Gopalraja; Praburam

Patent Applications and Registrations

Patent applications and USPTO patent grants for Gopalraja; Praburam.The latest application filed is for "additive patterning of semiconductor film stacks".

Company Profile

7.76.77

Gopalraja; Praburam - Santa Clara CA
GOPALRAJA; Praburam - San Jose CA
GOPALRAJA; Praburam - Sunnyvale CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Bottom-up approach to high aspect ratio hole formation in 3D memory structures Grant 11,315,943 - Gopalraja , et al. April 26, 2	2022-04-26
Self-aligned high aspect ratio structures and methods of making Grant 11,177,164 - Roy , et al. November 16, 2	2021-11-16
Additive Patterning Of Semiconductor Film Stacks App 20210305501 - DUKOVIC; John O. ; et al.	2021-09-30
Additive patterning of semiconductor film stacks Grant 11,049,537 - Dukovic , et al. June 29, 2	2021-06-29
Chamber with individually controllable plasma generation regions for a reactor for processing a workpiece Grant 10,957,518 - Ramaswamy , et al. March 23, 2	2021-03-23
Bottom-Up Approach To High Aspect Ratio Hole Formation In 3D Memory Structures App 20210050365 - Gopalraja; Praburam ; et al.	2021-02-18
Additive Patterning Of Semiconductor Film Stacks App 20210035619 - DUKOVIC; John O. ; et al.	2021-02-04
Methods of forming self-aligned vias and air gaps Grant 10,840,186 - Roy , et al. November 17, 2	2020-11-17
Chamber With Individually Controllable Plasma Generation Regions For A Reactor For Processing A Workpiece App 20200312630 - Ramaswamy; Kartik ; et al.	2020-10-01
Self-Aligned High Aspect Ratio Structures And Methods Of Making App 20200194304 - Roy; Susmit Singha ; et al.	2020-06-18
Single oxide metal deposition chamber Grant 10,597,785 - Subramani , et al.	2020-03-24
Sputtering showerhead Grant 10,577,689 - Subramani , et al.	2020-03-03
Methods Of Forming Self-Aligned Vias And Air Gaps App 20190348368 - Roy; Susmit Singha ; et al.	2019-11-14
Methods of forming self-aligned vias and air gaps Grant 10,403,542 - Roy , et al. Sep	2019-09-03
Methods Of Forming Self-Aligned Vias And Air Gaps App 20180358260 - Roy; Susmit Singha ; et al.	2018-12-13
Self-ionized And Inductively-coupled Plasma For Sputtering And Resputtering App 20180327893 - DING; Peijun ; et al.	2018-11-15
Self-ionized and inductively-coupled plasma for sputtering and resputtering Grant 10,047,430 - Ding , et al. August 14, 2	2018-08-14
Self-aligned multiple spacer patterning schemes for advanced nanometer technology Grant 9,978,596 - Zhang , et al. May 22, 2	2018-05-22
Sputtering Showerhead App 20180087155 - SUBRAMANI; Anantha K. ; et al.	2018-03-29
Single Oxide Metal Deposition Chamber App 20180073150 - SUBRAMANI; Anantha K. ; et al.	2018-03-15
Plasma Reactor For Processing A Workpiece With An Array Of Plasma Point Sources App 20170092470 - Ramaswamy; Kartik ; et al.	2017-03-30
Self-aligned Multiple Spacer Patterning Schemes For Advanced Nanometer Technology App 20170092494 - ZHANG; Ying ; et al.	2017-03-30
Self-aligned multiple spacer patterning schemes for advanced nanometer technology Grant 9,548,201 - Zhang , et al. January 17, 2	2017-01-17
Self-aligned Multiple Spacer Patterning Schemes For Advanced Nanometer Technology App 20150371852 - ZHANG; Ying ; et al.	2015-12-24
Self-ionized and capacitively-coupled plasma for sputtering and resputtering Grant 9,062,372 - Gopalraja , et al. June 23, 2	2015-06-23
Method For Stabilizing An Interface Post Etch To Minimize Queue Time Issues Before Next Processing Step App 20150079799 - NEMANI; Srinivas D. ; et al.	2015-03-19
