Printed circuit board

Kong November 27, 2

Patent Grant D556158

U.S. patent number D556,158 [Application Number D/255,524] was granted by the patent office on 2007-11-27 for printed circuit board. This patent grant is currently assigned to Hon Hai Precision Industry Co., Ltd.. Invention is credited to Xiang-Jian Kong.


United States Patent D556,158
Kong November 27, 2007

Printed circuit board

Claims

CLAIM The ornamental design for a printed circuit board, as shown and described.
Inventors: Kong; Xiang-Jian (Shenzhen, CN)
Assignee: Hon Hai Precision Industry Co., Ltd. (Tu-Cheng, Taipei Hsien, TW)
Appl. No.: D/255,524
Filed: March 8, 2006

Foreign Application Priority Data

Nov 18, 2005 [CN] 2005 3 0079456
Current U.S. Class: D13/182
Current International Class: 1303
Field of Search: ;D13/182 ;174/250,251,253-256,260,261,265 ;361/720,748,760 ;428/901

References Cited [Referenced By]

U.S. Patent Documents
4715928 December 1987 Hamby
4876120 October 1989 Belke et al.
5008496 April 1991 Schmidt et al.
5121297 June 1992 Haas
D440209 April 2001 Kang
D442149 May 2001 Kang
D442567 May 2001 Kang
6936916 August 2005 Moxham et al.
2002/0131253 September 2002 Kobayashi
2003/0081393 May 2003 Yokoyama
Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Knapp; Jeffrey T.

Description



FIG. 1 is a top, front and right side perspective view of a printed circuit board showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

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