U.S. patent application number 13/739045 was filed with the patent office on 2014-07-17 for semiconductor device with chip having low-k-layers.
This patent application is currently assigned to Intel Mobile Communications GmbH. The applicant listed for this patent is Sven Albers, Markus Brunnbauer, Christian Geissler, Thorsten Meyer, David O'Sullivan, Jan Proschwitz, Andreas Wolter, Frank Zudock. Invention is credited to Sven Albers, Markus Brunnbauer, Christian Geissler, Thorsten Meyer, David O'Sullivan, Jan Proschwitz, Andreas Wolter, Frank Zudock.
Application Number | 20140197530 13/739045 |
Document ID | / |
Family ID | 51164554 |
Filed Date | 2014-07-17 |
United States Patent
Application |
20140197530 |
Kind Code |
A1 |
Meyer; Thorsten ; et
al. |
July 17, 2014 |
SEMICONDUCTOR DEVICE WITH CHIP HAVING LOW-K-LAYERS
Abstract
A semiconductor device is described having at least one
semiconductor chip, the chip having an active area on a top side
thereof, the active area formed at least in part of low-k material,
said low-k material defining a low-k subarea of said active area;
an embedding material, in which said at least one semiconductor
chip is embedded, at least part of the embedding material forming a
coplanar area with said active area; at least one contact area
within the low-k subarea; a redistribution layer on the coplanar
area, the redistribution layer connected to said contact areas; at
least one first-level interconnect, located outside said low-k
subarea, the first-level interconnect electrically connected to at
least one of said contact areas via the redistribution layer.
Inventors: |
Meyer; Thorsten;
(Regensburg, DE) ; Albers; Sven; (Regensburg,
DE) ; Geissler; Christian; (Teugn, DE) ;
Wolter; Andreas; (Regensburg, DE) ; Brunnbauer;
Markus; (Lappersdorf, DE) ; O'Sullivan; David;
(Sinzing, DE) ; Zudock; Frank; (Regensburg,
DE) ; Proschwitz; Jan; (Riesa, DE) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Meyer; Thorsten
Albers; Sven
Geissler; Christian
Wolter; Andreas
Brunnbauer; Markus
O'Sullivan; David
Zudock; Frank
Proschwitz; Jan |
Regensburg
Regensburg
Teugn
Regensburg
Lappersdorf
Sinzing
Regensburg
Riesa |
|
DE
DE
DE
DE
DE
DE
DE
DE |
|
|
Assignee: |
Intel Mobile Communications
GmbH
Neubiberg
DE
|
Family ID: |
51164554 |
Appl. No.: |
13/739045 |
Filed: |
January 11, 2013 |
Current U.S.
Class: |
257/692 ;
438/126 |
Current CPC
Class: |
H01L 23/49827 20130101;
H01L 2924/181 20130101; H01L 2224/04105 20130101; H01L 2224/12105
20130101; H01L 2924/15311 20130101; H01L 21/565 20130101; H01L
23/315 20130101; H01L 24/19 20130101; H01L 2224/16225 20130101;
H01L 2224/02375 20130101; H01L 2924/15311 20130101; H01L 2924/00
20130101; H01L 2224/32225 20130101; H01L 2224/16225 20130101; H01L
2924/00 20130101; H01L 2224/73204 20130101; H01L 2224/16225
20130101; H01L 2224/32225 20130101; H01L 2924/00012 20130101; H01L
2924/181 20130101; H01L 23/49816 20130101; H01L 23/562 20130101;
H01L 2224/0401 20130101; H01L 2224/73204 20130101; H01L 2224/73204
20130101; H01L 23/3128 20130101; H01L 23/49833 20130101; H01L
2224/32225 20130101 |
Class at
Publication: |
257/692 ;
438/126 |
International
Class: |
H01L 23/29 20060101
H01L023/29; H01L 21/56 20060101 H01L021/56 |
Claims
1. A semiconductor device comprising: at least one semiconductor
chip, the chip comprising: an active area on a top side of the at
least one semiconductor chip, the active area being formed at least
in part of a low-k material defining a low-k sub-area of the active
area; an embedding material embedding the at least one
semiconductor chip, wherein at least part of the embedding material
forms a coplanar area with the active area; at least one contact
area disposed within the low-k sub-area; and at least one
interconnect, located outside the low-k sub-area, the interconnect
electrically connected to the at least one contact area.
