| Patent | Date |
|---|
Patch Antennas Stitched To Systems In Packages And Methods Of Assembling Same
App 20220294115 - Augustin; Andreas ; et al. | 2022-09-15 |
Integrated circuit devices with front-end metal structures
Grant 11,410,908 - Mahnkopf , et al. August 9, 2 | 2022-08-09 |
Patch antennas stitched to systems in packages and methods of assembling same
Grant 11,374,323 - Augustin , et al. June 28, 2 | 2022-06-28 |
Assembly Of 2xd Module Using High Density Interconnect Bridges
App 20220199562 - WAIDHAS; Bernd ; et al. | 2022-06-23 |
Vertical Inductor For Wlcsp
App 20220122756 - WOLTER; Andreas ; et al. | 2022-04-21 |
Package Stacking Using Chip To Wafer Bonding
App 20220108976 - SEIDEMANN; Georg ; et al. | 2022-04-07 |
Bare-die smart bridge connected with copper pillars for system-in-package apparatus
Grant 11,270,941 - Seidemann , et al. March 8, 2 | 2022-03-08 |
Vertical inductor for WLCSP
Grant 11,250,981 - Wolter , et al. February 15, 2 | 2022-02-15 |
Package stacking using chip to wafer bonding
Grant 11,239,199 - Seidemann , et al. February 1, 2 | 2022-02-01 |
Vertical and lateral interconnects between dies
Grant 11,177,220 - Seidemann , et al. November 16, 2 | 2021-11-16 |
Semiconductor inductors
Grant 11,127,813 - Seidemann , et al. September 21, 2 | 2021-09-21 |
Interconnect structure for stacked die in a microelectronic device
Grant 11,107,763 - Wagner , et al. August 31, 2 | 2021-08-31 |
Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory
Grant 11,018,114 - Waidhas , et al. May 25, 2 | 2021-05-25 |
Resonant Lc Tank Package And Method Of Manufacture
App 20210104359 - Maruthamuthu; Saravana ; et al. | 2021-04-08 |
Resonant LC tank package and method of manufacture
Grant 10,896,780 - Maruthamuthu , et al. January 19, 2 | 2021-01-19 |
Component magnetic shielding for microelectronic devices
Grant 10,867,934 - Maruthamuthu , et al. December 15, 2 | 2020-12-15 |
Vertical Inductor For Wlcsp
App 20200381161 - WOLTER; Andreas ; et al. | 2020-12-03 |
Single Metal Cavity Antenna In Package Connected To An Integrated Transceiver Front-end
App 20200373259 - KOLLER; Sonja ; et al. | 2020-11-26 |
Package Integrated Cavity Resonator Antenna
App 20200365996 - ROTH; Kilian ; et al. | 2020-11-19 |
Integrated circuit packages including an optical redistribution layer
Grant 10,816,742 - Seidemann , et al. October 27, 2 | 2020-10-27 |
Embedded-bridge Substrate Connectors And Methods Of Assembling Same
App 20200328182 - WAIDHAS; Bernd ; et al. | 2020-10-15 |
Vertical inductor for WLCSP
Grant 10,784,033 - Wolter , et al. Sept | 2020-09-22 |
Embedded-bridge substrate connectors and methods of assembling same
Grant 10,727,197 - Waidhas , et al. | 2020-07-28 |
Semiconductor Packages, and Methods for Forming Semiconductor Packages
App 20200227388 - Waidhas; Bernd ; et al. | 2020-07-16 |
Semiconductor Inductors
App 20200185490 - Seidemann; Georg ; et al. | 2020-06-11 |
Patch Antennas Stitched To Systems In Packages And Methods Of Assembling Same
App 20200144723 - Augustin; Andreas ; et al. | 2020-05-07 |
Vertical And Lateral Interconnects Between Dies
App 20200126922 - Seidemann; Georg ; et al. | 2020-04-23 |
Package Devices Having A Ball Grid Array With Side Wall Contact Pads
App 20200066692 - WOLTER; Andreas ; et al. | 2020-02-27 |
Component Terminations For Semiconductor Packages
App 20200068711 - Wolter; Andreas ; et al. | 2020-02-27 |
Interconnect Structure For Stacked Die In A Microelectronic Device
App 20200020629 - Wagner; Thomas ; et al. | 2020-01-16 |
Semiconductor devices, and a method for forming a semiconductor device
Grant 10,535,578 - Mahnkopf , et al. Ja | 2020-01-14 |
Microelectronic package having a passive microelectronic device disposed within a package body
Grant 10,522,454 - Meyer , et al. Dec | 2019-12-31 |
