U.S. patent application number 14/998368 was filed with the patent office on 2017-06-29 for mold compound with reinforced fibers.
The applicant listed for this patent is Intel Corporation. Invention is credited to Nisha ANANTHAKRISHNAN, Yiqun BAI, Arjun KRISHNAN, Suriyakala RAMALINGAM.
Application Number | 20170186658 14/998368 |
Document ID | / |
Family ID | 59087954 |
Filed Date | 2017-06-29 |
United States Patent
Application |
20170186658 |
Kind Code |
A1 |
RAMALINGAM; Suriyakala ; et
al. |
June 29, 2017 |
Mold compound with reinforced fibers
Abstract
Techniques and mechanisms for mitigating warpage of structures
in a package. In an embodiment, a packaged integrated circuit
device includes a mold compound disposed at least partially around
an integrated circuit chip. The mold compound comprises fibers
suspended in a media that is to aid in mechanical reinforcement of
such fibers. The reinforced fibers contribute to mold compound
properties that resist warping of the IC chip that might otherwise
take place as a result of solder reflow or other processing. A
modulus of elasticity of the mold compound is equal to or more than
three GigePascals (3 GPa), where the modulus of elasticity
corresponds to a temperature equal to two hundred and sixty degrees
Celsius (260.degree. C.). In another embodiment, a spiral flow
value of the mold compound is equal to or more than sixty five
centimeters (65 cm).
Inventors: |
RAMALINGAM; Suriyakala;
(Chandler, AZ) ; BAI; Yiqun; (Chandler, AZ)
; ANANTHAKRISHNAN; Nisha; (Chandler, AZ) ;
KRISHNAN; Arjun; (Chandler, AZ) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Intel Corporation |
Santa Clara |
CA |
US |
|
|
Family ID: |
59087954 |
Appl. No.: |
14/998368 |
Filed: |
December 23, 2015 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 23/15 20130101;
H01L 2924/3511 20130101; H01L 2224/32225 20130101; H01L 23/49811
20130101; H01L 23/49822 20130101; H01L 21/4853 20130101; H01L
2224/81815 20130101; H01L 2224/16227 20130101; H01L 2224/16238
20130101; H01L 23/49827 20130101; H01L 2924/1434 20130101; H01L
23/3128 20130101; H01L 24/32 20130101; H01L 2224/92125 20130101;
H01L 23/295 20130101; H01L 24/16 20130101; H01L 2924/15311
20130101; H01L 2224/73204 20130101; H01L 2924/1431 20130101; H01L
24/92 20130101; H01L 24/81 20130101; H01L 24/73 20130101; H01L
2224/73204 20130101; H01L 2224/16225 20130101; H01L 2224/32225
20130101; H01L 2924/00 20130101 |
International
Class: |
H01L 23/16 20060101
H01L023/16; H01L 21/48 20060101 H01L021/48; H01L 21/56 20060101
H01L021/56; H01L 23/29 20060101 H01L023/29; H01L 23/498 20060101
H01L023/498 |
Claims
1. A packaged device comprising: a substrate including a first side
and a second side opposite the first side, wherein contacts are
disposed on the first side; an integrated circuit (IC) chip
disposed on the second side, the IC chip coupled to the contacts
via the substrate; and a mold compound disposed at least partially
around the IC chip, the mold compound comprising a suspension media
and fibers disposed in the suspension media, wherein a spiral flow
value of the mold compound is equal to or more than sixty five
centimeters (65 cm), and wherein a modulus of elasticity of the
mold compound is equal to or more than three GigaPascals (3 GPa),
the modulus of elasticity corresponding to a temperature equal to
two hundred and sixty degrees Celsius (260.degree. C.).
2. The packaged device of claim 1, wherein the modulus of
elasticity is equal to or more than 4 GPa.
3. The packaged device of claim 2, wherein the modulus of
elasticity is equal to or more than 5 GPa.
4. The packaged device of claim 1, wherein the spiral flow value is
equal to or more than 100 cm.
5. The packaged device of claim 4, wherein the spiral flow value is
equal to or more than 130 cm.
6. The packaged device of claim 1, wherein the fibers comprise 35%
or less of the mold compound by weight.
7. The packaged device of claim 6, wherein the fibers comprise 30%
or less of the mold compound by weight.
8. The packaged device of claim 7, wherein the fibers comprise 20%
or less of the mold compound by weight.
9. The packaged device of claim 1, wherein the fibers include glass
fibers, carbon fibers or Kevlar fibers.
10. The packaged device of claim 9, wherein the fibers include
glass fibers or Kevlar fibers.
11. A method comprising: forming contacts on a first side of a
substrate; coupling an integrated circuit (IC) chip to the contacts
via a second side of the substrate, the second side opposite to the
first side; and while the IC chip is coupled to the contacts,
packaging the IC chip, including disposing mold compound at least
partially around the IC chip, the mold compound including a
suspension media and fibers disposed in the suspension media,
wherein a spiral flow value of the mold compound is equal to or
more than sixty five centimeters (65 cm), and wherein a modulus of
elasticity of the mold compound is equal to or more than three
GigaPascals (3 GPa), the modulus of elasticity corresponding to a
temperature equal to two hundred and sixty degrees Celsius
(260.degree. C.).
12. The method of claim 11, wherein the modulus of elasticity is
equal to or more than 4 GPa.
13. The method of claim 11, wherein the spiral flow value is equal
to or more than 100 cm.
14. The method of claim 11, wherein the fibers comprise 35% or less
of the mold compound by weight.
