U.S. patent application number 11/516099 was filed with the patent office on 2007-01-25 for methods of underfilling and encapsulating semiconductor assemblies with materials having selected properties using stereolithography.
Invention is credited to Warren M. Farnworth, David R. Hembree.
Application Number | 20070020814 11/516099 |
Document ID | / |
Family ID | 35461055 |
Filed Date | 2007-01-25 |
United States Patent
Application |
20070020814 |
Kind Code |
A1 |
Hembree; David R. ; et
al. |
January 25, 2007 |
Methods of underfilling and encapsulating semiconductor assemblies
with materials having selected properties using
stereolithography
Abstract
Methods of forming semiconductor packages include immersing a
semiconductor device assembly in a liquid photopolymerizable resin
including a plurality of discrete particles dispersed therethrough,
and selectively at least partially curing portions of the resin
adjacent at least one semiconductor die of the semiconductor device
assembly. In some embodiments, the semiconductor device assembly
may be immersed in a second liquid photopolymerizable resin having
at least one physical property differing from the first liquid
photopolymerizable resin, and the second liquid photopolymerizable
resin may be selectively at least partially cured. Furthermore, the
semiconductor die may have an active surface including an array of
optically interactive semiconductor devices, and portions of the
liquid photopolymerizable resin surrounding a periphery of the
array may be selectively at least partially cured to form a
substantially opaque support structure.
Inventors: |
Hembree; David R.; (Boise,
ID) ; Farnworth; Warren M.; (Nampa, ID) |
Correspondence
Address: |
TRASK BRITT
P.O. BOX 2550
SALT LAKE CITY
UT
84110
US
|
Family ID: |
35461055 |
Appl. No.: |
11/516099 |
Filed: |
September 5, 2006 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
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10867257 |
Jun 14, 2004 |
|
|
|
11516099 |
Sep 5, 2006 |
|
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|
Current U.S.
Class: |
438/124 ;
257/E21.503; 257/E21.515; 257/E23.114; 257/E23.121 |
Current CPC
Class: |
H01L 2224/73104
20130101; H01L 2924/01075 20130101; H01L 2224/81136 20130101; H01L
2224/8121 20130101; H01L 2924/01018 20130101; H01L 2224/13016
20130101; H01L 2924/00014 20130101; H01L 24/27 20130101; H01L
2224/27554 20130101; H01L 2224/2908 20130101; H01L 2924/3025
20130101; H01L 23/552 20130101; H01L 2224/29386 20130101; H01L
2224/73204 20130101; H01L 2924/12042 20130101; H01L 21/563
20130101; H01L 23/295 20130101; H01L 24/743 20130101; H01L
2224/1147 20130101; H01L 2224/83192 20130101; H01L 2924/351
20130101; H01L 24/29 20130101; H01L 2224/13386 20130101; H01L
2224/16225 20130101; H01L 2224/83192 20130101; H01L 2924/00014
20130101; H01L 24/81 20130101; H01L 2224/05568 20130101; H01L
2224/83851 20130101; H01L 24/90 20130101; H01L 2224/13386 20130101;
H01L 2224/05573 20130101; H01L 2224/293 20130101; H01L 2924/3512
20130101; B33Y 80/00 20141201; H01L 2924/00014 20130101; H01L
2924/00014 20130101; H01L 2924/00012 20130101; H01L 2224/05599
20130101; H01L 2924/00 20130101; H01L 2924/0665 20130101; H01L
2924/00 20130101; H01L 2224/73204 20130101; H01L 2924/0503
20130101; H01L 2224/16225 20130101; H01L 2924/00 20130101; H01L
2924/00014 20130101; H01L 2224/16225 20130101; H01L 2924/00
20130101; H01L 2224/32225 20130101; H01L 2924/00014 20130101; H01L
2924/00014 20130101; H01L 2224/32225 20130101; H01L 2224/32225
20130101; H01L 2924/00 20130101; H01L 2924/00014 20130101; H01L
2224/83194 20130101; H01L 2924/0106 20130101; H01L 2224/73203
20130101; H01L 2224/81903 20130101; H01L 2924/01033 20130101; H01L
24/13 20130101; H01L 27/14618 20130101; H01L 2224/16237 20130101;
H01L 2224/81815 20130101; H01L 2224/81815 20130101; H01L 2924/12042
20130101; H01L 2224/32225 20130101; H01L 2924/01005 20130101; H01L
27/1462 20130101; H01L 2224/73204 20130101; H01L 2224/81192
20130101; H01L 2224/90 20130101; H01L 2224/1329 20130101; H01L
2224/293 20130101; H01L 2224/81855 20130101; H01L 2224/81855
20130101; H01L 2224/83192 20130101; H01L 2924/351 20130101; B33Y
30/00 20141201; H01L 2924/01077 20130101; H01L 2224/2929 20130101;
H01L 2224/83191 20130101; H01L 24/83 20130101; H01L 2224/1329
20130101; H01L 2224/2929 20130101 |
Class at
Publication: |
438/124 |
International
Class: |
H01L 21/00 20060101
H01L021/00 |
Claims
1. A method of forming a semiconductor package, comprising:
providing a carrier substrate bearing a plurality of conductive
traces; securing at least one semiconductor die having lateral
sides, a back side, and an active surface including a plurality of
discrete conductive elements projecting therefrom by the plurality
of discrete conductive elements to the conductive traces of the
carrier substrate to form a semiconductor device assembly;
immersing the semiconductor device assembly in a first liquid
photopolymerizable resin including a plurality of discrete
particles dispersed therethrough; and selectively at least
partially curing portions of the first liquid photopolymerizable
resin adjacent the at least one semiconductor die.
2. The method according to claim 1, further comprising at least
partially curing portions of the first liquid photopolymerizable
resin to form an underfill structure that substantially fills a
volume between the at least one semiconductor die and the carrier
substrate.
3. The method according to claim 2, further comprising submerging
the semiconductor assembly to a depth wherein the first liquid
photopolymerizable resin overlies the at least one semiconductor
die and at least partially curing the first liquid
photopolymerizable resin to fully enclose the at least one
semiconductor die.
4. The method according to claim 3, further comprising selecting
the discrete particles to comprise boron nitride.
5. The method according to claim 1, further comprising: immersing
the semiconductor device assembly in a second liquid
photopolymerizable resin prior to immersion in and selectively at
least partially curing portions of the first liquid
photopolymerizable resin; at least partially curing the second
liquid photopolymerizable resin within a volume between the at
least one semiconductor die and the carrier substrate and a lateral
periphery surrounding the at least one semiconductor die to form an
underfill structure; and at least partially curing portions of the
first liquid photopolymerizable resin to form a cover structure
that covers the back side of the at least one semiconductor die and
is contiguous with the underfill structure.
