Temporary package for semiconductor dice

Description

FIG. 1 is an enlarged top perspective view of a temporary package for semiconductor dice showing our new design;

FIG. 2 is a left side elevational view thereof;

FIG. 3 is a right side elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a front side elevational view thereof;

FIG. 6 is a bottom plan view thereof; and,

FIG. 7 is a rear side elevation view thereof.

Claims

The ornamental design for a temporary package for semiconductor dice, as shown and described.

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Inventors:	Farnworth; Warren M. (Nampa, ID), Wood; Alan G. (Boise, ID), Hembree; David R. (Boise, ID), Akram; Salman (Boise, ID)
Assignee:	Micron Technology, Inc. (Boise, ID)
Appl. No.:	D/070,029
Filed:	April 25, 1997

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Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D14/114 ;D13/182 ;257/668,671,672,693 ;174/52.1-52.5 ;439/55,70 ;361/718,820

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References Cited [Referenced By]

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U.S. Patent Documents

D317592	June 1991	Yoshizawa
D359028	June 1995	Siegel et al.
5053853	October 1991	Haj-Ali-Ahmadi et al.
5155067	October 1992	Wood et al.
5173451	December 1992	Kinsman et al.
5206536	April 1993	Lim
5302891	April 1994	Wood et al.
5408190	April 1995	Wood et al.
5440240	August 1995	Wood et al.
5442232	August 1995	Goto et al.
5451165	September 1995	Cearley-Cabbiness et al.
5455452	October 1995	Kiyono
5471088	November 1995	Song
5495179	February 1996	Wood et al.
5517125	May 1996	Posedel et al.
5519332	May 1996	Wood et al.
5530376	June 1996	Lim et al.
5541525	July 1996	Wood et al.
5543725	August 1996	Lim et al.
5581195	December 1996	Lee et al.

Other References

1994 DRAM Data Book, Micron Semiconductor, Inc., pp. 7-7 - 7-13, Apr., 1994 ..

Primary Examiner: Tung; M. H.
Attorney, Agent or Firm: Gratton; Stephen A.