15. The method of claim 14, wherein the fibers comprise 30% or less
of the mold compound by weight.
16. A system comprising: a packaged device including: a substrate
including a first side and a second side opposite the first side,
wherein contacts are disposed on the first side; an integrated
circuit (IC) chip disposed on the second side, the IC chip coupled
to the contacts via the substrate; and a mold compound disposed at
least partially around the IC chip, the mold compound comprising a
suspension media and fibers disposed in the suspension media,
wherein a spiral flow value of the mold compound is equal to or
more than sixty five centimeters (65 cm), and wherein a modulus of
elasticity of the mold compound is equal to or more than three
GigaPascals (3 GPa), the modulus of elasticity corresponding to a
temperature equal to two hundred and sixty degrees Celsius
(260.degree. C.); and a display device coupled to the packaged
device, the display device to display an image based on signals
exchanged with the IC chip.
17. The system of claim 16, wherein the modulus of elasticity is
equal to or more than 4 GPa.
18. The system of claim 16, wherein the spiral flow value is equal
to or more than 100 cm.
19. The system of claim 16, wherein the fibers include glass
fibers, carbon fibers or Kevlar fibers.
20. The system of claim 19, wherein the fibers include glass fibers
or Kevlar fibers.
Description
BACKGROUND
[0001] 1. Technical Field
[0002] Embodiments of the invention relate generally to packaged
integrated circuit devices and more particularly, but not
exclusively, to mold compounds that mitigate warping in a
package.
[0003] 2. Background Art
[0004] Ultra-thin cores and coreless designs, which significantly
reduce the vertical (z-height) profile of integrated circuit
packages, are increasingly used in tablets and other mobile
devices. Warpage is one significant challenge to the manufacture of
these types of integrated circuit packages. Typically, stringent
warpage specs are imposed so that ball-attach (BA), surface mount
technology (SMT) or other assembly processing can be performed
successfully.
[0005] Stiffener structures are sometimes added to a substrate to
mitigate the possibility of warpage. However, the uses of such
stiffeners can complicate processing or otherwise lead to increased
costs. Moreover, such warpage mitigation is usually limited by
properties of an adhesive which is used to bond the stiffener.
Other techniques to mitigate warpages, such as over-molding or a
molded underfill, are becoming less effective as successive
generations of manufacturing technology continue to scale toward
thinner packages. Therefore, there is an increasing demand for
improved solutions to mitigate package warping, where such
solutions can be applied to very thin package designs.
BRIEF DESCRIPTION OF THE DRAWINGS
[0006] The various embodiments of the present invention are
illustrated by way of example, and not by way of limitation, in the
figures of the accompanying drawings and in which:
[0007] FIG. 1 is a cross-sectional diagram illustrating elements of
a system including a packaged integrated circuit device according
to an embodiment.
[0008] FIG. 2 is a flow diagram illustrating elements of a method
of manufacturing a packaged device according to an embodiment.
[0009] FIG. 3 shows cross-sectional views of processing to
manufacture a packaged integrated circuit device according to an
embodiment.
[0010] FIG. 4 is a table showing respective features of various
mold compounds each according to a corresponding embodiment.
[0011] FIG. 5 is a high-level functional block diagram illustrating
features of a computing device in accordance with one
embodiment.
[0012] FIG. 6 is a high-level functional block diagram illustrating
features of an exemplary computer system, in accordance with one
embodiment.
[0013] FIG. 7 is an interposer implementing one or more
embodiments.
[0014] FIG. 8 is a high-level functional block diagram illustrating
features of a computing device built in accordance with an
embodiment.
DETAILED DESCRIPTION
[0015] Embodiments discussed herein variously include techniques or
mechanisms to reduce warpage of a packaged device with a mold
compound (MC) that provides improved mechanical properties. A MC
according to one embodiment includes fibers--e.g., including glass
fibers, carbon fibers and/or Kevlar fibers--that aid in the MC
having a high modulus, high spin flow and/or any of a variety of
one or more other characteristics. Such characteristics may
mitigate warpage of an integrated circuit (IC) chip and/or a
substrate coupled to the IC chip. The substrate--e.g., comprising
any of a variety of thin core or coreless structures--may include
one or more layers of an insulator material and interconnect
structures disposed therein. The interconnect structures may
provide for coupling of the IC chip to conductive contacts (such as
pads, bumps or other such structures) that are disposed on an
opposite side of the substrate. Fibers of an MC may serve as a
substitute, at least in part, for any of a variety of one or more
conventional mold materials, such as a silica, which are
non-fibrous. In some embodiments, one or more characteristics aid
in deposition and/or other processing of the mold compound.
[0016] An MC according to an embodiment may include one or more
other materials in which fibers of the MC are suspended. For
brevity, such one or more other materials are referred to herein as
a "suspension media." In one illustrative embodiment, a suspension
media includes an epoxy resin. Prior to and/or during packaging
with such an MC, a suspension media may have fluid characteristics.
Subsequently (e.g., after a curing of the MC), such a suspension
media may form a solid with fibers of the MC. A suspension material
may function as a binder to mechanically and/or chemically aid the
fibers in the formation of support structures within a package
mold. For example, a suspension material may reinforce the shapes
of fibers in the MC.
[0017] The technologies described herein may be implemented in one
or more electronic devices. Non-limiting examples of electronic
devices that may utilize the technologies described herein include
any kind of mobile device and/or stationary device, such as
cameras, cell phones, computer terminals, desktop computers,
electronic readers, facsimile machines, kiosks, netbook computers,
notebook computers, internet devices, payment terminals, personal
digital assistants, media players and/or recorders, servers (e.g.,
blade server, rack mount server, combinations thereof, etc.),
set-top boxes, smart phones, tablet personal computers,
ultra-mobile personal computers, wired telephones, combinations
thereof, and the like. Such devices may be portable or stationary.
