| Patent | Date |
|---|
Micro-electronic Package With Substrate Protrusion To Facilitate Dispense Of Underfill Between A Narrow Die-to-die Gap
App 20220165585 - LIN; Ziyin ; et al. | 2022-05-26 |
Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap
Grant 11,282,717 - Lin , et al. March 22, 2 | 2022-03-22 |
Underfill Material For Integrated Circuit (ic) Package
App 20210242102 - NOFEN; Elizabeth ; et al. | 2021-08-05 |
Microelectronics Package Comprising A Package-on-package (pop) Architecture With Inkjet Barrier Material For Controlling Bondline Thickness And Pop Adhesive Keep Out Zone
App 20210066155 - NOFEN; Elizabeth ; et al. | 2021-03-04 |
Wafer Level Passive Heat Spreader Interposer To Enable Improved Thermal Solution For Stacked Dies In Multi-chips Package And Warpage Control
App 20210057381 - BRUN; Xavier F. ; et al. | 2021-02-25 |
Thin Line Dam On Underfill Material To Contain Thermal Interface Materials
App 20200126887 - Lin; Ziyin ; et al. | 2020-04-23 |
Two material high K thermal encapsulant system
Grant 10,475,715 - McMahan , et al. Nov | 2019-11-12 |
Micro-electronic Package With Substrate Protrusion To Facilitate Dispense Of Underfill Between A Narrow Die-to-die Gap
App 20190304808 - LIN; Ziyin ; et al. | 2019-10-03 |
Compressible Media Applicator, Application System And Methods For Same
App 20190099776 - Hackenberg; Ken P. ; et al. | 2019-04-04 |
Compressible Media Applicator, Application System And Methods For Same
App 20190099777 - Hackenberg; Ken P. ; et al. | 2019-04-04 |
Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby
Grant 10,115,606 - Bai , et al. October 30, 2 | 2018-10-30 |
Processes And Methods For Applying Underfill To Singulated Die
App 20180286704 - Nofen; Elizabeth M. ; et al. | 2018-10-04 |
Mold compound with reinforced fibers
Grant 9,704,767 - Ramalingam , et al. July 11, 2 | 2017-07-11 |
Mold compound with reinforced fibers
App 20170186658 - RAMALINGAM; Suriyakala ; et al. | 2017-06-29 |
Two Material High K Thermal Encapsulant System
App 20170170088 - McMahan; Venmathy ; et al. | 2017-06-15 |
Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials
Grant 9,640,415 - Lowe, Jr. , et al. May 2, 2 | 2017-05-02 |
Methods of forming wafer level underfill materials and structures formed thereby
Grant 9,631,065 - Prakash , et al. April 25, 2 | 2017-04-25 |
Narrow-gap flip chip underfill composition
Grant 9,611,372 - Xiu , et al. April 4, 2 | 2017-04-04 |
Fluxing-encapsulant Material For Microelectronic Packages Assembled Via Thermal Compression Bonding Process
App 20170042043 - NAGARAJAN; SIVAKUMAR ; et al. | 2017-02-09 |
Reduction Of Underfill Filler Settling In Integrated Circuit Packages
App 20160343591 - Ramalingam; Suriyakala ; et al. | 2016-11-24 |
Fluxing-encapsulant material for microelectronic packages assembled via thermal compression bonding process
Grant 9,504,168 - Nagarajan , et al. November 22, 2 | 2016-11-22 |
Flexible underfill compositions for enhanced reliability
Grant 9,458,283 - Xu , et al. October 4, 2 | 2016-10-04 |
Method for reducing underfill filler settling in integrated circuit packages
Grant 9,431,274 - Ramalingam , et al. August 30, 2 | 2016-08-30 |
Methods Of Promoting Adhesion Between Underfill And Conductive Bumps And Structures Formed Thereby
App 20160240395 - Bai; Yiqun ; et al. | 2016-08-18 |
Narrow-gap Flip Chip Underfill Composition
App 20160168351 - Xiu; Yonghao ; et al. | 2016-06-16 |
Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby
Grant 9,330,993 - Bai , et al. May 3, 2 | 2016-05-03 |
Narrow-gap flip chip underfill composition
Grant 9,269,596 - Xiu , et al. February 23, 2 | 2016-02-23 |
Flexible Underfill Compositions For Enhanced Reliability
App 20150284503 - XU; Dingying ; et al. | 2015-10-08 |
Flexible underfill compositions for enhanced reliability
Grant 9,068,067 - Xu , et al. June 30, 2 | 2015-06-30 |
Narrow-gap Flip Chip Underfill Composition
App 20150179478 - Xiu; Yonghao ; et al. | 2015-06-25 |
Robust Ink Formulations For Durable Markings On Microelectronic Packages And Its Extendibility As A Barrier Material For Thermal And Sealant Materials
App 20150166804 - Lowe, JR.; Randall D. ; et al. | 2015-06-18 |
Epoxy-amine underfill materials for semiconductor packages
Grant 8,916,981 - Xiu , et al. December 23, 2 | 2014-12-23 |
Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials
Grant 8,900,919 - Lowe, Jr. , et al. December 2, 2 | 2014-12-02 |
Techniques and configurations for surface treatment of an integrated circuit substrate
Grant 8,895,365 - Ramalingam , et al. November 25, 2 | 2014-11-25 |
Epoxy-amine Underfill Materials For Semiconductor Packages
App 20140332966 - Xiu; Yonghao ; et al. | 2014-11-13 |
Methods Of Forming Wafer Level Underfill Materials And Structures Formed Thereby
App 20140264827 - Prakash; Anna M. ; et al. | 2014-09-18 |
Robust Ink Formulations For Durable Markings On Microelectronic Packages And Its Extendibility As A Barrier Material For Thermal And Sealant Materials
App 20140264957 - Lowe, JR.; Randall D. ; et al. | 2014-09-18 |
Reduction Of Underfill Filler Settling In Integrated Circuit Packages
App 20140177149 - Ramalingam; Suriyakala ; et al. | 2014-06-26 |
Methods Of Promoting Adhesion Between Underfill And Conductive Bumps And Structures Formed Thereby
App 20140175634 - Bai; Yiqun ; et al. | 2014-06-26 |
Techniques And Configurations For Surface Treatment Of An Integrated Circuit Substrate
App 20140061902 - Ramalingam; Suriyakala ; et al. | 2014-03-06 |
Fluxing-encapsulant Material For Microelectronic Packages Assembled Via Thermal Compression Bonding Process
App 20130263446 - Nagarajan; Sivakumar ; et al. | 2013-10-10 |
Flexible Underfill Compositions For Enhanced Reliability
App 20120074597 - Xu; Dingying ; et al. | 2012-03-29 |
Microelectronic package with wear resistant coating
Grant 7,759,780 - Chakrapani , et al. July 20, 2 | 2010-07-20 |
Microelectronic Package With Wear Resistant Coating
App 20100078806 - Chakrapani; Nirupama ; et al. | 2010-04-01 |
Magnetic Particles For Low Temperature Cure Of Underfill
App 20090170247 - SHEKHAWAT; Linda A. ; et al. | 2009-07-02 |
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