2. (canceled)
3. The device of claim 1, further comprising: a redistribution
layer disposed on the coplanar area, wherein the redistribution
layer is electrically connected to the at least one contact
area.
4. The device of claim 3, wherein the at least one interconnect is
electrically connected to the at least one contact area via the
redistribution layer.
5. The device of claim 4, further comprising: a dielectric layer
disposed on the coplanar area.
6. The device of claim 4, further comprising: a protection layer
disposed over the low-k sub-area.
7. The device of claim 6, wherein the protection layer is composed
of one or more materials selected from the group consisting of:
silicone, polyurethane, epoxy, polyimide.
8. The device of claim 6, wherein the protection layer comprises
silicone particles with one of the following fillers: air gaps, air
foams, bubbles.
9. The device of claim 4, further comprising: a lid disposed over
the active area.
10. The device of claim 9, wherein the lid is one of a polymer lid,
a metal lid and a ceramic lid.
11. The device of claim 9, wherein the lid is glued, soldered,
clamped, or bonded to the active area.
12. The device of claim 1, wherein the at least one interconnect is
located on a back side of the at least one semiconductor chip.
13. The device of claim 12, wherein the at least one interconnect
is electrically connected to the at least one contact area by at
least one through-silicon-via.
14. The device of claim 13, wherein the low-k sub-area is
mechanically decoupled from the back side of the at least one chip
by at least one layer of silicon.
15. The device of claim 1, further comprising: a substrate
electrically connected to the at least one interconnect.
16. The device of claim 1, wherein the at least one interconnect is
a flip-chip bump or a copper pillar.
17. A semiconductor device comprising: at least one semiconductor
chip, the chip comprising: an active area on a top side of the at
least one semiconductor chip, the active area being formed at least
in part of a low-k material defining a low-k sub-area of the active
area; an embedding material embedding the at least one
semiconductor chip, wherein at least part of the embedding material
forms a coplanar area with the active area; at least one contact
area disposed within the low-k sub-area; a redistribution layer
disposed on the coplanar area, wherein the redistribution layer is
electrically connected to the at least one contact area; at least
one interconnect, located outside the low-k subarea, the
interconnect electrically connected to the at least one contact
area via the redistribution layer.
18. The device of claim 17, further comprising: a dielectric layer
disposed on the coplanar area.
19. The device of claim 17, further comprising: a protection layer
applied over the low-k sub-area.
20. The device of claim 19, wherein the protection layer is
composed of one or more materials selected from the group
consisting of: silicone, polyurethane, epoxy, polyimide.
21. The device of claim 19, wherein the protection layer contains
silicone particles with one of the following fillers: air gaps, air
foams, bubbles.
22. The device of claim 17, further comprising: a lid disposed over
the active area.
23. The device of claim 22, wherein the lid is one of a polymer
lid, a metal lid and a ceramic lid.
24. The device of claim 22, wherein the lid is glued, soldered,
clamped, or bonded to the active area.
25. The device of claim 17, further comprising: a substrate
electrically connected to the at least one interconnect.
26. The device of claim 17, wherein the at least one interconnect
is a flip-chip bump or a copper pillar.
27. A method of producing a semiconductor device, comprising:
embedding a semiconductor chip, including a top side with an active
area formed at least part of low-k material defining a low-k
sub-area, into an embedding material; forming a planar surface on
the embedding material, the active area coplanar with the embedding
material; disposing at least one contact area within the low-k
sub-area; disposing a redistribution layer on the coplanar area,
the redistribution layer electrically connected to the at least one
contact area; forming at least one interconnect outside the low-k
sub-area, the at least one interconnect electrically connected to
the at least one contact area within the low-k sub-area via the
redistribution layer.
28. The method of claim 27, further comprising: depositing a
dielectric layer on the coplanar area.
29. The method of claim 27, further comprising: depositing a
protection layer over the low-k sub-area.
30. The method of claim 27, further comprising: disposing a lid
over the low-k sub-area.
31. The method of claim 27, further comprising: connecting a
substrate electrically with the at least one interconnect.
