| Patent | Date |
|---|
Stacked Semiconductor Die Assemblies With High Efficiency Thermal Paths And Molded Underfill
App 20220157624 - Hembree; David R. ; et al. | 2022-05-19 |
Apparatuses and methods for internal heat spreading for packaged semiconductor die
Grant 11,329,026 - Hembree May 10, 2 | 2022-05-10 |
Semiconductor Devices With Redistribution Structures Configured For Switchable Routing
App 20220059509 - Jensen; Travis M. ; et al. | 2022-02-24 |
Stacked semiconductor die assemblies with high efficiency thermal paths and molded underfill
Grant 11,239,095 - Hembree , et al. February 1, 2 | 2022-02-01 |
Methods Of Manufacturing Stacked Semiconductor Die Assemblies With High Efficiency Thermal Paths
App 20220013434 - Vadhavkar; Sameer S. ; et al. | 2022-01-13 |
Semiconductor devices with redistribution structures configured for switchable routing
Grant 11,171,121 - Jensen , et al. November 9, 2 | 2021-11-09 |
Semiconductor Devices With Redistribution Structures Configured For Switchable Routing
App 20210305211 - Jensen; Travis M. ; et al. | 2021-09-30 |
Semiconductor Device Assembly With Die Support Structures
App 20210167030 - Wirz; Brandon P. ; et al. | 2021-06-03 |
Semiconductor device assembly with die support structures
Grant 10,923,447 - Wirz , et al. February 16, 2 | 2021-02-16 |
Stacked Semiconductor Die Assemblies With High Efficiency Thermal Paths And Molded Underfill
App 20200020547 - Hembree; David R. ; et al. | 2020-01-16 |
Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods
Grant 10,461,059 - Koopmans , et al. Oc | 2019-10-29 |
Stacked semiconductor die assemblies with high efficiency thermal paths and molded underfill
Grant 10,424,495 - Hembree , et al. Sept | 2019-09-24 |
Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths
Grant 10,163,755 - Vadhavkar , et al. Dec | 2018-12-25 |
Semiconductor Device Assembly With Die Support Structures
App 20180342475 - Wirz; Brandon P. ; et al. | 2018-11-29 |
Methods Of Manufacturing Stacked Semiconductor Die Assemblies With High Efficiency Thermal Paths
App 20180308785 - Vadhavkar; Sameer S. ; et al. | 2018-10-25 |
Stacked Semiconductor Die Assemblies With High Efficiency Thermal Paths And Molded Underfill
App 20180294169 - Hembree; David R. ; et al. | 2018-10-11 |
Apparatuses and methods for heat transfer from packaged semiconductor die
Grant 10,068,875 - Hembree September 4, 2 | 2018-09-04 |
Stacked semiconductor die assemblies with high efficiency thermal paths and molded underfill
Grant 10,008,395 - Hembree , et al. June 26, 2 | 2018-06-26 |
Methods for transferring heat from stacked microfeature devices
Grant 9,960,148 - Akram , et al. May 1, 2 | 2018-05-01 |
Stacked Semiconductor Die Assemblies With High Efficiency Thermal Paths And Molded Underfill
App 20180108592 - Hembree; David R. ; et al. | 2018-04-19 |
Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods
Grant 9,837,396 - Vadhavkar , et al. December 5, 2 | 2017-12-05 |
Apparatuses And Methods For Internal Heat Spreading For Packaged Semiconductor Die
App 20170236804 - HEMBREE; DAVID R. | 2017-08-17 |
Methods Of Manufacturing Stacked Semiconductor Die Assemblies With High Efficiency Thermal Paths
App 20170229439 - Vadhavkar; Sameer S. ; et al. | 2017-08-10 |
Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths
Grant 9,691,746 - Vadhavkar , et al. June 27, 2 | 2017-06-27 |
Apparatuses And Methods For Heat Transfer From Packaged Semiconductor Die
App 20170117254 - HEMBREE; DAVID R. | 2017-04-27 |
Methods and systems for releasably attaching support members to microfeature workpieces
Grant 9,595,504 - Pratt , et al. March 14, 2 | 2017-03-14 |
Solid state lights with thermal control elements
Grant 9,548,286 - Sills , et al. January 17, 2 | 2017-01-17 |
Stacked Semiconductor Die Assemblies With High Efficiency Thermal Paths And Associated Methods
App 20160372452 - Vadhavkar; Sameer S. ; et al. | 2016-12-22 |
Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods
Grant 9,443,744 - Vadhavkar , et al. September 13, 2 | 2016-09-13 |
Stacked Semiconductor Die Assemblies With Improved Thermal Performance And Associated Systems And Methods
App 20160141270 - Koopmans; Michel ; et al. | 2016-05-19 |
Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods
Grant 9,269,700 - Koopmans , et al. February 23, 2 | 2016-02-23 |
Stacked Semiconductor Die Assemblies With High Efficiency Thermal Paths And Associated Methods
App 20160013115 - Vadhavkar; Sameer S. ; et al. | 2016-01-14 |
Methods Of Manufacturing Stacked Semiconductor Die Assemblies With High Efficiency Thermal Paths
App 20160013173 - Vadhavkar; Sameer S. ; et al. | 2016-01-14 |
Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods
Grant 9,165,888 - Fay , et al. October 20, 2 | 2015-10-20 |
Stacked Semiconductor Die Assemblies With Improved Thermal Performance And Associated Systems And Methods
App 20150279828 - Koopmans; Michel ; et al. | 2015-10-01 |
Methods And Systems For Releasably Attaching Support Members To Microfeature Workpieces
App 20150214185 - Pratt; David ; et al. | 2015-07-30 |
Semiconductor module system having encapsulated through wire interconnect (TWI)
Grant 9,018,751 - Hembree , et al. April 28, 2 | 2015-04-28 |
Through wire interconnect (TWI) for semiconductor components having wire in via and bonded connection with substrate contact
Grant 9,013,044 - Wood , et al. April 21, 2 | 2015-04-21 |
Methods and systems for releasably attaching support members to microfeature workpieces
Grant 8,999,498 - Pratt , et al. April 7, 2 | 2015-04-07 |
Lens master devices, lens structures, imaging devices, and methods and apparatuses of making the same
Grant 8,982,469 - Hembree , et al. March 17, 2 | 2015-03-17 |
Semiconductor Module System Having Encapsulated Through Wire Interconnect (twi)
App 20140225259 - Hembree; David R ; et al. | 2014-08-14 |
Interconnect Structures For Stacked Dies, Including Penetrating Structures For Through-silicon Vias, And Associated Systems And Methods
App 20140206145 - Fay; Owen R. ; et al. | 2014-07-24 |
Method for fabricating a through wire interconnect (TWI) on a semiconductor substrate having a bonded connection and an encapsulating polymer layer
Grant 8,741,667 - Hembree , et al. June 3, 2 | 2014-06-03 |
Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods
Grant 8,680,654 - Fay , et al. March 25, 2 | 2014-03-25 |
Through-wafer interconnects for photoimager and memory wafers
Grant 8,669,179 - Akram , et al. March 11, 2 | 2014-03-11 |
Method For Fabricating A Through Wire Interconnect (twi) On A Semiconductor Substrate Having A Bonded Connection And An Encapsulating Polymer Layer