6. The method according to claim 5, further comprising selecting
the discrete particles to comprise boron nitride.
7. The method according to claim 5, further comprising immersing
the semiconductor device assembly in a third liquid
photopolymerizable resin and at least partially curing portions of
the third liquid photopolymerizable resin to at least partially
enclose the at least one semiconductor die, the underfill
structure, and the cover structure.
8. The method according to claim 7, further comprising selecting
the third liquid photopolymerizable resin to include a plurality of
discrete particles comprising an elemental metal or an alloy.
9. The method according to claim 1, further comprising: immersing
the semiconductor device assembly in a second liquid
photopolymerizable resin prior to immersion in and selectively at
least partially curing portions of the first liquid
photopolymerizable resin; at least partially curing the second
liquid photopolymerizable resin within a volume between the at
least one semiconductor die and the carrier substrate and a lateral
periphery surrounding the at least one semiconductor die to form an
underfill structure; and at least partially curing portions of the
first liquid photopolymerizable resin to surround a lateral
periphery of the at least one semiconductor die and be contiguous
with the underfill structure.
10. The method according to claim 9, further comprising selecting
the discrete particles to comprise an elemental metal or an
alloy.
11. The method according to claim 1, further comprising: wherein
the selectively at least partially curing portions of the first
liquid photopolymerizable resin comprises forming a first layer
thereof on the carrier substrate located in a region between the
carrier substrate and the at least one semiconductor die; immersing
the semiconductor device assembly in at least one additional liquid
photopolymerizable resin including a plurality of discrete
particles to cause the at least one additional liquid
photopolymerizable resin to fill a volume between the at least one
semiconductor die and the first layer; and selectively at least
partially curing portions of the at least one additional liquid
photopolymerizable resin to form a second layer contiguous with the
first layer.
12. The method according to claim 11, further comprising
formulating the at least one additional liquid photopolymerizable
resin including a plurality of discrete particles to cause the
second layer to have a coefficient of thermal expansion less than
that of the first layer.
13. The method according to claim 12, further comprising selecting
the discrete particles to comprise boron nitride or a silicate.
14. A method of forming a semiconductor package comprising:
providing a carrier substrate having a plurality of conductive
traces; immersing the carrier substrate in a first liquid
photopolymerizable resin to cover the carrier substrate with a
layer thereof, the first liquid photopolymerizable resin having a
first coefficient of thermal expansion in a cured state;
selectively at least partially curing the layer of the first liquid
photopolymerizable resin to form a first layer exposing at least a
portion of the plurality of the conductive traces through a
plurality of apertures; depositing a conductive material in the
plurality of apertures; securing at least one semiconductor die
including a plurality of discrete conductive elements to the
carrier substrate to form a semiconductor device assembly, the
plurality of discrete conductive elements in electrical
communication with the plurality of conductive traces of the
carrier substrate; immersing the semiconductor device assembly in a
second liquid photopolymerizable resin, the second liquid
photopolymerizable resin having a second coefficient of thermal
expansion in a cured state less than the first coefficient of
thermal expansion; and selectively at least partially curing the
second liquid photopolymerizable resin to form a second layer that
fills at least a portion of a region between the first layer and
the at least one semiconductor die and substantially seals the at
least one semiconductor die.
15. The method according to claim 14, further comprising, prior to
depositing the conductive material in the plurality of apertures,
forming one or more additional layers from a cured photopolymer
material, wherein the one or more additional layers and the first
layer exhibit a gradient in coefficient of thermal expansion that
decreases in a direction from the first layer toward the one or
more additional layers.
16. The method according to claim 14, further comprising curing the
first layer and the second layer to form a unitary structure.
17. The method according to claim 15, further comprising curing the
first layer, the second layer, and the one or more additional
layers to form a unitary structure.
18. The method according to claim 14, further comprising selecting
the second layer to have a concentration of discrete particles that
is greater than a concentration of discrete particles of the first
layer.
19. The method according to claim 18, further comprising selecting
the discrete particles to comprise boron nitride or a silicate.
20. A method of forming a semiconductor package, comprising:
providing at least one semiconductor die having an active surface
including an array of optically interactive semiconductor devices;
immersing the at least one semiconductor die in a first liquid
photopolymerizable resin; and selectively at least partially curing
portions of the first liquid photopolymerizable resin surrounding a
periphery of the array to form a substantially opaque support
structure.
21. The method according to claim 20, further comprising: immersing
the at least one semiconductor die in a second liquid
photopolymerizable resin; and selectively at least partially curing
portions of the second liquid photopolymerizable resin covering the
array.
22. The method according to claim 21, further comprising fixing at
least one lens to the support structure over the array.
23. The method according to claim 20, further comprising fixing at
least one lens to the support structure.
24. The method according to claim 23, further comprising disposing
an infrared filter between the at least one lens and the active
surface.
25. The method according to claim 20, further comprising
formulating the first liquid photopolymerizable resin to include a
plurality of discrete particles.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a divisional of application Ser. No.
10/867,257, filed Jun. 14, 2004, pending.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to the underfilling and
encapsulation of semiconductor devices on a carrier substrate. More
specifically, the present invention relates to a method of
fabricating a semiconductor assembly, wherein the underfill and
encapsulation materials may exhibit differing material properties
and are formed using stereolithography.
[0004] 2. State of the Art
[0005] Flip-chip style packaging for semiconductor dice is becoming
ever more popular. In a flip-chip package, an array or pattern of
external conductive elements such as solder bumps, or conductive or
conductor-filled epoxy pillars, protrude from the active surface of
the semiconductor die for use in mechanically and electrically
connecting the semiconductor die to the patterned ends of
conductive traces of higher level packaging, such as a carrier
substrate.
[0006] There is typically a substantial mismatch in the coefficient
of thermal expansion (CTE) between the material of the
semiconductor die and that of the carrier substrate, such as a
printed circuit board or interposer, bearing the conductive traces
to which the external conductive elements of the die are bonded.