Description
TECHNICAL FIELD
[0001] The disclosure relates to a semiconductor device, and more
particularly to semiconductor chips which may include low-k
material.
BACKGROUND
[0002] Flip-Chip packaging technology is widely used for packaging
in the mobile application space. Different first-level interconnect
principles, the connection between the chip and the Flip Chip
Substrate, were developed to address the needs of, for example,
smaller pitch, of future technology nodes. The first level
interconnects also serve as mechanical joints between the die and
substrate and thus couple chip mechanically to the substrate.
During reliability testing a large deformation, caused by the
mismatch in thermal expansion is observed. This is known to lead to
defects (cracks) in the brittle low-k-layers of the chip.
[0003] For 40 nm front end technology and following generations a
polymer dielectric layer on the die was introduced. This layer acts
as a stress buffer and protects the ultra-low-k-layers from
mechanical damage. During the package process and especially after
the assembly on a printed circuit board (PCB), in addition to the
residual stresses and the ultra-low-k stack thermal mismatch
stresses of the wafer processes, the global thermal mismatch of the
package internally and between package and board causes stress on
the copper/low-k- and ultra-low-k-structures.
[0004] For future technology nodes beyond today's available
technologies the introduction of (porous) low-k-layers will be
needed to allow higher speed and higher density. These (porous)
low-k-layers with k<2.5 can be reached by introducing air gaps
(air k=1). The air gaps will lead to a very brittle layer, which
will be very sensitive to mechanical forces. Probably the
application of a dielectric on the active chip surface will not be
sufficient to prevent the (porous) low-k-layer from cracking due to
the stress which is transferred from especially the first-level
interconnects (solder bumps or copper columns)
BRIEF SUMMARY
[0005] The present disclosure provides a solution for reliably
packaging of chip with stress-sensitive material such as (porous)
low-k-layers in Flip Chip Technology.
[0006] According to an aspect of the present disclosure, a
semiconductor device is disclosed having: at least one
semiconductor chip, the chip having an active area on a top side
thereof, the active area formed at least in part of low-k material,
said low-k material defining a low-k subarea of said active area;
at least one contact area within the low-k subarea; at least one
first-level interconnect, located outside said low-k subarea, the
first-level interconnect electrically connected to at least one of
said contact areas.
[0007] According to a further aspect of the present disclosure, the
device may include an embedding material, in which said at least
one semiconductor chip is embedded, at least part of the embedding
material forming a coplanar area with said active area.
[0008] According to a further aspect of the present disclosure, the
device may include a redistribution layer on the coplanar area, the
redistribution layer connected to said contact areas. At least one
of said first-level interconnects is electrically connected to at
least one of said contact areas via the redistribution layer.
[0009] According to a further aspect of the present disclosure, the
device may include a dielectric layer disposed on the coplanar
area.
[0010] According to a further aspect of the present disclosure, the
device may include a protection layer applied over said low-k
subarea. The protection layer is composed of one or more materials
selected from the group including: silicone, polyurethane, epoxy,
polyimide, silicone particles with air gaps, air foams,
bubbles.
[0011] According to a further aspect of the present disclosure, the
device may include a lid applied over said active area. The lid is
one of a polymer lid, a metal lid and a ceramic lid. The lid is
glued, soldered, clamped, or bonded to said active area.
[0012] According to a further aspect of the present disclosure, the
first-level interconnects are located at a back side of said chip.
At least one of said first-level interconnects is electrically
connected to at least one of said contact areas by
through-silicon-vias. Said low-k subarea is mechanically decoupled
from said back side of the chip by at least one layer of
silicon.
[0013] According to a further aspect of the present disclosure, the
device may include a substrate connected to the first-level
interconnects. The first-level interconnects are flip-chip bumps or
copper pillars.
[0014] According to an aspect of the present disclosure, a
semiconductor device is disclosed having: at least one
semiconductor chip, the chip having an active area on a top side
thereof, the active area formed at least in part of low-k material,
said low-k material defining a low-k subarea of said active area;
an embedding material, in which said at least one semiconductor
chip is embedded, at least part of the embedding material forming a
coplanar area with said active area; at least one contact area
within the low-k subarea; a redistribution layer on the coplanar
area, the redistribution layer connected to said contact areas; at
least one first-level interconnect, located outside said low-k
subarea, the first-level interconnect electrically connected to at
least one of said contact areas via the redistribution layer.
