dissipating device
Grant 9,252,074 - Huang February 2, 2 | 2016-02-02 |
Method for fabricating quad flat non-leaded package structure with electromagnetic interference shielding function
Grant 9,190,387 - Yao , et al. November 17, 2 | 2015-11-17 |
Fabrication method of semiconductor package having electrical connecting structures
Grant 9,177,837 - Lin , et al. November 3, 2 | 2015-11-03 |
Showerhead
Grant 9,126,214 - Huang , et al. September 8, 2 | 2015-09-08 |
Method For Fabricating Emi Shielding Package Structure
App 20150155240 - Yao; Chin-Tsai ; et al. | 2015-06-04 |
Chip scale package with electronic component received in encapsulant, and fabrication method thereof
Grant 9,040,361 - Chang , et al. May 26, 2 | 2015-05-26 |
Semiconductor package structure
Grant 8,981,575 - Lin , et al. March 17, 2 | 2015-03-17 |
Semiconductor package without chip carrier and fabrication method thereof
Grant 8,975,734 - Tsai , et al. March 10, 2 | 2015-03-10 |
EMI shielding package structure and method for fabricating the same
Grant 8,963,298 - Yao , et al. February 24, 2 | 2015-02-24 |
Driver having dead-time compensation function
Grant 8,901,864 - Chi , et al. December 2, 2 | 2014-12-02 |
Package structure
Grant 8,873,244 - Lin , et al. October 28, 2 | 2014-10-28 |
Fabrication Method Of Semiconductor Package Without Chip Carrier
App 20140315351 - Tsai; Yueh-Ying ; et al. | 2014-10-23 |
Method For Fabricating Quad Flat Non-leaded Package Structure With Electromagnetic Interference Shielding Function
App 20140227830 - Yao; Chin-Tsai ; et al. | 2014-08-14 |
Fabrication method of semiconductor package device, and fabrication method of semiconductor package structure
Grant 8,802,507 - Chiang , et al. August 12, 2 | 2014-08-12 |
Semiconductor Package And Method Of Fabricating The Same
App 20140203450 - Huang; Chien-Ping | 2014-07-24 |
Fabrication Method Of Semiconductor Package Having Electrical Connecting Structures
App 20140206146 - Lin; Pang-Chun ; et al. | 2014-07-24 |
Heat Dissipating Device
App 20140203425 - Huang; Chien-Ping | 2014-07-24 |
Quad flat non-leaded package structure with electromagnetic interference shielding function and method for fabricating the same
Grant 8,736,030 - Yao , et al. May 27, 2 | 2014-05-27 |
Semiconductor equipment
Grant 8,719,993 - Huang , et al. May 13, 2 | 2014-05-13 |
Semiconductor package having electrical connecting structures and fabrication method thereof
Grant 8,716,861 - Lin , et al. May 6, 2 | 2014-05-06 |
Package having MEMS element and fabrication method thereof
Grant 8,653,661 - Chan , et al. February 18, 2 | 2014-02-18 |
Semiconductor Equipment
App 20140000655 - HUANG; Chien-Ping ; et al. | 2014-01-02 |
Showerhead
App 20130277459 - HUANG; Chien-Ping ; et al. | 2013-10-24 |
Package structure having micro-electromechanical element
Grant 8,564,115 - Chan , et al. October 22, 2 | 2013-10-22 |
Method for fabricating heat dissipating semiconductor package
Grant 8,546,183 - Huang , et al. October 1, 2 | 2013-10-01 |
Chip scale package and fabrication method thereof
Grant 8,525,348 - Chang , et al. September 3, 2 | 2013-09-03 |
Semiconductor Equipment
App 20130219639 - HUANG; Chien-Ping ; et al. | 2013-08-29 |
Semiconductor Package Structure
App 20130200508 - Lin; Pang-Chun ; et al. | 2013-08-08 |
Method for making a showerhead
Grant 8,484,847 - Huang , et al. July 16, 2 | 2013-07-16 |
Semiconductor Package Having Electrical Connecting Structures And Fabrication Method Thereof
App 20130161802 - Lin; Pang-Chun ; et al. | 2013-06-27 |
Semiconductor equipment
Grant 8,448,288 - Huang , et al. May 28, 2 | 2013-05-28 |
Fabrication method of leadframe-based semiconductor package
Grant 8,420,452 - Pu , et al. April 16, 2 | 2013-04-16 |
Semiconductor package structure
Grant 8,421,199 - Lin , et al. April 16, 2 | 2013-04-16 |
Driver Having Dead-time Compensation Function
App 20130063059 - Chi; Chien-Yu ; et al. | 2013-03-14 |
Fabrication Method Of Semiconductor Package Device, And Fabrication Method Of Semiconductor Package Structure
App 20130059418 - Chiang; Cheng-Chia ; et al. | 2013-03-07 |
Semiconductor package having electrical connecting structures and fabrication method thereof
Grant 8,390,118 - Lin , et al. March 5, 2 | 2013-03-05 |
Light-emitting Diode (led) Package Structure And Packaging Method Thereof
App 20130026516 - Wang; Jih-Fu ; et al. | 2013-01-31 |
Method for fabricating heat dissipation package structure
Grant 8,361,843 - Hung , et al. January 29, 2 | 2013-01-29 |
Package Having Mems Element And Fabrication Method Thereof
App 20120286425 - Chan; Chang-Yueh ; et al. | 2012-11-15 |
Fabrication method of semiconductor package structure
Grant 8,304,268 - Lin , et al. November 6, 2 | 2012-11-06 |
Semiconductor package device, semiconductor package structure, and fabrication methods thereof
Grant 8,304,891 - Chiang , et al. November 6, 2 | 2012-11-06 |
Package Structure Having Micro-electromechanical Element
App 20120241937 - Chan; Chang-Yueh ; et al. | 2012-09-27 |
Fabrication method of semiconductor device having conductive bumps
Grant 8,253,248 - Ke , et al. August 28, 2 | 2012-08-28 |
Semiconductor package with a support structure and fabrication method thereof
Grant 8,241,967 - Huang , et al. August 14, 2 | 2012-08-14 |
Package structure having micro-electromechanical element and fabrication method thereof
Grant 8,198,689 - Chan , et al. June 12, 2 | 2012-06-12 |
Method of fabricating stacked semiconductor structure
Grant 8,183,092 - Huang , et al. May 22, 2 | 2012-05-22 |
Package structure having MEMS element and fabrication method thereof
Grant 8,154,115 - Chan , et al. April 10, 2 | 2012-04-10 |
Chip Scale Package And Method Of Fabricating The Same