Due to this substantial CTE mismatch, significant stresses develop
between the semiconductor die and carrier substrate during normal
thermal cycling. Without a strong mechanical attachment of the
semiconductor die to the substrate, the die may debond from the
carrier substrate, or one or more of the external conductive
elements may fracture or release from its corresponding conductive
trace. In addition, the small spacing or pitch of the external
conductive elements creates a significant potential for shorting
between adjacent conductive elements or conductive elements and
adjacent carrier substrate traces due to the presence of a dust
particle or condensed moisture between the semiconductor die and
the carrier substrate. Therefore, when a flip-chip type of
electronic device, such as a semiconductor die, is conductively
attached to a carrier substrate, underfilling the space between the
device and substrate with an electrically insulative material is
very desirable to enhance the mechanical bond between the die and
the carrier substrate and to dielectrically isolate adjacent
electrical connections between the die and the carrier
substrate.
[0007] In the past, underfilling has been achieved using a
dielectric, polymeric material that is heated to a temperature
sufficient for it to flow. A vacuum source is typically used to
draw the heated, viscous, dielectric material to fill the region
between the substrate and the semiconductor die. However, effecting
adequate removal of air, water vapor, and moisture from between the
substrate and the semiconductor die has always been a problem
associated with the conventional underfill process. A more
controlled and precise manufacturing technique termed
"stereolithography," also known as "layered manufacturing," has
been employed recently to form the underfill and encapsulation
region in semiconductor packages.
[0008] A representative patent disclosing forming the underfill and
encapsulation structures of semiconductor device assemblies using
stereolithography, assigned to the current assignee of the present
application, is U.S. Pat. No. 6,537,482 to Farnworth (hereinafter
"the '482 Farnworth Patent"), the disclosure of which is herein
incorporated by reference. As shown in FIG. 1, the '482 Farnworth
Patent discloses semiconductor device assembly 40 having an
underfill and encapsulation region formed using stereolithography.
Semiconductor dice 20 having an active surface 22, backside 18, and
lateral sides 24 is illustrated having a flip-chip configuration
using a ball grid array (BGA) of external conductive elements 30
bonded to a plurality of conductive bond pads 32 contained on the
active surface 22. The external conductive elements 30 are bonded
to conductive traces 14 on the face 12 of the carrier substrate 10.
An underfill 50 is formed of a polymerized material that fills the
spaces 34 between each semiconductor die 20 and the carrier
substrate 10. An encapsulation region 48 formed of a polymerized
material, contiguous with the underfill 50, seals and protects each
semiconductor die 20. The underfill 50 and the encapsulation region
48 are formed by immersing the semiconductor device assembly to a
predetermined depth in a bath of a liquid photopolymer resin and
subsequently curing it using either a controlled light source,
thermal process, or both. The process is repeated as necessary to
form the complete semiconductor package as exemplified by the
semiconductor device assembly 40 shown in FIG. 1.
[0009] While the '482 Farnworth Patent provides a useful method for
encapsulating and underfilling a semiconductor die to form a
semiconductor package, it is limited to forming the underfill and
encapsulation regions from a photopolymerizable material having
uniform material properties and formed from conventional
photopolymerizable materials. Therefore, it is desirable to develop
a method that enables varying the photopolymerizable material used
to form the underfill and encapsulation regions of the
semiconductor package. Furthermore, it would be desirable to tailor
the material properties of the photopolymerizable material used to
form the underfill and encapsulation structures in specific regions
to reduce the thermal stresses experienced by the semiconductor
package in service and enable protection of the semiconductor
package from external elements.
BRIEF SUMMARY OF THE INVENTION
[0010] The present invention, in a number of embodiments, includes
underfill and encapsulation structures using a variety of
photopolymerizable materials exhibiting differing material
properties to package semiconductor devices and assemblies. Methods
for fabricating the semiconductor packages employing
stereolithography are also disclosed.
[0011] In a broad exemplary embodiment, a semiconductor device
assembly includes at least one semiconductor die having a back side
and an active surface including a plurality of discrete conductive
elements projecting therefrom. The discrete conductive elements of
the at least one semiconductor die are in electrical communication
with a plurality of conductive traces of a carrier substrate. At
least a portion of the semiconductor device assembly may be covered
with a cured photopolymer material, wherein the cured photopolymer
material includes a polymerized matrix having a plurality of
discrete particles dispersed therethrough.
[0012] In an exemplary embodiment, the discrete particles of the
cured photopolymer material may be formed from a material such as,
for example, boron nitride, which enables efficient heat transfer
from the semiconductor device assembly. The cured photopolymer
material may form an underfill structure between the at least one
semiconductor die and the carrier substrate. In another exemplary
embodiment, the cured photopolymer material may further sealingly
enclose the at least one semiconductor die.
[0013] In another exemplary embodiment, a first cured photopolymer
material may underfill the region between the at least one
semiconductor die and the carrier substrate and cover at least
portions of the lateral sides of the semiconductor die. A second
cured photopolymer material that includes a polymerized matrix
having a plurality of discrete particles dispersed therethrough
formed from a material such as, for example, boron nitride, may
cover the backside of the at least one semiconductor die to form a
contiguous structure with the first cured photopolymer material. In
another exemplary embodiment, the second cured photopolymer
material may exhibit an electrical conductivity greater than that
of the first polymerized material forming the underfill structure.
The second cured photopolymer material may include a plurality of
conductive particles formed from elemental metals or alloys to at
least partially surround the at least one semiconductor die and
improve electrostatic discharge protection and radio frequency
shielding.
[0014] In yet another exemplary embodiment, the underfill structure
that fills the region between the at least one semiconductor die
and the carrier substrate may be formed from at least two layers of
cured photopolymer materials. This underfill structure exhibits a
coefficient of thermal expansion (CTE) gradient that decreases in a
direction from the carrier substrate to the opposing face of the
semiconductor die. By tailoring the CTE of each layer of cured
photopolymer material, the thermal stresses caused by the CTE
difference between carrier substrate and the at least one
semiconductor die may be reduced. Additional photopolymer materials
may be used to at least partially enclose the at least one
semiconductor die.
[0015] In yet another exemplary embodiment, a semiconductor package
for packaging an array of optically interactive semiconductor
devices is disclosed. An array of optically interactive
semiconductor devices may be surrounded by a substantially opaque
support structure formed from a first cured photopolymer material.
In another exemplary embodiment, a second cured photopolymer
material covers the array of optically interactive semiconductor
devices to protect the array.
[0016] These features, advantages, and alternative aspects of the
present invention will be apparent to those skilled in the art from
a consideration of the following detailed description taken in
combination with the accompanying drawings.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS
[0017] In the drawings, which illustrate what is currently
considered to be the best mode for carrying out the invention:
[0018] FIG. 1 illustrates a sectional view of a prior art
semiconductor device assembly.
[0019] FIG. 2 illustrates a stereolithography apparatus that may be
used to practice the present invention.