In some embodiments the technologies described herein may be
employed in a desktop computer, laptop computer, smart phone,
tablet computer, netbook computer, notebook computer, personal
digital assistant, server, combinations thereof, and the like. More
generally, the technologies described herein may be employed in any
of a variety of electronic devices including a package comprising
an at least partially fibrous mold compound.
[0018] FIG. 1 shows features of a system 100 including a package
material according to an embodiment. System 100 may include, or
function as a component of, a computer (e.g., a server, desktop
computer, laptop computer, tablet or the like), smart phone or any
of a variety of other hardware platforms including a packaged IC
device.
[0019] In the illustrative embodiment shown, system 100 includes a
packaged device 110 comprising one or more IC chips (as represented
by the illustrative IC chip 114), an interface 118 and a substrate
116 coupling the one or more IC chips to interface 118. IC chip 114
may include a system-on-chip (SoC) or any of various other
circuitry comprising processor logic, memory logic, controller
logic and/or the like. In some embodiments, packaged device 110
comprises one or more additional and/or different IC chips.
[0020] IC chip 114 and interface 118 may be variously coupled,
directly or indirectly, on opposite sides of substrate 116.
Interface 118 may include input/output (I/O) contacts (e.g.,
including conductive pads, bumps, pins and/or other such
structures) to enable access to IC chip 114 via substrate 116.
Substrate 116 may include one or more layers of an insulation
material and interconnect structures--e.g., including conductive
vias, traces and/or the like--disposed therein. Such interconnect
structures may aid in providing access to IC chip 114 via interface
118. By way of illustration and not limitation, substrate 110 may
include a laminate core or, alternatively, a monolithic core--e.g.,
where substrate 110 includes a thin core. Although some embodiments
are not limited in this regard, substrate 110 includes structures
adapted from any of various conventional coreless substrate
designs.
[0021] In an embodiment, a package material of device 110 includes
a mold compound (MC) 112 disposed on--e.g., around--one or both of
IC chip 114 and substrate 116. MC 112 may include fibers that,
during manufacture of packaged device 110, aid in mitigating
warpage of IC chip 114. For example, MC 112 may include a media 134
and fibers 132 suspended therein (as illustrated in the detail view
of a region 130). Fibers 132 may include any of a variety of
materials that contribute to an increased modulus of elasticity of
MC 112. By way of illustration and not limitation, fibers 132 may
include one or more of glass fibers, carbon fibers and/or fibers of
any of a variety of synthetic materials such as Kevlar.RTM. from E.
I. du Pont de Nemours and Company of Wilmington, Del., USA. In some
embodiments, a proportion of fibers 132--e.g., in relation to media
134--contributes to spin flow characteristics that facilitate good
processability of MC 112 during packaging of IC chip 114 and/or
substrate 116.
[0022] Although some embodiments are not limited in this regard,
system 100 may further include, or couple to, a support structure
for packaged device 110, such as the illustrative printed circuit
board 120. Printed circuit board 120 may aid in coupling of
packaged device 110--e.g., via I/O contacts of an interface 122--to
hardware, software, a user interface and/or any of various other
such mechanisms (not shown) that are included in, or are to couple
to, system 100.
[0023] FIG. 2 shows features of a method 200 for producing a
packaged circuit device according to an embodiment. Method 200 may
produce a device having some or all of the features of packaged
device 110, for example. In an embodiment, method 200 includes, at
210, forming contacts on a first side of a substrate such as
substrate 116. For example, interface 118 may include some or all
of the contacts formed at 210. Method 200 may further comprise, at
220, coupling an integrated circuit (IC) chip to the contacts via a
second side of the substrate--e.g., where the second side is
opposite the first side. In one embodiment, the forming at 210 and
the coupling at 220 includes semiconductor processing (such as one
or more mask, photolithography, etch, metal deposition and/or other
fabrication operations) adapted from conventional techniques for
building a substrate and I/O contacts, directly or indirectly, on
one or more IC chips. Some embodiments are not limited with respect
to such techniques, which are not detailed herein to avoid
obscuring certain features of various embodiments.
[0024] Method 200 may further comprise, at 230, packaging the IC
chip with a mold compound including a suspension media and fibers
disposed therein. The packaging at 230 may be performed after the
coupling at 220, for example. In an embodiment, the packaging at
230 includes disposing the mold compound at least partially around
the IC chip--e.g., using operations adapted from any of a wide
range of conventional encapsulation techniques such as resin
transfer molding, sheet molding and/or the like.
[0025] Some or all of the suspension media may be adapted from any
of a wide range of conventional package materials. Examples of such
materials include, but are not limited to, an epoxy resin and/or
any of various filler materials such as a silica, thermally
conductive aluminum nitride (AlN) and boron nitride (BN) and/or
other additives such as mold release agents, surfactants, etc. Some
or all fibers of the mold compound may provide for an increased
spiral flow and/or other improved characteristics. For example,
fibers of the mold compound may include a carbon material, a glass,
Kevlar, or any of various other materials that have a relatively
high modulus of elasticity--e.g., as compared to a corresponding
modulus of the suspension media.
