Ramalingam; Suriyakala

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ramalingam; Suriyakala.The latest application filed is for "coupling a magnet with a mems device".

Company Profile

4.12.18

Ramalingam; Suriyakala - Chandler AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Coupling a magnet with a MEMS device Grant 11,022,792 - Yazzie , et al. June 1, 2	2021-06-01
Coupling A Magnet With A Mems Device App 20190391386 - Yazzie; Kyle ; et al.	2019-12-26
Apparatus and method for conformal coating of integrated circuit packages Grant 10,356,912 - Dobriyal , et al. July 16, 2	2019-07-16
Compartment for magnet placement Grant 10,317,952 - Iyer , et al.	2019-06-11
Method for forming an electrical device and electrical devices Grant 10,269,695 - Cheney , et al.	2019-04-23
Conductive Adhesive Layer For Semiconductor Devices And Packages App 20180342463 - GAINES; Taylor ; et al.	2018-11-29
No-flow Adhesive For Second And Third Level Interconnects App 20180324955 - SOOD; Mohit ; et al.	2018-11-08
Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby Grant 10,115,606 - Bai , et al. October 30, 2	2018-10-30
Conductive Adhesive Layer For Semiconductor Devices And Packages App 20180190593 - GAINES; Taylor ; et al.	2018-07-05
Compartment For Magnet Placement App 20180095503 - IYER; Sandeep S. ; et al.	2018-04-05
Conformal Coating Of Integrated Circuit Packages App 20180070456 - Dobriyal; Priyanka ; et al.	2018-03-08
Method For Forming An Electrical Device And Electrical Devices App 20170263517 - Cheney; Robert F. ; et al.	2017-09-14
Mold compound with reinforced fibers Grant 9,704,767 - Ramalingam , et al. July 11, 2	2017-07-11
Mold compound with reinforced fibers App 20170186658 - RAMALINGAM; Suriyakala ; et al.	2017-06-29
Method for forming an electrical device and electrical devices Grant 9,691,675 - Cheney , et al. June 27, 2	2017-06-27
Method For Forming An Electrical Device And Electrical Devices App 20170178988 - Cheney; Robert F ; et al.	2017-06-22
Reduction Of Underfill Filler Settling In Integrated Circuit Packages App 20160343591 - Ramalingam; Suriyakala ; et al.	2016-11-24
On Package Floating Metal/Stiffener Grounding to Mitigate RFI and SI Risks App 20160268213 - JIANG; Hongjin ; et al.	2016-09-15
Method for reducing underfill filler settling in integrated circuit packages Grant 9,431,274 - Ramalingam , et al. August 30, 2	2016-08-30
Methods Of Promoting Adhesion Between Underfill And Conductive Bumps And Structures Formed Thereby App 20160240395 - Bai; Yiqun ; et al.	2016-08-18
Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby Grant 9,330,993 - Bai , et al. May 3, 2	2016-05-03
Techniques and configurations for surface treatment of an integrated circuit substrate Grant 8,895,365 - Ramalingam , et al. November 25, 2	2014-11-25
Methods Of Promoting Adhesion Between Underfill And Conductive Bumps And Structures Formed Thereby App 20140175634 - Bai; Yiqun ; et al.	2014-06-26
Reduction Of Underfill Filler Settling In Integrated Circuit Packages App 20140177149 - Ramalingam; Suriyakala ; et al.	2014-06-26
Techniques And Configurations For Surface Treatment Of An Integrated Circuit Substrate App 20140061902 - Ramalingam; Suriyakala ; et al.	2014-03-06

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