[0015] According to a further aspect of the present disclosure, the
device may include a dielectric layer disposed on the coplanar
area.
[0016] According to a further aspect of the present disclosure, the
device may include a protection layer applied over said low-k
subarea. The protection layer is composed of one or more materials
selected from the group including: silicone, polyurethane, epoxy,
polyimide, silicone particles with air gaps, air foams,
bubbles.
[0017] According to a further aspect of the present disclosure, the
device may include a lid applied over said active area. The lid is
one of a polymer lid, a metal lid and a ceramic lid. The lid is
glued, soldered, clamped, or bonded to said active area.
[0018] According to a further aspect of the present disclosure, the
device may include a substrate connected to the first-level
interconnects. The first-level interconnects are flip-chip bumps or
copper pillars.
[0019] According to an aspect of the present disclosure, a method
of producing a semiconductor device is disclosed including
embedding a semiconductor chip, including a top side with an active
area formed at least part of low-k material, said low-k material
defining a low-k subarea, into an embedding material; forming a
planar surface on said embedding material, the active area coplanar
therewith; disposing at least one contact area within the low-k
sub-area; applying a redistribution layer on the coplanar area, the
redistribution layer electrically connected to said contact area;
forming at least one first-level interconnect outside said low-k
subarea, the first-level interconnect electrically connected to at
least one contact area within said low-k subarea via the
redistribution layer.
[0020] According to a further aspect of the present disclosure, the
method may include depositing a dielectric layer on the coplanar
area.
[0021] According to a further aspect of the present disclosure, the
method may include applying a protection layer over said low-k
subarea.
[0022] According to a further aspect of the present disclosure, the
method may include attaching a lid over said low-k subarea.
[0023] According to a further aspect of the present disclosure, the
method may include connecting a substrate with the first-level
interconnects.
BRIEF DESCRIPTION OF THE DRAWINGS
[0024] In the drawings, like reference characters generally refer
to the same parts throughout the different views. The drawings are
not necessarily to scale, emphasis instead generally being placed
upon illustrating the principles of the present disclosure. In the
following description, various approaches are described with
reference to the following drawings, in which:
[0025] FIG. 1A shows a cross-section of an exemplary semiconductor
device.
[0026] FIG. 1B shows a plan view of the exemplary semiconductor
device in accordance with FIG. 1A.
[0027] FIG. 1C shows another plan view of the exemplary
semiconductor device in accordance with FIG. 1A.
[0028] FIG. 2 shows a cross-section of an exemplary semiconductor
device having a low-k-Protection layer.
[0029] FIG. 3 shows a cross-section of an exemplary semiconductor
device having a lid.
[0030] FIG. 4 shows a cross-section of an exemplary semiconductor
device having Through Silicon Vias.
DETAILED DESCRIPTION
[0031] In the following detailed description, reference is made to
the accompanying drawings, which form a part hereof, and in which
is shown by way of illustration specific approaches in which the
disclosure may be practiced. In this regard, directional
terminology, such as "top," "bottom," etc., is used with reference
to the orientation of the Figure(s) being described. Because
components of approaches of the present disclosure can be
positioned in a number of different orientations, the directional
terminology is used for purposes of illustration and is in no way
limiting. It is to be understood that other approach may be
utilized and structural or logical changes may be made without
departing from the scope of the present disclosure. The following
detailed description, therefore, is not to be taken in a limiting
sense, and the scope of the present disclosure is defined by the
appended claims.
[0032] The present disclosure proposes to decouple the active side
of the chip and the interposer board. This may be accomplished in
one aspect by using a fan-out principle to avoid bumps over an
active area of the chip. Additionally, the brittle active area can
completely or partly be protected by a protection material or a
lid.
