Module with built-in integrated circuits for use with IC card

Description

FIG. 1 is a perspective view of a module with built-in integrated circuits for use with IC card, showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a rear elevational view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

CLAIM The ornamental design for a module with built-in integrated circuits for use with IC card, as shown and described.

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Inventors:	Komatsu; Akira (Yokohama, JP)
Applicant:	Name City State Country Type Komatsu; Akira Yokohama N/A JP
Assignee:	Kabushiki Kaisha Toshiba (Tokyo, JP)
Appl. No.:	D/422,445
Filed:	May 21, 2012

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Foreign Application Priority Data

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Nov 22, 2011 [JP]			2011-026932

Current U.S. Class:	D14/437
Current International Class:	1402
Field of Search:	;D14/435,436,437,478,479,480,485,486,487,488,489,490,491,492,493,495,474 ;D13/182 ;369/275.1,275.2,275.3,275.4,275.5,44.26,284,286,100,52.1,273,280,281,282,283,285,287,288 ;283/81 ;720/718 ;435/6,287.2 ;604/891.1 ;216/2 ;D11/80 ;235/492,488 ;361/737

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References Cited [Referenced By]

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Foreign Patent Documents

	201030223483.4		Apr 2011		CN
	899738-2		Feb 1995		JP
	981954		May 1997		JP

Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Banner & Witcoff, Ltd.

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