[0026] Characteristics of a mold compound may be attributable at
least in part to one or more dimensions of the fibers therein. For
example, fibers of a mold compound may have an average
cross-sectional width (e.g., a diameter) in a range from 0.1
micrometers (.mu.m) to 100 .mu.m. Alternatively or in addition,
such fibers may have an average length (e.g., orthogonal to a
cross-section) that is at least 0.5 .mu.m. In one illustrative
embodiment, a ratio of an average fiber width to an average fiber
length is equal to five (5) or more--e.g., where such a ratio is
equal to ten (10) or more. However, such fiber dimensions may vary
widely according to implementation-specific details, and may not be
limiting on some embodiments.
[0027] In some embodiments, a fractional proportion of fibers in
the mold compound may contribute to spiral flow and/or other
mechanical properties that provide for improved processability. By
way of illustration and not a limitation, fibers may comprise 35%
or less (e.g., no more than 30%) by weight of a mold compound. Such
fibers may comprise, for example, no more than 20% by weight (and,
in some embodiments, no more than 15%) of the mold compound. In
some embodiments, a mold compound comprises no more than 5% fibers
by weight.
[0028] Based on characteristics such as a fiber material, fiber
dimensions and/or fractional proportion of fibers, a mold compound
according to some embodiments may exhibit a high spiral flow
characteristics. As used herein, "spiral flow" (or "spiral flow
value") refers to a flow property of a material, as measured
according to the Standard Test Method for Spiral Flow of
Low-Pressure Thermosetting Molding Compounds, ASTM D3123-09,
released in 2009 by the American Society of the International
Association for Testing and Materials (ASTM) of West Conshohocken,
Pa. In one illustrative embodiment, a spiral flow of the mold
compound may be equal to or more than 65 centimeters (cm)--e.g.,
where the spiral flow is 80 cm or more. For example, the spiral
flow may be equal to or more than 100 cm (and, in some embodiments,
equal to or more than 130 cm).
[0029] Alternatively or in addition, the mold compound may exhibit
a high modulus of elasticity at a high temperature, such as a
solder reflow temperature. In one example embodiment, a mold
compound has a modulus of elasticity, at 260.degree. C., that is
equal to or more than three GigaPascals (GPa). For example, such a
modulus of elasticity may be equal to or more than 4 GPa and, in
some embodiments, equal to or more than 5 GPa. Other mechanical
properties of a mold compound may aid in fabrication processing
and/or mitigate structure warpage during or after such fabrication
processing. For example, a mold compound may further exhibit good
expansion characteristics at high temperatures. In one embodiment,
such a mold compound has a coefficient of thermal expansion (CTE)
at 260.degree. C. (or some other solder reflow temperature) that is
equal to or more than 5 parts per million per degree Celsius
(Ppm/.degree. C.). In some embodiments, such a higher temperature
CTE is more than 20 Ppm/.degree. C.--e.g., where the CTE is more
than 30 Ppm/.degree. C.
[0030] Although some embodiments are not limited in this regard, a
mold compound may have a CTE at room temperature (e.g., 25.degree.
C.) that is equal to or more than 5 Ppm/.degree. C. In some
embodiments, such a room temperature CTE may be more than 10
Ppm/.degree. C. (e.g., where the CTE is more than 15 Ppm/.degree.
C.). Alternatively or in addition, a mold compound may have a glass
transition temperature that, for example, is in a range of
175.degree. C. to 210.degree. C.
[0031] FIG. 3 shows cross-sectional views illustrating respective
stages 300, 302 of processing to fabricate a packaged integrated
circuit device according to one embodiment. The processing
represented in FIG. 3 may include operations of method 200--e.g.,
where such processing is to fabricate packaged device 100 at least
in part.
[0032] At stage 300, an IC chip 320 may be bonded to an upper
surface of a substrate 310--e.g., by a flip chip process. In an
embodiment, substrate 310 includes a thin core or a coreless
substrate, comprising layers of interconnections and vias, with one
surface having conductive bumps or other contacts for electrical
connection to corresponding contacts of IC chip 320. The lower
surface of the substrate 310 may comprise or have disposed thereon
an array 340 of electrical connects, such as solder balls, serving
as input/output electrical connections for the package. While
various embodiments are described herein as variously including a
thin core or coreless substrate, other embodiments are not limited
to such context, i.e., practice of other embodiments may have uses
with various types of chips, substrates and/or mounting
technologies, e.g., such as a flip chip pin grid array. Although
some embodiments are not limited in this regard, an underfill
material 330 may dispensed--e.g., at the edges of IC die 320--and
allowed to seep to a space between the IC die 320 and substrate 310
by a capillary action.
[0033] At stage 302, a mold compound 350 may be disposed at least
partially (e.g., in at least two dimensions) around IC chip 320
and/or substrate 310. Deposition of mold compound 350 may include
operations adapted from any of various conventional molding
techniques such as injection molding, resin transfer molding, sheet
molding and/or the like. In an embodiment, mold compound 350
includes fibers that mitigate warping of structures including IC
chip 320 and/or substrate 310. For example, such fibers may be
suspended in a media of mold compound 350 that, when cured,
reinforces such fibers. The fibers may contribute to one or more
properties (e.g., spin flow, modulus of elasticity and/or the like)
that aid in deposition of the mold compound 350 around IC chip 320
and/or substrate 310. Additionally or alternatively, such one or
more mechanical characteristics may resist warpage of IC chip 320
and/or substrate 310 during subsequent solder reflow and/or other
processing.