[0020] FIG. 3 illustrates a perspective view of an exemplary
semiconductor device assembly having a flip-chip configuration.
[0021] FIG. 4 illustrates a sectional view of the semiconductor
device assembly of FIG. 3 taken along line 4-4.
[0022] FIG. 5 illustrates a sectional view of the semiconductor
device assembly of FIG. 3 taken along line 5-5.
[0023] FIGS. 6A through 6C illustrate an exemplary method for
fabricating the present invention.
[0024] FIG. 7 illustrates a sectional view of another exemplary
semiconductor device assembly employing two different types of
photopolymer materials to form the semiconductor package.
[0025] FIGS. 8A and 8B illustrate sectional views of exemplary
semiconductor device assemblies employing two different types of
photopolymer materials to form the semiconductor package.
[0026] FIGS. 9A through 9C illustrate a sectional view of another
exemplary semiconductor device assembly having a layered underfill
structure.
[0027] FIGS. 10A through 10C illustrate an exemplary process for
forming the underfill structure shown in FIGS. 9A through 9C.
[0028] FIGS. 11A through 11C illustrate another exemplary process
for forming the underfill structure shown in FIGS. 9A-9C.
[0029] FIGS. 12A and 12B illustrate sectional views of an optically
interactive semiconductor device packaged using various
photopolymer materials.
DETAILED DESCRIPTION OF THE INVENTION
[0030] The present invention, in a number of embodiments, employs
stereolithography processing to form the packaging for
semiconductor devices and semiconductor assemblies. In accordance
with the present invention, liquid photopolymerizable resins
exhibiting different material properties when cured maybe used to
form various regions of underfill and encapsulation structures to
tailor the material properties thereof for specific
applications.
[0031] The semiconductor packages of the present invention may be
formed using stereolithography systems known in the art. One such
system is disclosed in the aforementioned '482 Farnworth Patent.
The reader is directed to the disclosure of the '482 Farnworth
Patent for specific details; however, the general aspects of the
stereolithography system will be elaborated below in the
description of FIG. 2.
[0032] FIG. 2 schematically illustrates a stereolithographic
apparatus 100 for underfilling, encapsulating, and forming other
various structures for packaging semiconductor devices and
assemblies. A plurality of flip-chip semiconductor dice 20 mounted
on a carrier substrate 10 is shown in FIG. 2. The apparatus 100 is
shown in a purge mode, wherein semiconductor device assembly 40 is
mounted on a support surface 122 of a manipulatable support
platform 120, tilted and immersed in a reservoir of liquid
photopolymer resin 60. Purge mode, as used in the art, means
immersing the semiconductor assembly 40 at an angle in order to
assist with removal of gases, water vapor, and moisture from the
interstitial volume between the carrier substrate 10 and the
semiconductor die 20. Platform 120 is supported by and manipulated
in a vertical direction 82 and preferably in a horizontal direction
84 as well, by motion actuator 80 acting through arm 74 to insert
and remove the semiconductor assembly 40 into the reservoir 104 of
liquid photopolymer 60. Reservoir 104 may be configured to be
removable from the apparatus 100 to enable replacing the reservoir
104 with a different reservoir 104 containing a new liquid
photopolymer resin 60 or the reservoir 104 may be drained and
re-filled with a new liquid photopolymer resin 60. The motion
actuator 80 as well as the generator 72, vibration element 76 or 78
are controlled by a program operating in computer (microprocessor)
102 and stored in memory 106. A generally low-power vibration 70
may be applied to the liquid photopolymer 60 by sonic or ultrasonic
generator 72 or, alternatively, a vibration element 76 or 78 may be
connected to the platform 120. FIG. 2 also illustrates other parts
of the stereolithography apparatus 100 not typically used in the
purge mode, such as laser 108 configured to project a laser beam
110, beam mirror 114 and camera 124, and optional cameras 126, 128
and 130. As known in the art, a data file containing the structure
of the underfill and encapsulation structure, and the intermediate
structures to be formed using the stereolithography apparatus 100
are stored in the memory of computer 102. The data files may be a
3-D CAD file or, preferably, a Stereolithography (STL) file as
employed by most stereolithography equipment manufacturers.
[0033] The semiconductor assembly 40 supported by platform 120 may
be immersed into the reservoir 104 of liquid photopolymer resin 60
covering the semiconductor device assembly 40 with a precise amount
of liquid photopolymer 60. While still submerged and positioned to
be substantially horizontal, the layer of liquid photopolymer
covering the semiconductor assembly 40 may then be irradiated by
the beam 112 to cure or partially cure at least a portion of it.
The individual stereolithographic acts required to form the
underfill and encapsulation structures of the present invention are
discussed in more detail below with respect to FIGS. 3-12. The
surface level 62 of the liquid photopolymer resin 60 is
automatically maintained at an extremely precise, constant
magnitude by devices known in the art responsive to output of level
sensors, not shown, within the apparatus 100 and preferably under
control of computer 102.
[0034] The semiconductor packages of the present invention may use
polymerized materials formed by modifying a variety of commercially
available liquid photopolymer resins 60. Suitable photopolymers for
use in practicing the present invention include, without
limitation, ACCURA.RTM. SI 40 HC and AR materials and CIBATOOL SL
5170 and SL 5210 resins for the SLA.RTM. 250/50HR and SLA.RTM. 500
systems, ACCURA.RTM. SI 40 ND material and CIBATOOL SL 5530 resin
for the SLA.RTM. 5000 and 7000 systems, and CIBATOOL SL 7510 resin
for the SLA.RTM. 7000 system. The ACCURA.RTM. materials are
available from 3D Systems, Inc., of Valencia, Calif., while the
CIBATOOL resins are available from Ciba Specialty Chemicals Company
of Basel, Switzerland. Additional photopolymers that are suitable
for use in practicing the present invention include, without
limitation, Loctite.RTM. 5071, 5084, 5088, and 5089 silicone-based
materials available from Henkel Loctite Corp., of Industry, Calif.