Electromagnet array in a sputter reactor Grant 8,871,064 - Gung , et al. October 28, 2	2014-10-28
Self-ionized And Inductively-coupled Plasma For Sputtering And Resputtering App 20140305802 - DING; Peijun ; et al.	2014-10-16
Self-ionized and inductively-coupled plasma for sputtering and resputtering Grant 8,696,875 - Ding , et al. April 15, 2	2014-04-15
Self-ionized and inductively-coupled plasma for sputtering and resputtering Grant 8,668,816 - Ding , et al. March 11, 2	2014-03-11
Sputtering chamber having auxiliary backside magnet to improve etch uniformity and magnetron producing sustained self sputtering of ruthenium and tantalum Grant 8,557,094 - Tang , et al. October 15, 2	2013-10-15
Coils For Generating A Plasma And For Sputtering App 20130168232 - NULMAN; Jaim ; et al.	2013-07-04
Coils for generating a plasma and for sputtering Grant 8,398,832 - Nulman , et al. March 19, 2	2013-03-19
Electromagnet array in a sputter reactor App 20100155223 - GUNG; Tza-Jing ; et al.	2010-06-24
Selective ruthenium deposition on copper materials Grant 7,737,028 - Wang , et al. June 15, 2	2010-06-15
Remote plasma pre-clean with low hydrogen pressure Grant 7,704,887 - Fu , et al. April 27, 2	2010-04-27
Pvd Cu Seed Overhang Re-sputtering With Enhanced Cu Ionization App 20100096253 - Cao; Yong ; et al.	2010-04-22
Multi-step process for forming a metal barrier in a sputter reactor Grant 7,686,926 - Gung , et al. March 30, 2	2010-03-30
Metal / metal nitride barrier layer for semiconductor device applications Grant 7,687,909 - Ding , et al. March 30, 2	2010-03-30
Oxidized barrier layer Grant 7,659,204 - Tang , et al. February 9, 2	2010-02-09
Self-ionized And Inductively-coupled Plasma For Sputtering And Resputtering App 20090233438 - DING; Peijun ; et al.	2009-09-17
Methods and apparatus for forming barrier layers in high aspect ratio vias Grant 7,547,644 - Chen , et al. June 16, 2	2009-06-16
Selective Ruthenium Deposition On Copper Materials App 20090087982 - WANG; RONGJUN ; et al.	2009-04-02
Self-ionized and capacitively-coupled plasma for sputtering and resputtering Grant 7,504,006 - Gopalraja , et al. March 17, 2	2009-03-17
Method of depositing a diffusion barrier layer which provides an improved interconnect App 20090053888 - Ding; Peijun ; et al.	2009-02-26
Oxidized Barrier Layer App 20080237029 - TANG; Xianmin ; et al.	2008-10-02
Resputtered Copper Seed Layer App 20080190760 - TANG; XIANMIN ; et al.	2008-08-14
Self-ionized And Capacitively-coupled Plasma For Sputtering And Resputtering App 20080142359 - GOPALRAJA; Praburam ; et al.	2008-06-19
Self-ionized And Inductively-coupled Plasma For Sputtering And Resputtering App 20080110747 - DING; Peijun ; et al.	2008-05-15
Sputtering Chamber Having Auxiliary Backside Magnet to Improve Etch Uniformity and Magnetron Producing Sustained Self Sputtering of Ruthenium and Tantalum App 20080083610 - Tang; Xianmin ; et al.	2008-04-10
Sputtering using an unbalanced magnetron Grant 7,335,282 - Fu , et al. February 26, 2	2008-02-26
Metal / metal nitride barrier layer for semiconductor device applications App 20070241458 - Ding; Peijun ; et al.	2007-10-18
Etch and sidewall selectivity in plasma sputtering App 20070209925 - Tang; Xianmin ; et al.	2007-09-13
Method of depositing a tantalum nitride/tantalum diffusion barrier layer system Grant 7,253,109 - Ding , et al. August 7, 2	2007-08-07
Remote plasma pre-clean with low hydrogen pressure App 20070117397 - Fu; Xinyu ; et al.	2007-05-24
Controlled multi-step magnetron sputtering process App 20070095654 - Gopalraja; Praburam ; et al.	2007-05-03
