U.S. patent application number 16/003827 was filed with the patent office on 2018-12-13 for methods of forming self-aligned vias and air gaps.
The applicant listed for this patent is Applied Materials, Inc.. Invention is credited to Ziqing Duan, Praburam Gopalraja, Abhijit Basu Mallick, Susmit Singha Roy.
Application Number | 20180358260 16/003827 |
Document ID | / |
Family ID | 64564252 |
Filed Date | 2018-12-13 |
United States Patent
Application |
20180358260 |
Kind Code |
A1 |
Roy; Susmit Singha ; et
al. |
December 13, 2018 |
Methods Of Forming Self-Aligned Vias And Air Gaps
Abstract
A first metallization layer comprises a set of first conductive
lines that extend along a first direction on a first dielectric
layer on a substrate. Pillars are formed on recessed first
dielectric layers and a second dielectric layer covers the pillars.
A dual damascene etch provides a contact hole through the second
dielectric layer and an etch removes the pillars to form air
gaps.
Inventors: |
Roy; Susmit Singha;
(Sunnyvale, CA) ; Duan; Ziqing; (San Jose, CA)
; Mallick; Abhijit Basu; (Palo Alto, CA) ;
Gopalraja; Praburam; (San Jose, CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Applied Materials, Inc. |
Santa Clara |
CA |
US |
|
|
Family ID: |
64564252 |
Appl. No.: |
16/003827 |
Filed: |
June 8, 2018 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
62517855 |
Jun 10, 2017 |
|
|
|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01J 37/32165 20130101;
H01L 21/76807 20130101; H01L 21/76849 20130101; H01L 21/76888
20130101; H01J 37/32715 20130101; H01L 21/7682 20130101; H01L
21/76834 20130101; H01L 21/31122 20130101; H01L 21/76897 20130101;
H01L 21/76843 20130101; H01J 37/32357 20130101; H01L 21/76871
20130101; H01L 21/76879 20130101; H01L 21/76801 20130101; H01J
37/32091 20130101; H01L 21/76883 20130101; H01L 23/53266
20130101 |
International
Class: |
H01L 21/768 20060101
H01L021/768; H01L 21/311 20060101 H01L021/311; H01J 37/32 20060101
H01J037/32 |
Claims
1. A method to provide self-aligned air gaps, the method
comprising: recessing first conductive lines on a first dielectric
layer on a substrate, the first conducting lines extending along a
first direction on the first dielectric layer; forming pillars on
the recessed first conductive lines; depositing a second dielectric
layer between the pillars; etching the second dielectric layer to
form a contact hole in the second dielectric layer between adjacent
pillars; depositing a metal film in the contact hole; removing the
second dielectric layer to expose the pillars; removing the pillars
to form air gaps; and depositing a cap layer to enclose the air
gaps.
2. The method of claim 1, further comprising selectively growing a
seed layer on the recessed first conductive lines, the pillars
being formed from the seed layer.
3. The method of claim 2, wherein the pillars are formed by
oxidizing the seed layer.
4. The method of claim 3, wherein the seed layer comprises tungsten
and the pillars comprise tungsten oxide.
5. The method of claim 3, further comprising forming a conformal
liner on the recessed first conductive lines and the first
dielectric layer, the seed layer formed on the conformal liner.
6. The method of claim 1, further comprising forming a hard mask
layer on the second dielectric layer after depositing the metal
film and before removing the second dielectric layer to expose the
pillars.
7. The method of claim 1, further comprising forming a conformal
liner on the second dielectric after forming the opening in the
second dielectric layer.
8. The method of claim 1, wherein removing the pillars comprises
selectively etching the pillars using a metal halide etchant.
9. The method of claim 8, wherein the pillars comprise tungsten
oxide and the metal halide etchant comprises a tungsten halide.
10. The method of claim 1, wherein the second dielectric layer is a
flowable film.
11. The method of claim 1, wherein depositing the metal in the
contact hole comprises depositing a metal overburden and removing
the overburden to form a metal film that is level with a top of the
second dielectric layer.
12. A method to provide self-aligned air gaps, the method
comprising: recessing first conductive lines on a first dielectric
layer on a substrate, the first conducting lines extending along a
first direction on the first dielectric layer; forming a conformal
liner on the first conductive lines and the first dielectric layer;
selectively depositing a metal in the recessed first conductive
lines; oxidizing the metal to form pillars on the recessed first
conductive lines; depositing a second dielectric layer between the
pillars; etching the second dielectric layer with a dual damascene
etch to form a contact hole in the second dielectric layer between
adjacent pillars; forming a conformal liner in the contact hole;
depositing a metal film in the contact hole on the conformal liner;
masking and removing the second dielectric layer to expose the
pillars; masking and removing the pillars to form air gaps; and
depositing a cap layer to enclose the air gaps.
13. The method of claim 12, further comprising selectively growing
a seed layer on the recessed first conductive lines, the pillars
being formed from the seed layer.
14. The method of claim 13, wherein the pillars are formed by
oxidizing the seed layer.
15. The method of claim 14, wherein the seed layer comprises
tungsten and the pillars comprise tungsten oxide.
16. The method of claim 12, wherein removing the pillars comprises
selectively etching the pillars using a metal halide etchant.
17. The method of claim 16, wherein the pillars comprise tungsten
oxide and the metal halide etchant comprises a tungsten halide.
18. The method of claim 12, wherein the second dielectric layer is
a flowable film.
19. The method of claim 12, wherein depositing the metal in the
contact hole comprises depositing a metal overburden and removing
the overburden to form a metal film that is level with a top of the
second dielectric layer.
20. A system to manufacture an electronic device, the system
comprising; a processing chamber comprising a pedestal to hold an
electronic device structure comprising a first metallization layer
comprising a set of first conductive lines extending along a first
direction on a first dielectric layer on a substrate; a plasma
source coupled to the processing chamber to generate plasma; and a
processor coupled to the plasma source, the processor having a
first configuration to control recessing the first conductive
lines, a second configuration to control forming pillars on the
recessed first conductive lines, a third configuration to control
depositing a second dielectric between the pillars, a fourth
configuration to control a dual damascene etch in the second
dielectric to from a contact hole in the second dielectric layer
between adjacent pillars and a fifth configuration to control
removal of the pillars.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims priority to U.S. Provisional
Application No. 62/517,855, filed Jun. 10, 2017, the entire
disclosure of which is hereby incorporated by reference herein.
TECHNICAL FIELD
[0002] The present disclosure relates generally to methods of
depositing and etching thin films. In particular, the disclosure
relates to processes for forming self-aligned vias and air gaps and
devices containing same.