The liquid photopolymer resins 60 may be mixed with a particulate
filler constituent to enable tailoring and adjustment of the
material properties of photopolymer upon being cured. The
particulate filler constituent is typically in the range of about 5
:m to 15 :m in particle size, so as to be small enough to fill any
voids and other features into which the liquid photopolymer is to
flow. However, the size of the particulate filler constituent is
not critical within the foregoing constraint and may be selected to
enable a substantially uniform distribution of suspended particles
within the liquid photopolymer resin 60 and to prevent
agglomeration of the particles. Exemplary filler constituents may
be selected from boron nitride, silicates, elemental metals, and
alloys. Thus, by selecting the appropriate filler constituent, the
physical properties of the polymerized material may be tailored to
fulfill the needs of particular applications. A more thermally
conductive polymerized material may be formed by adding a filler
constituent, such as boron nitride, that exhibits a thermal
conductivity greater than that of the liquid photopolymer resin 60
it is dispersed therethrough. The CTE of the polymerized material
may be decreased by adding a filler constituent having a CTE that
is less than the CTE of the liquid photopolymer resin 60 in a
cured, unfilled state. The degree of CTE adjustment may, of course,
be dependent on the filler volume and particle size employed.
Exemplary filler constituents for decreasing the CTE of polymerized
material include filler constituents such as, for example,
silicates or boron nitride. The electrical conductivity of the
polymerized material may, also, be increased relative to the liquid
photopolymer resin 60 by adding a conductive filler constituent
such as, for example, elemental metals or alloys. The degree to
which the filler constituents alter the physical properties of the
liquid photopolymer resin 60 is generally governed by a rule of
mixtures type of formula. Upon curing or at least partially curing
to at least a semisolid state, the cured photopolymer material
exhibits a polymerized matrix having a plurality of discrete
particles (i.e., the filler constituent) dispersed
therethrough.
[0035] The liquid photopolymer resin 60 is responsive to light in
the UV wavelength range such that it at least partially cures or
polymerizes upon exposure to UV wavelength light to form a
semisolid structure. The liquid photopolymer resin 60 may also be
cured by other means, such as elevated temperature, to become a
fully cured polymeric structure. Furthermore, with regard to the
liquid photopolymer resins 60 that include filler constituents, as
the volume percent of the filler constituent is increased in the
liquid photopolymer 60, the thickness that may be partially cured
using UV light to a semisolid state decreases. A thickness of about
18.times.10.sup.-3 inches may be partially cured to a semisolid
state if the liquid photopolymer resin 60 does not posses any
filler constituent. A thickness of about 4.5.times.10.sup.-3 inches
may be partially cured to a semisolid state if the liquid
photopolymer resin 60 possesses about 50 volume percent filler
constituent.
[0036] An exemplary semiconductor device assembly 40 formed in
accordance with the present invention is shown in FIGS. 3, 4 and 5.
The semiconductor device assembly 40 comprises a carrier substrate
10 such as a printed circuit board, interposer or other substrate
to which external conductive elements 30 such as conductive balls,
bumps or columns protruding from the active surface 22 of one or
more flip-chip semiconductor dice 20 are bonded through conductive
traces 14 on the planar carrier substrate face 12. The exemplary
carrier substrate 10 is shown as having a generally planar backside
16. However, the method may be applied to carrier substrates 10 and
semiconductor dice 20 of any configuration, where a volume or space
therebetween requires underfilling. The present invention comprises
a method for underfilling the volume between a semiconductor die 20
mounted on a carrier substrate 10 and encompasses extension of the
underfill to encapsulate the semiconductor die 20 in the same
process.
[0037] In FIG. 4, exemplary semiconductor dice 20 are illustrated
as having a flip-chip configuration, each having a ball grid array
(BGA) of external conductive elements 30 such as solder balls or
conductive or conductor-filled epoxy on active surface 22, and
having a back side 18 and lateral sides 24. The external conductive
elements 30 are shown as being bonded to the plurality of
conductive pads 32 on the active surface 22 and to conductive trace
pads 14 on the face 12 of carrier substrate 10. The external
conductive elements 30 may be bonded to the conductive trace pads
14 by heat-induced reflow in the case of solder or by curing in the
case of epoxy, using any effective method such as is known in the
art.
[0038] As shown in FIGS. 4 and 5, an underfill structure 50 formed
of a cured photopolymer material essentially fills the interstitial
volume or spaces 34 between each semiconductor die 20 and the
carrier substrate 10, including the crevices where the external
conductive elements 30 meet the active surface 22 and the carrier
substrate face 12. The underfill structure 50 is tightly adhered to
the active surface 22 and the carrier substrate face 12 to
mechanically attach the semiconductor die 20 to the carrier
substrate 10. Contiguous with the underfill structure 50 is an
encapsulation structure 48 of protective cured photopolymer
material which is shown as covering the four lateral sides 24 and
backside 18 of each semiconductor die 20. The underfill structure
50, together with the encapsulation structure 48, form a polymeric
protective package, that seals and protects each semiconductor dice
20. Because of the unique method by which the underfill structure
50 is formed, there are essentially no bubbles of air or other gas,
water vapor, or moisture in any other form within the underfill
structure 50. Thus, any opportunity for short-circuiting between
external conductive elements 30, the plurality of conductive pads
32, and conductive trace pads 14 is virtually eliminated. Further,
the highly conformal underfill structure helps to support the
external conductive elements 30.
[0039] Referring to FIG. 4, in an exemplary embodiment of the
present invention, the underfill structure 50 and the encapsulation
structure 48 may be formed from a thermally conductive polymerized
material. The polymerized material may be formed from a liquid
photopolymer resin 60 that includes a filler constituent such as,
for example, boron nitride for increasing the thermal conductivity
thereof. By forming the underfill structure 50 and the
encapsulation structure 48 from a polymerized material of enhanced
thermal conductivity, heat transfer from the semiconductor die 20
during service is improved.
[0040] An exemplary method for forming the underfill structure 50
and encapsulation structure 48 is described with reference to FIGS.
6A-6C. The semiconductor assembly 40 is immersed in the reservoir
104 of liquid photopolymer resin 60 to a predetermined depth 96A
below the surface level 62 of the liquid photopolymer resin 60. The
laser 108 scans the liquid photopolymer resin 60 in selected
portions to at least partially cure (partially polymerize) the
liquid photopolymer resin 60 to form structures 90A that retain an
uncured pool of the liquid photopolymer 60 between the carrier
substrate 10 and the semiconductor die 20, as shown in FIG. 6A. As
shown in FIG. 6B, the semiconductor assembly 40 may be further
immersed to a predetermined depth 96B below the surface level 62 of
the liquid photopolymer resin 60. Again, the laser 108 scans the
liquid photopolymer resin 60 in selected portions to form another
partially cured structure 90B that is bonded to and contiguous with
the structure 90A between as shown in FIG. 6B. As depicted, for
illustrative purposes in FIG. 6B, structures 90A and 90B form a dam
structure that sealingly retains liquid photopolymer resin 60
between the carrier substrate face 12 and the semiconductor die 20.