App 20120061825 - Chang; Chiang-Cheng ; et al. | 2012-03-15 |
Chip Scale Package And Fabrication Method Thereof
App 20120038044 - Chang; Chiang-Cheng ; et al. | 2012-02-16 |
Chip Scale Package And Fabrication Method Thereof
App 20120032347 - Chang; Chiang-Cheng ; et al. | 2012-02-09 |
Showerhead
App 20120024478 - Huang; Chien-Ping ; et al. | 2012-02-02 |
Chip Scale Package And Fabrication Method Thereof
App 20120013006 - Chang; Chiang-Cheng ; et al. | 2012-01-19 |
Semiconductor Package Without Chip Carrier And Fabrication Method Thereof
App 20120007234 - Tsai; Yueh-Ying ; et al. | 2012-01-12 |
Chip-sized Package And Fabrication Method Thereof
App 20120001328 - Chang; Chiang-Cheng ; et al. | 2012-01-05 |
Built-in module for inverter and having tension control with integrated tension and velocity closed loops
Grant 8,079,539 - Huang , et al. December 20, 2 | 2011-12-20 |
Carrier-free Semiconductor Package And Fabrication Method
App 20110298126 - Tsai; Yueh-Ying ; et al. | 2011-12-08 |
Leadframe-based Semiconductor Package And Fabrication Method Thereof
App 20110300671 - PU; Han-Ping ; et al. | 2011-12-08 |
Method For Fabricating Heat Dissipation Package Structure
App 20110287587 - Hung; Min-Shun ; et al. | 2011-11-24 |
Method For Manufacturing Heat-dissipating Semiconductor Package Structure
App 20110287588 - Tseng; Wen-Tsung ; et al. | 2011-11-24 |
Method for fabricating heat dissipating package structure
Grant 8,062,933 - Huang , et al. November 22, 2 | 2011-11-22 |
Method for fabricating chip scale package structure with metal pads exposed from an encapsulant
Grant 8,058,100 - Pu , et al. November 15, 2 | 2011-11-15 |
Fabrication method of semiconductor device having conductive bumps
Grant 8,026,602 - Ke , et al. September 27, 2 | 2011-09-27 |
Multi-chip Stack Structure Having Through Silicon Via
App 20110227226 - Chiang; Chiang-Cheng ; et al. | 2011-09-22 |
Heat dissipation package structure and method for fabricating the same
Grant 8,013,436 - Hung , et al. September 6, 2 | 2011-09-06 |
Electronic carrier board and package structure thereof
Grant 8,013,443 - Tsai , et al. September 6, 2 | 2011-09-06 |
Semiconductor package with heat dissipating structure
Grant RE42,653 - Huang August 30, 2 | 2011-08-30 |
Heat-dissipating semiconductor package structure and method for manufacturing the same
Grant 8,008,769 - Tseng , et al. August 30, 2 | 2011-08-30 |
Quad Flat Non-leaded Package Structure With Electromagnetic Interference Shielding Function And Method For Fabricating The Same
App 20110198737 - Yao; Chin-Tsai ; et al. | 2011-08-18 |
Semiconductor package fabrication method
Grant 7,993,967 - Jiang , et al. August 9, 2 | 2011-08-09 |
Gate valve
App 20110186761 - HUANG; Chien-Ping ; et al. | 2011-08-04 |
Semiconductor Equipment
App 20110186078 - HUANG; Chien-Ping ; et al. | 2011-08-04 |
Showerhead
App 20110186228 - Huang; Chien-Ping ; et al. | 2011-08-04 |
Built-in Module For Inverter And Having Tension Control With Integrated Tension And Velocity Closed Loops
App 20110180649 - HUANG; Chien-Ping ; et al. | 2011-07-28 |
Semiconductor device has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant
Grant 7,985,618 - Tsai , et al. July 26, 2 | 2011-07-26 |
Emi Shielding Package Structure And Method For Fabricating The Same
App 20110175210 - Yao; Chin-Tsai ; et al. | 2011-07-21 |
Fabrication method of multi-chip stack structure
Grant 7,981,729 - Huang , et al. July 19, 2 | 2011-07-19 |
Fabrication Method Of Semiconductor Package Structure
App 20110159643 - Lin; Pang-Chun ; et al. | 2011-06-30 |
Semiconductor Package Having Electrical Connecting Structures And Fabrication Method Thereof
App 20110156252 - Lin; Pang-Chun ; et al. | 2011-06-30 |
Package Structure Having Micro-electromechanical Element And Fabrication Method Thereof
App 20110156180 - Chan; Chang-Yueh ; et al. | 2011-06-30 |
Semiconductor Package Structure
App 20110156227 - Lin; Pang-Chun ; et al. | 2011-06-30 |
Package Structure
App 20110157851 - Lin; Pang-Chun ; et al. | 2011-06-30 |
Semiconductor Package With A Support Structure And Fabrication Method Thereof
App 20110143498 - Huang; Chien-Ping ; et al. | 2011-06-16 |
Semiconductor Device Has Encapsulant With Chamfer Such That Portion Of Substrate And Chamfer Are Exposed From Encapsulant And Remaining Portion Of Surface Of Substrate Is Covered By Encapsulant
App 20110129966 - Tsai; Yun-Lung ; et al. | 2011-06-02 |
Method for fabricating semiconductor package free of substrate
Grant 7,939,383 - Huang , et al. May 10, 2 | 2011-05-10 |
Package structure fabrication method
Grant 7,934,313 - Lin , et al. May 3, 2 | 2011-05-03 |
Fabrication Method Of Semiconductor Device Having Conductive Bumps
App 20110070728 - Ke; Chun-Chi ; et al. | 2011-03-24 |
Semiconductor package with a support structure and fabrication method thereof
Grant 7,893,547 - Huang , et al. February 22, 2 | 2011-02-22 |
Semiconductor device has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant
Grant 7,884,456 - Tsai , et al. February 8, 2 | 2011-02-08 |
Semiconductor device having conductive bumps, metallic layers, covering layers and fabrication method thereof
Grant 7,863,740 - Ke , et al. January 4, 2 | 2011-01-04 |
Sensor-type semiconductor package and fabrication method thereof
Grant 7,858,446 - Huang , et al. December 28, 2 | 2010-12-28 |
Fabrication Method Of Semiconductor Device Having Conductive Bumps
App 20100323513 - Ke; Chun-Chi ; et al. | 2010-12-23 |
Conductive Bump Structure For Semiconductor Device And Fabrication Method Thereof
App 20100297842 - KE; Chun Chi ; et al. | 2010-11-25 |
Method Of Fabricating Stacked Semiconductor Structure
App 20100267202 - Huang; Chien-Ping ; et al. | 2010-10-21 |
Method for fabricating semiconductor package free of substrate