BACKGROUND
[0003] The semiconductor industry is rapidly developing chips with
smaller and smaller transistor dimensions to gain more
functionality per unit area. As the dimensions of devices continue
to shrink, so does the gap/space between the devices, increasing
the difficulty to physically isolate the devices from one another.
Filling in the high aspect ratio trenches/spaces/gaps between
devices which are often irregularly shaped with high-quality
dielectric materials is becoming an increasing challenge to
implementation with existing methods including gapfill, hardmasks
and spacer applications.
[0004] Resistance-Capacitance (RC) delay is a challenging aspect of
back end of line (BEOL) device production. The RC delay continues
to increase with metal pitch scaling, metal line length increasing
and metal line thickness decreasing. Reducing metal line resistance
or dielectric capacitance in the back end of line is a priority of
engineers working on BEOL. Low dielectric constant (k) materials
are the main materials besides metals in the BEOL, which account
for the capacitance that needs to be reduced. Reducing k has been a
trend in the past decades. IBM introduced the air-gap technology
around 10 years ago. However, it has not penetrated in the whole
industry because of the process/design/integration complexity.
[0005] Another challenging aspect in the current semiconductor
manufacture is edge placement error (EPE) appearing in the
patterning steps. When patterning multiple layers, layer-to-layer
connection or alignment becomes more and more difficult with
smaller features. On BEOL, big EPE could cause both the resistance
of interconnect and parasitic capacitance to increase which will
increase the RC delay. In the worst cases, the EPE can result in
the misalignment of two metal layers and device failure.
[0006] Therefore, there is a need in the art for methods for back
end of line device production with decreased RC delay and/or
decreased edge placement error.
SUMMARY
[0007] A method to provide self-aligned air gaps, the method
comprising: recessing first conductive lines on a first dielectric
layer on a substrate, the first conducting lines extending along a
first direction on the first dielectric layer; forming pillars on
the recessed first conductive lines; depositing a second dielectric
layer between the pillars; etching the second dielectric layer to
form a contact hole in the second dielectric layer between adjacent
pillars; depositing a metal film in the contact hole; removing the
second dielectric layer to expose the pillars; removing the pillars
to form air gaps; and depositing a cap layer to enclose the air
gaps.
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] So that the manner in which the above recited features of
the present invention can be understood in detail, a more
particular description of the invention, briefly summarized above,
may be had by reference to embodiments, some of which are
illustrated in the appended drawings. It is to be noted, however,
that the appended drawings illustrate only typical embodiments of
this invention and are therefore not to be considered limiting of
its scope, for the invention may admit to other equally effective
embodiments.
[0009] FIG. 1A illustrates a top view and a cross-sectional view of
an electronic device structure to provide a fully self-aligned via
according to some embodiments;
[0010] FIG. 1B is a perspective view of the electronic device
structure depicted in FIG. 1A;
[0011] FIG. 2A is a side cross-sectional view of the electronic
device structure after the conductive lines are recessed according
to some embodiments;
[0012] FIG. 2B is a top view of the electronic device structure of
FIG. 2A;
[0013] FIG. 3 is a side cross-sectional view of the electronic
device structure after a liner is deposited on the recessed
conductive lines according to some embodiments;
[0014] FIG. 4 is a side cross-sectional view of the electronic
device structure after a seed gapfill layer is deposited on the
liner according to some embodiments;
[0015] FIG. 5A is a side cross-sectional view of the electronic
device structure after portions of the seed gapfill layer are
removed to expose top portions of the insulating layer according to
some embodiments;
[0016] FIG. 5B is a perspective view of the electronic device
structure shown in FIG. 5A;
[0017] FIG. 6A is a side cross-sectional view of the electronic
device structure after self-aligned selective growth pillars are
formed according to some embodiments;
[0018] FIG. 6B is a perspective view of the electronic device
structure shown in FIG. 6A,
[0019] FIG. 7A is a side cross-sectional view of the electronic
device structure after an insulating layer is deposited to overfill
the gaps between the pillars according to some embodiments;
[0020] FIG. 7B is a perspective view of the electronic device
structure shown in FIG. 7A,
[0021] FIG. 8A is a side cross-sectional view of the electronic
device structure after a dual damascene etch according to some
embodiments;
[0022] FIG. 8B is a top view of the electronic device structure
shown in FIG. 8A;
[0023] FIG. 9A is a side cross-sectional view of the electronic
device structure after formation of a liner in the etched structure
according to some embodiments;
[0024] FIG. 9B is a top view of the electronic device structure
shown in FIG. 9A;
[0025] FIG. 10A is a side cross-sectional view of the electronic
device structure after gapfill of the etched structure in
accordance with one or more embodiment;
[0026] FIG. 10B is a top view of the electronic device structure
shown in FIG. 10A;
[0027] FIG. 11A is a side cross-sectional view of the electronic
device structure after masking in accordance with one or more
embodiment;
[0028] FIG. 11B is a top view of the electronic device structure
shown in FIG. 11A;
[0029] FIG. 12A is a side cross-sectional view of the electronic
device structure after etching the dielectric and exposing the
pillars in accordance with one or more embodiment;
[0030] FIG. 12B is a top view of the electronic device structure
shown in FIG. 12A;
[0031] FIG. 13A is a side cross-sectional view of the electronic
device structure after removal of the pillars in accordance with
one or more embodiment;
[0032] FIG. 13B is a top view of the electronic device structure
shown in FIG. 13A;
[0033] FIG. 14A is a side cross-sectional view of the electronic
device structure after blanket deposition in accordance with one or
more embodiment;
[0034] FIG. 14B is a top view of the electronic device structure
shown in FIG. 14A; and
[0035] FIG. 15 shows a schematic of a processing chamber to form
the electronic device structure in accordance with one or more
embodiment of the disclosure.
[0036] In the appended figures, similar components and/or features
may have the same reference label. Further, various components of
the same type may be distinguished by following the reference label
by a dash and a second label that distinguishes among the similar
components. If only the first reference label is used in the
specification, the description is applicable to any one of the
similar components having the same first reference label
irrespective of the second reference label.
DETAILED DESCRIPTION
[0037] Before describing several exemplary embodiments of the
invention, it is to be understood that the invention is not limited
to the details of construction or process steps set forth in the
following description. The invention is capable of other
embodiments and of being practiced or being carried out in various
ways.
[0038] A "substrate" as used herein, refers to any substrate or
material surface formed on a substrate upon which film processing
is performed during a fabrication process. For example, a substrate
surface on which processing can be performed include materials such
as silicon, silicon oxide, strained silicon, silicon on insulator
(SOI), carbon doped silicon oxides, amorphous silicon, doped
silicon, germanium, gallium arsenide, glass, sapphire, and any
other materials such as metals, metal nitrides, metal alloys, and
other conductive materials, depending on the application.