[0034] FIG. 4 shows a table 400 listing various characteristics for
respective mold compounds each according to a corresponding
embodiment. More particularly, table 400 shows, for each of three
example mold compounds, a spiral flow value (as measured according
to ASTM D3123-09), a CTE corresponding to the mold compound being
at a room temperature, another CTE corresponding to the mold
compound being at a solder reflow temperature, a glass transition
temperature Tg, a modulus of elasticity E1 for the mold compound
when at the room temperature, and another modulus of elasticity E2
for the mold compound when at the solder reflow temperature. In the
examples represented by table 400, the room temperature is
25.degree. C. and the solder reflow temperature is 260.degree. C.
Such examples may include, for example, one or both of mold
compounds 112, 350.
[0035] The examples 1 and 2 represented in table 400 each include
glass fibers and silica in a 20/80 ratio. The example 3 represented
in table 400 includes carbon fibers and silica in a 30/70 ratio.
The glass fibers of example 2 comprise a glass material that, as
compared to that of example 1, have a relatively high modulus of
elasticity both at a room temperature (25.degree. C.) and at a
solder reflow temperature (260.degree. C.).
[0036] As illustrated by table 400, a mold compound may exhibit a
combination of characteristics--e.g., where, for each such
characteristic, the mold compound is within a respective range of
values (such as a range specified herein) and where the combination
of characteristics is particularly effective in mitigating warpage
and/or in aiding deposition or other processing of the mold
compound. By way of illustration and not limitation, a mold
compound according to an embodiment may have a spiral flow
characteristic that is within one of the ranges (e.g., equal to or
more than 65, equal to or more than 100, equal to or more than 130)
specified herein, where the mold compound also has a high
temperature modulus of elasticity that is within one of the ranges
(e.g., equal to or more than 3 GPa, equal to or more than 4 GPa,
equal to or more than 5 GPa) specified herein. The mold compound
may exhibit any of a variety of additional or alternative
combinations of characteristic each within one of various ranges
specified herein, according to different embodiments.
[0037] FIG. 5 illustrates a computing device 500 in accordance with
one embodiment. The computing device 500 houses a board 502. The
board 502 may include a number of components, including but not
limited to a processor 504 and at least one communication chip 506.
The processor 504 is physically and electrically coupled to the
board 502. In some implementations the at least one communication
chip 506 is also physically and electrically coupled to the board
502. In further implementations, the communication chip 506 is part
of the processor 504.
[0038] Depending on its applications, computing device 500 may
include other components that may or may not be physically and
electrically coupled to the board 502. These other components
include, but are not limited to, volatile memory (e.g., DRAM),
non-volatile memory (e.g., ROM), flash memory, a graphics
processor, a digital signal processor, a crypto processor, a
chipset, an antenna, a display, a touchscreen display, a
touchscreen controller, a battery, an audio codec, a video codec, a
power amplifier, a global positioning system (GPS) device, a
compass, an accelerometer, a gyroscope, a speaker, a camera, and a
mass storage device (such as hard disk drive, compact disk (CD),
digital versatile disk (DVD), and so forth).
[0039] The communication chip 506 enables wireless communications
for the transfer of data to and from the computing device 500. The
term "wireless" and its derivatives may be used to describe
circuits, devices, systems, methods, techniques, communications
channels, etc., that may communicate data through the use of
modulated electromagnetic radiation through a non-solid medium. The
term does not imply that the associated devices do not contain any
wires, although in some embodiments they might not. The
communication chip 506 may implement any of a number of wireless
standards or protocols, including but not limited to Wi-Fi (IEEE
802.11 family), WiMAX (IEEE 802.16 family), IEEE 802.20, long term
evolution (LTE), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM, GPRS,
CDMA, TDMA, DECT, Bluetooth, derivatives thereof, as well as any
other wireless protocols that are designated as 3G, 4G, 5G, and
beyond. The computing device 500 may include a plurality of
communication chips 506. For instance, a first communication chip
506 may be dedicated to shorter range wireless communications such
as Wi-Fi and Bluetooth and a second communication chip 506 may be
dedicated to longer range wireless communications such as GPS,
EDGE, GPRS, CDMA, WiMAX, LTE, Ev-DO, and others.
[0040] The processor 504 of the computing device 500 includes an
integrated circuit die packaged within the processor 504. The term
"processor" may refer to any device or portion of a device that
processes electronic data from registers and/or memory to transform
that electronic data into other electronic data that may be stored
in registers and/or memory. The communication chip 506 also
includes an integrated circuit die packaged within the
communication chip 506.
[0041] In various implementations, the computing device 500 may be
a laptop, a netbook, a notebook, an ultrabook, a smartphone, a
tablet, a personal digital assistant (PDA), an ultra mobile PC, a
mobile phone, a desktop computer, a server, a printer, a scanner, a
monitor, a set-top box, an entertainment control unit, a digital
camera, a portable music player, or a digital video recorder. In
further implementations, the computing device 500 may be any other
electronic device that processes data.
[0042] Some embodiments may be provided as a computer program
product, or software, that may include a machine-readable medium
having stored thereon instructions, which may be used to program a
computer system (or other electronic devices) to perform a process
according to an embodiment. A machine-readable medium includes any
mechanism for storing or transmitting information in a form
readable by a machine (e.g., a computer). For example, a
machine-readable (e.g., computer-readable) medium includes a
machine (e.g., a computer) readable storage medium (e.g., read only
memory ("ROM"), random access memory ("RAM"), magnetic disk storage
media, optical storage media, flash memory devices, etc.), a
machine (e.g., computer) readable transmission medium (electrical,
optical, acoustical or other form of propagated signals (e.g.,
infrared signals, digital signals, etc.)), etc.