App 20140038406 - Hembree; David R ; et al. | 2014-02-06 |
Through Wire Interconnect (TWI) For Semiconductor Components Having Wire In Via And Bonded Connection With Substrate Contact
App 20130299983 - Wood; Alan G. ; et al. | 2013-11-14 |
Through wire interconnect (TWI) having bonded connection and encapsulating polymer layer
Grant 8,581,387 - Hembree , et al. November 12, 2 | 2013-11-12 |
Through-wafer Interconnects For Photoimager And Memory Wafers
App 20130295766 - Akram; Salman ; et al. | 2013-11-07 |
Stacked semiconductor components having conductive interconnects
Grant 8,546,931 - Wood , et al. October 1, 2 | 2013-10-01 |
Interconnect Structures For Stacked Dies, Including Penetrating Structures For Through-silicon Vias, And Associated Systems And Methods
App 20130234296 - Fay; Owen R. ; et al. | 2013-09-12 |
Stacked semiconductor component having through wire interconnect (TWI) with compressed wire
Grant 8,513,797 - Wood , et al. August 20, 2 | 2013-08-20 |
Through-wafer interconnects for photoimager and memory wafers
Grant 8,502,353 - Akram , et al. August 6, 2 | 2013-08-06 |
Methods And Systems For Releasably Attaching Support Members To Microfeature Workpieces
App 20130136898 - Pratt; David ; et al. | 2013-05-30 |
Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods
Grant 8,435,836 - Fay , et al. May 7, 2 | 2013-05-07 |
Method for fabricating stacked semiconductor system with encapsulated through wire interconnects (TWI)
Grant 8,404,523 - Hembree , et al. March 26, 2 | 2013-03-26 |
Methods and systems for releasably attaching support members to microfeature workpieces
Grant 8,361,604 - Pratt , et al. January 29, 2 | 2013-01-29 |
Method For Fabricating Stacked Semiconductor System With Encapsulated Through Wire Interconnects (twi)
App 20120288997 - HEMBREE; DAVID R. ; et al. | 2012-11-15 |
Stacked Semiconductor Component Having Through Wire Interconnect (twi) With Compressed Wire
App 20120228781 - Wood; Alan G. ; et al. | 2012-09-13 |
Semiconductor module system having stacked components with encapsulated through wire interconnects (TWI)
Grant 8,217,510 - Hembree , et al. July 10, 2 | 2012-07-10 |
Semiconductor component having through wire interconnect (TWI) with compressed wire
Grant 8,193,646 - Wood , et al. June 5, 2 | 2012-06-05 |
Methods And Apparatuses For Transferring Heat From Stacked Microfeature Devices
App 20120135567 - Akram; Salman ; et al. | 2012-05-31 |
Semiconductor Module System Having Stacked Components With Encapsulated Through Wire Interconnects (TWI)
App 20120043670 - Hembree; David R. ; et al. | 2012-02-23 |
System with semiconductor components having encapsulated through wire interconnects (TWI)
Grant 8,120,167 - Hembree , et al. February 21, 2 | 2012-02-21 |
Solid State Lights With Thermal Control Elements
App 20120032182 - Sills; Scott E. ; et al. | 2012-02-09 |
Methods and apparatuses for transferring heat from stacked microfeature devices
Grant 8,111,515 - Akram , et al. February 7, 2 | 2012-02-07 |
Semiconductor component having through wire interconnect with compressed bump
Grant 8,053,909 - Hembree November 8, 2 | 2011-11-08 |
Stacked Semiconductor Components Having Conductive Interconnects
App 20110175223 - Wood; Alan G. ; et al. | 2011-07-21 |
Lens Master Devices, Lens Structures, Imaging Devices, And Methods And Apparatuses Of Making The Same
App 20110157455 - Hembree; David R. ; et al. | 2011-06-30 |
Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates
Grant 7,960,829 - Wood , et al. June 14, 2 | 2011-06-14 |
Through-wafer interconnects for photoimager and memory wafers
Grant 7,956,443 - Akram , et al. June 7, 2 | 2011-06-07 |
Methods for fabricating semiconductor components with conductive interconnects having planar surfaces
Grant 7,951,702 - Wood , et al. May 31, 2 | 2011-05-31 |
Interconnect Structures For Stacked Dies, Including Penetrating Structures For Through-silicon Vias, And Associated Systems And Methods
App 20110111561 - Fay; Owen R. ; et al. | 2011-05-12 |
Semiconductor Component Having Through Wire Interconnect With Compressed Bump
App 20110108959 - Hembree; David R. | 2011-05-12 |
Semiconductor components with conductive interconnects
Grant 7,935,991 - Wood , et al. May 3, 2 | 2011-05-03 |
Stacked semiconductor component having through wire interconnect
Grant 7,919,846 - Hembree April 5, 2 | 2011-04-05 |
Lens master devices, lens structures, imaging devices, and methods and apparatuses of making the same
Grant 7,916,396 - Hembree , et al. March 29, 2 | 2011-03-29 |
Method for fabricating semiconductor component having encapsulated through wire interconnect (TWI)
Grant 7,883,908 - Hembree , et al. February 8, 2 | 2011-02-08 |
System With Semiconductor Components Having Encapsulated Through Wire Interconnects (TWI)
App 20110024745 - Hembree; David R. ; et al. | 2011-02-03 |
Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods
Grant 7,872,332 - Fay , et al. January 18, 2 | 2011-01-18 |
Method of fabricating semiconductor components with through interconnects
Grant 7,833,832 - Wood , et al. November 16, 2 | 2010-11-16 |
Microelectronic devices and methods for forming interconnects in microelectronic devices
Grant 7,829,976 - Kirby , et al. November 9, 2 | 2010-11-09 |
Semiconductor Component Having Through Wire Interconnect (TWI) With Compressed Wire
App 20100264521 - Wood; Alan G. ; et al. | 2010-10-21 |
Methods And Systems For Releasably Attaching Support Members To Microfeature Workpieces
App 20100247875 - Pratt; David ; et al. | 2010-09-30 |
Stacked semiconductor components with through wire interconnects (TWI)
Grant 7,786,605 - Wood , et al. August 31, 2 | 2010-08-31 |
System for fabricating semiconductor components with conductive interconnects
Grant 7,768,096 - Wood , et al. August 3, 2 | 2010-08-03 |
System for fabricating semiconductor components with through wire interconnects
Grant 7,757,385 - Hembree July 20, 2 | 2010-07-20 |
Methods and systems for releasably attaching support members to microfeature workpieces
Grant 7,749,349 - Pratt , et al. July 6, 2 | 2010-07-06 |
Die package and probe card structures and fabrication methods
Grant 7,745,942 - Hembree June 29, 2 | 2010-06-29 |
Stacked Semiconductor Component Having Through Wire Interconnect And Method Of Fabrication
App 20100140753 - Hembree; David R. | 2010-06-10 |
Methods For Fabricating Semiconductor Components With Conductive Interconnects Having Planar Surfaces
App 20100144139 - Wood; Alan G. ; et al. | 2010-06-10 |
Methods for fabricating semiconductor components with conductive interconnects