Substrates include, without limitation, semiconductor wafers.
Substrates may be exposed to a pretreatment process to polish,
etch, reduce, oxidize, hydroxylate, anneal, UV cure, e-beam cure
and/or bake the substrate surface. In addition to film processing
directly on the surface of the substrate itself, in the present
invention, any of the film processing steps disclosed may also be
performed on an underlayer formed on the substrate as disclosed in
more detail below, and the term "substrate surface" is intended to
include such underlayer as the context indicates. Thus for example,
where a film/layer or partial film/layer has been deposited onto a
substrate surface, the exposed surface of the newly deposited
film/layer becomes the substrate surface.
[0039] One or more embodiments of the disclosure are directed to
methods and apparatus to provide self-aligned vias and air gaps.
The various aspects of the disclosure are described with respect to
a detailed process illustrated in the Figures.
[0040] FIG. 1A illustrates a top view 100 and a cross-sectional
view 110 of an electronic device structure to provide a fully
self-aligned via or air gap according to some embodiments. The
cross-sectional view 110 is along an axis A-A', as depicted in FIG.
1A. FIG. 1B is a perspective view 120 of the electronic device
structure depicted in FIG. 1A. A lower metallization layer (Mx)
comprises a set of conductive lines 104 that extend along an X axis
(direction) 121 on an insulating layer 102 on a substrate 101, as
shown in FIGS. 1A and 1B. As shown in FIG. 1B, X direction 121
crosses a Y axis (direction) 122 at an angle 123. In one or more
embodiments, angle 123 is about 90 degrees. In some embodiments,
angle 123 is an angle that is other than a 90 degrees angle. The
insulating layer 102 comprises trenches 104. The conductive lines
103 are deposited in trenches 104.
[0041] In some embodiments, the substrate 101 comprises a
semiconductor material, e.g., silicon (Si), carbon (C), germanium
(Ge), silicon germanium (SiGe), gallium arsenide (GaAs), InP, GaAs,
InGaAs, InAlAs, other semiconductor material, or any combination
thereof. In some embodiments, substrate 101 is a
semiconductor-on-isolator (SOI) substrate including a bulk lower
substrate, a middle insulation layer, and a top monocrystalline
layer. The top monocrystalline layer may comprise any material
listed above, e.g., silicon. In various embodiments, the substrate
101 can be, for example, an organic, a ceramic, a glass, or a
semiconductor substrate. Although a few examples of materials from
which the substrate may be formed are described here, any material
that may serve as a foundation upon which passive and active
electronic devices (e.g., transistors, memories, capacitors,
inductors, resistors, switches, integrated circuits, amplifiers,
optoelectronic devices, or any other electronic devices) may be
built falls within the spirit and scope of the present
disclosure.
[0042] In some embodiments, substrate 101 includes one or more
metallization interconnect layers for integrated circuits. In some
embodiments, the substrate 101 includes interconnects, for example,
vias, configured to connect the metallization layers. In some
embodiments, the substrate 101 includes electronic devices, e.g.,
transistors, memories, capacitors, resistors, optoelectronic
devices, switches, and any other active and passive electronic
devices that are separated by an electrically insulating layer. For
example, an interlayer dielectric, a trench insulation layer or any
other insulating layer known to one of ordinary skill in the art of
the electronic device manufacturing. In some embodiments, the
substrate includes one or more buffer layers to accommodate for a
lattice mismatch between the substrate 101 and one or more layers
above substrate 101 and to confine lattice dislocations and
defects.
[0043] Insulating layer 102 can be any material suitable to
insulate adjacent devices and prevent leakage. In some embodiments,
electrically insulating layer 102 is an oxide layer, e.g., silicon
dioxide, or any other electrically insulating layer determined by
an electronic device design. In some embodiments, insulating layer
102 comprises an interlayer dielectric (ILD). In some embodiments,
insulating layer 102 is a low-k dielectric that includes, but is
not limited to, materials such as, e.g., silicon dioxide, silicon
oxide, carbon doped oxide ("CDO"), e.g., carbon doped silicon
dioxide, porous silicon dioxide, silicon nitride or any combination
thereof.
[0044] In some embodiments, insulating layer 102 includes a
dielectric material having k value less than 5. In some
embodiments, insulating layer 102 includes a dielectric material
having k-value less than 2. In some embodiments, insulating layer
102 includes a nitride, oxide, a polymer, phosphosilicate glass,
Fluorosilicate (SiOF) glass, organosilicate glass (SiOCH), other
electrically insulating layer determined by an electronic device
design, or any combination thereof. In some embodiments, insulating
layer 102 may include polyimide, epoxy, photodefinable materials,
such as benzocyclobutene (BCB), and WPR-series materials, or
spin-on-glass.
[0045] In some embodiments, insulating layer 102 is a low-k
interlayer dielectric to isolate one metal line from other metal
lines on substrate 101. In some embodiments, the thickness of the
layer 102 is in an approximate range from about 10 nanometers (nm)
to about 2 microns (.mu.m).
[0046] In some embodiments, insulating layer 102 is deposited using
one of deposition techniques, such as but not limited to a chemical
vapor deposition ("CVD"), a physical vapor deposition ("PVD"),
molecular beam epitaxy ("MBE"), metalorganic chemical vapor
deposition ("MOCVD"), atomic layer deposition ("ALO"), spin-on, or
other insulating deposition techniques known to one of ordinary
skill in the art of microelectronic device manufacturing.
[0047] In some embodiments, the lower metallization layer Mx
comprising metal lines 103 is a part of a back end metallization of
the electronic device. In some embodiments, the insulating layer
102 is patterned and etched using a hard mask to form trenches 104
using one or more patterning and etching techniques known to one of
ordinary skill in the art of microelectronic device manufacturing.
In some embodiments, the size of trenches in the insulating layer
104 is determined by the size of conductive lines formed later on
in a process.
[0048] In some embodiments, forming the conductive lines 103
involves filling the trenches 104 with a layer of conductive
material. In some embodiments, a base layer (not shown) is first
deposited on the internal sidewalls and bottom of the trenches 104,
and then the conductive layer is deposited on the base layer. In
some embodiments, the base layer includes a conductive seed layer
(not shown) deposited on a conductive barrier layer (not shown).