[0043] FIG. 6 illustrates a diagrammatic representation of a
machine in the exemplary form of a computer system 600 within which
a set of instructions, for causing the machine to perform any one
or more of the methodologies described herein, may be executed. In
alternative embodiments, the machine may be connected (e.g.,
networked) to other machines in a Local Area Network (LAN), an
intranet, an extranet, or the Internet. The machine may operate in
the capacity of a server or a client machine in a client-server
network environment, or as a peer machine in a peer-to-peer (or
distributed) network environment. The machine may be a personal
computer (PC), a tablet PC, a set-top box (STB), a Personal Digital
Assistant (PDA), a cellular telephone, a web appliance, a server, a
network router, switch or bridge, or any machine capable of
executing a set of instructions (sequential or otherwise) that
specify actions to be taken by that machine. Further, while only a
single machine is illustrated, the term "machine" shall also be
taken to include any collection of machines (e.g., computers) that
individually or jointly execute a set (or multiple sets) of
instructions to perform any one or more of the methodologies
described herein.
[0044] The exemplary computer system 600 includes a processor 602,
a main memory 604 (e.g., read-only memory (ROM), flash memory,
dynamic random access memory (DRAM) such as synchronous DRAM
(SDRAM) or Rambus DRAM (RDRAM), etc.), a static memory 606 (e.g.,
flash memory, static random access memory (SRAM), etc.), and a
secondary memory 618 (e.g., a data storage device), which
communicate with each other via a bus 630.
[0045] Processor 602 represents one or more general-purpose
processing devices such as a microprocessor, central processing
unit, or the like. More particularly, the processor 602 may be a
complex instruction set computing (CISC) microprocessor, reduced
instruction set computing (RISC) microprocessor, very long
instruction word (VLIW) microprocessor, processor implementing
other instruction sets, or processors implementing a combination of
instruction sets. Processor 602 may also be one or more
special-purpose processing devices such as an application specific
integrated circuit (ASIC), a field programmable gate array (FPGA),
a digital signal processor (DSP), network processor, or the like.
Processor 602 is configured to execute the processing logic 626 for
performing the operations described herein.
[0046] The computer system 600 may further include a network
interface device 608. The computer system 600 also may include a
video display unit 610 (e.g., a liquid crystal display (LCD), a
light emitting diode display (LED), or a cathode ray tube (CRT)),
an alphanumeric input device 612 (e.g., a keyboard), a cursor
control device 614 (e.g., a mouse), and a signal generation device
616 (e.g., a speaker).
[0047] The secondary memory 618 may include a machine-accessible
storage medium (or more specifically a computer-readable storage
medium) 632 on which is stored one or more sets of instructions
(e.g., software 622) embodying any one or more of the methodologies
or functions described herein. The software 622 may also reside,
completely or at least partially, within the main memory 604 and/or
within the processor 602 during execution thereof by the computer
system 600, the main memory 604 and the processor 602 also
constituting machine-readable storage media. The software 622 may
further be transmitted or received over a network 620 via the
network interface device 608.
[0048] While the machine-accessible storage medium 632 is shown in
an exemplary embodiment to be a single medium, the term
"machine-readable storage medium" should be taken to include a
single medium or multiple media (e.g., a centralized or distributed
database, and/or associated caches and servers) that store the one
or more sets of instructions. The term "machine-readable storage
medium" shall also be taken to include any medium that is capable
of storing or encoding a set of instructions for execution by the
machine and that cause the machine to perform any of one or more
embodiments. The term "machine-readable storage medium" shall
accordingly be taken to include, but not be limited to, solid-state
memories, and optical and magnetic media.
[0049] FIG. 7 illustrates an interposer 700 that includes one or
more embodiments. The interposer 700 is an intervening substrate
used to bridge a first substrate 702 to a second substrate 704. The
first substrate 702 may be, for instance, an integrated circuit
die. The second substrate 704 may be, for instance, a memory
module, a computer motherboard, or another integrated circuit die.
Generally, the purpose of an interposer 700 is to spread a
connection to a wider pitch or to reroute a connection to a
different connection. For example, an interposer 700 may couple an
integrated circuit die to a ball grid array (BGA) 706 that can
subsequently be coupled to the second substrate 704. In some
embodiments, the first and second substrates 702, 704 are attached
to opposing sides of the interposer 700. In other embodiments, the
first and second substrates 702, 704 are attached to the same side
of the interposer 700. And in further embodiments, three or more
substrates are interconnected by way of the interposer 700.
[0050] The interposer 700 may be formed of an epoxy resin, a
fiberglass-reinforced epoxy resin, a ceramic material, or a polymer
material such as polyimide. In further implementations, the
interposer may be formed of alternate rigid or flexible materials
that may include the same materials described above for use in a
semiconductor substrate, such as silicon, germanium, and other
group III-V and group IV materials.
[0051] The interposer may include metal interconnects 708 and vias
710, including but not limited to through-silicon vias (TSVs) 712.
The interposer 700 may further include embedded devices 714,
including both passive and active devices. Such devices include,
but are not limited to, capacitors, decoupling capacitors,
resistors, inductors, fuses, diodes, transformers, sensors, and
electrostatic discharge (ESD) devices. More complex devices such as
radio-frequency (RF) devices, power amplifiers, power management
devices, antennas, arrays, sensors, and MEMS devices may also be
formed on the interposer 700. In accordance with some embodiments,
apparatuses or processes disclosed herein may be used in the
fabrication of interposer 700.