[0033] The standard Flip Chip Flow (bumping of silicon wafer,
separation, assembly to interposer, overmolding/underfilling, ball
application) is changed. In one approach, the wafer is separated
after front-end-processing and the chips are embedded in a mold
compound by using the eWLB reconstitution processes. After molding
the wafer, typically, but not necessarily a dielectric layer is
applied. After that, a redistribution layer (e.g. thin-film
technology) is applied onto the reconstituted wafer. This way, the
positions of the bumps, which have been distributed over the chip
surface are redistributed onto the fan-out area, outside the active
area of the silicon with its mechanically unstable low-k layers. At
the end point of the redistribution, a bump or copper pillar (first
level Flip Chip Interconnect) is formed. Now the reconstituted
wafer is separated into individual packages. Those are attached to
the interposer board, soldered and
underfilled/over-/under-molded.
[0034] Due to the first level interconnects on the fan-out area,
the mechanical stress caused by the solder bumps is decoupled from
the (porous) low-k-layers of the silicon chip, isolating it from
mechanical damage. For further improvement: decoupling of the
brittle low-k material, an additional layer (e. g. very soft,
porous) can be applied as a buffer layer on the low-k-layers. Also
the application of a lid to protect the active die area is
possible. The lid can be made of plastic or metal, it can be
attached as complete lid or it can be generated on the die/wafer in
printing, thin-film or any other technology. The lid may define a
cavity filled, for example with air or other material, or a vacuum.
The lid material may also be crack resistant itself and have, for
example, a respective low Young's modulus or low CTE (coefficient
of thermal expansion), or alternately have a CTE close to that of
the chip to avoid inducing thermo-mechanical stress. Examples are
Silicon or highly filled polymers, but also unfilled or minimally
filled polymers.
[0035] Another approach can be the use of TSVs in the package. This
way, the connections can be directed from the active side of the
die (with (porous) low-k-layers) to its backside. There solder
bumps or copper pillars are applied and the die is mounted
up-side-down on the interposer board. After
underfilling/over-/under-molding the (porous) low-k-layers are
protected and face opposite the interposer board and the first
level interconnect elements, decoupled from the active area by the
intervening silicon. According to an aspect of the disclosure, the
decoupling may be said to take place by redistributing contact
areas for first-level interconnects to more structurally stable
areas. As defined herein, structurally stable indicates at least
less brittle than the low-k-layers on the active area. Structurally
stable may include all layers which do not contain brittle or
porous low-k layers and/or having mechanical stiffness sufficient
to withstand stresses due to the application and use of first-level
interconnects. [
[0036] In the further text, a semiconductor device 100 according to
one approach of the present disclosure is described with reference
to FIG. 1A.
[0037] Semiconductor device 100 contains a chip 102 in which
low-k-layers are formed. In this sense chip 102 may itself be
considered formed of low-k material. Chip 102 is shown embedded in
a mold compound 104 such as a mold compound as used in the eWLB
technology or laminate. The mold compound used for eWLB may be a
liquid mold compound. One exemplary matrix of the mold compound is
epoxy with additions and highly filled with particles. Chip 102 is
embedded in mold compound 104 in such a way that edge sides 124 and
the rear side 122 of chip 102 are embedded into mold compound 104,
and the top side 120 of chip 102 forms a coplanar area, indicated
by plane I-I in FIG. 1A, with parts of mold compound 104. Contact
areas 126 of chip 102 are at top side 120, which defines an active
area. The area beneath the active area of chip 102 defines a chip
shadow area 140, and the area beneath mold compound 104 but outside
chip shadow area 140 defines a fan-out area 142. As illustrated in
FIG. 1A, a patterned dielectric layer 106 is applied to coplanar
area I-I, which patterned dielectric layer 106 covers coplanar area
I-I but leaves contact areas 126 free. In a typical embodiment,
openings in the dielectric layer 106 define the contact areas of
chip 102, protecting other structures thereon from exposure. In
particular, a redistribution layer 108 is formed on dielectric
layer 106. Redistribution layer 108 is a patterned electrically
conductive layer providing discrete conductive redistribute
elements 108a. Each element 108a is shown having two parts: a first
part 132 located in chip shadow area 140 named as shadow-area-end
132; and a second part 134 located outside chip shadow area 140,
for example in fan-out area 142, named as fan-out-area-end 134.