The seed layer can include copper, and the conductive barrier layer
can include aluminum, titanium, tantalum, tantalum nitride, and the
like metals. The conductive barrier layer can be used to prevent
diffusion of the conductive material from the seed layer, e.g.,
copper, into the insulating layer 102. Additionally, the conductive
barrier layer can be used to provide adhesion for the seed layer
(e.g., copper).
[0049] In some embodiments, to form the base layer, the conductive
barrier layer is deposited onto the sidewalls and bottom of the
trenches 104, and then the seed layer is deposited on the
conductive barrier layer. In another embodiment, the conductive
base layer includes the seed layer that is directly deposited onto
the sidewalls and bottom of the trenches 104. Each of the
conductive barrier layer and seed layer may be deposited using any
thin film deposition technique known to one of ordinary skill in
the art of semiconductor manufacturing, e.g., sputtering, blanket
deposition, and the like. In one embodiment, each of the conductive
barrier layer and the seed layer has the thickness in an
approximate range from about 1 nm to about 100 nm. In some
embodiments, the barrier layer may be a thin dielectric that has
been etched to establish conductivity to the metal layer below. In
some embodiments, the barrier layer may be omitted altogether and
appropriate doping of the copper line may be used to make a
"self-forming barrier".
[0050] In some embodiments, the conductive layer e.g., copper, is
deposited onto the seed layer of base layer of copper, by an
electroplating process. In some embodiments, the conductive layer
is deposited into the trenches 104 using a damascene process known
to one of ordinary skill in the art of microelectronic device
manufacturing. In one embodiment, the conductive layer is deposited
onto the seed layer in the trenches 104 using a selective
deposition technique, such as but not limited to electroplating,
electroless, a CVD, PVD, MBE, MOCVD, ALO, spin-on, or other
deposition techniques known to one of ordinary skill in the art of
microelectronic device manufacturing.
[0051] In some embodiments, the choice of a material for conductive
layer for the conductive lines 103 determined the choice of a
material for the seed layer. For example, if the material for the
conductive lines 103 includes copper, the material for the seed
layer also includes copper. In some embodiments, the conductive
lines 103 include a metal, for example, copper (Cu), ruthenium
(Ru), nickel (Ni), cobalt (Co), chromium (Cr), iron (Fe), manganese
(Mn), titanium (Ti), aluminum (Al), hafnium (Hi), tantalum (Ta),
tungsten (W), Vanadium (V), Molybdenum (Mo), palladium (Pd), gold
(Au), silver (Au), platinum PI, indium (In), tin (Sn), lead (Pb),
antimony (Sb), bismuth (Bi), zinc (Zn), cadmium (Cd), or any
combination thereof.
[0052] In alternative embodiments, examples of the conductive
materials that may be used for the conductive lines 103 of the
metallization layer Mx are, but not limited to, metals, e.g.,
copper, tantalum, tungsten, ruthenium, titanium, hafnium,
zirconium, aluminum, silver, tin, lead, metal alloys, metal
carbides, e.g., hafnium carbide, zirconium carbide, titanium
carbide, tantalum carbide, aluminum carbide, other conductive
materials, or any combination thereof.
[0053] In some embodiments, portions of the conductive layer and
the base layer are removed to even out top portions of the
conductive lines 103 with top portions of the insulating layer 102
using a chemical-mechanical polishing ("CMP") technique known to
one of ordinary skill in the art of microelectronic device
manufacturing.
[0054] In one non-limiting example, the thickness of the conductive
lines 103 is in an approximate range from about 15 nm to about 1000
nm. In one non-limiting example, the thickness of the conductive
lines 103 is from about 20 nm to about 200 nm. In one non-limiting
example, the width of the conductive lines 103 is in an approximate
range from about 5 nm to about 500 nm. In one non-limiting example,
the spacing (pitch) between the conductive lines 103 is from about
2 nm to about 500 nm. In more specific non-limiting example, the
spacing (pitch) between the conductive lines 103 is from about 5 nm
to about 50 nm.
[0055] In some embodiments, the lower metallization layer Mx is
configured to connect to other metallization layers (not shown). In
some embodiments, the metallization layer Mx is configured to
provide electrical contact to electronic devices, e.g.,
transistors, memories, capacitors, resistors, optoelectronic
devices, switches, and any other active and passive electronic
devices that are separated by an electrically insulating layer, for
example, an interlayer dielectric, a trench insulation layer, or
any other insulating layer known to one of ordinary skill in the
art of electronic device manufacturing.
[0056] FIG. 2A is a view 200 similar to view 110 of FIG. 1A, after
the conductive lines 103 are recessed according to some
embodiments. FIG. 2B is a view 210 similar to FIG. 1B, after the
conductive lines 103 are recessed according to some embodiments.
The conductive lines 103 are recessed to a predetermined depth to
form recessed conductive lines 201. As shown in FIGS. 2A and 2B,
trenches 202 are formed in the insulating layer 102. Each trench
202 has sidewalls 204 that are portions of insulating layer 102 and
a bottom that is a top surface 203 of the recessed conductive line
201.
[0057] In some embodiments, the depth of the trenches 202 is from
about 10 nm to about 500 nm. In some embodiments, the depth of the
trenches 202 is from about 10% to about 100% of the thicknesses of
the conductive lines. In some embodiments, the conductive lines 103
are recessed using one or more of wet etching, dry etching, or a
combination of techniques known to one of ordinary skill in the art
of electronic device manufacturing.
[0058] FIG. 3 is a view 300 similar to FIG. 2A, after a liner 301
is deposited on the recessed conductive lines 201 according to some
embodiments. Liner 301 is deposited on the bottom and sidewalls of
the trenches 202, as shown in FIG. 3.
[0059] In some embodiments, liner 301 is deposited to protect the
conductive lines 201 from changing the properties later on in a
process (e.g., during tungsten deposition, or other processes). In
some embodiments, liner 301 is a conductive liner. In another
embodiment, liner 301 is a non-conductive liner. In some
embodiments, when liner 301 is a non-conductive liner, the liner
301 is removed later on in a process, as described in further
detail below. In some embodiments, liner 301 includes titanium
nitride (TiN), titanium (Ti), tantalum (Ta), tantalum nitride
(TaN), or any combination thereof. In another embodiment, liner 301
is an oxide, e.g., aluminum oxide (AlO), titanium oxide
(TiO.sub.2). In yet another embodiment, liner 301 is a nitride,
e.g., silicon nitride (SiN). In an embodiment, the liner 301 is
deposited to the thickness from about 0.5 nm to about 10 nm.