Although the process is illustrated using only two layers (90A and
90B), fewer layers may be used or additional layers may be used, as
required, to form additional dam structures. The number of layers
used in this iterative process is determined by thickness of liquid
photopolymer resin 60 that may be partially cured by the laser 108
into a semisolid state.
[0041] As illustrated in FIG. 6C, the process is repeated, to
further submerge the backside 18 of the semiconductor die 20 to a
predetermined depth 96C below the surface level 62 of the reservoir
60 to at least partially cure the liquid photopolymer resin 60 to
complete the encapsulation structure 48 by forming structure 90C.
The liquid photopolymer resin 60 remaining on the semiconductor
device assembly 40 is then drained. However, the interstitial
volume between the carrier substrate face 12 and the semiconductor
die 20 is filled with the liquid photopolymer resin 60 that is
sealingly retained therebetween by structures 90A and 90B. The
partially cured structures that comprise the encapsulation
structure 48 and the uncured liquid photopolymer remaining sealed
between the carrier substrate face 12 and semiconductor die 20 may
be fully cured by moving the semiconductor device assembly 40 to
another apparatus, such as a furnace, to fully cure both the
partially cured structure comprising the encapsulation structure 48
and the underfill structure 50 by heating to an elevated
temperature to form a contiguous unitary structure. The resultant
fully cured encapsulation structure 48 and underfill structure 50
is shown in the aforementioned FIG. 4.
[0042] Referring to FIG. 7, in another exemplary embodiment of the
present invention, the encapsulation structure 48A substantially
covering the four lateral sides 24 and the underfill structure 50
filling the spaces 34 between each semiconductor die 20 and the
carrier substrate 10 may be formed from a dielectric polymerized
material. The dielectric polymerized material may be formed from a
conventional liquid photopolymer resin 60 such as the
aforementioned commercially available photopolymers resins (i.e.,
without an additional filler constituent). Such dielectric
polymerized materials are thermal insulators. The encapsulation
structure 48A formed from the same dielectric material as underfill
structure 50 is contiguous with the underfill structure 50 and
substantially covers the four lateral sides 24 of the semiconductor
die 20. The encapsulation structure 48B may be formed from a
photopolymer material exhibiting thermally conductive properties
greater than that of the polymerized material used for the
encapsulation structure 48A and the underfill structure 50. Thus,
the photopolymer material employed for forming the encapsulation
structure 48B may be formed from a liquid photopolymer resin 60
that includes a filler constituent such as, for example, boron
nitride for increasing the thermal conductivity thereof. As with
the embodiment shown in FIG. 4, by forming the encapsulation region
48B from a thermally conductive polymerized material, more
efficient heat transfer from semiconductor die 20 is effected.
[0043] The underfill structure 50 and the encapsulation structures
48A and 48B of the embodiment shown in FIG. 7 may be formed in a
similar manner to that described in the aforementioned FIGS. 6A-6C.
The encapsulation structure 48A may be formed by immersing the
semiconductor device assembly 40 and selectively partially curing
the liquid photopolymer resin 60 by exposure to laser 108 to
substantially surround the four lateral sides 24 of the
semiconductor die 20 and sealingly retain liquid photopolymer resin
60 in the space between the carrier substrate face 12 and the
semiconductor die 20. The encapsulation structure 48A may be formed
using an iterative process that builds the encapsulation structure
48A from multiple layers, if needed. The remaining liquid
photopolymer resin 60 is drained from the semiconductor device
assembly 40. The liquid photopolymer 60 is replaced in the
reservoir 104 with a liquid photopolymer resin 60 that includes a
filler constituent such as, for example, boron nitride for
increasing the thermal conductivity thereof or the entire reservoir
104 may be replaced. Alternatively, reservoir 104 may be replaced
with another reservoir 104 containing the liquid photopolymer resin
60 with the filler constituent, or the assembly transferred to
another stereolithography apparatus 100 including a reservoir 104
with the particle-filled liquid photopolymer resin 60. The
semiconductor device assembly 40 is then immersed in the liquid
photopolymer resin 60 that includes a filler constituent and the
encapsulation region 48B is partially cured by exposure to the
laser 108. The encapsulation structure 48A including the uncured
liquid photopolymer resin 60 retained between the carrier substrate
10 and the semiconductor die 20 and encapsulation structure 48B are
then fully cured by heating to an elevated temperature.
[0044] Referring to FIGS. 8A and 8B, in another exemplary
embodiment, the underfill structure 50 filling the spaces 34
between each semiconductor die 20 and the carrier substrate 10 and
the encapsulation structure 49A that covers the four lateral sides
24 of the semiconductor die 20 may be formed from a dielectric
polymerized material. The dielectric polymerized material may be
formed from a conventional liquid photopolymer resin 60 such as the
aforementioned commercially available photopolymers (i.e., lacking
an additional filler constituent). As shown in FIG. 8A, the
encapsulation structure 49B may partially enclose each
semiconductor die 20 including the underfill structure 50 and the
encapsulation structure 49A to cover the lateral sides of each
semiconductor die 20. The encapsulation structure 49B may also
cover the backside 18 of each semiconductor die 20 to completely
enclose each semiconductor die 20 as shown in FIG. 8B. The
encapsulation structure 49B may be formed from a photopolymer
material exhibiting properties that enable electrostatic discharge
(ESD) protection and radio frequency (RF) shielding. A suitable
photopolymer material employed for forming the encapsulation
structure 49B may be formed from a liquid photopolymer resin 60
that includes a filler constituent such as, for example, an
elemental metal or alloy for increasing the electrical conductivity
thereof. The encapsulation structure 49B, formed from a cured
photopolymer material, exhibits a sufficient electrical
conductivity to assist with ESD protection and RF shielding.
[0045] The underfill structure 50 and the encapsulation structures
49A and 49B of the embodiment shown in FIG. 8 may be formed in a
similar manner to that described in the aforementioned FIGS. 6A-6C.
The encapsulation structure 49A may be formed by immersing the
semiconductor device assembly 40 and partially curing the liquid
photopolymer resin 60 by exposure to laser 108 to substantially
surround the four lateral sides 24 of the semiconductor die 20 and
sealingly retain liquid photopolymer resin 60 in the space between
the carrier substrate face 12 and the semiconductor die 20. The
encapsulation structure 49A may be formed using an iterative
process that builds the encapsulation structure 49A from multiple
layers. The remaining liquid photopolymer resin 60 is drained from
the semiconductor device assembly 40. The semiconductor device
assembly 40 is then immersed in the liquid photopolymer resin 60
that includes a filler constituent such as, for example, an
elemental metal or alloy for increasing the electrical conductivity
thereof and the encapsulation structure 49B is partially cured by
exposure to a laser 108 in multiple layers depending on the height
of the encapsulation structure 49B. The encapsulation structure 49A
including the uncured liquid photopolymer resin 60 retained between
the carrier substrate 10 and the semiconductor die 20,
encapsulation structure 49B, and the underfill structure 50, are
then fully cured by heating to an elevated temperature.