Grant 7,816,187 - Huang , et al. October 19, 2 | 2010-10-19 |
Fabrication Method Of Multi-chip Stack Structure
App 20100255635 - Huang; Jung-Pin ; et al. | 2010-10-07 |
Semiconductor package substrate
Grant 7,808,110 - Wang , et al. October 5, 2 | 2010-10-05 |
Semiconductor device having conductive bumps and deviated solder pad
Grant 7,804,173 - Ke , et al. September 28, 2 | 2010-09-28 |
Method For Fabricating Chip Scale Package Structure With Metal Pads Exposed From An Encapsulant
App 20100233855 - Pu; Han-Ping ; et al. | 2010-09-16 |
Method for fabricating flip-chip semiconductor package with lead frame as chip carrier
Grant 7,781,264 - Wu , et al. August 24, 2 | 2010-08-24 |
Stacked semiconductor structure and fabrication method thereof
Grant 7,772,685 - Huang , et al. August 10, 2 | 2010-08-10 |
Multi-chip stack structure and fabrication method thereof
Grant 7,768,106 - Huang , et al. August 3, 2 | 2010-08-03 |
Fabrication method of semiconductor package having heat dissipation device
Grant 7,759,170 - Pu , et al. July 20, 2 | 2010-07-20 |
Electronic Carrier Board And Package Structure Thereof
App 20100170709 - Tsai; Fang-Lin ; et al. | 2010-07-08 |
Chip scale package structure with metal pads exposed from an encapsulant
Grant 7,750,467 - Pu , et al. July 6, 2 | 2010-07-06 |
Heat dissipating package structure and method for fabricating the same
Grant 7,745,262 - Huang , et al. June 29, 2 | 2010-06-29 |
Fabrication Method Of Semiconductor Package Having Heat Dissipation Device
App 20100151631 - Pu; Han-Ping ; et al. | 2010-06-17 |
Electronic carrier board and package structure thereof
Grant 7,696,623 - Tsai , et al. April 13, 2 | 2010-04-13 |
Semiconductor package without chip carrier and fabrication method thereof
Grant 7,679,172 - Huang , et al. March 16, 2 | 2010-03-16 |
Semiconductor package on which a semiconductor device can be stacked and fabrication method thereof
Grant 7,679,178 - Pu , et al. March 16, 2 | 2010-03-16 |
Semiconductor Package And Fabrication Method Thereof
App 20100052146 - Jiang; Yih-Jenn ; et al. | 2010-03-04 |
Semiconductor package having heat dissipating device with cooling fluid
Grant 7,671,466 - Pu , et al. March 2, 2 | 2010-03-02 |
Fabrication method of a semiconductor device
Grant 7,666,779 - Ke , et al. February 23, 2 | 2010-02-23 |
Heat Dissipating Package Structure And Method For Fabricating The Same
App 20100041181 - Huang; Chien-Ping ; et al. | 2010-02-18 |
Semiconductor package and fabrication method thereof
Grant 7,638,879 - Jiang , et al. December 29, 2 | 2009-12-29 |
Method for fabricating semiconductor package with build-up layers formed on chip
Grant 7,629,199 - Huang , et al. December 8, 2 | 2009-12-08 |
Semiconductor package device, semiconductor package structure, and fabrication methods thereof
App 20090294959 - Chiang; Cheng-Chia ; et al. | 2009-12-03 |
Heat dissipating package structure and method for fabricating the same
Grant 7,615,862 - Huang , et al. November 10, 2 | 2009-11-10 |
Heat dissipation semiconductor package
Grant 7,608,915 - Liao , et al. October 27, 2 | 2009-10-27 |
Semiconductor device and manufacturing method thereof
App 20090261476 - Huang; Chien-Ping ; et al. | 2009-10-22 |
Semiconductor package and method for fabricating the same
App 20090102063 - Lee; Chun-Yuan ; et al. | 2009-04-23 |
Method for fabricating chip-stacked semiconductor package
Grant 7,521,285 - Huang April 21, 2 | 2009-04-21 |
Semiconductor package and method for fabricating the same
App 20090096115 - Huang; Chien-Ping ; et al. | 2009-04-16 |
Method For Fabricating Heat Dissipating Semiconductor Package
App 20090093089 - Huang; Chien-Ping ; et al. | 2009-04-09 |
Heat dissipating semiconductor package and fabrication method thereof
Grant 7,508,066 - Huang , et al. March 24, 2 | 2009-03-24 |
Sensor semiconductor device and method for fabricating the same
App 20090057799 - Chan; Chang-Yueh ; et al. | 2009-03-05 |
Sensor-type package and method for fabricating the same
App 20090039527 - Chan; Chang-Yueh ; et al. | 2009-02-12 |
Multi-chip stack structure having through silicon via and method for fabrication the same
App 20090032928 - Chiang; Chiang-Cheng ; et al. | 2009-02-05 |
Semiconductor device and method for fabricating the same
App 20090008801 - Lai; Jeng-Yuan ; et al. | 2009-01-08 |
Semiconductor Device Has Encapsulant With Chamfer Such That Portion Of Substrate And Chamfer Are Exposed From Encapsulant And Remaining Portion Of Surface Of Substrate Is Covered By Encapsulant
App 20090008760 - Tsai; Yun-Lung ; et al. | 2009-01-08 |
Method For Fabricating Semiconductor Package Free Of Substrate
App 20090004784 - Huang; Chien-Ping ; et al. | 2009-01-01 |
Semiconductor package and fabrication method thereof
App 20080308951 - Li; Yuan-Chun ; et al. | 2008-12-18 |
Heat dissipation package structure and method for fabricating the same
App 20080308926 - Hung; Min-Shun ; et al. | 2008-12-18 |
Sensor package and method for fabricating the same
App 20080303111 - Chan; Chang-Yueh ; et al. | 2008-12-11 |
Sensor semiconductor device and manufacturing method thereof
App 20080296716 - Chan; Chang-Yueh ; et al. | 2008-12-04 |
Semiconductor Device and Its Fabrication Method
App 20080283971 - Huang; Chien-Ping ; et al. | 2008-11-20 |
Stacked package structure and fabrication method thereof
App 20080283994 - Tsai; Ho-Yi ; et al. | 2008-11-20 |
Multi-chip semiconductor device having leads and method for fabricating the same
App 20080283982 - Liu; Chung-Lun ; et al. | 2008-11-20 |
Heat dissipation semiconductor package
App 20080277777 - Liao; Chun-Ming ; et al. | 2008-11-13 |
Sensor semiconductor device and fabrication method of the sensor semiconductor device