Grant 7,727,872 - Wood , et al. June 1, 2 | 2010-06-01 |
Semiconductor components with through wire interconnects
Grant 7,728,443 - Hembree June 1, 2 | 2010-06-01 |
Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers
Grant 7,723,741 - Farnworth , et al. May 25, 2 | 2010-05-25 |
Methods for thinning semiconductor substrates that employ support structures formed on the substrates
Grant 7,713,841 - Wood , et al. May 11, 2 | 2010-05-11 |
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
Grant 7,709,776 - Farnworth , et al. May 4, 2 | 2010-05-04 |
Methods for testing semiconductor devices methods for protecting the same from electrostatic discharge events during testing, and methods for fabricating inserts for use in testing semiconductor devices
Grant 7,709,279 - Hembree , et al. May 4, 2 | 2010-05-04 |
Test inserts and interconnects with electrostatic discharge structures
Grant 7,705,349 - Hembree , et al. April 27, 2 | 2010-04-27 |
Through-wafer interconnects for photoimager and memory wafers
Grant 7,683,458 - Akram , et al. March 23, 2 | 2010-03-23 |
Method for fabricating stacked semiconductor components with through wire interconnects
Grant 7,682,962 - Hembree March 23, 2 | 2010-03-23 |
Interconnect Structures For Stacked Dies, Including Penetrating Structures For Through-silicon Vias, And Associated Systems And Methods
App 20100059897 - Fay; Owen R. ; et al. | 2010-03-11 |
Method For Fabricating Semiconductor Component Having Encapsulated Through Wire Interconnect (TWI)
App 20100047934 - Hembree; David R. ; et al. | 2010-02-25 |
Semiconductor components having encapsulated through wire interconnects (TWI)
Grant 7,659,612 - Hembree , et al. February 9, 2 | 2010-02-09 |
Methods And Apparatuses For Transferring Heat From Stacked Microfeature Devices
App 20090321061 - Akram; Salman ; et al. | 2009-12-31 |
Lens master devices, lens structures, imaging devices, and methods and apparatuses of making the same
App 20090323195 - Hembree; David R. ; et al. | 2009-12-31 |
Methods and apparatuses for transferring heat from stacked microfeature devices
Grant 7,602,618 - Akram , et al. October 13, 2 | 2009-10-13 |
Semiconductor devices with permanent polymer stencil and method for manufacturing the same
Grant 7,589,010 - Farnworth , et al. September 15, 2 | 2009-09-15 |
Method And System For Fabricating Semiconductor Components With Through Interconnects
App 20090224404 - Wood; Alan G. ; et al. | 2009-09-10 |
Methods and systems for fabricating semiconductor components with through wire interconnects (TWI)
Grant 7,579,267 - Wood , et al. August 25, 2 | 2009-08-25 |
Microelectronic Devices And Methods For Forming Interconnects In Microelectronic Devices
App 20090191701 - Kirby; Kyle K. ; et al. | 2009-07-30 |
Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICs will undergo, such as additional repairs
Grant 7,561,938 - Akram , et al. July 14, 2 | 2009-07-14 |
Microelectronic Imagers With Optical Devices And Methods Of Manufacturing Such Microelectronic Imagers
App 20090155949 - Farnworth; Warren M. ; et al. | 2009-06-18 |
Underfill and encapsulation of semiconductor assemblies with materials having differing properties
Grant 7,547,978 - Hembree , et al. June 16, 2 | 2009-06-16 |
Semiconductor components having through interconnects
Grant 7,538,413 - Wood , et al. May 26, 2 | 2009-05-26 |
Microelectronic devices and methods for forming interconnects in microelectronic devices
Grant 7,531,453 - Kirby , et al. May 12, 2 | 2009-05-12 |
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
Grant 7,504,615 - Farnworth , et al. March 17, 2 | 2009-03-17 |
Semiconductor component having plate, stacked dice and conductive vias
Grant 7,498,675 - Farnworth , et al. March 3, 2 | 2009-03-03 |
Compliant contact pin assembly and card system
Grant 7,488,899 - Kirby , et al. February 10, 2 | 2009-02-10 |
Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts
Grant 7,459,393 - Farnworth , et al. December 2, 2 | 2008-12-02 |
Microelectronic imaging units and methods of manufacturing microelectronic imaging units at the wafer level
Grant 7,452,743 - Oliver , et al. November 18, 2 | 2008-11-18 |
System For Fabricating Semiconductor Components With Conductive Interconnects
App 20080229573 - Wood; Alan G. ; et al. | 2008-09-25 |
Microelectronic imagers and methods of packaging microelectronic imagers
Grant 7,419,841 - Farnworth , et al. September 2, 2 | 2008-09-02 |
Methods of sensing temperature of an electronic device workpiece
Grant 7,419,299 - Akram , et al. September 2, 2 | 2008-09-02 |
Methods For Fabricating Semiconductor Components With Conductive Interconnects
App 20080206990 - Wood; Alan G. ; et al. | 2008-08-28 |
Semiconductor Components With Conductive Interconnects
App 20080203539 - Wood; Alan G. ; et al. | 2008-08-28 |
Semiconductor components having through interconnects and methods of fabrication
App 20080157361 - Wood; Alan G. ; et al. | 2008-07-03 |
Compliant contact pin assembly and card system
Grant 7,394,267 - Kirby , et al. July 1, 2 | 2008-07-01 |
Backside method for fabricating semiconductor components with conductive interconnects
Grant 7,393,770 - Wood , et al. July 1, 2 | 2008-07-01 |
Dicing saw with variable indexing capability
Grant 7,387,119 - Akram , et al. June 17, 2 | 2008-06-17 |
Microelectronic Devices And Methods For Forming Interconnects In Microelectronic Devices
App 20080138973 - Kirby; Kyle K. ; et al. | 2008-06-12 |
Method for fabricating semiconductor components with through wire interconnects
Grant 7,371,676 - Hembree May 13, 2 | 2008-05-13 |
Contact pin assembly and contactor card
Grant 7,358,751 - Kirby , et al. April 15, 2 | 2008-04-15 |
Methods of packaging and testing microelectronic imaging devices
Grant 7,341,881 - Watkins , et al. March 11, 2 | 2008-03-11 |
Stacked Semiconductor Components With Through Wire Interconnects (TWI)
App 20080042247 - Wood; Alan G. ; et al. | 2008-02-21 |
Microelectronic devices and methods for forming interconnects in microelectronic devices
Grant 7,329,943 - Kirby , et al. February 12, 2 | 2008-02-12 |
Die package and probe card structures and fabrication methods
App 20070296090 - Hembree; David R. | 2007-12-27 |
Semiconductor components having through wire interconnects (TWI)
Grant 7,307,348 - Wood , et al. December 11, 2 | 2007-12-11 |
Method of making contact pin card system
Grant 7,297,563 - Kirby , et al. November 20, 2 | 2007-11-20 |
Compliant contact pin test assembly and methods thereof
Grant 7,288,954 - Kirby , et al. October 30, 2 | 2007-10-30 |
Methods of forming a contact pin assembly