Shadow-area-ends 132 of redistribution layer 108 provides
connection to contact areas 126 of chip 102, and fan-out-area-ends
134 of redistribution layer 108 are provided with Flip Chip (FC)
bumps 110. FC bumps are typically deposited on the chip pads on the
top side of the wafer during the final wafer processing step. In
order to mount the chip to a flip chip substrate, it is flipped
over so that its top side faces down, and aligned so that its pads
align with matching pads on the external circuit, and then the
solder is flowed to complete the interconnect.
[0038] In contrast to the much larger BGA balls, which are
typically placed in pitches of 0.5 mm or 0.4 mm, flip chip (FC)
bumps are not thermo-mechanically reliable without underfill for
chip sizes as typically used in the mobile industry.
[0039] A typical FC bump is electroplated or printed, while BGA
solder balls are typically dropped as preformed solder balls.
Exemplary sizes for FC bumps are 60-90 .mu.m (pitch 120-200 .mu.m)
while BGA solder balls have a nominal diameter of 250 .mu.m (for
pitch 0.4 mm) to 300 .mu.m (for pitch 0.5 mm)
[0040] The arrangement of redistribution layer 108 can be discerned
particularly clearly in the plan view in FIG. 1B. FIG. 1B
illustrates a plan view of chip 102 embedded into eWLB mold
compound 104. The area where chip 102 is fixed below is shadow area
140, and the area where eWLB mold compound 104 is formed thereto is
fan-out area 142. Shadow-area-ends 132 of redistribution layer 108
are located in chip shadow area 140, connecting to chip 102 via
contact areas 126, while fan-out-area-ends 134 of redistribution
layer 108 are arranged on fan-out area 142. The chip shadow area
140 is coextensive with the active area 144 of the chip 102. As
disclosed herein, the chip shadow area may form all or a part of
the active area of the chip. More specifically, the chip shadow
area is understood as the low-k or structurally relevant area (i.e.
the area with limited structural stability), which may be a subset
of the active area 144 of the chip. The shadow area may thus be
considered a low-k subarea of the chip, or a low-k subarea of the
active area of chip 102. Likewise, the structurally relevant area
may extend beyond the border of the active area of the chip. As
shown here, the active area is coextensive with the shadow
area.
[0041] As illustrated in FIG. 1C, the chip shadow area (or the
low-k subarea) 140 may be smaller than the active area 144 of the
chip 102.
[0042] As illustrated in FIG. 1A, one side of FC bumps 110 are
soldered on fan-out-area-ends 134 of redistribution layer 108, and
the opposite side of FC bumps 110 are attached to the top side of a
PCB board 112 by pads 118. Between coplanar area I-I and PCB board
112, underfill 114 is applied. On the bottom side of PCB board 112,
solder balls 116 are soldered evenly to pads 118. Wiring 130 going
through PCB board 112 connects solder bumps 110 with solder balls
116.
[0043] FIG. 1A illustrates an arrangement in which contact areas
126, which have been distributed over the chip active area are
redistributed on fan-out area 142, outside the active area of chip
102. When needed, dielectric layer 106 can be formed of dielectrics
having relative permittivity of less than 4, i.e. a low-k
dielectric. A low-k dielectric may be porous or due to other reason
of low mechanical stability and therefore not capable of
withstanding high mechanical loading. Consequently, positions of FC
bumps 110, namely contact areas 126, which have been defined over
the chip surface by dielectric layer 106 are redistributed on
fan-out area 142 by redistribution layer 108. Due to FC bumps 110
fitting on fan-out area 142, mechanical stress caused by or
transmitted through FC bumps 110 is isolated or decoupled from the
low-k-layers of chip 102, preventing damage thereto.
[0044] Semiconductor device 100 in accordance with FIG. 1A has only
one semiconductor chip 102. It is possible, however, also to
integrate a plurality of semiconductor chips in a semiconductor
device 100 according to the present disclosure. One or more of the
additional semiconductor chips may include respective active areas,
one or more of which may include low-k layers or layers of limited
structural stability. The additional semiconductor chips may
selectively also employ the aspects of the present disclosure in
decoupling the active areas from transmitted stresses.
[0045] For further improvement of the semiconductor device, an
additional layer as Low-k-Protection layer 202 can be applied as
illustrated in FIG. 2.