Grant 7,446,307 - Huang , et al. November 4, 2 | 2008-11-04 |
Method for fabricating wafer level semiconductor package with build-up layer
Grant 7,445,957 - Huang , et al. November 4, 2 | 2008-11-04 |
Semiconductor device for use as multimedia memory card, has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant
Grant 7,443,016 - Tsai , et al. October 28, 2 | 2008-10-28 |
Semiconductor Device and Method for Fabricating the Same
App 20080258306 - Chang; Chin-Huang ; et al. | 2008-10-23 |
Heat-dissipating semiconductor package structure and method for manufacturing the same
App 20080258294 - Tseng; Wen-Tsung ; et al. | 2008-10-23 |
Fabricating method of semiconductor package and heat-dissipating structure applicable thereto
App 20080251910 - Chang; Chih-Wei ; et al. | 2008-10-16 |
Stackable semiconductor device and manufacturing method thereof
App 20080251937 - Chang; Chin-Huang ; et al. | 2008-10-16 |
Heat dissipation unit and a semiconductor package that has the heat dissipation unit
App 20080246142 - Lai; Jeng-Yuan ; et al. | 2008-10-09 |
Sensor-type semiconductor device and manufacturing method thereof
App 20080237767 - Chan; Chang-Yueh ; et al. | 2008-10-02 |
Stackable semiconductor device and fabrication method thereof
App 20080230913 - Huang; Chien-Ping ; et al. | 2008-09-25 |
Multi-chip stack structure and fabrication method thereof
App 20080224289 - Huang; Jung-Pin ; et al. | 2008-09-18 |
Leadframe-based semiconductor package and fabrication method thereof
App 20080224283 - Pu; Han-Ping ; et al. | 2008-09-18 |
Semiconductor package free of substrate and fabrication method thereof
Grant 7,423,340 - Huang , et al. September 9, 2 | 2008-09-09 |
Semiconductor device having conductive bumps and fabrication method thereof
App 20080211093 - Ke; Chun-Chi ; et al. | 2008-09-04 |
Method for fabricating semiconductor device and carrier applied therein
App 20080213942 - Hung; Min-Shun ; et al. | 2008-09-04 |
Sensor-type semiconductor package and method for fabricating the same
App 20080203511 - Huang; Chien-Ping ; et al. | 2008-08-28 |
Sensor semiconductor device and manufacturing method thereof
App 20080197438 - Chan; Chang-Yueh ; et al. | 2008-08-21 |
Method for fabricating a photosensitive semiconductor package
Grant 7,410,836 - Huang August 12, 2 | 2008-08-12 |
Sensor semiconductor package and fabrication
App 20080185671 - Huang; Chien-Ping ; et al. | 2008-08-07 |
Semiconductor package substrate
App 20080185726 - Wang; Yu-Po ; et al. | 2008-08-07 |
Semiconductor substrate
App 20080185725 - Lee; Wen Cheng ; et al. | 2008-08-07 |
Fabrication Method Of A Semiconductor Device
App 20080182401 - Ke; Chun-Chi ; et al. | 2008-07-31 |
Semiconductor device having conductive bumps and fabrication method thereof
App 20080169562 - Ke; Chun-Chi ; et al. | 2008-07-17 |
Method For Fabricating A Sensor Semiconductor Device With Sensor Chip
App 20080166831 - Huang; Chien-Ping ; et al. | 2008-07-10 |
Method for fabricating heat-dissipating package and heat-dissipating structure applicable thereto
App 20080157346 - Hung; Min-Shun ; et al. | 2008-07-03 |
Method for fabricating semiconductor package
App 20080160678 - Wang; Yu-Po ; et al. | 2008-07-03 |
Chip scale package structure and method for fabricating the same
App 20080138935 - Pu; Han-Ping ; et al. | 2008-06-12 |
Heat dissipating semiconductor package and fabrication method therefor
App 20080122071 - Tseng; Wen-Tsung ; et al. | 2008-05-29 |
Heat dissipating semiconductor package and fabrication method therefor
App 20080122070 - Tseng; Wen-Tsung ; et al. | 2008-05-29 |
Semiconductor package and fabrication method thereof
App 20080116580 - Jiang; Yih-Jenn ; et al. | 2008-05-22 |
Method for fabricating semiconductor package with heat sink
Grant 7,371,617 - Tsai , et al. May 13, 2 | 2008-05-13 |
Sensor-type semiconductor package and fabrication method thereof
App 20080105942 - Huang; Chien-Ping ; et al. | 2008-05-08 |
Method For Fabricating Semiconductor Package Free Of Substrate
App 20080108182 - Huang; Chien Ping ; et al. | 2008-05-08 |
Sensor semiconductor device with sensor chip
Grant 7,365,364 - Huang , et al. April 29, 2 | 2008-04-29 |
Method for fabricating thermally enhanced semiconductor package
Grant 7,364,944 - Huang , et al. April 29, 2 | 2008-04-29 |
Semiconductor package on which a semiconductor device can be stacked and fabrication method thereof
App 20080088011 - Hu; Han-Ping ; et al. | 2008-04-17 |
Method For Fabricating Heat Dissipating Package Structure
App 20080090336 - Huang; Chien-Ping ; et al. | 2008-04-17 |
Fabrication method of under bump metallurgy structure
Grant 7,358,177 - Ke , et al. April 15, 2 | 2008-04-15 |
Semiconductor device and fabrication method thereof
Grant 7,355,279 - Ke , et al. April 8, 2 | 2008-04-08 |
Method for fabricating semiconductor package free of substrate
Grant 7,354,796 - Huang , et al. April 8, 2 | 2008-04-08 |
Sensor-type package and fabrication method thereof
App 20080079105 - Chang; Tse-Wen ; et al. | 2008-04-03 |
Method for fabricating semiconductor packages
Grant 7,348,211 - Lin , et al. March 25, 2 | 2008-03-25 |
Semiconductor package free of substrate and fabrication method thereof
Grant 7,342,318 - Huang , et al. March 11, 2 | 2008-03-11 |
Semiconductor package with heat dissipating structure
Grant 7,342,304 - Huang March 11, 2 | 2008-03-11 |
Method for measuring average velocity pressure and system thereof
Grant 7,337,675 - Huang March 4, 2 | 2008-03-04 |
Method for fabricating chip-stacked semiconductor package
App 20080032450 - Huang; Chien-Ping | 2008-02-07 |
Heat dissipating semiconductor package and heat dissipating structure thereof
App 20080017977 - Tseng; Wen-Tsung ; et al. | 2008-01-24 |
