Chipcard module

Description

FIG. 1 is a top-plan view of a chipcard module showing our new design;

FIG. 2 is a bottom-plan view thereof;

FIG. 3 is a right-side elevational view thereof;

FIG. 4 is a left-side elevational view thereof;

FIG. 5 is a front elevational view thereof;

FIG. 6 is a rear elevational view thereof;

FIG. 7 is a cross-sectional view thereof taken along the line VII--VII of FIGS. 1 and 2; and,

FIG. 8 is a cross-sectional view thereof taken along the line VIII--VIII of FIGS. 1 and 2.

Claims

The ornamental design for the chipcard module, as shown and described.

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Inventors:	Mundigl; Josef (Nittendorf, DE), Kirschbauer; Josef (Blaibach, DE)
Assignee:	Siemens Aktiengesellschaft (Munich, DE)
Appl. No.:	D/018,711
Filed:	February 14, 1994

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Foreign Application Priority Data

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Aug 12, 1993 [DE]			93 06 379.2

Current U.S. Class:	D14/437
Field of Search:	;D14/100,114,117 ;235/378-390,492 ;439/43,52,64 ;D13/182 ;361/739,737-738

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References Cited [Referenced By]

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U.S. Patent Documents

D342728	December 1993	Gloton
D344502	February 1994	Gloton
D353135	December 1994	Gloton
D353136	December 1994	Gloton
5003520	March 1991	Grieu et al.
5055662	October 1991	Hasegawa

Primary Examiner: Word; A. Hugo
Assistant Examiner: Tung; M. H.
Attorney, Agent or Firm: Lerner; Herbert L. Greenberg; Laurence A.