[0060] In some embodiments, the liner 301 is deposited using an
atomic layer deposition (ALD) technique. In some embodiments, the
liner 301 is deposited using one of deposition techniques, such as
but not limited to a CVD, PVD, MBE, MOCVD, spin-on, or other liner
deposition techniques known to one of ordinary skill in the art of
microelectronic device manufacturing.
[0061] FIG. 4 is a view 400 similar to FIG. 3, after a seed gapfill
layer 401 is deposited on the liner 301 according to some
embodiments. In some embodiments, seed gapfill layer 401 is a
self-aligned selective growth seed film. As shown in FIG. 4, seed
gapfill layer 401 is deposited on liner 301 on the top surface 203
of the recessed conductive lines 201, the sidewalls 204 of the
trenches 202 and top portions of the insulating layer 102. In some
embodiments, seed gapfill layer 401 is a tungsten (W) layer, or
other seed gapfill layer to provide selective growth pillars. In
some embodiments, seed gapfill layer 401 is a metal film or a metal
containing film. Suitable metal films include, but are not limited
to, films including one or more of Co, Mo, W, Ta, Ti, Ru, rhodium
(Rh), Cu, Fe, Mn, V, Niobium (Nb), hafnium (Hf), Zirconium (Zr),
Yttrium (Y), Al, Sn, Cr, Lanthanum (La), or any combination
thereof. In some embodiments, seed gapfill layer 401 comprises is a
tungsten (W) seed gapfill layer.
[0062] In some embodiments, the seed gapfill layer 401 is deposited
using one of deposition techniques, such as but not limited to an
ALD, a CVD, PVD, MBE, MOCVD, spin-on, or other liner deposition
techniques known to one of ordinary skill in the art of
microelectronic device manufacturing.
[0063] FIG. 5A is a view 500 similar to FIG. 4, after portions of
the seed gapfill layer 401 are removed to expose top portions of
the insulating layer 102 according to one embodiment. FIG. 5B is a
perspective view of the electronic device structure shown in FIG.
5A. In some embodiments, the portions of the seed gapfill layer 401
are removed using one of the chemical-mechanical polishing (CMP)
techniques known to one of ordinary skill in the art of
microelectronic device manufacturing.
[0064] FIG. 6A is a view 600 similar to FIG. 5A, and FIG. 6B is a
view 610 similar to FIG. 5B, after self-aligned selective growth
pillars 601 are formed using the seed gap fill layer 401 on the
liner 301 on the recessed conductive lines 201 according to one or
more embodiment. As shown in FIGS. 6A and 6B, an array of the
self-aligned selective growth pillars 601 has the same pattern as
the set of the conductive lines 201. As shown in FIGS. 6A and 6B,
the pillars 601 extend substantially orthogonally from the top
surfaces of the conductive lines 201. As shown in FIGS. 6A and 6B,
the pillars 601 extend along the same direction as the conductive
lines 201. As shown in FIGS. 6A and 6B, the pillars 601 are
separated by gaps 603.
[0065] In some embodiments, the pillars 601 are selectively grown
from the seed gapfill layer 401 on portions of the liner 301 on the
conductive lines 201. The pillars 601 are not grown on portions of
the liner 301 on the insulating layer 102, as shown in FIGS. 6A and
6B. In some embodiments, portions of the seed gapfill layer 401
above the conductive lines 201 are expanded for example, by
oxidation, nitridation, or other process to grow pillars 601. In
some embodiments, the seed gapfill layer 401 is oxidized by
exposure to an oxidizing agent or oxidizing conditions to transform
the metal or metal containing seed gapfill layer 401 to metal oxide
pillars 601. In some embodiments, pillars 601 include an oxide of
one or more metals listed above. In more specific embodiment,
pillars 601 include tungsten oxide (e.g., WO, WO.sub.3 and other
tungsten oxide).
[0066] The oxidizing agent can be any suitable oxidizing agent
including, but not limited to, O.sub.2, O.sub.3, N.sub.2O,
H.sub.2O, H.sub.2O.sub.2, CO, CO.sub.2, NH.sub.3, N.sub.2/Ar,
N.sub.2/He, N.sub.2/Ar/He or any combination thereof. In some
embodiments, the oxidizing conditions comprise a thermal oxidation,
plasma enhanced oxidation, remote plasma oxidation, microwave and
radio-frequency oxidation (e.g., inductively coupled plasma (ICP),
capacitively coupled plasma (CCP)).
[0067] In some embodiments, the pillars 601 are formed by oxidation
of the seed gapfill layer at any suitable temperature depending on,
for example, the composition of the seed gapfill layer and the
oxidizing agent. In some embodiments, the oxidation occurs at a
temperature in an approximate range of about 25 degrees C. to about
800 degrees C. In some embodiments, the oxidation occurs at a
temperature greater than or equal to about 150.degree. C. In some
embodiments, the height 602 of the pillars 601 is in an approximate
range from about 5 angstroms (A.) to about 10 microns (.mu.m).
[0068] FIG. 7A is a view 700 similar to FIG. 6A, and FIG. 7B is a
view 710 similar to FIG. 6B, after an insulating layer 701 is
deposited to overfill the gaps 603 between the pillars 601
according to some embodiments. As shown in FIGS. 7A and 7B,
insulating layer 701 is deposited on the opposing sidewalls 702 and
top portions 703 of the pillars 601 and through the gaps 603 on the
portions of the insulating layer 102 and liner 301 between the
pillars 601.
[0069] In some embodiments, insulating layer 701 is a low-k gapfill
layer. In one embodiment, insulating layer 701 is a flowable
silicon oxide (FSiOx) layer. In some embodiments, insulating layer
701 is an oxide layer, e.g., silicon dioxide, or any other
electrically insulating layer determined by an electronic device
design. In some embodiments, insulating layer 701 is an interlayer
dielectric (ILD). In some embodiments, insulating layer 701 is a
low-k dielectric that includes, but is not limited to, materials
such as, e.g., silicon dioxide, silicon oxide, a carbon based
material, e.g., a porous carbon film, carbon doped oxide ("CDO"),
e.g., carbon doped silicon dioxide, porous silicon dioxide, porous
silicon oxide carbide hydride (SiOCH), silicon nitride, or any
combination thereof. In some embodiments, insulating layer 701 is a
dielectric material having k-value less than 3. In some
embodiments, insulating layer 701 is a dielectric material having
k-value in an approximate range from about 2.2 to about 2.7. In
some embodiments, insulating layer 701 includes a dielectric
material having k-value less than 2. In some embodiments,
insulating layer 701 represents one of the insulating layers
described above with respect to insulating layer 102.