Heat-dissipating package structure and fabrication method thereof
App 20080006933 - Huang; Chien-Ping ; et al. | 2008-01-10 |
Chip-stacked semiconductor package and method for fabricating the same
Grant 7,315,078 - Huang January 1, 2 | 2008-01-01 |
Heat dissipating structure and method for fabricating the same
App 20070296079 - Huang; Chien-Ping ; et al. | 2007-12-27 |
Method of making semiconductor package with heat spreader
Grant RE39,957 - Huang , et al. December 25, 2 | 2007-12-25 |
Method for fabricating flip-chip semiconductor package with lead frame as chip carrier
App 20070284710 - Wu; Chi-Chuan ; et al. | 2007-12-13 |
Semiconductor package and method for fabricating the same
App 20070278701 - Chang; Cheng-Yi ; et al. | 2007-12-06 |
Semiconductor package, chip carrier structure thereof, and method for fabricating the chip carrier
App 20070273019 - Huang; Chien Ping ; et al. | 2007-11-29 |
Sensor Semiconductor Device
App 20070272994 - Huang; Chien-Ping ; et al. | 2007-11-29 |
Method for fabricating semiconductor package free of substrate
App 20070249101 - Huang; Chien Ping ; et al. | 2007-10-25 |
Semiconductor package, array arranged substrate structure for the semiconductor package and fabrication method of the semiconductor package
App 20070243666 - Huang; Chien-Ping ; et al. | 2007-10-18 |
Flip-chip semiconductor package with lead frame as chip carrier and fabrication method thereof
Grant 7,274,088 - Wu , et al. September 25, 2 | 2007-09-25 |
Method for fabricating sensor semiconductor device
Grant 7,271,024 - Huang , et al. September 18, 2 | 2007-09-18 |
Bump structure of semiconductor package and method for fabricating the same
Grant 7,271,483 - Lin , et al. September 18, 2 | 2007-09-18 |
Semiconductor package free of substrate and fabrication method thereof
Grant 7,271,493 - Huang , et al. September 18, 2 | 2007-09-18 |
Semiconductor package having heat dissipating device and fabrication method of the semiconductor package
App 20070200228 - Pu; Han-Ping ; et al. | 2007-08-30 |
Stacked semiconductor structure and fabrication method thereof
App 20070181990 - Huang; Chien-Ping ; et al. | 2007-08-09 |
Method for fabricating a photosensitive semiconductor package
App 20070178630 - Huang; Chien-Ping | 2007-08-02 |
Semiconductor package structure and fabrication method thereof
App 20070164411 - Huang; Chien-Ping ; et al. | 2007-07-19 |
Semiconductor package structure and fabrication method thereof
App 20070164403 - Huang; Chien-Ping ; et al. | 2007-07-19 |
Semiconductor device and fabrication method thereof
App 20070164386 - Chang; Cheng-Yi ; et al. | 2007-07-19 |
Method for fabricating semiconductor package with build-up layers formed on chip
App 20070158861 - Huang; Chien-Ping ; et al. | 2007-07-12 |
Photosensitive semiconductor package, method for fabricating the same, and lead frame thereof
Grant 7,242,068 - Huang July 10, 2 | 2007-07-10 |
Electronic carrier board and package structure thereof
App 20070145561 - Tsai; Fang-Lin ; et al. | 2007-06-28 |
Electronic carrier board and package structure thereof
App 20070138632 - Tsai; Fang-Lin ; et al. | 2007-06-21 |
Method for fabricating semiconductor packages, and structure and method for positioning semiconductor components
App 20070141761 - Lin; Ying-Ren ; et al. | 2007-06-21 |
Stacked semiconductor packages
Grant 7,208,825 - Pu , et al. April 24, 2 | 2007-04-24 |
Semiconductor package and method for fabricating the same
Grant 7,205,642 - Wang , et al. April 17, 2 | 2007-04-17 |
Semiconductor package with build-up layers formed on chip and fabrication method of the semiconductor package
Grant 7,205,674 - Huang , et al. April 17, 2 | 2007-04-17 |
Semiconductor element with conductive bumps and fabrication method thereof
App 20070075423 - Ke; Chun-Chi ; et al. | 2007-04-05 |
Semiconductor package without bonding wires and fabrication method thereof
Grant 7,199,459 - Pu , et al. April 3, 2 | 2007-04-03 |
Semiconductor package with heat sink
Grant 7,196,414 - Lin , et al. March 27, 2 | 2007-03-27 |
Method of manufacturing quad flat non-leaded semiconductor package
App 20070059863 - Li; Chun-Yuan ; et al. | 2007-03-15 |
Semiconductor Package With A Support Structure And Fabrication Method Thereof
App 20070059865 - Huang; Chien-Ping ; et al. | 2007-03-15 |
Carrier-free semiconductor package with stand-off member and fabrication method thereof
App 20070054438 - Huang; Chien Ping ; et al. | 2007-03-08 |
Method For Fabricating Semiconductor Packages
App 20070054484 - Lin; Ying-Ren ; et al. | 2007-03-08 |
Method for fabricating wafer level semiconductor package with build-up layer
App 20070034998 - Huang; Chien-Ping ; et al. | 2007-02-15 |
Semiconductor package with heat sink
Grant 7,177,155 - Lin , et al. February 13, 2 | 2007-02-13 |
Method for fabricating semiconductor package with heat sink
App 20070029683 - Tsai; Ho-Yi ; et al. | 2007-02-08 |
Semiconductor element with conductive bumps and fabrication method thereof
App 20070023925 - Ke; Chun-Chi ; et al. | 2007-02-01 |
Wafer level semiconductor package with build-up layer and method for fabricating the same
Grant 7,170,152 - Huang , et al. January 30, 2 | 2007-01-30 |
Sensor semiconductor device and fabricating method thereof
App 20070018088 - Huang; Chien Ping ; et al. | 2007-01-25 |
Semiconductor package without chip carrier and fabrication method thereof
App 20070018291 - Huang; Chien-Ping ; et al. | 2007-01-25 |
Image sensor package, optical glass used therein, and processing method of the optical glass
App 20070018309 - Chang; Cheng Yi ; et al. | 2007-01-25 |
Semiconductor package with heat sink and method for fabricating same
Grant 7,164,210 - Tsai , et al. January 16, 2 | 2007-01-16 |