Coil and coil support for generating a plasma App 20070062452 - Pancham; Ian A. ; et al.	2007-03-22
Integrated process for sputter deposition of a conductive barrier layer, especially an alloy of ruthenium and tantalum, underlying copper or copper alloy seed layer App 20070059502 - Wang; Rongjun ; et al.	2007-03-15
Simultaneous ion milling and sputter deposition App 20070051622 - Tang; Xianmin ; et al.	2007-03-08
Process kit for improved power coupling through a workpiece in a semiconductor wafer processing system Grant 7,163,607 - Stimson , et al. January 16, 2	2007-01-16
Conductive barrier layer, especially an alloy of ruthenium and tantalum and sputter deposition thereof App 20060251872 - Wang; Jenn Yue ; et al.	2006-11-09
Coils for generating a plasma and for sputtering App 20060070875 - Nulman; Jaim ; et al.	2006-04-06
Methods and apparatus for forming barrier layers in high aspect ratio vias App 20060057843 - Chen; Fusen ; et al.	2006-03-16
Multi-step magnetron sputtering process Grant 6,991,709 - Gopalraja , et al. January 31, 2	2006-01-31
Methods and apparatus for forming barrier layers in high aspect ratio vias Grant 6,974,771 - Chen , et al. December 13, 2	2005-12-13
Method of depositing low resistivity barrier layers for copper interconnects App 20050272254 - Ding, Peijun ; et al.	2005-12-08
Methods and apparatus for forming barrier layers in high aspect ratio vias App 20050266682 - Chen, Fusen ; et al.	2005-12-01
Multi-step process for forming a metal barrier in a sputter reactor App 20050263390 - Gung, Tza-Jing ; et al.	2005-12-01
Method and apparatus for forming a barrier layer on a substrate App 20050252765 - Zhang, Hong ; et al.	2005-11-17
Controlled multi-step magnetron sputtering process App 20050255700 - Gopalraja, Praburam ; et al.	2005-11-17
Self-ionized and inductively-coupled plasma for sputtering and resputtering App 20050255691 - Ding, Peijun ; et al.	2005-11-17
Method of depositing a tantalum nitride / tantalum diffusion barrier layer system App 20050208767 - Ding, Peijun ; et al.	2005-09-22
Method and apparatus for forming a barrier layer on a substrate App 20050189217 - Zhang, Hong ; et al.	2005-09-01
Method of depositing a TaN seed layer Grant 6,911,124 - Tang , et al. June 28, 2	2005-06-28
Partially filling copper seed layer Grant 6,899,796 - Wang , et al. May 31, 2	2005-05-31
Method and apparatus for forming a barrier layer on a substrate Grant 6,887,786 - Zhang , et al. May 3, 2	2005-05-03
Diffusion enhanced ion plating for copper fill Grant 6,884,329 - Wang , et al. April 26, 2	2005-04-26
Multi-step magnetron sputtering process App 20050056536 - Gopalraja, Praburam ; et al.	2005-03-17
Sputtering using an unbalanced magnetron App 20050051424 - Fu, Jianming ; et al.	2005-03-10
Self-ionized and inductively-coupled plasma for sputtering and resputtering App 20050006222 - Ding, Peijun ; et al.	2005-01-13
Asymmetric rotating sidewall magnet ring for magnetron sputtering Grant 6,837,975 - Wang , et al. January 4, 2	2005-01-04
Methods and apparatus for forming barrier layers in high aspect ratio vias App 20040266175 - Chen, Fusen ; et al.	2004-12-30
Coils for generating a plasma and for sputtering App 20040256217 - Nulman, Jaim ; et al.	2004-12-23
Partial turn coil for generating a plasma Grant 6,824,658 - Gopalraja , et al. November 30, 2	2004-11-30
Oblique ion milling of via metallization App 20040222082 - Gopalraja, Praburam ; et al.	2004-11-11
Self ionized sputtering using a high density plasma source Grant 6,790,323 - Fu , et al. September 14, 2	2004-09-14
