U.S. patent number D387,747 [Application Number D/062,839] was granted by the patent office on 1997-12-16 for ic module.
This patent grant is currently assigned to Kabushiki Kaisha Toshiba. Invention is credited to Tomiaki Ishihara.
United States Patent |
D387,747 |
Ishihara |
December 16, 1997 |
IC module
Claims
The ornamental design for an IC module, as shown and described.
Inventors: |
Ishihara; Tomiaki (Yokohama,
JP) |
Assignee: |
Kabushiki Kaisha Toshiba
(Kawasaki, JP)
|
Appl.
No.: |
D/062,839 |
Filed: |
November 27, 1996 |
Foreign Application Priority Data
|
|
|
|
|
May 29, 1996 [JP] |
|
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8-15397 |
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Current U.S.
Class: |
D14/437 |
Current International
Class: |
1402 |
Field of
Search: |
;D14/114,117,107
;235/378-380,487-492 ;257/731,669 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
Primary Examiner: Chin; Kay H.
Attorney, Agent or Firm: Oblon, Spivak, McClelland, Maier
& Neustadt, P.C.
Description
FIG. 1 is a front, bottom and right side perspective view of an IC
module, showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a right side elevational view thereof, the opposite side
being a mirror image;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof; and,
FIG. 6 is a rear elevational view thereof.
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