Heat-dissipating semiconductor package and fabrication method thereof
App 20060292741 - Tseng; Wen-Tsung ; et al. | 2006-12-28 |
Ball grid array substrate strip with warpage-preventive linkage structure
Grant 7,148,561 - Huang , et al. December 12, 2 | 2006-12-12 |
Semiconductor Device For Accommodating Large Chips, Fabrication Method Thereof, And Carrier Used In The Semiconductor Device
App 20060273442 - Tsai; Yun-Lung ; et al. | 2006-12-07 |
Semiconductor package and fabrication method thereof
App 20060273452 - Tsai; Ho-Yi ; et al. | 2006-12-07 |
Sensor Semiconductor Device And Method For Fabricating The Same
App 20060270089 - Huang; Chien-Ping ; et al. | 2006-11-30 |
Sensor Semiconductor Device And Method For Fabricating The Same
App 20060267125 - Huang; Chien-Ping ; et al. | 2006-11-30 |
Semiconductor device and fabrication method thereof
App 20060258137 - Ke; Chun-Chi ; et al. | 2006-11-16 |
Fabrication method of under bump metallurgy structure
App 20060252245 - Ke; Chun-Chi ; et al. | 2006-11-09 |
Flip-chip semiconductor device
App 20060249852 - Chiu; Shih-Kuang ; et al. | 2006-11-09 |
Method for fabricating semiconductor package having conductive bumps on chip
Grant 7,132,312 - Huang , et al. November 7, 2 | 2006-11-07 |
Conductive bump structure for semiconductor device and fabrication method thereof
App 20060246706 - Ke; Chun Chi ; et al. | 2006-11-02 |
Method for fabricating semiconductor packages
Grant 7,129,119 - Lin , et al. October 31, 2 | 2006-10-31 |
Monitoring systems and methods thereof
Grant 7,127,377 - Huang , et al. October 24, 2 | 2006-10-24 |
Thermally enhanced semiconductor package and fabrication method thereof
App 20060231944 - Huang; Chien Ping ; et al. | 2006-10-19 |
Chip carrier and method for testing electrical performance of passive component
Grant 7,119,565 - Chen , et al. October 10, 2 | 2006-10-10 |
Sensor module structure and method for fabricating the same
App 20060223216 - Chang; Chin-Huang ; et al. | 2006-10-05 |
IC card type circuit module
Grant D529,031 - Huang , et al. September 26, 2 | 2006-09-26 |
Chip carrier for semiconductor chip
Grant 7,102,239 - Pu , et al. September 5, 2 | 2006-09-05 |
Chip-stacked semiconductor package and method for fabricating the same
App 20060172457 - Huang; Chien-Ping | 2006-08-03 |
Photosensitive semiconductor package and method for fabricating the same
Grant 7,084,474 - Hung , et al. August 1, 2 | 2006-08-01 |
Fabrication method of semiconductor package with heat sink
Grant 7,074,645 - Huang , et al. July 11, 2 | 2006-07-11 |
Semiconductor package and fabrication method of the same
App 20060145362 - Chang; Chin-Huang ; et al. | 2006-07-06 |
Method for fabricating thermally enhanced semiconductor package
App 20060138674 - Huang; Chien-Ping ; et al. | 2006-06-29 |
Heat dissipating semiconductor package and fabrication method thereof
App 20060125088 - Huang; Chien-Ping ; et al. | 2006-06-15 |
Method for measuring average velocity pressure and system thereof
App 20060117858 - Huang; Chien-Ping | 2006-06-08 |
Method for fabricating semiconductor package having conductive bumps on chip
App 20060118944 - Huang; Chien-Ping ; et al. | 2006-06-08 |
Semiconductor package with heat sink
Grant 7,057,276 - Lin , et al. June 6, 2 | 2006-06-06 |
Heat dissipating packages structure and method for fabricating the same
App 20060103014 - Huang; Chien-Ping ; et al. | 2006-05-18 |
Semiconductor device having flip-chip package and method for fabricating the same
App 20060097402 - Pu; Han-Ping ; et al. | 2006-05-11 |
Semiconductor package with heat sink and method for fabricating same
App 20060091527 - Tsai; Ho-Yi ; et al. | 2006-05-04 |
Heat Dissipating Package Structure And Method For Fabricating The Same
App 20060081978 - Huang; Chien-Ping ; et al. | 2006-04-20 |
Thermally enhanced semiconductor package
Grant 7,019,406 - Huang , et al. March 28, 2 | 2006-03-28 |
Bump structure of semiconductor package and method for fabricating the same
App 20060051954 - Lin; Ying-Ren ; et al. | 2006-03-09 |
Lead-frame-based semiconductor package and fabrication method thereof
Grant 7,008,826 - Chen , et al. March 7, 2 | 2006-03-07 |
Semiconductor package with photosensitive chip and fabrication method thereof
Grant 7,005,720 - Huang , et al. February 28, 2 | 2006-02-28 |
Semiconductor package having conductive bumps on chip and method for fabricating the same
Grant 7,002,245 - Huang , et al. February 21, 2 | 2006-02-21 |
Semiconductor package with heat sink
App 20060017145 - Lin; Chang-Fu ; et al. | 2006-01-26 |
Fabrication method of semiconductor package with photosensitive chip
Grant 6,989,296 - Huang , et al. January 24, 2 | 2006-01-24 |
Method for fabricating semiconductor packages
App 20050287713 - Lin, Ying-Ren ; et al. | 2005-12-29 |
Method for fabricating semiconductor packages
App 20050287707 - Lin, Ying-Ren ; et al. | 2005-12-29 |
Semiconductor package with heat dissipating structure
Grant 6,980,438 - Huang , et al. December 27, 2 | 2005-12-27 |
Semiconductor package with heat sink
App 20050280132 - Lin, Chang-Fu ; et al. | 2005-12-22 |
Semiconductor package with enhanced electrical and thermal performance and method for fabricating the same
Grant 6,972,216 - Huang , et al. December 6, 2 | 2005-12-06 |
Semiconductor package with build-up layers formed on chip and fabrication method of the semiconductor package
App 20050258537 - Huang, Chien-Ping ; et al. | 2005-11-24 |
Semiconductor package and method for fabricating the same
App 20050253284 - Wang, Yu-Po ; et al. | 2005-11-17 |
Semiconductor package with build-up structure and method for fabricating the same
App 20050212129 - Huang, Chien-Ping ; et al. | 2005-09-29 |
Monitoring systems and methods thereof
App 20050216229 - Huang, Chien-Ping ; et al. | 2005-09-29 |
