BAI; Yiqun

Patent Applications and Registrations

Patent applications and USPTO patent grants for BAI; Yiqun.The latest application filed is for "hydrophobic feature to control adhesive flow".

Company Profile

4.13.26

BAI; Yiqun - Chandler AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Completely Encapsulated Optical Multi Chip Package App 20220196941 - TODA; Asako ; et al.	2022-06-23
Hydrophobic Feature To Control Adhesive Flow App 20220196937 - ZIADEH; Bassam ; et al.	2022-06-23
Dummy Die Structures Of A Packaged Integrated Circuit Device App 20220102242 - Modi; Mitul ; et al.	2022-03-31
High Thermal Conductivity, High Modulus Structure Within A Mold Material Layer Of An Integrated Circuit Package App 20210272878 - Bai; Yiqun ; et al.	2021-09-02
Trenches In Wafer Level Packages For Improvements In Warpage Reliability And Thermals App 20210035859 - MEHTA; Vipul ; et al.	2021-02-04
Integrated Heat Spreader Comprising A Silver And Sintering Silver Layered Structure App 20200286806 - Nofen; Elizabeth ; et al.	2020-09-10
Crystalline Carbon Heat Spreading Materials For Ic Die Hot Spot Reduction App 20200273768 - Karhade; Omkar ; et al.	2020-08-27
Coupled Cooling Fins In Ultra-small Systems App 20200273772 - Uppal; Aastha ; et al.	2020-08-27
Thermal Management Solutions For Integrated Circuit Packages App 20200227332 - Singh; Kumar Abhishek ; et al.	2020-07-16
Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby Grant 10,115,606 - Bai , et al. October 30, 2	2018-10-30
Mold compound with reinforced fibers Grant 9,704,767 - Ramalingam , et al. July 11, 2	2017-07-11
Mold compound with reinforced fibers App 20170186658 - RAMALINGAM; Suriyakala ; et al.	2017-06-29
Narrow-gap flip chip underfill composition Grant 9,611,372 - Xiu , et al. April 4, 2	2017-04-04
Reduction Of Underfill Filler Settling In Integrated Circuit Packages App 20160343591 - Ramalingam; Suriyakala ; et al.	2016-11-24
Method for reducing underfill filler settling in integrated circuit packages Grant 9,431,274 - Ramalingam , et al. August 30, 2	2016-08-30
Methods Of Promoting Adhesion Between Underfill And Conductive Bumps And Structures Formed Thereby App 20160240395 - Bai; Yiqun ; et al.	2016-08-18
Narrow-gap Flip Chip Underfill Composition App 20160168351 - Xiu; Yonghao ; et al.	2016-06-16
Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby Grant 9,330,993 - Bai , et al. May 3, 2	2016-05-03
Narrow-gap flip chip underfill composition Grant 9,269,596 - Xiu , et al. February 23, 2	2016-02-23
Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures Grant 9,230,833 - Dubey , et al. January 5, 2	2016-01-05
Methods To Prevent Filler Entrapment In Microelectronic Device To Microelectronic Substrate Interconnection Structures App 20150179479 - Dubey; Manish ; et al.	2015-06-25
Narrow-gap Flip Chip Underfill Composition App 20150179478 - Xiu; Yonghao ; et al.	2015-06-25
Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures Grant 8,999,765 - Dubey , et al. April 7, 2	2015-04-07
Methods To Prevent Filler Entrapment In Microelectronic Device To Microelectronic Substrate Interconnection Structures App 20140377916 - Dubey; Manish ; et al.	2014-12-25
Epoxy-amine underfill materials for semiconductor packages Grant 8,916,981 - Xiu , et al. December 23, 2	2014-12-23
Epoxy-amine Underfill Materials For Semiconductor Packages App 20140332966 - Xiu; Yonghao ; et al.	2014-11-13
Methods Of Promoting Adhesion Between Underfill And Conductive Bumps And Structures Formed Thereby App 20140175634 - Bai; Yiqun ; et al.	2014-06-26
Reduction Of Underfill Filler Settling In Integrated Circuit Packages App 20140177149 - Ramalingam; Suriyakala ; et al.	2014-06-26
Integrated micro-channels for 3D through silicon architectures Grant 8,012,808 - Shi , et al. September 6, 2	2011-09-06
Integrated Micro-channels For 3d Through Silicon Architectures App 20090201643 - Shi; Wei ; et al.	2009-08-13
Integrated micro-channels for 3D through silicon architectures Grant 7,432,592 - Shi , et al. October 7, 2	2008-10-07
Integrated micro-channels for 3D through silicon architectures App 20070085198 - Shi; Wei ; et al.	2007-04-19

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