[0070] In some embodiments, insulating layer 701 is a low-k
interlayer dielectric to isolate one metal line from other metal
lines. In some embodiments, insulating layer 701 is deposited using
one of deposition techniques, such as but not limited to a CVD,
spin-on, an ALD, PVD, MBE, MOCVD, or other low-k insulating layer
deposition techniques known to one of ordinary skill in the art of
microelectronic device manufacturing.
[0071] FIG. 8A is a view 800 similar to FIG. 7A, and FIG. 8B is a
view 810 similar to FIG. 7B, after an insulating layer 701 is
deposited a dual damascene etch 801 is performed in the insulating
layer 701. The dual damascene etch can be performed by any suitable
method known to those skilled in the art. Briefly, a mask (not
shown) is applied or positioned adjacent insulting layer 701 and
the etch 801 is performed through the mask. The etch 801 extends
through insulating layer 701, extending between two adjacent
pillars 601. The sides 802 of the etch 801 can extend up to a side
of the pillar 601. The etch 801 removes liner 301 between the
adjacent pillars 601 to expose insulating layer 102. A top view 810
shows a rectangular etch 801 in insulating layer 701 exposing the
insulating layer 102 with liner 301 on either side of the
insulating layer 102. The opening between the adjacent pillars 601
is referred to as a contact hole.
[0072] FIG. 9A is a view 900 similar to FIG. 8A, and FIG. 9B is a
view 910 similar to FIG. 8B, after the dual damascene etch 801 a
conformal liner 901 is formed in the opening formed by the etch
801.
[0073] In some embodiments, liner 901 is deposited to protect the
dielectric 701, pillar 601 and/or dielectric 301 from later
processes (e.g., during tungsten deposition, or other processes).
In some embodiments, liner 901 is a conductive liner. In another
embodiment, liner 901 is a non-conductive liner. In some
embodiments, when liner 901 is a non-conductive liner, the liner
901 can be removed later on in a process, as described in further
detail below. In some embodiments, liner 901 includes titanium
nitride (TiN), titanium (Ti), tantalum (Ta), tantalum nitride
(TaN), or any combination thereof. In another embodiment, liner 901
is an oxide, e.g., aluminum oxide (AlO), titanium oxide
(TiO.sub.2). In yet another embodiment, liner 901 is a nitride,
e.g., silicon nitride (SiN). In an embodiment, the liner 901 is
deposited to the thickness from about 0.5 nm to about 10 nm.
[0074] In some embodiments, the liner 901 is deposited using an
atomic layer deposition (ALD) technique. In some embodiments, the
liner 901 is deposited using one of deposition techniques, such as
but not limited to a CVD, PVD, MBE, MOCVD, spin-on, or other liner
deposition techniques known to one of ordinary skill in the art of
microelectronic device manufacturing.
[0075] Liner 901 forms conformally on dielectric 701 and dielectric
102. As used herein, the term "conformal", or "conformally", refers
to a layer that adheres to and uniformly covers exposed surfaces
with a thickness having a variation of less than 1% relative to the
average thickness of the film. For example, a 1,000 .ANG. thick
film would have less than 10 .ANG. variations in thickness. This
thickness and variation includes edges, corners, sides, and the
bottom of recesses. For example, a conformal layer deposited by ALD
in various embodiments of the disclosure would provide coverage
over the deposited region of essentially uniform thickness on
complex surfaces.
[0076] In some embodiments, the liner 901 is a continuous film. As
used herein, the term "continuous" refers to a layer that covers an
entire exposed surface without gaps or bare spots that reveal
material underlying the deposited layer. A continuous layer may
have gaps or bare spots with a surface area less than about 1% of
the total surface area of the film.
[0077] FIG. 10A is a view 1000 similar to FIG. 9A, and FIG. 10B is
a view 1010 similar to FIG. 9B, after the conformal liner 901 is
deposited, a metal 1001 (also referred to as M2) is deposited in
the opening formed by etch 801 lined with liner 901. FIG. 10 shows
the metal 1001 even with the top of the dielectric 701. The even
top can be formed by depositing the gapfill metal 1001 to provide a
sufficient amount of overburden on the surface followed by a
chemical mechanical planarization process to form an even
surface.
[0078] The metal 1001 can be any suitable metal. In some
embodiments, the film 130 is a metal film or a metal containing
film. Suitable metal films include, but are not limited to, films
including one or more of Co, Mo, W, Ta, Ti, Ru, Rh, Cu, Fe, Mn, V,
Nb, Hf, Zr, Y, Al, Sn, Cr and/or La. In some embodiments, the metal
film comprises tungsten. In another embodiment, the metal 1001 is
deposited using an atomic layer deposition (ALD) technique. In some
embodiments, the metal 1001 is deposited using one of deposition
techniques, such as but not limited to a CVD, PVD, MBE, MOCVD,
spin-on, or other liner deposition techniques known to one of
ordinary skill in the art of microelectronic device
manufacturing.
[0079] FIG. 11A is a view 1100 similar to FIG. 10A, and FIG. 11B is
a view 1110 similar to FIG. 10B. After deposition of the M2 metal
1001, a mask 1101 is applied to cover the via formed by metal 1001.
The top view of FIG. 11B shows the metal 1001 covered and protected
by the mask 1101. The mask can be any suitable mask that can
protect the metal 1001 for subsequent processes.
[0080] FIGS. 12A and 12B illustrates the result of etching after
mask 1101 has been applied. The side view 1101 in FIG. 12A appears
the same as FIG. 11A because the changes due to etching occur in a
different plane that that illustrated. FIG. 12B shows a top view
1110 with the dielectric 701 and pillar 601 exposed.
[0081] FIGS. 13A and 13B show side view 1300 and top view 1310
after removal of the pillars 601 to leave air gaps 1301. Removal of
the pillars 601 can be done by an isotropic etch that can etch
sideways to remove material from beneath the mask 1101. The etching
or removal process can be selective for the pillar 601 material
relative to the liner 301, liner 901 and/or dielectric 701. In some
embodiments, etching removes substantially all of the pillar 601
leaving air gap 1301 having substantially the same shape and size
of the pillar 601. As used in this regard, the term "all of the
pillar" means that greater than or equal to about 90%, 95%, 98% or
99% of the pillar (by volume) is removed.
[0082] Etching of the pillars 601 can be done by any suitable
technique. In some embodiments, etching the pillars 601 comprises
exposing the pillars 601 to a metal halide compound. In some
embodiments, the metal halide compound has a different metal than
the pillars 601.
[0083] In some embodiments, etching the pillars 601 comprises
exposure to a metal-and-halogen-containing precursor (e.g.
WCl.sub.6), also referred to as a metal halide precursor. The metal
halide precursor can react with the pillars 601.