Semiconductor package and fabrication method thereof
App 20050205978 - Pu, Han-Ping ; et al. | 2005-09-22 |
Wafer level semiconductor package with build-up layer and method for fabricating the same
App 20050202590 - Huang, Chien-Ping ; et al. | 2005-09-15 |
Substrate and fabrication method of the same
Grant 6,943,439 - Huang , et al. September 13, 2 | 2005-09-13 |
Semiconductor package free of substrate and fabrication method thereof
App 20050194666 - Huang, Chien Ping ; et al. | 2005-09-08 |
Semiconductor package free of substrate and fabrication method thereof
App 20050194667 - Huang, Chien Ping ; et al. | 2005-09-08 |
Semiconductor package free of substrate and fabrication method thereof
App 20050194665 - Huang, Chien Ping ; et al. | 2005-09-08 |
Semiconductor package free of substrate and fabrication method thereof
App 20050189659 - Huang, Chien Ping ; et al. | 2005-09-01 |
Semiconductor package free of substrate and fabrication method thereof
App 20050184368 - Huang, Chien Ping ; et al. | 2005-08-25 |
Photosensitive semiconductor package with support member and method for fabricating the same
App 20050184404 - Huang, Chih-Ming ; et al. | 2005-08-25 |
Fabrication method of semiconductor package with photosensitive chip
App 20050170561 - Huang, Chien-Ping ; et al. | 2005-08-04 |
Semiconductor package with photosensitive chip and fabrication method thereof
App 20050161755 - Huang, Chien-Ping ; et al. | 2005-07-28 |
Method for fabricating a flash-preventing window ball grid array semiconductor package
App 20050148117 - Huang, Chien-Ping | 2005-07-07 |
Photosensitive semiconductor package and method for fabricating the same
App 20050139946 - Hung, Chia-Yu ; et al. | 2005-06-30 |
Photosensitive semiconductor package, method for fabricating the same, and frame thereof
App 20050133878 - Huang, Chien-Ping | 2005-06-23 |
Semiconductor package and fabrication method thereof
Grant 6,891,273 - Pu , et al. May 10, 2 | 2005-05-10 |
Fabrication method of semiconductor package with heat sink
App 20050095875 - Huang, Chien-Ping ; et al. | 2005-05-05 |
Semiconductor package free of substrate and fabrication method thereof
Grant 6,884,652 - Huang , et al. April 26, 2 | 2005-04-26 |
Flash-preventing window ball grid array semiconductor package, method for fabricating the same, and chip carrier used in the semiconductor package
Grant 6,870,274 - Huang March 22, 2 | 2005-03-22 |
Flash-preventing semiconductor package
Grant 6,867,487 - Huang , et al. March 15, 2 | 2005-03-15 |
Semiconductor Package With Heat Sink
App 20050040519 - Huang, Chien-Ping ; et al. | 2005-02-24 |
Chip carrier for semiconductor chip
App 20050040524 - Pu, Han-Ping ; et al. | 2005-02-24 |
Heat sink with collapse structure for semiconductor package
Grant 6,858,931 - Huang , et al. February 22, 2 | 2005-02-22 |
Semiconductor package with heat dissipating structure
App 20050036291 - Huang, Chien-Ping ; et al. | 2005-02-17 |
Multi-chip package device with heat sink and fabrication method thereof
App 20050035444 - Huang, Chien-Ping | 2005-02-17 |
Semiconductor package with heat sink
Grant 6,856,015 - Huang , et al. February 15, 2 | 2005-02-15 |
Lead-frame-based semiconductor package and fabrication method thereof
App 20050029639 - Chen, Holman ; et al. | 2005-02-10 |
Semiconductor package with heat sink attached to substrate
Grant 6,849,942 - Lin , et al. February 1, 2 | 2005-02-01 |
Window-type ball grid array semiconductor package with lead frame as chip carrier and method for fabricating the same
Grant 6,847,104 - Huang , et al. January 25, 2 | 2005-01-25 |
Semiconductor package with heat sink
Grant 6,844,622 - Huang , et al. January 18, 2 | 2005-01-18 |
Semiconductor package with heat sink
App 20040251538 - Lin, Chang-Fu ; et al. | 2004-12-16 |
Method of fabricating BGA packages
Grant 6,830,957 - Pu , et al. December 14, 2 | 2004-12-14 |
Semiconductor package having conductive bumps on chip and method for fabricating the same
App 20040245608 - Huang, Chien-Ping ; et al. | 2004-12-09 |
Module device of stacked semiconductor packages and method for fabricating the same
Grant 6,828,665 - Pu , et al. December 7, 2 | 2004-12-07 |
Thermally enhanced semiconductor package and fabrication method thereof
App 20040238945 - Huang, Chien-Ping ; et al. | 2004-12-02 |
Flash-preventing window ball grid array semiconductor package, method for fabricating the same, and chip carrier used in the semiconductor package
App 20040227234 - Huang, Chien-Ping | 2004-11-18 |
Semiconductor package and fabricating method thereof
Grant 6,812,063 - Huang November 2, 2 | 2004-11-02 |
Lead-frame-based semiconductor package and fabrication method thereof
Grant 6,806,565 - Chen , et al. October 19, 2 | 2004-10-19 |
Chip carrier and method for testing electrical performance of passive component
App 20040190273 - Chen, Chien-Te ; et al. | 2004-09-30 |
Semiconductor package with enhanced electrical and thermal performance and method for fabricating the same
App 20040183174 - Huang, Chien-Ping ; et al. | 2004-09-23 |
Semiconductor package with heat sink
App 20040178494 - Lin, Chang-Fu ; et al. | 2004-09-16 |
Semiconductor package with heat sink
App 20040174682 - Lin, Chang-Fu ; et al. | 2004-09-09 |
Array structure of solder balls able to control collapse
Grant 6,787,921 - Huang September 7, 2 | 2004-09-07 |
Intercrossedly-stacked dual-chip semiconductor package and method of fabricating the same
Grant 6,784,019 - Huang August 31, 2 | 2004-08-31 |
Semiconductor package with heat dissipating structure
App 20040164404 - Huang, Chien-Ping | 2004-08-26 |
Array structure of solder balls able to control collapse
Grant 6,781,245 - Huang August 24, 2 | 2004-08-24 |