Grant 7,287,326 - Kirby , et al. October 30, 2 | 2007-10-30 |
Semiconductor components and systems having encapsulated through wire interconnects (TWI) and wafer level methods of fabrication
App 20070246819 - Hembree; David R. ; et al. | 2007-10-25 |
Methods for releasably attaching support members to microfeature workpieces
App 20070241078 - Pratt; David ; et al. | 2007-10-18 |
Semiconductor devices at least partially covered by a composite coating including particles dispersed through photopolymer material
Grant 7,282,806 - Hembree , et al. October 16, 2 | 2007-10-16 |
Compliant contact pin assembly, card system and methods thereof
Grant 7,282,932 - Kirby , et al. October 16, 2 | 2007-10-16 |
Semiconductor Components With Through Wire Interconnects
App 20070222054 - Hembree; David R. | 2007-09-27 |
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
Grant 7,265,330 - Farnworth , et al. September 4, 2 | 2007-09-04 |
System For Fabricating Semiconductor Components With Through Wire Interconnects
App 20070200255 - Hembree; David R. | 2007-08-30 |
Circuit and method for error test, recordation, and repair
App 20070200575 - Hembree; David R. | 2007-08-30 |
Prefabricated housings for microelectronic imagers
Grant 7,262,405 - Farnworth , et al. August 28, 2 | 2007-08-28 |
Methods for packaging microelectronic imagers
Grant 7,253,390 - Farnworth , et al. August 7, 2 | 2007-08-07 |
Substrate supports for use with programmable material consolidation apparatus and systems
App 20070179654 - Hiatt; William M. ; et al. | 2007-08-02 |
Probe card for semiconductor wafers having mounting plate and socket
Grant 7,250,780 - Hembree , et al. July 31, 2 | 2007-07-31 |
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
App 20070170350 - Farnworth; Warren M. ; et al. | 2007-07-26 |
Methods and systems for fabricating semiconductor components with through wire interconnects (TWI)
App 20070167000 - Wood; Alan G. ; et al. | 2007-07-19 |
Methods for supporting substrates during fabrication of one or more objects thereon by programmed material consolidation techniques
App 20070168074 - Hiatt; William M. ; et al. | 2007-07-19 |
Methods of processing a workpiece, methods of communicating signals with respect to a wafer, and methods of communicating signals within a workpiece processing apparatus
Grant 7,245,136 - Hembree July 17, 2 | 2007-07-17 |
Chip on board and heat sink attachment methods
Grant 7,244,637 - Hembree July 17, 2 | 2007-07-17 |
Methods for removing and reclaiming unconsolidated material from substrates following fabrication of objects thereon by programmed material consolidation techniques
App 20070157952 - Hiatt; William M. ; et al. | 2007-07-12 |
Substrate supports for use with programmable material consolidation apparatus and systems
Grant 7,239,933 - Hiatt , et al. July 3, 2 | 2007-07-03 |
Microelectronic devices and methods for forming interconnects in microelectronic devices
Grant 7,232,754 - Kirby , et al. June 19, 2 | 2007-06-19 |
Semiconductor component having plate, stacked dice and conductive vias
App 20070132104 - Farnworth; Warren M. ; et al. | 2007-06-14 |
Semiconductor components having through wire interconnects (TWI)
App 20070126091 - Wood; Alan G. ; et al. | 2007-06-07 |
Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers
Grant 7,223,626 - Farnworth , et al. May 29, 2 | 2007-05-29 |
Semiconductor component having plate and stacked dice
Grant 7,224,051 - Farnworth , et al. May 29, 2 | 2007-05-29 |
Methods for supporting substrates during fabrication of one or more objects thereon by programmable material consolidation techniques
Grant 7,225,044 - Hiatt , et al. May 29, 2 | 2007-05-29 |
Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICs will undergo, such as additional repairs
App 20070088451 - Akram; Salman ; et al. | 2007-04-19 |
Microelectronic imagers and methods of packaging microelectronic imagers
Grant 7,199,439 - Farnworth , et al. April 3, 2 | 2007-04-03 |
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
Grant 7,189,954 - Farnworth , et al. March 13, 2 | 2007-03-13 |
Microelectronic imaging units and methods of manufacturing microelectronic imaging units at the wafer level
App 20070045632 - Oliver; Steven D. ; et al. | 2007-03-01 |
Process of forming socket contacts
App 20070037418 - Akram; Salman ; et al. | 2007-02-15 |
Stress and force management techniques for a semiconductor die
App 20070018336 - Farnworth; Warren M. ; et al. | 2007-01-25 |
Methods of underfilling and encapsulating semiconductor assemblies with materials having selected properties using stereolithography
App 20070020814 - Hembree; David R. ; et al. | 2007-01-25 |
Pin-in elastomer electrical contactor and methods and processes for making and using the same
Grant 7,167,010 - Hembree January 23, 2 | 2007-01-23 |
Multi-chip module system
Grant 7,166,915 - Akram , et al. January 23, 2 | 2007-01-23 |
Semiconductor devices at least partially covered by a composite coating including particles dispersed through photopolymer material
App 20070001321 - Hembree; David R. ; et al. | 2007-01-04 |
Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs
Grant 7,155,300 - Akram , et al. December 26, 2 | 2006-12-26 |
Articles of manufacture and wafer processing apparatuses
Grant 7,148,718 - Hembree December 12, 2 | 2006-12-12 |
Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts
App 20060270108 - Farnworth; Warren M. ; et al. | 2006-11-30 |
Microelectronic imagers and methods of packaging microelectronic imagers
App 20060261340 - Farnworth; Warren M. ; et al. | 2006-11-23 |
Backside method and system for fabricating semiconductor components with conductive interconnects
App 20060261446 - Wood; Alan G. ; et al. | 2006-11-23 |
Packaged microelectronic imaging devices and methods of packaging microelectronic imaging device
App 20060255418 - Watkins; Charles M. ; et al. | 2006-11-16 |
Compliant contact pin test assembly and methods thereof
App 20060244475 - Kirby; Kyle K. ; et al. | 2006-11-02 |
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
App 20060243889 - Farnworth; Warren M. ; et al. | 2006-11-02 |
Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers
App 20060234422 - Farnworth; Warren M. ; et al. | 2006-10-19 |
Method and system for fabricating semiconductor components with through wire interconnects
App 20060228825 - Hembree; David R. | 2006-10-12 |
Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICS will undergo, such as additional repairs
Grant 7,120,513 - Akram , et al. October 10, 2 | 2006-10-10 |
Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices
Grant 7,115,961 - Watkins , et al. October 3, 2 | 2006-10-03 |
Microelectronic devices and methods for forming interconnects in microelectronic devices
App 20060199363 - Kirby; Kyle K. ; et al. | 2006-09-07 |
Methods for packaging microelectronic imagers
App 20060186317 - Farnworth; Warren M. ; et al. | 2006-08-24 |
Plating
Grant 7,090,750 - Akram , et al. August 15, 2 | 2006-08-15 |
Microelectronic workpieces and methods for forming interconnects in microelectronic workpieces
App 20060177999 - Hembree; David R. ; et al. | 2006-08-10 |
Wafer level methods for fabricating multi-dice chip scale semiconductor components
Grant 7,060,526 - Farnworth , et al. June 13, 2 | 2006-06-13 |
Semiconductor component having plate and stacked dice
App 20060113682 - Farnworth; Warren M. ; et al. | 2006-06-01 |
Method for fabricating semiconductor components with conductive vias
App 20060115932 - Farnworth; Warren M. ; et al. | 2006-06-01 |
Semiconductor test board having laser patterned conductors
Grant 7,049,700 - Hembree , et al. May 23, 2 | 2006-05-23 |
Hybrid interconnect and system for testing semiconductor dice
Grant 7,049,840 - Hembree , et al. May 23, 2 | 2006-05-23 |
Method and process of contact to a heat softened solder ball array
App 20060081583 - Hembree; David R. ; et al. | 2006-04-20 |
Spring element for use in an apparatus for attaching to a semiconductor and a method of making
Grant 7,011,532 - Hembree , et al. March 14, 2 | 2006-03-14 |
Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices
App 20060043509 - Watkins; Charles M. ; et al. | 2006-03-02 |
Methods and apparatuses for transferring heat from stacked microfeature devices
App 20060044773 - Akram; Salman ; et al. | 2006-03-02 |
Pin-in elastomer electrical contactor and methods and processes for making and using the same
App 20060043986 - Hembree; David R. | 2006-03-02 |
Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers
App 20060040421 - Farnworth; Warren M. ; et al. | 2006-02-23 |
Multi-dice chip scale semiconductor components
Grant 6,998,717 - Farnworth , et al. February 14, 2 | 2006-02-14 |
Semiconductor devices with permanent polymer stencil and method for manufacturing the same
Grant 6,998,334 - Farnworth , et al. February 14, 2 | 2006-02-14 |
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
App 20060011809 - Farnworth; Warren M. ; et al. | 2006-01-19 |
Materials for use in programmed material consolidation processes
App 20060008739 - Wood; Alan G. ; et al. | 2006-01-12 |
Semiconductor devices with permanent polymer stencil and method for manufacturing the same
App 20060003569 - Farnworth; Warren M. ; et al. | 2006-01-05 |
Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates
App 20060001139 - Wood; Alan G. ; et al. | 2006-01-05 |
Assemblies including semiconductor substrates of reduced thickness and support structures therefor
App 20060003549 - Wood; Alan G. ; et al. | 2006-01-05 |
Methods for optimizing physical characteristics of selectively consolidatable materials
App 20060003255 - Wood; Alan G. ; et al. | 2006-01-05 |
Microelectronic devices and methods for forming interconnects in microelectronic devices
App 20050287783 - Kirby, Kyle K. ; et al. | 2005-12-29 |
Underfill and encapsulation of semicondcutor assemblies with materials having differing properties and methods of fabrication using stereolithography
App 20050277231 - Hembree, David R. ; et al. | 2005-12-15 |
Compliant contact pin assembly and card system
App 20050275083 - Kirby, Kyle K. ; et al. | 2005-12-15 |
Prefabricated housings for microelectronic imagers and methods for packaging microelectronic imagers
App 20050275051 - Farnworth, Warren M. ; et al. | 2005-12-15 |
Microelectronic imagers and methods of packaging microelectronic imagers
App 20050275048 - Farnworth, Warren M. ; et al. | 2005-12-15 |
Compliant contact pin assembly and card system
App 20050275084 - Kirby, Kyle K. ; et al. | 2005-12-15 |
Method and process of contact to a heat softened solder ball array
Grant 6,967,307 - Hembree , et al. November 22, 2 | 2005-11-22 |
Wafer processing apparatuses and electronic device workpiece processing apparatuses
Grant 6,967,497 - Hembree November 22, 2 | 2005-11-22 |
Method of plating
App 20050247567 - Akram, Salman ; et al. | 2005-11-10 |
Methods of forming a contact pin assembly
App 20050229393 - Kirby, Kyle K. ; et al. | 2005-10-20 |
Compliant contact pin assembly and card system
App 20050230810 - Kirby, Kyle K. ; et al. | 2005-10-20 |
Method of making contact pin card system
App 20050233482 - Kirby, Kyle K. ; et al. | 2005-10-20 |
Compliant contact pin assembly and card system
App 20050230811 - Kirby, Kyle K. ; et al. | 2005-10-20 |
Compliant contact pin assembly and card system
App 20050230809 - Kirby, Kyle K. ; et al. | 2005-10-20 |
Semiconductor component with redistribution circuit having conductors and test contacts
Grant 6,954,000 - Hembree , et al. October 11, 2 | 2005-10-11 |
Dicing saw with variable indexing capability
App 20050211236 - Akram, Salman ; et al. | 2005-09-29 |
Stress and force management techniques for a semiconductor die
App 20050206012 - Farnworth, Warren M. ; et al. | 2005-09-22 |
Compliant contact pin assembly, card system and methods thereof
App 20050194180 - Kirby, Kyle K. ; et al. | 2005-09-08 |
Spring element for use in an apparatus for attaching to a semiconductor and a method of making
Grant 6,939,145 - Hembree , et al. September 6, 2 | 2005-09-06 |
Spring element for use in an apparatus for attaching to a semiconductor and a method of making
App 20050191876 - Hembree, David R. ; et al. | 2005-09-01 |
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions and dicing apparatus
Grant 6,932,077 - Akram , et al. August 23, 2 | 2005-08-23 |
Semiconductor component having test contacts
Grant 6,933,524 - Hembree , et al. August 23, 2 | 2005-08-23 |
Semiconductor component and interconnect having conductive members and contacts on opposing sides
Grant 6,903,443 - Farnworth , et al. June 7, 2 | 2005-06-07 |
Apparatus for continuous processing of semiconductor wafers
Grant 6,899,797 - Akram , et al. May 31, 2 | 2005-05-31 |
Apparatus for automatically positioning electronic dice within component packages
Grant 6,900,459 - Farnworth , et al. May 31, 2 | 2005-05-31 |
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
Grant 6,897,571 - Akram , et al. May 24, 2 | 2005-05-24 |
Test system with interconnect having conductive members and contacts on opposing sides
App 20050101037 - Farnworth, Warren M. ; et al. | 2005-05-12 |