[0052] FIG. 8 illustrates a computing device 800 in accordance with
one embodiment. The computing device 800 may include a number of
components. In one embodiment, these components are attached to one
or more motherboards. In an alternate embodiment, these components
are fabricated onto a single system-on-a-chip (SoC) die rather than
a motherboard. The components in the computing device 800 include,
but are not limited to, an integrated circuit die 802 and at least
one communication chip 808. In some implementations the
communication chip 808 is fabricated as part of the integrated
circuit die 802. The integrated circuit die 802 may include a CPU
804 as well as on-die memory 806, often used as cache memory, that
can be provided by technologies such as embedded DRAM (eDRAM) or
spin-transfer torque memory (STTM or STTM-RAM).
[0053] Computing device 800 may include other components that may
or may not be physically and electrically coupled to the
motherboard or fabricated within an SoC die. These other components
include, but are not limited to, volatile memory 810 (e.g., DRAM),
non-volatile memory 812 (e.g., ROM or flash memory), a graphics
processing unit 814 (GPU), a digital signal processor 816, a crypto
processor 842 (a specialized processor that executes cryptographic
algorithms within hardware), a chipset 820, an antenna 822, a
display or a. touchscreen display 824, a touchscreen controller
826, a battery 829 or other power source, a power amplifier (not
shown), a global positioning system (GPS) device 828, a compass
830, a motion coprocessor or sensors 832 (that may include an
accelerometer, a gyroscope, and a compass), a speaker 834, a camera
836, user input devices 838 (such as a keyboard, mouse, stylus, and
touchpad), and a mass storage device 840 (such as hard disk drive,
compact disk (CD), digital versatile disk (DVD), and so forth).
[0054] The communications chip 808 enables wireless communications
for the transfer of data to and from the computing device 800. The
term "wireless" and its derivatives may be used to describe
circuits, devices, systems, methods, techniques, communications
channels, etc., that may communicate data through the use of
modulated electromagnetic radiation through a non-solid medium. The
term does not imply that the associated devices do not contain any
wires, although in some embodiments they might not. The
communication chip 808 may implement any of a number of wireless
standards or protocols, including but not limited to Wi-Fi (IEEE
802.11 family), WiMAX (IEEE 802.16 family), IEEE 802.20, long term
evolution (LTE), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM, GPRS,
CDMA, TDMA, DECT, Bluetooth, derivatives thereof, as well as any
other wireless protocols that are designated as 3G, 4G, 5G, and
beyond. The computing device 800 may include a plurality of
communication chips 808. For instance, a first communication chip
808 may be dedicated to shorter range wireless communications such
as Wi-Fi and Bluetooth and a second communication chip 808 may be
dedicated to longer range wireless communications such as GPS,
EDGE, GPRS, CDMA, WiMAX, LTE, Ev-DO, and others.
[0055] The term "processor" may refer to any device or portion of a
device that processes electronic data from registers and/or memory
to transform that electronic data into other electronic data that
may be stored in registers and/or memory. In various embodiments,
the computing device 800 may be a laptop computer, a netbook
computer, a notebook computer, an ultrabook computer, a smartphone,
a tablet, a personal digital assistant (PDA), an ultra mobile PC, a
mobile phone, a desktop computer, a server, a printer, a scanner, a
monitor, a set-top box, an entertainment control unit, a digital
camera, a portable music player, or a digital video recorder. In
further implementations, the computing device 800 may be any other
electronic device that processes data.
[0056] In one implementation, a packaged device comprises a
substrate including a first side and a second side opposite the
first side, wherein contacts are disposed on the first side, and an
integrated circuit (IC) chip disposed on the second side, the IC
chip coupled to the contacts via the substrate. The packaged device
further comprises a mold compound disposed at least partially
around the IC chip, the mold compound comprising a suspension media
and fibers disposed in the suspension media, wherein a spiral flow
value of the mold compound is equal to or more than sixty five
centimeters (65 cm), and wherein a modulus of elasticity of the
mold compound is equal to or more than three GigePascals (3 GPa),
the modulus of elasticity corresponding to a temperature equal to
two hundred and sixty degrees Celsius (260.degree. C.).
[0057] In one embodiment, the modulus of elasticity is equal to or
more than 4 GPa. In another embodiment, the modulus of elasticity
is equal to or more than 5 GPa. In another embodiment, the spiral
flow value is equal to or more than 100 cm. In another embodiment,
the spiral flow value is equal to or more than 130 cm. In another
embodiment, the fibers comprise 35% or less of the mold compound by
weight. In another embodiment, the fibers comprise 30% or less of
the mold compound by weight. In another embodiment, the fibers
comprise 20% or less of the mold compound by weight. In another
embodiment, the fibers include glass fibers, carbon fibers or
Kevlar fibers. In another embodiment, the fibers include glass
fibers or Kevlar fibers.
[0058] In another implementation, a method comprises forming
contacts on a first side of a substrate, coupling an integrated
circuit (IC) chip to the contacts via a second side of the
substrate, the second side opposite the first side, and, while the
IC chip is coupled to the contacts, packaging the IC chip,
including disposing mold compound at least partially around the IC
chip, the mold compound including a suspension media and fibers
disposed in the suspension media, wherein a spiral flow value of
the mold compound is equal to or more than sixty five centimeters
(65 cm), and wherein a modulus of elasticity of the mold compound
is equal to or more than three GigePascals (3 GPa), the modulus of
elasticity corresponding to a temperature equal to two hundred and
sixty degrees Celsius (260.degree. C.).