Semiconductor package with flash-proof device
Grant 6,777,819 - Huang August 17, 2 | 2004-08-17 |
Semiconductor package without substrate and method of manufacturing same
Grant 6,770,959 - Huang , et al. August 3, 2 | 2004-08-03 |
Image sensor of a quad flat package
Grant 6,767,753 - Huang July 27, 2 | 2004-07-27 |
Semiconductor package and fabrication method thereof
App 20040140573 - Pu, Han-Ping ; et al. | 2004-07-22 |
Semiconductor package free of substrate and fabrication method thereof
App 20040142505 - Huang, Chien Ping ; et al. | 2004-07-22 |
Semiconductor package and fabricating method thereof
Grant 6,764,880 - Wu , et al. July 20, 2 | 2004-07-20 |
Flip-chip ball grid array semiconductor package with heat-dissipating device and method for fabricating the same
Grant 6,756,684 - Huang June 29, 2 | 2004-06-29 |
IC card type circuit module
Grant D492,314 - Huang , et al. June 29, 2 | 2004-06-29 |
Dual-chip integrated circuit package with unaligned chip arrangement and method of manufacturing the same
Grant 6,753,206 - Huang , et al. June 22, 2 | 2004-06-22 |
Substrate with dam bar structure for smooth flow of encapsulating resin
Grant 6,750,533 - Wang , et al. June 15, 2 | 2004-06-15 |
Integrated circuit package configuration having an encapsulating body with a flanged portion and an encapsulating mold for molding the encapsulating body
Grant 6,743,706 - Huang June 1, 2 | 2004-06-01 |
Chip package capable of reducing moisture penetration
Grant 6,740,978 - Huang , et al. May 25, 2 | 2004-05-25 |
Semiconductor package with heat dissipating structure
Grant 6,720,649 - Huang April 13, 2 | 2004-04-13 |
Semiconductor package for enhancing heat dissipation
Grant 6,713,864 - Huang March 30, 2 | 2004-03-30 |
Super low profile package with high efficiency of heat dissipation
Grant 6,713,321 - Huang , et al. March 30, 2 | 2004-03-30 |
Semiconductor package with crack-preventing member
Grant 6,707,167 - Huang , et al. March 16, 2 | 2004-03-16 |
Quad flat non-leaded semiconductor package and method of fabricating the same
Grant 6,703,691 - Chen , et al. March 9, 2 | 2004-03-09 |
Semiconductor package with enhanced electrical and thermal performance and method for fabricating the same
Grant 6,703,698 - Huang , et al. March 9, 2 | 2004-03-09 |
Substrate of semiconductor package
Grant 6,699,731 - Huang , et al. March 2, 2 | 2004-03-02 |
Substrate for accommodating passive component
Grant 6,700,204 - Huang , et al. March 2, 2 | 2004-03-02 |
Semiconductor package with heat dissipating structure
Grant 6,696,750 - Yin , et al. February 24, 2 | 2004-02-24 |
Semiconductor device and fabrication method of the same
Grant 6,689,636 - Liao , et al. February 10, 2 | 2004-02-10 |
Dual-die integrated circuit package
Grant 6,677,665 - Huang January 13, 2 | 2004-01-13 |
Ball grid array semiconductor package and substrate without power ring or ground ring
Grant 6,667,546 - Huang , et al. December 23, 2 | 2003-12-23 |
Lead-on-chip type of semiconductor package with embedded heat sink
Grant 6,664,649 - Huang December 16, 2 | 2003-12-16 |
Semiconductor package which has no resinous flash formed on lead frame and method for manufacturing the same
Grant 6,661,089 - Huang December 9, 2 | 2003-12-09 |
Semicondctor package
Grant 6,657,296 - Ho , et al. December 2, 2 | 2003-12-02 |
Structure of a multi chip module having stacked chips
Grant 6,650,009 - Her , et al. November 18, 2 | 2003-11-18 |
Semiconductor package with stacked chips
Grant 6,650,006 - Huang , et al. November 18, 2 | 2003-11-18 |
Ball grid array semiconductor package
Grant 6,646,349 - Pu , et al. November 11, 2 | 2003-11-11 |
Method of fabricating a semiconductor device package having a core-hollowed portion without causing resin flash on lead frame
Grant 6,643,919 - Huang November 11, 2 | 2003-11-11 |
Semiconductor package having a die pad with downward-extended tabs
Grant 6,639,306 - Huang October 28, 2 | 2003-10-28 |
Method of encapsulating a substrate-based package assembly without causing mold flash
Grant 6,635,209 - Huang October 21, 2 | 2003-10-21 |
Low-profile semiconductor package with strengthening structure
Grant 6,630,729 - Huang October 7, 2 | 2003-10-07 |
Lead frame adaptable to the trend of IC packaging
Grant 6,621,150 - Lee , et al. September 16, 2 | 2003-09-16 |
Chip package capable of reducing moisture penetration
Grant 6,593,658 - Huang , et al. July 15, 2 | 2003-07-15 |
Stacked-die package structure
Grant 6,593,662 - Pu , et al. July 15, 2 | 2003-07-15 |
Crack-preventive semiconductor package
Grant 6,590,281 - Wu , et al. July 8, 2 | 2003-07-08 |
Semiconductor package
Grant 6,570,249 - Liao , et al. May 27, 2 | 2003-05-27 |
Semiconductor package having heat sink at the outer surface
Grant 6,559,525 - Huang May 6, 2 | 2003-05-06 |
Multiple stacked-chip packaging structure
Grant 6,555,902 - Lo , et al. April 29, 2 | 2003-04-29 |
Semiconductor package having an exposed heat spreader
Grant 6,552,428 - Huang , et al. April 22, 2 | 2003-04-22 |
Image sensor of a quad flat package
Grant 6,545,332 - Huang April 8, 2 | 2003-04-08 |
Super low profile package with high efficiency of heat dissipation
Grant 6,541,854 - Huang , et al. April 1, 2 | 2003-04-01 |
Heat sink with collapse structure and semiconductor package with heat sink
Grant 6,538,321 - Huang , et al. March 25, 2 | 2003-03-25 |
Ball grid array semiconductor package with exposed base layer
Grant 6,528,722 - Huang , et al. March 4, 2 | 2003-03-04 |
Semiconductor package having heat sink attached to substrate
Grant 6,528,876 - Huang March 4, 2 | 2003-03-04 |
Heat dissipation ball grid array package
Grant 6,525,942 - Huang , et al. February 25, 2 | 2003-02-25 |
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