Elastic membrane for semiconductor wafer polishing

Description

FIG. 1 is a front view of an elastic membrane for semiconductor wafer polishing showing our new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a bottom view thereof;

FIG. 4 is a plan view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a right side view thereof;

FIG. 7 is a cross-section view taken along the line 7-7 of FIG. 2 thereof;

FIG. 8 is a enlarged view of part 8 of FIG. 7 thereof; and,

FIG. 9 is a enlarged perspective view, observed from above thereof.

The broken lines depict environmental subject matter only and form no part of the claimed design.

Claims

CLAIM The ornamental design for an elastic membrane for semiconductor wafer polishing, as shown and described.

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Inventors:	Fukushima; Makoto (Tokyo, JP), Yasuda; Hozumi (Tokyo, JP), Nabeya; Osamu (Tokyo, JP), Watanabe; Katsuhide (Tokyo, JP), Namiki; Keisuke (Tokyo, JP)
Applicant:	Name City State Country Type EBARA CORPORATION Tokyo N/A JP
Assignee:	Ebara Corporation (Tokyo, JP)
Appl. No.:	D/496,207
Filed:	July 10, 2014

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Related U.S. Patent Documents

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	Application Number	Filing Date	Patent Number	Issue Date
	29384219	Jan 28, 2011	D711330

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Foreign Application Priority Data

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Dec 28, 2010 [JP]			2010-031213
Dec 28, 2010 [JP]			2010-031214
Dec 28, 2010 [JP]			2010-031215
Dec 28, 2010 [JP]			2010-031216

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;451/66,288,289

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References Cited [Referenced By]

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Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Sughrue Mion, PLLC