Carrier for cleaning sockets for semiconductor components having contact balls
App 20050093558 - Hembree, David R. | 2005-05-05 |
Semiconductor test board having laser patterned conductors
App 20050084986 - Hembree, David R. ; et al. | 2005-04-21 |
Carrier for cleaning sockets for semiconductor components having contact balls
Grant 6,881,274 - Hembree April 19, 2 | 2005-04-19 |
Probe card for testing microelectronic components
Grant 6,881,974 - Wood , et al. April 19, 2 | 2005-04-19 |
Support structure for thinning semiconductor substrates and thinning methods employing the support structure
App 20050064681 - Wood, Alan G. ; et al. | 2005-03-24 |
Multi-dice chip scale semiconductor components
App 20050046038 - Farnworth, Warren M. ; et al. | 2005-03-03 |
Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems
Grant 6,851,597 - Hembree , et al. February 8, 2 | 2005-02-08 |
Assembly for testing silicon wafers which have a through-via
Grant 6,850,084 - Hembree February 1, 2 | 2005-02-01 |
Articles of manufacture and wafer processing apparatuses
App 20050007133 - Hembree, David R. | 2005-01-13 |
Multi-dice chip scale semiconductor components and wafer level methods of fabrication
Grant 6,841,883 - Farnworth , et al. January 11, 2 | 2005-01-11 |
Memory modules including capacity for additional memory
Grant 6,841,868 - Akram , et al. January 11, 2 | 2005-01-11 |
Multi-dice Chip Scale Semiconductor Components And Wafer Level Methods Of Fabrication
App 20040256734 - Farnworth, Warren M. ; et al. | 2004-12-23 |
Test apparatus for testing semiconductor dice including substrate with penetration limiting contacts for making electrical connections
Grant 6,828,812 - Farnworth , et al. December 7, 2 | 2004-12-07 |
Method for testing semiconductor components using interposer
Grant 6,819,127 - Hembree November 16, 2 | 2004-11-16 |
Spring element for use in an apparatus for attaching to a semiconductor and a method of attaching
Grant 6,806,493 - Hembree , et al. October 19, 2 | 2004-10-19 |
Chip on board with heat sink attachment and assembly
Grant 6,806,567 - Hembree October 19, 2 | 2004-10-19 |
Test insert with electrostatic discharge structures and associated methods
App 20040195584 - Hembree, David R. ; et al. | 2004-10-07 |
Wafer level methods for fabricating multi-dice chip scale semiconductor components
App 20040188819 - Farnworth, Warren M. ; et al. | 2004-09-30 |
Method for testing semiconductor wafers
Grant 6,798,224 - Hembree , et al. September 28, 2 | 2004-09-28 |
Substrate supports for use with programmable material consolidation apparatus and systems
App 20040186608 - Hiatt, William M. ; et al. | 2004-09-23 |
Chip on board with heat sink attachment and assembly
App 20040169272 - Hembree, David R. | 2004-09-02 |
Chip on board and heat sink attachment methods
Grant 6,784,113 - Hembree August 31, 2 | 2004-08-31 |
Methods of sensing temperature of an electronic device workpiece
App 20040164372 - Akram, Salman ; et al. | 2004-08-26 |
Handling system for use with programmable material consolidation systems and associated methods
App 20040167663 - Hiatt, William M. ; et al. | 2004-08-26 |
Methods for removing and reclaiming unconsolidated material from substrates following fabrication of objects thereon by programmed material consolidation techniques
App 20040159340 - Hiatt, William M. ; et al. | 2004-08-19 |
Cleaning components for use with programmable material consolidation apparatus and systems
App 20040159344 - Hiatt, William M. ; et al. | 2004-08-19 |
Methods for supporting substrates during fabrication of one or more objects thereon by programmable material consolidation techniques
App 20040158343 - Hiatt, William M. ; et al. | 2004-08-12 |
Method for aligning and connecting semiconductor components to substrates
Grant 6,774,651 - Hembree August 10, 2 | 2004-08-10 |
Probe card, e.g., for testing microelectronic components, and methods for making same
Grant 6,773,938 - Wood , et al. August 10, 2 | 2004-08-10 |
Probe card for semiconductor wafers and method and system for testing wafers
App 20040132222 - Hembree, David R. ; et al. | 2004-07-08 |
Chip on board and heat sink attachment methods
App 20040126931 - Hembree, David R. | 2004-07-01 |
Probe card, e.g., for testing microelectronic components, and methods for making same
App 20040113644 - Wood, Alan G. ; et al. | 2004-06-17 |
Electronic device workpieces, methods of semiconductor processing and methods of sensing temperature of an electronic device workpiece
Grant 6,744,346 - Akram , et al. June 1, 2 | 2004-06-01 |
Methods for electrical connector
Grant 6,735,855 - Akram , et al. May 18, 2 | 2004-05-18 |
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions and dicing apparatus
App 20040089282 - Akram, Salman ; et al. | 2004-05-13 |
Semiconductor component having redistribution conductors and bumped contacts on selected portions thereof
App 20040089954 - Hembree, David R. ; et al. | 2004-05-13 |
Multi-chip module system and method of fabrication
Grant 6,730,526 - Akram , et al. May 4, 2 | 2004-05-04 |
Methods for the fabrication of electrical connectors
Grant 6,725,536 - Akram , et al. April 27, 2 | 2004-04-27 |
Apparatus providing redundancy for fabricating highly reliable memory modules
Grant 6,720,652 - Akram , et al. April 13, 2 | 2004-04-13 |
CSP BGA test socket with insert and method
Grant 6,710,612 - Farnworth , et al. March 23, 2 | 2004-03-23 |
Electronic device workpieces, methods of semiconductor processing and methods of sensing temperature of an electronic device workpiece
Grant 6,709,878 - Akram , et al. March 23, 2 | 2004-03-23 |
Semiconductor component having test contacts
App 20040048401 - Hembree, David R. ; et al. | 2004-03-11 |
Spring element for use in an apparatus for attaching to a semiconductor and a method of attaching
Grant 6,703,640 - Hembree , et al. March 9, 2 | 2004-03-09 |
Test insert with electrostatic discharge structures and associated methods
App 20040041168 - Hembree, David R. ; et al. | 2004-03-04 |
Probe Card , E.g., For Testing Microelectronic Components, And Methods For Making Same
App 20040040149 - Wood, Alan G. ; et al. | 2004-03-04 |
Method and process of contact to a heat softened solder ball array
App 20040035841 - Hembree, David R. ; et al. | 2004-02-26 |
Plating
App 20040035712 - Akram, Salman ; et al. | 2004-02-26 |
Circuit and method for heating an adhesive to package or rework a semiconductor die
Grant 6,696,669 - Hembree , et al. February 24, 2 | 2004-02-24 |
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
Grant 6,691,696 - Akram , et al. February 17, 2 | 2004-02-17 |
