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name:-0.021907806396484
name:-0.021048784255981
name:-0.0019259452819824
KRISHNAN; Arjun Patent Filings

KRISHNAN; Arjun

Patent Applications and Registrations

Patent applications and USPTO patent grants for KRISHNAN; Arjun.The latest application filed is for "encapsulant material containing fluorophores for in-situ visualization of stress in an organic package".

Company Profile
2.17.23
  • KRISHNAN; Arjun - Chandler AZ US
  • Krishnan; Arjun - Evanston IL
  • Krishnan; Arjun - Plano TX
  • Krishnan; Arjun - Richardson TX
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Encapsulant Material Containing Fluorophores For In-situ Visualization Of Stress In An Organic Package
App 20190393112 - NOFEN; Elizabeth ;   et al.
2019-12-26
Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby
Grant 10,115,606 - Bai , et al. October 30, 2
2018-10-30
Processes And Methods For Applying Underfill To Singulated Die
App 20180286704 - Nofen; Elizabeth M. ;   et al.
2018-10-04
Stiffener tape for electronic assembly
Grant 9,793,151 - Brun , et al. October 17, 2
2017-10-17
Mold compound with reinforced fibers
Grant 9,704,767 - Ramalingam , et al. July 11, 2
2017-07-11
Mold compound with reinforced fibers
App 20170186658 - RAMALINGAM; Suriyakala ;   et al.
2017-06-29
Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials
Grant 9,640,415 - Lowe, Jr. , et al. May 2, 2
2017-05-02
Methods of forming wafer level underfill materials and structures formed thereby
Grant 9,631,065 - Prakash , et al. April 25, 2
2017-04-25
Stiffener tape for electronic assembly that includes wafer or panel
Grant 9,620,404 - Brun , et al. April 11, 2
2017-04-11
Narrow-gap flip chip underfill composition
Grant 9,611,372 - Xiu , et al. April 4, 2
2017-04-04
Methods Of Promoting Adhesion Between Underfill And Conductive Bumps And Structures Formed Thereby
App 20160240395 - Bai; Yiqun ;   et al.
2016-08-18
Stiffener Tape For Electronic Assembly
App 20160172229 - Brun; Xavier ;   et al.
2016-06-16
Narrow-gap Flip Chip Underfill Composition
App 20160168351 - Xiu; Yonghao ;   et al.
2016-06-16
Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby
Grant 9,330,993 - Bai , et al. May 3, 2
2016-05-03
Narrow-gap flip chip underfill composition
Grant 9,269,596 - Xiu , et al. February 23, 2
2016-02-23
Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures
Grant 9,230,833 - Dubey , et al. January 5, 2
2016-01-05
Methods To Prevent Filler Entrapment In Microelectronic Device To Microelectronic Substrate Interconnection Structures
App 20150179479 - Dubey; Manish ;   et al.
2015-06-25
Narrow-gap Flip Chip Underfill Composition
App 20150179478 - Xiu; Yonghao ;   et al.
2015-06-25
Robust Ink Formulations For Durable Markings On Microelectronic Packages And Its Extendibility As A Barrier Material For Thermal And Sealant Materials
App 20150166804 - Lowe, JR.; Randall D. ;   et al.
2015-06-18
Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures
Grant 8,999,765 - Dubey , et al. April 7, 2
2015-04-07
Methods To Prevent Filler Entrapment In Microelectronic Device To Microelectronic Substrate Interconnection Structures
App 20140377916 - Dubey; Manish ;   et al.
2014-12-25
Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials
Grant 8,900,919 - Lowe, Jr. , et al. December 2, 2
2014-12-02
Methods Of Forming Wafer Level Underfill Materials And Structures Formed Thereby
App 20140264827 - Prakash; Anna M. ;   et al.
2014-09-18
Robust Ink Formulations For Durable Markings On Microelectronic Packages And Its Extendibility As A Barrier Material For Thermal And Sealant Materials
App 20140264957 - Lowe, JR.; Randall D. ;   et al.
2014-09-18
Methods Of Promoting Adhesion Between Underfill And Conductive Bumps And Structures Formed Thereby
App 20140175634 - Bai; Yiqun ;   et al.
2014-06-26
Thermoplastic Polymer Compositions With Programmable End-of-life And Method Of Making The Same
App 20130108883 - Krishnan; Arjun ;   et al.
2013-05-02
System and associated terminal, method and computer program product for directional channel browsing of broadcast content
Grant 7,490,341 - Kiiskinen , et al. February 10, 2
2009-02-10
System and associated terminal, method and computer program product for directional channel browsing of broadcast content
App 20060277582 - Kiiskinen; Arto ;   et al.
2006-12-07
System, mobile station and method for delivering services
Grant 7,043,261 - Krishnan May 9, 2
2006-05-09
Mobile station and method for transmitting and receiving messages
App 20050273327 - Krishnan, Arjun
2005-12-08
System, mobile station and method for delivering services
App 20040266401 - Krishnan, Arjun
2004-12-30
Exchange of system and terminal capabilities over the same analog control channel
Grant 5,924,026 - Krishnan July 13, 1
1999-07-13
Dual mode network call forwarding activation and deactivation
Grant 5,826,191 - Krishnan October 20, 1
1998-10-20

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