Magnetron for a vault shaped sputtering target having two opposed sidewall magnets Grant 6,790,326 - Subramani , et al. September 14, 2	2004-09-14
Process kit for improved power coupling through a workpiece in a semiconductor wafer processing system App 20040173156 - Stimson, Bradley O. ; et al.	2004-09-09
Operating a magnetron sputter reactor in two modes Grant 6,787,006 - Gopalraja , et al. September 7, 2	2004-09-07
Methods and apparatus for forming barrier layers in high aspect ratio vias Grant 6,784,096 - Chen , et al. August 31, 2	2004-08-31
Coils for generating a plasma and for sputtering Grant 6,783,639 - Nulman , et al. August 31, 2	2004-08-31
Shaping features in sputter deposition App 20040140196 - Gopalraja, Praburam ; et al.	2004-07-22
Partially filling copper seed layer App 20040134769 - Wang, Wei D. ; et al.	2004-07-15
Diffusion enhanced ion plating for copper fill App 20040134768 - Wang, Wei D. ; et al.	2004-07-15
Magnetically confined metal plasma sputter source with magnetic control of ion and neutral densities Grant 6,758,949 - Wang , et al. July 6, 2	2004-07-06
Coil and coil support for generating a plasma App 20040118521 - Pancham, Ian A. ; et al.	2004-06-24
Self-ionized and capacitively-coupled plasma for sputtering and resputtering App 20040094402 - Gopalraja, Praburam ; et al.	2004-05-20
Auxiliary electromagnets in a magnetron sputter reactor Grant 6,730,196 - Wang , et al. May 4, 2	2004-05-04
Apparatus for improved power coupling through a workpiece in a semiconductor wafer processing system Grant 6,723,214 - Stimson , et al. April 20, 2	2004-04-20
Multiple-step sputter deposition Grant 6,709,553 - Wang , et al. March 23, 2	2004-03-23
Magnetically confined metal plasma sputter source with magnetic control of ion and neutral densities App 20040045811 - Wang, Wei D. ; et al.	2004-03-11
Methods and apparatus for forming barrier layers in high aspect ratio vias App 20040048461 - Chen, Fusen ; et al.	2004-03-11
Auxiliary electromagnets in a magnetron sputter reactor App 20040020770 - Wang, Wei D. ; et al.	2004-02-05
Asymmetric rotating sidewall magnet ring for magnetron sputtering App 20040020768 - Wang, Wei D. ; et al.	2004-02-05
Pulsed-mode RF bias for side-wall coverage improvement Grant 6,673,724 - Forster , et al. January 6, 2	2004-01-06
Feedthrough overlap coil Grant 6,660,134 - Gopalraja , et al. December 9, 2	2003-12-09
Method and apparatus for sputter deposition App 20030216037 - Zhang, Hong ; et al.	2003-11-20
Multiple-step sputter deposition App 20030209422 - Wang, Wei ; et al.	2003-11-13
Self-ionized and inductively-coupled plasma for sputtering and resputtering App 20030116427 - Ding, Peijun ; et al.	2003-06-26
Method of depositing a TaN seed layer App 20030089597 - Tang, Xianmin ; et al.	2003-05-15
Partial turn coil for generating a plasma App 20030051994 - Gopalraja, Praburam ; et al.	2003-03-20
Operating a magnetron sputter reactor in two modes App 20020185370 - Gopalraja, Praburam ; et al.	2002-12-12
Integrated copper fill process Grant 6,485,618 - Gopalraja , et al. November 26, 2	2002-11-26
Sputtering method utilizing an extended plasma region Grant 6,485,617 - Fu , et al. November 26, 2	2002-11-26
Magnetron for a vault shaped sputtering target having two opposed sidewall magnets App 20020148725 - Subramani, Anantha ; et al.	2002-10-17
Coils for generating a plasma and for sputtering App 20020144901 - Nulman, Jaim ; et al.	2002-10-10
Vault shaped target and magnetron operable in two sputtering modes Grant 6,451,177 - Gopalraja , et al. September 17, 2	2002-09-17