Method for fabricating interconnect having support members for preventing component flexure
Grant 6,687,989 - Farnworth , et al. February 10, 2 | 2004-02-10 |
Sawing method employing multiple indexing techniques and semiconductor device structures fabricated thereby
Grant 6,687,990 - Akram , et al. February 10, 2 | 2004-02-10 |
Semiconductor devices with permanent polymer stencil and method for manufacturing the same
App 20040005770 - Farnworth, Warren M. ; et al. | 2004-01-08 |
Method for aligning and connecting semiconductor components to substrates
Grant 6,670,818 - Hembree December 30, 2 | 2003-12-30 |
Method for filling a wafer through-via with a conductive material
App 20030215568 - Hembree, David R. | 2003-11-20 |
Electrical connector
Grant 6,648,654 - Akram , et al. November 18, 2 | 2003-11-18 |
Apparatus for forming coaxial silicon interconnects
Grant 6,646,458 - Akram , et al. November 11, 2 | 2003-11-11 |
Test carrier with molded interconnect for testing semiconductor components
Grant 6,642,730 - Hembree , et al. November 4, 2 | 2003-11-04 |
Method and apparatus for testing semiconductor dice
Grant 6,639,416 - Akram , et al. October 28, 2 | 2003-10-28 |
Spring element for use in an apparatus for attaching to a semiconductor and a method of making
App 20030192172 - Hembree, David R. ; et al. | 2003-10-16 |
Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions
Grant 6,631,662 - Akram , et al. October 14, 2 | 2003-10-14 |
Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's undergo, such as additional repairs
App 20030191550 - Akram, Salman ; et al. | 2003-10-09 |
Chip on board and heat sink attachment methods
Grant 6,630,371 - Hembree October 7, 2 | 2003-10-07 |
CSP BGA test socket with insert
Grant 6,630,836 - Farnworth , et al. October 7, 2 | 2003-10-07 |
CSP BGA test socket with insert and method
Grant 6,628,128 - Farnworth , et al. September 30, 2 | 2003-09-30 |
Electronic device workpieces, methods of semiconductor processing and methods of sensing temperature of an electronic device workpiece
App 20030173635 - Akram, Salman ; et al. | 2003-09-18 |
Method for testing bumped semiconductor components
Grant 6,620,633 - Hembree , et al. September 16, 2 | 2003-09-16 |
Method for fabricating semiconductor components and interconnects with contacts on opposing sides
Grant 6,620,731 - Farnworth , et al. September 16, 2 | 2003-09-16 |
Methods to utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems
Grant 6,619,532 - Hembree , et al. September 16, 2 | 2003-09-16 |
Method of forming a test insert for interfacing a device containing contact bumps with a test substrate
Grant 6,617,687 - Akram , et al. September 9, 2 | 2003-09-09 |
Method and process of contact to a heat softened solder ball array
Grant 6,614,003 - Hembree , et al. September 2, 2 | 2003-09-02 |
Method for continuous processing of semiconductor wafers
Grant 6,605,205 - Akram , et al. August 12, 2 | 2003-08-12 |
Force applying probe card and test system for semiconductor wafers
Grant 6,600,334 - Hembree , et al. July 29, 2 | 2003-07-29 |
Method of making a spring element for use in an apparatus for attaching to a semiconductor
Grant 6,598,290 - Hembree , et al. July 29, 2 | 2003-07-29 |
Chip on board and heat sink attachment methods
Grant 6,596,565 - Hembree July 22, 2 | 2003-07-22 |
Method for filling a wafer through-via with a conductive material
Grant 6,589,594 - Hembree July 8, 2 | 2003-07-08 |
Apparatus for continuous processing of semiconductor wafers
App 20030116429 - Akram, Salman ; et al. | 2003-06-26 |
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
Grant 6,578,458 - Akram , et al. June 17, 2 | 2003-06-17 |
Method and apparatus for automatically positioning electronic dice within component packages
App 20030088973 - Farnworth, Warren M. ; et al. | 2003-05-15 |
Method of making a socket assembly for use with a solder ball
Grant 6,562,545 - Hembree , et al. May 13, 2 | 2003-05-13 |
Method for fabricating semiconductor components and interconnects with contacts on opposing sides
App 20030080408 - Farnworth, Warren M. ; et al. | 2003-05-01 |
Method of using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs
Grant 6,553,276 - Akram , et al. April 22, 2 | 2003-04-22 |
Test carrier with molded interconnect for testing semiconductor components
Grant 6,544,461 - Hembree , et al. April 8, 2 | 2003-04-08 |
Methods of semiconductor processing
App 20030059960 - Akram, Salman ; et al. | 2003-03-27 |
Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems
App 20030057260 - Hembree, David R. ; et al. | 2003-03-27 |
Electronic system including memory module with redundant memory capability
Grant 6,531,772 - Akram , et al. March 11, 2 | 2003-03-11 |
Electrical connector
App 20030037870 - Akram, Salman ; et al. | 2003-02-27 |
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
App 20030030122 - Akram, Salman ; et al. | 2003-02-13 |
Method for filling a wafer through-VIA with a conductive material
App 20030017687 - Hembree, David R. | 2003-01-23 |
CSP BGA test socket with insert and method
App 20030011393 - Farnworth, Warren M. ; et al. | 2003-01-16 |
Apparatus and methods for substantial planarization of solder bumps
Grant 6,503,127 - Hembree January 7, 2 | 2003-01-07 |
Method for forming coaxial silicon interconnects
App 20030001603 - Akram, Salman ; et al. | 2003-01-02 |
Sawing method employing multiple indexing techniques and semiconductor device structures fabricated thereby
App 20020194968 - Akram, Salman ; et al. | 2002-12-26 |
Carrier for cleaning sockets for semiconductor components having contact balls
App 20020195122 - Hembree, David R. | 2002-12-26 |
CSP BGA test socket with insert and method
App 20020190739 - Farnworth, Warren M. ; et al. | 2002-12-19 |
Method and apparatus providing redundancy for fabricating highly reliable memory modules
App 20020185731 - Akram, Salman ; et al. | 2002-12-12 |
Method for automatically positioning electronic die within component packages
Grant 6,492,187 - Farnworth , et al. December 10, 2 | 2002-12-10 |
Chip on board and heat sink attachment methods
App 20020182781 - Hembree, David R. | 2002-12-05 |
Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems
App 20020179681 - Hembree, David R. ; et al. | 2002-12-05 |
Method and process of contact to a heat softened solder ball array
App 20020179584 - Hembree, David R. ; et al. | 2002-12-05 |
Circuit and method for heating an adhesive to package or rework a semiconductor die
App 20020175153 - Hembree, David R. ; et al. | 2002-11-28 |
Chip on board and heat sink attachment methods