[0046] FIG. 2 shows a semiconductor device 200 in accordance with
an approach of the present disclosure. Semiconductor device 200
similar to semiconductor device 100 of FIG. 1A contains a chip 102
in which low-k-layers are formed. In this sense chip 102 may itself
be considered formed of low-k material. Chip 102 is shown embedded
in mold compound 104 in such a way that edge sides 124 and the rear
side 122 of chip 102 are embedded into mold compound 104, and the
top side 120 of chip 102 forms a coplanar area, indicated by plane
I-I in FIG. 2, with parts of mold compound 104. Contact areas 126
of chip 102 are at top side 120, which defines an active area. The
area beneath the active area of chip 102 defines a chip shadow area
140, and the area beneath mold compound 104 but outside chip shadow
area 140 defines a fan-out area 142. As illustrated in FIG. 2, a
patterned dielectric layer 106 is applied to coplanar area I-I,
which patterned dielectric layer 106 covers coplanar area I-I but
leaves contact areas 126 free. In a typical embodiment, openings in
the dielectric layer 106 define the contact areas of chip 102,
protecting other structures thereon from exposure. In particular, a
redistribution layer 108 is formed on dielectric layer 106.
Redistribution layer 108 is a patterned electrically conductive
layer providing discrete conductive redistribute elements 108a.
Each element 108a is shown having two parts: a first part 132
located in chip shadow area 140 named as shadow-area-end 132; and a
second part 134 located outside chip shadow area 140, for example
in fan-out area 142, named as fan-out-area-end 134. As disclosed
herein, the chip shadow area may form all or a part of the active
area of the chip. More specifically, the chip shadow area is
understood as the low-k or structurally relevant area (i.e. the
area with limited structural stability), which may be a subset of
the active area of the chip. The shadow area may thus be considered
a low-k subarea of the chip, or a low-k subarea of the active area
of chip 102. Likewise, the structurally relevant area may extend
beyond the border of the active area of the chip. As shown here,
the active area is coextensive with the shadow area.
Shadow-area-ends 132 of redistribution layer 108 provide
connections to contact areas 126 of chip 102, and fan-out-area-ends
134 of redistribution layer 108 are provided with FC bumps 110.
Thus, stress transmitting FC bumps 110 are provided on contacts
that have been re-routed out of the shadow area.
[0047] As illustrated in FIG. 2, one side of FC bumps 110 are
soldered on fan-out-area-ends 134 of redistribution layer 108, and
the opposite side of FC bumps 110 are attached to the top side of a
PCB board 112 by pads 118. Between coplanar area I-I and PCB board
112, underfill 114 is molded. On the bottom side of PCB board 112,
solder balls 116 are soldered evenly to pads 118. Wiring 130 going
through PCB board 112 connects solder bumps 110 with solder balls
116. Semiconductor device 200 may further contain a
low-k-Protection layer 202 applied over the active area of the chip
102, typically covering the dielectric layer 106 and the
redistribution layer 108 at the chip shadow area 140. The material
of the low-k-Protection layer 202 may be soft, e.g. silicone,
polyurethane, or epoxy, etc. Alternatively, the low-k-Protection
layer 202 may be filled with e.g. silicone particles, air gaps, or
air or gas bubbles, etc.
[0048] Low-k-Protection layer 202 as applied over the active area
of the chip 102, acts as a stress buffer layer that alleviates the
stress level caused by external forces and protects the
low-k-layers 202 of the chip 102 from mechanical damage.
[0049] Semiconductor device 200 in accordance with FIG. 2 has only
one semiconductor chip 102. It is possible, however, also to
integrate a plurality of semiconductor chips in a semiconductor
device 200 according to the present disclosure.
[0050] For further decoupling of the low-k-layer, a lid 302 can be
applied as illustrated in FIG. 3.
[0051] FIG. 3 show a semiconductor device 300 in accordance with an
approach of the present disclosure. Semiconductor device 300
similar to semiconductor device 100 of FIG. 1A contains a chip 102
in which low-k-layers are formed. In this sense chip 102 may itself
be considered formed of low-k material. Chip 102 is shown embedded
in an eWLB mold compound 104 in such a way that edge sides 124 and
the rear side 122 of chip 102 are embedded into eWLB mold compound
104, and the top side 120 of chip 102 forms a coplanar area,
indicated by plane I-I in FIG. 3, with parts of mold compound 104.
