Carrier element for a semiconductor chip for integration into a chipcard

Huber , et al. February 16, 1

Patent Grant D405779

U.S. patent number D405,779 [Application Number D/070,054] was granted by the patent office on 1999-02-16 for carrier element for a semiconductor chip for integration into a chipcard. This patent grant is currently assigned to Siemens Aktiengesellschaft. Invention is credited to Christian Hauser, Erik Heinemann, Michael Huber, Frank Pueschner, Peter Stampka.


United States Patent D405,779
Huber ,   et al. February 16, 1999

Carrier element for a semiconductor chip for integration into a chipcard

Claims

The ornamental design for a carrier element for a semiconductor chip for integration into a chipcard, as shown and described.
Inventors: Huber; Michael (Nittendorf, DE), Stampka; Peter (Schwandorf-Klardorf, DE), Heinemann; Erik (Regensburg, DE), Hauser; Christian (Regensburg, DE), Pueschner; Frank (Kelheim, DE)
Assignee: Siemens Aktiengesellschaft (Munich, DE)
Appl. No.: D/070,054
Filed: April 25, 1997

Foreign Application Priority Data

Oct 25, 1996 [DE] M 96 09 746.9
Current U.S. Class: D14/437
Current International Class: 1402
Field of Search: ;D14/117,114 ;235/378-390,492 ;361/739,737-738

References Cited [Referenced By]

U.S. Patent Documents
D342728 December 1993 Gloton
D344502 February 1994 Gloton
D353135 December 1994 Gloton
D353136 December 1994 Gloton
D365092 December 1995 Mundigl et al.
5003520 March 1991 Grieu et al.
5055662 October 1991 Hasegawa
Primary Examiner: Vinson; Brian N.
Attorney, Agent or Firm: Lerner; Herbert L. Greenberg; Laurence A.

Description



FIG. 1 is a top, perspective view of a carrier element for a semiconductor chip for integration into a chipcard showing our new design; and,

FIG. 2 is a top plan view thereof.

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