App 20020177258 - Hembree, David R. | 2002-11-28 |
Methods of semiconductor processing
Grant 6,472,240 - Akram , et al. October 29, 2 | 2002-10-29 |
Method For Fabricating Semiconductor Components
App 20020139976 - Hembree, David R. ; et al. | 2002-10-03 |
Electrical connector
App 20020133941 - Akram, Salman ; et al. | 2002-09-26 |
Methodology of removing misplaced encapsulant for attachment of heat sinks in a chip on board package
Grant 6,451,709 - Hembree September 17, 2 | 2002-09-17 |
Spring element for use in an apparatus for attaching to a semiconductor and a method for making
App 20020117791 - Hembree, David R. ; et al. | 2002-08-29 |
Circuit and method for heating an adhesive to package or rework a semiconductor die
App 20020108940 - Hembree, David R. ; et al. | 2002-08-15 |
Methodology of removing misplaced encapsulant for attachment of heat sinks in a chip on board package
Grant 6,432,840 - Hembree August 13, 2 | 2002-08-13 |
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
Grant 6,427,676 - Akram , et al. August 6, 2 | 2002-08-06 |
Insert for seating a microelectronic device having a protrusion and a plurality of raised-contacts
Grant 6,426,642 - Akram , et al. July 30, 2 | 2002-07-30 |
Circuit and method for heating an adhesive to package or rework a semiconductor die
Grant 6,426,484 - Hembree , et al. July 30, 2 | 2002-07-30 |
Apparatus and methods for substantial planarization of solder bumps
Grant 6,422,923 - Hembree July 23, 2 | 2002-07-23 |
Calibration target for calibrating semiconductor wafer test systems
Grant 6,420,892 - Krivy , et al. July 16, 2 | 2002-07-16 |
Method and process of contact to a heat softened solder ball array
Grant 6,420,681 - Hembree , et al. July 16, 2 | 2002-07-16 |
Apparatus and methods for substantial planarization of solder bumps
Grant 6,419,550 - Hembree July 16, 2 | 2002-07-16 |
Test system having alignment member for aligning semiconductor components
Grant 6,417,685 - Akram , et al. July 9, 2 | 2002-07-09 |
Method for forming coaxial silicon interconnects
App 20020084796 - Akram, Salman ; et al. | 2002-07-04 |
Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs
App 20020082740 - Akram, Salman ; et al. | 2002-06-27 |
Micromachined chip scale package
Grant 6,407,451 - Akram , et al. June 18, 2 | 2002-06-18 |
Test system having alignment member for aligning semiconductor components
Grant 6,400,174 - Akram , et al. June 4, 2 | 2002-06-04 |
Electrical connector
Grant 6,397,460 - Hembree June 4, 2 | 2002-06-04 |
Multi-chip module system and method of fabrication
Grant 6,395,565 - Akram , et al. May 28, 2 | 2002-05-28 |
Multi-chip module system and method of fabrication
App 20020053733 - Akram, Salman ; et al. | 2002-05-09 |
Multi-chip module system and method of fabrication
App 20020052054 - Akram, Salman ; et al. | 2002-05-02 |
CSP BGA test socket with insert and method
App 20020047720 - Farnworth, Warren M. ; et al. | 2002-04-25 |
Methods Of Sensing Temperature Of An Electronic Device Workpiece And Methods Of Semiconductor Processing
App 20020034832 - AKRAM, SALMAN ; et al. | 2002-03-21 |
Method and apparatus providing redundancy for fabricating highly reliable memory modules
App 20020020914 - Akram, Salman ; et al. | 2002-02-21 |
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
App 20020017177 - Akram, Salman ; et al. | 2002-02-14 |
Test insert containing vias for interfacing a device containing contact bumps with a test substrate
App 20020000829 - Akram, Salman ; et al. | 2002-01-03 |
Apparatus and methods fo substantial planarization of solder bumps
App 20010053657 - Hembree, David R. | 2001-12-20 |
Method and apparatus for continuous processing of semiconductor wafers
App 20010052464 - Akram, Salman ; et al. | 2001-12-20 |
Memory modules including capacity for additional memory
App 20010052637 - Akram, Salman ; et al. | 2001-12-20 |
Method of forming a test insert for interfacing a device containing contact bumps with a test substrate
App 20010053567 - Akram, Salman ; et al. | 2001-12-20 |
Test Carrier For Testing Semiconductor Components Including Interconnect With Support Members For Preventing Component Flexure
App 20010052785 - FARNWORTH, WARREN M. ; et al. | 2001-12-20 |
Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems
App 20010048018 - Hembree, David R. ; et al. | 2001-12-06 |
Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems
App 20010045446 - Hembree, David R. ; et al. | 2001-11-29 |
Apparatus and methods for substantial planarization of solder bumps
App 20010046832 - Hembree, David R. | 2001-11-29 |
Apparatus and methods for substantial planarization of solder bumps
App 20010044262 - Hembree, David R. | 2001-11-22 |
Test Carrier With Molded Interconnect For Testing Semiconductor Components
App 20010043074 - HEMBREE, DAVID R. ; et al. | 2001-11-22 |
Apparatus and methods for substantial planarization of solder bumps
App 20010041516 - Hembree, David R. | 2001-11-15 |
Apparatus and methods for substantial planarization of solder bumps
App 20010041506 - Hembree, David R. | 2001-11-15 |
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
App 20010039728 - Akram, Salman ; et al. | 2001-11-15 |
Apparatus and methods for substantial planarization of solder bumps
App 20010041503 - Hembree, David R. | 2001-11-15 |
Apparatus and methods for substantial planarization of solder bumps
App 20010041518 - Hembree, David R. | 2001-11-15 |
Apparatus and methods for substantial planarization of solder bumps
App 20010041504 - Hembree, David R. | 2001-11-15 |
Apparatus and methods for substantial planarization of solder bumps
App 20010041515 - Hembree, David R. | 2001-11-15 |
Apparatus and methods for substantial planarization of solder bumps
App 20010041505 - Hembree, David R. | 2001-11-15 |
Apparatus and methods for substantial planarization of solder bumps
App 20010039165 - Hembree, David R. | 2001-11-08 |
Apparatus and methods for substantial planarization of solder bumps
App 20010039164 - Hembree, David R. | 2001-11-08 |
Bondpad Attachments Having Self-limiting Properties For Penetration Of Semiconductor Die
App 20010024118 - FARNWORTH, WARREN M. ; et al. | 2001-09-27 |
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
App 20010023973 - Akram, Salman ; et al. | 2001-09-27 |
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
App 20010023113 - Akram, Salman ; et al. | 2001-09-20 |
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
App 20010020408 - Akram, Salman ; et al. | 2001-09-13 |
An electronic device workpiece processing intermediate member
App 20010017551 - Hembree, David R. | 2001-08-30 |
| 