Sputtering target having an annular vault Grant 6,444,104 - Gopalraja , et al. September 3, 2	2002-09-03
Vault-shaped target and magnetron having both distributed and localized magnets Grant 6,436,251 - Gopalraja , et al. August 20, 2	2002-08-20
Alternate steps of IMP and sputtering process to improve sidewall coverage App 20020084181 - Gopalraja, Praburam ; et al.	2002-07-04
Pulsed sputtering with a small rotating magnetron Grant 6,413,382 - Wang , et al. July 2, 2	2002-07-02
Magnetron with a rotating center magnet for a vault shaped sputtering target Grant 6,406,599 - Subramani , et al. June 18, 2	2002-06-18
Pulsed-mode RF bias for side-wall coverage improvement App 20020068464 - Forster, John ; et al.	2002-06-06
Apparatus for improved power coupling through a workpiece in a semiconductor waffer processing system App 20020053513 - Stimson, Bradley O. ; et al.	2002-05-09
Coils for generating a plasma and for sputtering Grant 6,368,469 - Nulman , et al. April 9, 2	2002-04-09
Alternate steps of IMP and sputtering process to improve sidewall coverage Grant 6,350,353 - Gopalraja , et al. February 26, 2	2002-02-26
Pulsed-mode RF bias for sidewall coverage improvement Grant 6,344,419 - Forster , et al. February 5, 2	2002-02-05
Sputtering target having an annular vault App 20010050223 - Gopalraja, Praburam ; et al.	2001-12-13
Integrated copper fill process App 20010050226 - Gopalraja, Praburam ; et al.	2001-12-13
Vault shaped target and magnetron having both distributed and localized magnets App 20010032783 - Gopalraja, Praburam ; et al.	2001-10-25
High-density plasma for ionized metal deposition capable of exciting a plasma wave Grant 6,306,265 - Fu , et al. October 23, 2	2001-10-23
Sputtering method utilizing an extended plasma region App 20010030123 - Fu, Jianming ; et al.	2001-10-18
Integrated process for copper via filling using a magnetron and target producing highly energetic ions Grant 6,277,249 - Gopalraja , et al. August 21, 2	2001-08-21
Integrated process for copper via filling Grant 6,274,008 - Gopalraja , et al. August 14, 2	2001-08-14
Use of variable impedance having rotating core to control coil sputter distribution Grant 6,254,738 - Stimson , et al. July 3, 2	2001-07-03
Magnetron and target producing an extended plasma region in a sputter reactor Grant 6,251,242 - Fu , et al. June 26, 2	2001-06-26
Alternate Steps Of Imp And Sputtering Process To Improve Sidewall Coverage App 20010003607 - GOPALRAJA, PRABURAM ; et al.	2001-06-14
Squared overlap coil Grant D442,852 - Gopalraja , et al. May 29, 2	2001-05-29
Rounded overlap coil Grant D442,853 - Gopalraja , et al. May 29, 2	2001-05-29
Modulated power for ionized metal plasma deposition Grant 6,235,169 - Gopalraja , et al. May 22, 2	2001-05-22
Apparatus for providing RF return current path control in a semiconductor wafer processing system Grant 6,221,221 - Al-Shaikh , et al. April 24, 2	2001-04-24
Sputtering chamber coil Grant D440,582 - Gopalraja , et al. April 17, 2	2001-04-17
Use of modulated inductive power and bias power to reduce overhang and improve bottom coverage Grant 6,193,855 - Gopalraja , et al. February 27, 2	2001-02-27
Sputtering method and apparatus with small diameter RF coil Grant 6,146,508 - Gopalraja , et al. November 14, 2	2000-11-14
Method and apparatus to improve the side wall and bottom coverage in IMP process by using magnetic field Grant 6,143,140 - Wang , et al. November 7, 2	2000-11-07
Adjustment of deposition uniformity in an inductively coupled plasma source Grant 6,042,700 - Gopalraja , et al. March 28, 2	2000-03-28

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.