U.S. patent number D711,330 [Application Number D/384,219] was granted by the patent office on 2014-08-19 for elastic membrane for semiconductor wafer polishing.
This patent grant is currently assigned to Ebara Corporation. The grantee listed for this patent is Makoto Fukushima, Osamu Nabeya, Keisuke Namiki, Katsuhide Watanabe, Hozumi Yasuda. Invention is credited to Makoto Fukushima, Osamu Nabeya, Keisuke Namiki, Katsuhide Watanabe, Hozumi Yasuda.
United States Patent |
D711,330 |
Fukushima , et al. |
August 19, 2014 |
Elastic membrane for semiconductor wafer polishing
Claims
CLAIM The ornamental design for an elastic membrane for
semiconductor wafer polishing, as shown and described.
Inventors: |
Fukushima; Makoto (Tokyo,
JP), Yasuda; Hozumi (Tokyo, JP), Nabeya;
Osamu (Tokyo, JP), Watanabe; Katsuhide (Tokyo,
JP), Namiki; Keisuke (Tokyo, JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
Fukushima; Makoto
Yasuda; Hozumi
Nabeya; Osamu
Watanabe; Katsuhide
Namiki; Keisuke |
Tokyo
Tokyo
Tokyo
Tokyo
Tokyo |
N/A
N/A
N/A
N/A
N/A |
JP
JP
JP
JP
JP |
|
|
Assignee: |
Ebara Corporation (Tokyo,
JP)
|
Appl.
No.: |
D/384,219 |
Filed: |
January 28, 2011 |
Foreign Application Priority Data
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|
|
|
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Dec 28, 2010 [JP] |
|
|
2010-031213 |
Dec 28, 2010 [JP] |
|
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2010-031214 |
Dec 28, 2010 [JP] |
|
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2010-031215 |
Dec 28, 2010 [JP] |
|
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2010-031216 |
|
Current U.S.
Class: |
D13/182 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/182 ;D7/534,624.1
;451/66,288,289 ;257/E21.304 ;D8/395 ;D15/143 ;D23/269 ;D25/136
;52/288.1 ;277/584,612 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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1833640 |
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Sep 2007 |
|
EP |
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2000-167762 |
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Jun 2000 |
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JP |
|
2000-301452 |
|
Oct 2000 |
|
JP |
|
2002-075936 |
|
Mar 2002 |
|
JP |
|
2002-527894 |
|
Aug 2002 |
|
JP |
|
2004-297029 |
|
Oct 2004 |
|
JP |
|
2004-363505 |
|
Dec 2004 |
|
JP |
|
2006-159392 |
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Jun 2006 |
|
JP |
|
2006-255851 |
|
Sep 2006 |
|
JP |
|
3937368 |
|
Apr 2007 |
|
JP |
|
30-0526799 |
|
Apr 2009 |
|
KR |
|
30-0526801 |
|
Apr 2009 |
|
KR |
|
Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Sughrue Mion, PLLC
Description
FIG. 1 is a front view of an elastic membrane for semiconductor
wafer polishing showing our new design;
FIG. 2 is a rear view thereof;
FIG. 3 is a plain view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a cross section view taken along the line 7-7 of FIG. 2
thereof;
FIG. 8 is a enlarged view of part 8 of FIG. 7 thereof; and,
FIG. 9 is an enlarged view taken of portion 9-9' of FIG. 8
thereof.
The broken lines depict environmental subject matter only and form
no part of the claimed design.
* * * * *