U.S. patent number D556,158 [Application Number D/255,524] was granted by the patent office on 2007-11-27 for printed circuit board.
This patent grant is currently assigned to Hon Hai Precision Industry Co., Ltd.. Invention is credited to Xiang-Jian Kong.
United States Patent |
D556,158 |
Kong |
November 27, 2007 |
Printed circuit board
Claims
CLAIM The ornamental design for a printed circuit board, as shown
and described.
Inventors: |
Kong; Xiang-Jian (Shenzhen,
CN) |
Assignee: |
Hon Hai Precision Industry Co.,
Ltd. (Tu-Cheng, Taipei Hsien, TW)
|
Appl.
No.: |
D/255,524 |
Filed: |
March 8, 2006 |
Foreign Application Priority Data
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|
|
|
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Nov 18, 2005 [CN] |
|
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2005 3 0079456 |
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Current U.S.
Class: |
D13/182 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/182
;174/250,251,253-256,260,261,265 ;361/720,748,760 ;428/901 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Knapp; Jeffrey T.
Description
FIG. 1 is a top, front and right side perspective view of a printed
circuit board showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
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