[0059] In one embodiment, the modulus of elasticity is equal to or
more than 4 GPa. In another embodiment, the modulus of elasticity
is equal to or more than 5 GPa. In another embodiment, the spiral
flow value is equal to or more than 100 cm. In another embodiment,
the spiral flow value is equal to or more than 130 cm. In another
embodiment, the fibers comprise 35% or less of the mold compound by
weight. In another embodiment, the fibers comprise 30% or less of
the mold compound by weight. In another embodiment, the fibers
comprise 20% or less of the mold compound by weight. In another
embodiment, the fibers include glass fibers, carbon fibers or
Kevlar fibers. In another embodiment, the fibers include glass
fibers or Kevlar fibers.
[0060] In another implementation, a system comprises a packaged
device including a substrate including a first side and a second
side opposite the first side, wherein contacts are disposed on the
first side, an integrated circuit (IC) chip disposed on the second
side, the IC chip coupled to the contacts via the substrate, and a
mold compound disposed at least partially around the IC chip, the
mold compound comprising a suspension media and fibers disposed in
the suspension media, wherein a spiral flow value of the mold
compound is equal to or more than sixty five centimeters (65 cm),
and wherein a modulus of elasticity of the mold compound is equal
to or more than three GigePascals (3 GPa), the modulus of
elasticity corresponding to a temperature equal to two hundred and
sixty degrees Celsius (260.degree. C.). The system further
comprises a display device coupled to the packaged device, the
display device to display an image based on signals exchanged with
the IC chip.
[0061] In one embodiment, the modulus of elasticity is equal to or
more than 4 GPa. In another embodiment, the modulus of elasticity
is equal to or more than 5 GPa. In another embodiment, the spiral
flow value is equal to or more than 100 cm. In another embodiment,
the spiral flow value is equal to or more than 130 cm. In another
embodiment, the fibers comprise 35% or less of the mold compound by
weight. In another embodiment, the fibers comprise 30% or less of
the mold compound by weight. In another embodiment, the fibers
comprise 20% or less of the mold compound by weight. In another
embodiment, the fibers include glass fibers, carbon fibers or
Kevlar fibers. In another embodiment, the fibers include glass
fibers or Kevlar fibers.
[0062] Techniques and architectures for packaging integrated
circuitry are described herein. In the above description, for
purposes of explanation, numerous specific details are set forth in
order to provide a thorough understanding of certain embodiments.
It will be apparent, however, to one skilled in the art that
certain embodiments can be practiced without these specific
details. In other instances, structures and devices are shown in
block diagram form in order to avoid obscuring the description.
[0063] Reference in the specification to "one embodiment" or "an
embodiment" means that a particular feature, structure, or
characteristic described in connection with the embodiment is
included in at least one embodiment of the invention. The
appearances of the phrase "in one embodiment" in various places in
the specification are not necessarily all referring to the same
embodiment.
[0064] Some portions of the detailed description herein are
presented in terms of algorithms and symbolic representations of
operations on data bits within a computer memory. These algorithmic
descriptions and representations are the means used by those
skilled in the computing arts to most effectively convey the
substance of their work to others skilled in the art. An algorithm
is here, and generally, conceived to be a self-consistent sequence
of steps leading to a desired result. The steps are those requiring
physical manipulations of physical quantities. Usually, though not
necessarily, these quantities take the form of electrical or
magnetic signals capable of being stored, transferred, combined,
compared, and otherwise manipulated. It has proven convenient at
times, principally for reasons of common usage, to refer to these
signals as bits, values, elements, symbols, characters, terms,
numbers, or the like.
[0065] It should be borne in mind, however, that all of these and
similar terms are to be associated with the appropriate physical
quantities and are merely convenient labels applied to these
quantities. Unless specifically stated otherwise as apparent from
the discussion herein, it is appreciated that throughout the
description, discussions utilizing terms such as "processing" or
"computing" or "calculating" or "determining" or "displaying" or
the like, refer to the action and processes of a computer system,
or similar electronic computing device, that manipulates and
transforms data represented as physical (electronic) quantities
within the computer system's registers and memories into other data
similarly represented as physical quantities within the computer
system memories or registers or other such information storage,
transmission or display devices.
[0066] Certain embodiments also relate to apparatus for performing
the operations herein. This apparatus may be specially constructed
for the required purposes, or it may comprise a general purpose
computer selectively activated or reconfigured by a computer
program stored in the computer. Such a computer program may be
stored in a computer readable storage medium, such as, but is not
limited to, any type of disk including floppy disks, optical disks,
CD-ROMs, and magnetic-optical disks, read-only memories (ROMs),
random access memories (RAMs) such as dynamic RAM (DRAM), EPROMs,
EEPROMs, magnetic or optical cards, or any type of media suitable
for storing electronic instructions, and coupled to a computer
system bus.
[0067] The algorithms and displays presented herein are not
inherently related to any particular computer or other apparatus.
Various general purpose systems may be used with programs in
accordance with the teachings herein, or it may prove convenient to
construct more specialized apparatus to perform the required method
steps. The required structure for a variety of these systems will
appear from the description herein. In addition, certain
embodiments are not described with reference to any particular
programming language. It will be appreciated that a variety of
programming languages may be used to implement the teachings of
such embodiments as described herein.
[0068] Besides what is described herein, various modifications may
be made to the disclosed embodiments and implementations thereof
without departing from their scope. Therefore, the illustrations
and examples herein should be construed in an illustrative, and not
a restrictive sense. The scope of the invention should be measured
solely by reference to the claims that follow.
* * * * *