Contact areas 126 of chip 102 are at top side 120, which defines an
active area. The area beneath the active area of chip 102 defines a
chip shadow area 140, and the area beneath eWLB mold compound 104
but outside chip shadow area 140 defines a fan-out area 142. As
illustrated in FIG. 3, a patterned dielectric layer 106 is applied
to coplanar area I-I, which patterned dielectric layer 106 covers
coplanar area I-I but leaves contact areas 126 free. In a typical
embodiment, openings in the dielectric layer 106 define the contact
areas of chip 102, protecting other structures thereon from
exposure. In particular, a redistribution layer 108 is formed on
dielectric layer 106. Redistribution layer 108 is a patterned
electrically conductive layer providing discrete conductive
redistribute elements 108a. Each element 108a is shown having two
parts: a first part 132 located in chip shadow area 140 named as
shadow-area-end 132; and a second part 134 located outside chip
shadow area 140, for example in fan-out area 142, named as
fan-out-area-end 134. Shadow-area-ends 132 of redistribution layer
108 provides connection to contact areas 126 of chip 102, and
fan-out-area-ends 134 of redistribution layer 108 are provided with
FC bumps 110.
[0052] As illustrated in FIG. 3, one side of FC bumps 110 are
soldered on fan-out-area-ends 134 of redistribution layer 108, and
the opposite side of FC bumps 110 are attached to the top side of a
PCB board 112 by pads 118. Between coplanar area I-I and PCB board
112, underfill 114 is molded. On the bottom side of PCB board 112,
solder balls 116 are soldered evenly to pads 118. Wiring 130 going
through PCB board 112 connects solder bumps 110 with solder balls
116. Semiconductor device 300 may further include a lid 302
covering the active area of chip 102. Between the active area of
chip 102 and lid 302, a cavity 304 is formed filled with air or
other gas. Lid 302 can be a polymer lid, a metal lid, a ceramic
lid, etc. The lid can be glued, soldered, clamped, bonded or
attached in any other way.
[0053] The application of a lid 302 isolates the active area of the
chip 102 from underfill material 114 of semiconductor device 300.
Lid 302 protects the active area of chip 102 from mechanical
damage. The lid material may also be crack resistant itself and
have a CTE close to that of chip 102 or be soft enough to avoid
inducing thermo-mechanical stress.
[0054] Semiconductor device 300 in accordance with FIG. 3 has only
one semiconductor chip 102. It is possible, however, also to
integrate a plurality of semiconductor chips in a semiconductor
device 300 according to the present disclosure.
[0055] Another approach can be the use of TSVs in the package as
illustrated in FIG. 4. A semiconductor device 400 according to one
approach of the present disclosure is described with reference to
FIG. 4.
[0056] Semiconductor device 400 contains a silicon chip 402 with
low-k-layers on the top side 418. TSVs 406 connect chip pads 414 on
top side 418 with pads 412 on the backside 420 of chip 402. One
side of FC bumps 408 are soldered to back side 420 of silicon chip
402 with pads 412, and the opposite side of FC bumps 408 are
attached to a substrate 410 with pads 412. Silicon chip 402 is
embedded in mold underfill (MUF) 416.
[0057] In operation, chip 402 is mounted up-side down on substrate
410. Low-k-layers 404 at the active area of chip 402 are protected
by MUF 416 and face opposite substrate 410 and FC bumps 408.
Mechanical stress caused by or transmitted through FC bumps 408
and/or substrate 410 is isolated from the active area of chip 412,
by the intervening silicon of chip 402.
[0058] Semiconductor device 400 in accordance with FIG. 4 has only
one semiconductor chip 402. It is possible, however, also to
integrate a plurality of semiconductor chips in a semiconductor
device 400 according to the present disclosure.
[0059] While the disclosure has been particularly shown and
described with reference to specific approaches, it should be
understood by those skilled in the art that various changes in form
and detail may be made therein without departing from the spirit
and scope of the present disclosure as defined by the appended
claims. The scope of the disclosure is thus indicated by the
appended claims and all changes which come within the meaning and
range of equivalency of the claims are therefore intended to be
embraced.
* * * * *