[0084] In some embodiments, exposure to the metal halide precursor
causes an exothermic reaction with the pillar material and no
plasma is present in the substrate processing region. No plasma
excites the metal-halide precursor prior to entering the substrate
processing region according to one or more embodiments.
[0085] In an exemplary non-limiting process, the pillars comprise
tungsten and grown by reaction with oxygen to form the tungsten
oxide pillars, which may take the form of WO.sub.3. Exposure of
WO.sub.3 to WCl.sub.6 (or possibly WCl.sub.5) forms volatile
WOCl.sub.4 and/or WO.sub.2Cl.sub.2 which leaves the surface until
all tungsten oxide is removed. The reaction can spontaneously stop
once the tungsten oxide portion (or metal oxide portion in general)
is removed. The process can be repeated an integral number of
cycles. Each cycle may remove a selectable amount of the original
tungsten film (e.g. 1 or 2 monolayers).
[0086] In some embodiments, the metal halide precursor includes two
or more or only two different elements including a metal element
and a halogen element. The metal halide precursor may include only
a single atom of the metal element but multiple atoms of the same
halogen element (as is the case for WCl.sub.6 and WCl.sub.5). The
metal element of the metal halide may include one or more of
titanium, hafnium, zirconium, vanadium, niobium, tantalum,
chromium, molybdenum, tungsten, manganese, rhenium, technetium,
iron, aluminum and gallium in embodiments. In some embodiments, the
metal element of the metal halide has an atomic number of 22, 23,
24, 40, 41, 42, 72, 73 or 74. In one or more embodiments, the metal
element comprises an element of group 4, group 5 or group 6 of the
periodic table or may be transition metals. The halogen element may
be one of F and Cl according to one or more embodiments. The
halogen element may be one or more of F, Cl, Br and/or I. In some
embodiments, the metal-and-halogen-containing precursor
fluorine-free. Some examples of suitable metal halide precursors
include, but are not limited to, vanadium pentahalides, tantalum
pentahalides, chromium hexahalides, molybdenum pentahalides,
molybdenum hexahalides, niobium pentahalides, tungsten
pentahalides, tungsten hexahalides, and manganese tetrahalides. In
some embodiments, the metal halide precursors include, but are not
limited to, vanadium halides, tantalum halides, chromium halides,
molybdenum halides, niobium halides, tungsten halides and/or
manganese halides, where the oxidation state of the metal element
can be any suitable oxidation state.
[0087] The etch processes of some embodiments has a selectivity
greater than or equal to about 10:1, greater than or equal to about
15:1, greater than or equal to about 20:1 or greater than or equal
to about 25:1.
[0088] In some embodiments, there is little or no local plasma used
in the etch process to make etch processes more selective, delicate
and isotropic. The term "plasma-free" will be used herein to
describe the substrate processing region during application of no
or essentially no plasma power to the substrate processing region.
The etchants (the metal-and-halogen-containing precursor) described
possess energetically favorable etch reaction pathways which enable
the substrate processing region to be plasma-free during operations
of etching metal-containing materials herein. Stated another way,
the electron temperature in the substrate processing region may be
less than 0.5 eV, less than 0.45 eV, less than 0.4 eV, or less than
0.35 eV according to one or more embodiments. Moreover, the
metal-and-halogen-containing precursor may have not been excited in
any remote plasma prior to entering the substrate processing region
in embodiments. For example, if a remote plasma region or a
separate chamber region is present and used to conduct the
halogen-containing precursor toward the substrate processing
region, the separate chamber region or remote plasma region may be
plasma-free as defined herein.
[0089] FIGS. 14A and 14B illustrate a side view 1400 and top view
1410 after blanket deposition of film 1401. Film 1401 can be any
suitable material that does not fill the air gaps 1301 formed from
the pillars. In some embodiments, the film 1401 is deposited by a
plasma enhanced process. In some embodiments, the film 1401 is a
non-conformal film. In some embodiments, the film 1401 comprises an
insulating material.
[0090] FIG. 15 shows a block diagram of a plasma system to perform
at least some of the operations to provide a fully self-aligned via
according to one embodiment. As shown in FIG. 15, system 1800 has a
processing chamber 1801. A movable pedestal 1802 to hold an
electronic device structure 1803 is placed in processing chamber
1801. Pedestal 1802 comprises an electrostatic chuck ("ESC"), a DC
electrode embedded into the ESC, and a cooling/heating base. In an
embodiment, pedestal 1802 acts as a moving cathode. In an
embodiment, the ESC comprises an Al.sub.2O.sub.3 material,
Y.sub.2O.sub.3, or other ceramic materials known to one of ordinary
skill of electronic device manufacturing. A DC power supply 1804 is
connected to the DC electrode of the pedestal 1802.
[0091] As shown in FIG. 15, an electronic device structure 1803 is
loaded through an opening 1808 and placed on the pedestal 1802. The
electronic device structure 1803 represents one of the electronic
device structures described above. System 1800 comprises an inlet
to input one or more process gases 1812 through a mass flow
controller 1811 to a plasma source 1813. A plasma source 1813
comprising a showerhead 1814 is coupled to the processing chamber
1801 to receive one or more gases 1812 to generate plasma. Plasma
source 1813 is coupled to a RF source power 1810. Plasma source
1813 through showerhead 1814 generates a plasma 1815 in processing
chamber 1801 from one or more process gases 1812 using a high
frequency electric field. Plasma 1815 comprises plasma particles,
such as ions, electrons, radicals or any combination thereof. In an
embodiment, power source 1810 supplies power from about 50 W to
about 3000 W at a frequency from about 400 kHz to about 162 MHz to
generate plasma 1815.
[0092] A plasma bias power 1805 is coupled to the pedestal 1802
(e.g., cathode) via a RF match 1807 to energize the plasma. In an
embodiment. the plasma bias power 1805 provides a bias power that
is not greater than 1000 W at a frequency between about 2 MHz to 60
MHz. and in a particular embodiment at about 13 MHz. A plasma bias
power 1806 may also be provided. for example to provide another
bias power that is not greater than 1000 W at a frequency from
about 400 kHz to about 60 MHz, and in a particular embodiment, at
about 60 MHz. Plasma bias power 1806 and bias power 1805 are
connected to RF match 1807 to provide a dual frequency bias power.
In an embodiment. a total bias power applied to the pedestal 1802
is from about 10 W to about 3000 W.
[0093] As shown in FIG. 15, a pressure control system 1809 provides
a pressure to processing chamber 1801. As shown in FIG. 15, chamber
1801 has one or more exhaust outlets 1816 to evacuate volatile
products produced during processing in the chamber. In an
embodiment, the plasma system 1800 is an inductively coupled plasma
(ICP) system. In an embodiment. the plasma system 180 is a
capacitively coupled plasma (CCP) system.
