Heinemann; Erik

Patent Applications and Registrations

Patent applications and USPTO patent grants for Heinemann; Erik.The latest application filed is for "optoelectronic component and method for producing an optoelectronic component".

Company Profile

0.11.14

Heinemann; Erik - Regensburg N/A DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Optoelectronic component and method for producing an optoelectronic component Grant 9,368,700 - Jerebic , et al. June 14, 2	2016-06-14
Optoelectronic Component and Method for Producing an Optoelectronic Component App 20140191272 - Jerebic; Simon ; et al.	2014-07-10
Semiconductor Component and Method for Producing a Semiconductor Component App 20130181247 - Jerebic; Simon ; et al.	2013-07-18
Semiconductor arrangement and method for producing a semiconductor arrangement Grant 7,902,683 - Pueschner , et al. March 8, 2	2011-03-08
Optoelectronic Surface-mounted Device And Method For Forming An Optoelectronic Surface-mounted Device App 20100142882 - Heinemann; Erik ; et al.	2010-06-10
Optoelectronic surface-mounted device and method for forming an optoelectronic surface-mounted device Grant 7,731,433 - Heinemann , et al. June 8, 2	2010-06-08
Chip module and chip card Grant 7,605,453 - Stampka , et al. October 20, 2	2009-10-20
Chip Card Module And Method Of Producing A Chip Card Module App 20080205012 - HEINEMANN; ERIK ; et al.	2008-08-28
Chip Module And Chip Card App 20070034999 - Stampka; Peter ; et al.	2007-02-15
Semiconductor arrangement and method for producing a semiconductor arrangement App 20060278958 - Pueschner; Frank ; et al.	2006-12-14
Method for producing laminated smart cards Grant 7,069,652 - Heinemann , et al. July 4, 2	2006-07-04
Making contact with semiconductor chips in chip cards Grant 7,019,981 - Heinemann , et al. March 28, 2	2006-03-28
Smart-card module with an anisotropically conductive substrate film Grant 6,992,898 - Heinemann , et al. January 31, 2	2006-01-31
Nonconducting substrate, forming a strip or a panel, on which a multiplicity of carrier elements are formed App 20040256150 - Barchmann, Bernd ; et al.	2004-12-23
Device with at least one semiconductor component and a printed circuit board and method of establishing an electromechanical connection between the two Grant 6,806,562 - Barchmann , et al. October 19, 2	2004-10-19
Making contact with semiconductor chips in chip cards App 20040150962 - Heinemann, Erik ; et al.	2004-08-05
Smart card module, smart card with the smart card module, and method for producing the smart card module Grant 6,557,769 - Puschner , et al. May 6, 2	2003-05-06
Method for producing laminated smart cards App 20030064544 - Heinemann, Erik ; et al.	2003-04-03
Smart-card module with an anisotropically conductive substrate film App 20020172018 - Heinemann, Erik ; et al.	2002-11-21
Smart card module, smart card with the smart card module, and method for producing the smart card module App 20020113131 - Puschner, Frank ; et al.	2002-08-22
Device with at least one semiconductor component and a printed circuit board and method of establishing an electromechanical connection between the two App 20020113311 - Barchmann, Bernd ; et al.	2002-08-22
Carrier element for a semiconductor chip for integration into a chipcard Grant D405,779 - Huber , et al. February 16, 1	1999-02-16

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