[0046] Referring to FIGS. 9A and 9B, in another exemplary
embodiment, the underfill structure 50 may be comprised of multiple
layers, wherein each layer exhibits a different CTE. The CTE of the
layer nearest to the active surface 22 of the semiconductor die 20
closely matches that of the CTE of the semiconductor die 20, while
the CTE of the layer nearest the carrier substrate face 12 closely
matches the CTE of the carrier substrate 10. The CTE of each layer
of cured photopolymer material that comprises the underfill
structure 50 progressively increases in a direction from the active
surface 22 of the semiconductor die 20 to the carrier substrate
face 12, with the CTE of the layer closest to the carrier substrate
face 12 closely matching the CTE of the carrier substrate 10. This
CTE gradient that increases from the active surface 22 of the
semiconductor die 20 to the face 12 of the carrier substrate 10
alleviates the thermal stresses that develop during use of the
semiconductor assembly 40 due to the substantial CTE mismatch
between the semiconductor die 20 and the carrier substrate 10.
[0047] FIG. 9B illustrates a more detailed sectional view of a
single semiconductor die 20 mounted on carrier substrate 10
employing a layered underfill structure 50. The underfill structure
50 may be comprised of multiple layers of a photopolymer material,
wherein the CTE of each layer increases in the direction 52. Layer
50A may be comprised of, for example, a polymerized material having
a CTE between about 15 to about 35 ppm. Layer 50B may be comprised
of, for example, a photopolymer material having a CTE between about
8 to about 15 ppm. Layer 50C may be comprised of, for example, a
photopolymer material having a CTE between about 5 to about 10 ppm.
In the exemplary embodiment illustrated in FIGS. 9A and 9B, the CTE
of the photopolymer material may be altered by adding a filler
constituent such as, for example, silicates or boron nitride to the
liquid photopolymer resin 60. The addition of silicates or boron
nitride to the liquid photopolymer resin 60 decreases the CTE upon
curing to form the polymerized material and the CTE may be adjusted
by varying the volume of filler, particle size and material of the
filler. Although the underfill structure 50 is shown being
comprised of only three layers (50A-50C), it may comprise
additional or fewer layers, if desired. Additionally, the
encapsulation structure 48 may be comprised of a thermally
conductive photopolymer material. The photopolymer material used
for the encapsulation structure 48 may be formed from a liquid
photopolymer resin 60 that includes a filler constituent such as,
for example, boron nitride for increasing the thermal conductivity
thereof. In addition, the entire underfill structure 50 and
encapsulation structure 48 may be at least partially surrounded or
completely enclosed by an electrically conductive photopolymer
material 53, as shown in FIG. 9C, to enable ESD protection and RF
shielding of the semiconductor die 20.
[0048] FIGS. 10A-10C briefly illustrate a process for forming the
underfill structure 50 and encapsulation structure 48 shown in
FIGS. 9A-9C. Referring to FIG. 10A, layer 50A of the underfill
structure 50 may be formed by immersing the semiconductor device
assembly 40 to a predetermined depth and partially curing the
liquid photopolymer resin 60 by exposure to laser 108 to form
structure 100A which completely surrounds the four lateral sides 24
of the semiconductor die 20. The semiconductor device assembly 40
is removed from the reservoir 104 and the excess liquid
photopolymer resin 60 is drained. However, there remains uncured,
liquid photopolymer resin 60 of a level 62 retained by structure
100A between the carrier substrate face 12 and the semiconductor
die 20. The semiconductor device assembly 40 is then moved to an
external beat source such as a quartz lamp or oven to cure, or at
least partially cure, the remaining liquid photopolymer resin 60
retained between the carrier substrate face 12 and the
semiconductor die 20 to form a unitary layer 50A. The liquid
photopolymer resin 60 is replaced in the reservoir 104 with a
second liquid photopolymer resin 60 that has a lower CTE than the
liquid photopolymer resin 60 used for layer 50A, or the reservoir
104 may be replaced, or the assembly moved to a different
stereolithography apparatus 100. Referring to FIG. 10B, the
semiconductor device assembly 40 is immersed in the second liquid
photopolymer resin 60 and partially cured by exposure to the laser
108 to form structure 100B that is bonded to and contiguous with
structure 50A. The semiconductor device assembly 40 is removed from
the reservoir 104 and the excess liquid photopolymer resin 60 is
drained. As with forming the first layer 50A, there remains
uncured, liquid photopolymer resin 60 of a level 62 retained by
structures 100A and 100B between layer 50A and the semiconductor
die 20. The semiconductor device assembly 40 is then moved to an
external heat source to cure, or at least partially cure, the
remaining liquid photopolymer resin 60 retained between the layer
50A and the semiconductor die 20 to form a unitary layer 50B. The
liquid photopolymer resin 60 is replaced in the reservoir 104 with
a third liquid photopolymer resin 60 that has a lower CTE than the
liquid photopolymer resin 60 used for layer 50A and 50B, or the
entire reservoir 104 may be replaced, or the assembly moved to
another stereolithography apparatus 100.
[0049] Referring to FIG. 10C, the semiconductor device assembly 40
is then immersed in the third liquid photopolymer resin 60 and
partially cured by exposure to the laser 108 to form structure 100C
that is bonded to and contiguous with structure 100B. Structure
100C sealingly retains uncured, liquid photopolymer resin 60
between the layer 50B and the semiconductor die 20. The
semiconductor device assembly 40 is removed from the reservoir 104
and the excess liquid photopolymer resin 60 is drained. As with
forming the previous layers 50A and 50B, there remains uncured,
liquid photopolymer resin 60 retained between the layer 50B and the
semiconductor die 20. The semiconductor device assembly 40 may then
be moved to an external heat source to cure, or at least partially
cure, the remaining liquid photopolymer resin 60 retained between
the layer 50B and the semiconductor die 20 to form a unitary layer
50C that seals and protects each semiconductor die 20. The
encapsulation structure 48 may be formed by immersion of the
semiconductor device assembly 40 to a predetermined depth within
another reservoir 104 and subsequent exposure by a laser 108 to
form the encapsulation structure 48 that is contiguous with the
underfill structure 50 and covers the backside 18 of the
semiconductor die 20, prior to or after forming unitary layer 50C.