[0094] A control system 1817 is coupled to the chamber 1801. The
control system 1817 comprises a processor 1818. a temperature
controller 1819 coupled to the processor 1818, a memory 1820
coupled to the processor 1818. and input/output devices 1821
coupled to the processor 1818 to form fully self-aligned via as
described herein.
[0095] In one embodiment, the processor 1018 has a configuration to
control recessing first conductive lines on a first insulating
layer on a substrate, the first conductive lines extending along a
first direction on the first insulating layer. The processor 1018
has a configuration to control depositing a liner on the recessed
first conductive lines. The processor has a configuration to
control selectively growing a seed layer on the recessed first
conductive lines. The processor 1018 has a configuration to control
forming pillars using the selectively grown seed layer. The
processor 1018 has a configuration to control depositing a second
insulating layer between the pillars. The processor 1018 has a
configuration to control removing the pillars to form air gaps (or
trenches) in the second insulating layer. The processor 1018 has a
configuration to control depositing a conductive layer into the
contact hole, as described above.
[0096] The control system 1817 is configured to perform at least
some of the methods as described herein and may be either software
or hardware or a combination of both. The plasma system 1800 may be
any type of high performance processing plasma systems known in the
art, such as but not limited to an etcher, a cleaner, a furnace, or
any other plasma system to manufacture electronic devices.
[0097] According to one or more embodiments, the substrate is
subjected to processing prior to and/or after forming the layer.
This processing can be performed in the same chamber or in one or
more separate processing chambers. In some embodiments, the
substrate is moved from the first chamber to a separate, second
chamber for further processing. The substrate can be moved directly
from the first chamber to the separate processing chamber, or it
can be moved from the first chamber to one or more transfer
chambers, and then moved to the separate processing chamber.
Accordingly, the processing apparatus may comprise multiple
chambers in communication with a transfer station. An apparatus of
this sort may be referred to as a "cluster tool" or "clustered
system," and the like.
[0098] Generally, a cluster tool is a modular system comprising
multiple chambers which perform various functions including
substrate center-finding and orientation, degassing, annealing,
deposition and/or etching. According to one or more embodiments, a
cluster tool includes at least a first chamber and a central
transfer chamber. The central transfer chamber may house a robot
that can shuttle substrates between and among processing chambers
and load lock chambers. The transfer chamber is typically
maintained at a vacuum condition and provides an intermediate stage
for shuttling substrates from one chamber to another and/or to a
load lock chamber positioned at a front end of the cluster tool.
Two well-known cluster tools which may be adapted for the present
invention are the Centura.RTM. and the Endura.RTM., both available
from Applied Materials, Inc., of Santa Clara, Calif. However, the
exact arrangement and combination of chambers may be altered for
purposes of performing specific steps of a process as described
herein. Other processing chambers which may be used include, but
are not limited to, cyclical layer deposition (CLD), atomic layer
deposition (ALD), chemical vapor deposition (CVD), physical vapor
deposition (PVD), etch, pre-clean, chemical clean, thermal
treatment such as RTP, plasma nitridation, degas, orientation,
hydroxylation and other substrate processes. By carrying out
processes in a chamber on a cluster tool, surface contamination of
the substrate with atmospheric impurities can be avoided without
oxidation prior to depositing a subsequent film.
[0099] According to one or more embodiments, the substrate is
continuously under vacuum or "load lock" conditions, and is not
exposed to ambient air when being moved from one chamber to the
next. The transfer chambers are thus under vacuum and are "pumped
down" under vacuum pressure. Inert gases may be present in the
processing chambers or the transfer chambers. In some embodiments,
an inert gas is used as a purge gas to remove some or all of the
reactants. According to one or more embodiments, a purge gas is
injected at the exit of the deposition chamber to prevent reactants
from moving from the deposition chamber to the transfer chamber
and/or additional processing chamber. Thus, the flow of inert gas
forms a curtain at the exit of the chamber.
[0100] The substrate can be processed in single substrate
deposition chambers, where a single substrate is loaded, processed
and unloaded before another substrate is processed. The substrate
can also be processed in a continuous manner, similar to a conveyer
system, in which multiple substrate are individually loaded into a
first part of the chamber, move through the chamber and are
unloaded from a second part of the chamber. The shape of the
chamber and associated conveyer system can form a straight path or
curved path. Additionally, the processing chamber may be a carousel
in which multiple substrates are moved about a central axis and are
exposed to deposition, etch, annealing, cleaning, etc. processes
throughout the carousel path.
[0101] During processing, the substrate can be heated or cooled.
Such heating or cooling can be accomplished by any suitable means
including, but not limited to, changing the temperature of the
substrate support and flowing heated or cooled gases to the
substrate surface. In some embodiments, the substrate support
includes a heater/cooler which can be controlled to change the
substrate temperature conductively. In one or more embodiments, the
gases (either reactive gases or inert gases) being employed are
heated or cooled to locally change the substrate temperature. In
some embodiments, a heater/cooler is positioned within the chamber
adjacent the substrate surface to convectively change the substrate
temperature.
[0102] The substrate can also be stationary or rotated during
processing. A rotating substrate can be rotated continuously or in
discrete steps. For example, a substrate may be rotated throughout
the entire process, or the substrate can be rotated by a small
amount between exposures to different reactive or purge gases.
Rotating the substrate during processing (either continuously or in
steps) may help produce a more uniform deposition or etch by
minimizing the effect of, for example, local variability in gas
flow geometries.
[0103] Reference throughout this specification to "some
embodiments," "certain embodiments," "one or more embodiments" or
"an embodiment" means that a particular feature, structure,
material, or characteristic described in connection with the
embodiment is included in some embodiments of the invention. Thus,
the appearances of the phrases such as "in one or more
embodiments," "in certain embodiments," "in some embodiments" or
"in an embodiment" in various places throughout this specification
are not necessarily referring to the same embodiment of the
invention. Furthermore, the particular features, structures,
materials, or characteristics may be combined in any suitable
manner in one or more embodiments.
[0104] Although the invention herein has been described with
reference to particular embodiments, it is to be understood that
these embodiments are merely illustrative of the principles and
applications of the present invention. It will be apparent to those
skilled in the art that various modifications and variations can be
made to the method and apparatus of the present invention without
departing from the spirit and scope of the invention. Thus, it is
intended that the present invention include modifications and
variations that are within the scope of the appended claims and
their equivalents.
* * * * *