If desired, the semiconductor device assembly 40 may be immersed in
a reservoir 104 containing a liquid photopolymer resin 60 that
includes containing a filler constituent for increasing the
electrical conductivity thereof and subsequently, partially curing
by exposure to the laser 108 to form the electrically conductive
polymerized material 53, as shown in FIG. 9C. The partially
polymerized photopolymer materials that comprise the underfill
structure 50, encapsulation structure 48, and if present, the
electrically conductive photopolymer material 53 may be fully cured
by heating to an elevated temperature.
[0050] FIGS. 11A-11C briefly illustrate another exemplary process
for forming the layered underfill structure 50 and encapsulation
structure 48 shown in FIGS. 9A-9C. As depicted in FIG. 11A, the
layered underfill structure 50 may be formed on the carrier
substrate face 12 with apertures 54 that expose the conductive
traces 14. The external conductive elements 30, such as conductive
or conductor-filled epoxy pillars or solder balls, may be stenciled
so as to be deposited within apertures 54 contacting the conductive
traces 14. Referring to FIG. 11B, conductive traces 14 and
conductive bond pads or redistributed bond pads 32 on the active
surface 22 of the semiconductor die 20 may be bonded to the
external conductive elements 30 as known in the art, such as by
solder reflow or by heating to cure and bond the epoxy pillars to
the conductive traces 14 and bond pads 32. Also illustrated in FIG.
11B, the semiconductor device assembly 40 may then be immersed in
the reservoir 104 to a predetermined depth and subsequently exposed
to laser 108 to partially cure structures 202 that are bonded to
and contiguous with layer 50C and sealingly retains uncured, liquid
photopolymer resin 60 between the layer 50C and the semiconductor
die 20. If desired, the entire assembly may be cured by heating to
an elevated temperature to fully cure all of the layers 50A-50D
that comprise the underfill structure 50 as shown in FIG. 11C. An
encapsulation structure 48 may be formed by immersion of the
semiconductor device assembly 40 to a predetermined depth within a
reservoir 104 containing a liquid photopolymer resin 60 and
subsequent exposure by laser 108 to form the encapsulation
structure 48 that is contiguous with the underfill structure 50 and
covers the backside 18 of the semiconductor die. The encapsulation
structure 48 may be formed prior to or after fully curing the
underfill structure 50. Although not shown, if desired, additional
encapsulation structures may be formed as performed in the previous
embodiments to at least partially enclose the semiconductor die 20
using an electrically conductive polymerized material to assist
with ESD and RF shielding.
[0051] Referring to FIGS. 12A and 12B, a sectional view of an
optically interactive semiconductor device that is packaged using
various photopolymer materials is illustrated. Semiconductor die 20
includes an array 6 of optically interactive semiconductor devices
such as, for example, CCD image sensors or CMOS image sensors on
its active surface 22. The array 6 of optically interactive
semiconductor devices may include a cover 204 formed from a
photopolymer material that seals and protects array 6 and is
transparent to light, preferably in the 400 nm to 650 nm wavelength
range. In an exemplary embodiment shown in FIG. 12A, cover 204 may
be formed from an optically transparent photopolymerized material
that filters infrared (IR) radiation. The array 6 of optically
interactive semiconductor devices may also be surrounded along
substantially all of its periphery by a support structure 206
including ledges 212 that supports at least one lens 208a-208n for
focusing light onto the array 6. Support structure 206 may be
formed from a photopolymerized material that is opaque. Suitable
photopolymer materials for forming support structure 206 are any of
the above mentioned commercially available liquid photopolymer
resins or a photopolymer material that comprises a polymerized
matrix having a filler constituent such as, for example, an
elemental metal or alloy dispersed therethrough. For example, a
photopolymer material that comprises approximately 50 volume
percent of a metallic particulate filler constituent will be
substantially opaque and suitable for forming the support structure
206. Thus, the photopolymer material that comprises support
structure 206 may shield array 6 of optically interactive
semiconductor devices, substantially allowing only light entering
through a lens 208 to be received by the array 6. If cover 204 is
formed from a photopolymer material that absorbs IR radiation, a
traditional IR filter is not needed.
[0052] An IR filter 210 is necessary to filter IR radiation from
being received by the array 6 if cover 204 does not absorb IR
radiation. As shown in FIG. 12B, an IR filter 210 and at least one
lens 208a-208n may be supported by ledges 212 of the support
structure 206. Cover 204 formed from an optically transparent
photopolymer may, optionally, be used to seal and protect array 6.
Although, not shown in FIGS. 12A and 12B, it should be understood
that the semiconductor die 20 includes external conductive elements
for electrically connecting semiconductor die 20 to other
semiconductor devices or higher level packaging, such as a printed
circuit board. Such external conductive elements may also be formed
using stereolithographic techniques, as desired.
[0053] The package for the optically interactive semiconductor
device may be formed using stereolithography methods similar to
those used in the previous embodiments. The semiconductor die 20
may be immersed in the liquid photopolymer resin 60 to the desired
depth. The liquid photopolymer resin 60 may be scanned by laser 108
to cure or at least partially cure a portion thereof to form cover
204 that covers the array 6. Cover 204 may be formed, if needed, by
multiple iterative steps to build up cover 204 from multiple
layers. The liquid photopolymer resin 60 may then be changed to
another and the semiconductor die 20 re-immersed therein. The
liquid photopolymer resin 60 is scanned by laser 108 to cure or at
least partially cure a portion thereof to surround the periphery of
array 6 with a support structure 206A. If needed, the above process
may be repeated to form support structure 206B that is contiguous
with support structure 206A and additional support structures
206C-206n. It should be understood, that support structure 206 may
be formed prior to or subsequent to forming cover 204. Lenses
208a-208n, IR filter 210, or both may then be fixed to support
structure 206 using an adhesive or other suitable technique.
[0054] Although the foregoing description contains many specifics,
these are not to be construed as limiting the scope of the present
invention, but merely as providing certain exemplary embodiments.
Similarly, other embodiments of the invention may be devised that
do not depart from the spirit or scope of the present invention.
The scope of the invention is, therefore, indicated and limited
only by the appended claims and their legal equivalents, rather
than by the foregoing description. All additions, deletions, and
modifications to the invention, as disclosed herein, which fall
within the meaning and scope of the claims, are encompassed by the
present invention.
* * * * *