Electrical device and a method for forming an electrical device
Grant 10,522,485 - Geissler , et al. Dec | 2019-12-31 |
Integrated Circuit Devices With Front-end Metal Structures
App 20190393130 - Mahnkopf; Reinhard ; et al. | 2019-12-26 |
Packages Of Stacking Integrated Circuits
App 20190393191 - REINGRUBER; Klaus ; et al. | 2019-12-26 |
Vertical wire connections for integrated circuit package
Grant 10,490,527 - Geissler , et al. Nov | 2019-11-26 |
Monolithic Silicon Bridge Stack Including A Hybrid Baseband Die Supporting Processors And Memory
App 20190341371 - Waidhas; Bernd ; et al. | 2019-11-07 |
Interconnect Structure For A Microelectronic Device
App 20190333886 - Reingruber; Klaus ; et al. | 2019-10-31 |
Component Magnetic Shielding For Microelectronic Devices
App 20190304922 - Maruthamuthu; Saravana ; et al. | 2019-10-03 |
Cross-connected multi-chip modules coupled by silicon bent-bridge interconnects and methods of assembling same
Grant 10,431,545 - Seidemann , et al. O | 2019-10-01 |
Bare-die Smart Bridge Connected With Copper Pillars For System-in-package Apparatus
App 20190287904 - Seidemann; Georg ; et al. | 2019-09-19 |
Microelectronic package with illuminated backside exterior
Grant 10,411,000 - Dittes , et al. Sept | 2019-09-10 |
Resonant Lc Tank Package And Method Of Manufacture
App 20190272950 - Maruthamuthu; Saravana ; et al. | 2019-09-05 |
System-in-package devices and methods for forming system-in-package devices
Grant 10,403,609 - Geissler , et al. Sep | 2019-09-03 |
Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory
Grant 10,403,602 - Waidhas , et al. Sep | 2019-09-03 |
Integrated circuit package configurations to reduce stiffness
Grant 10,373,844 - Albers , et al. | 2019-08-06 |
Interconnect structure for a microelectronic device
Grant 10,366,968 - Reingruber , et al. July 30, 2 | 2019-07-30 |
Vertical Inductor For Wlcsp
App 20190221349 - Wolter; Andreas ; et al. | 2019-07-18 |
Systems, Methods, And Apparatuses For Implementing Reduced Height Semiconductor Packages For Mobile Electronics
App 20190214369 - SEIDEMANN; Georg ; et al. | 2019-07-11 |
Thermal Conduction Devices And Methods For Embedded Electronic Devices
App 20190214327 - Koller; Sonja ; et al. | 2019-07-11 |
Eplb/ewlb Based Pop For Hbm Or Customized Package Stack
App 20190206833 - MEYER; Thorsten ; et al. | 2019-07-04 |
Antenna on ceramics for a packaged die
Grant 10,319,688 - Wolter , et al. | 2019-06-11 |
Vertical inductor for WLCSP
Grant 10,290,412 - Wolter , et al. | 2019-05-14 |
Optical Fiber Connection On Package Edge
App 20190121041 - Albers; Sven ; et al. | 2019-04-25 |
Electronic Component Alignment Device And Method
App 20190103347 - Seidemann; Georg ; et al. | 2019-04-04 |
Semiconductor devices, and a Method for Forming a Semiconductor device
App 20190103333 - Mahnkopf; Reinhard ; et al. | 2019-04-04 |
Flexible band wearable electronic device
Grant 10,228,725 - Albers , et al. | 2019-03-12 |
Conductive paths through dielectric with a high aspect ratio for semiconductor devices
Grant 10,229,858 - Meyer , et al. | 2019-03-12 |
Integrated Circuit Packages Including An Optical Redistribution Layer
App 20190072732 - Seidemann; Georg ; et al. | 2019-03-07 |
Integrated circuit packages including an optical redistribution layer
Grant 10,209,466 - Seidemann , et al. Feb | 2019-02-19 |
Cross-connected Multi-chip Modules Coupled By Silicon Bent-bridge Interconnects And Methods Of Assembling Same
App 20190006281 - Seidemann; Georg ; et al. | 2019-01-03 |
Monolithic Silicon Bridge Stack Including A Hybrid Baseband Die Supporting Processors And Memory
App 20190006318 - Waidhas; Bernd ; et al. | 2019-01-03 |
Vertical Wire Connections For Integrated Circuit Package
App 20180374819 - Geissler; Christian ; et al. | 2018-12-27 |
Bent-bridge semiconductive apparatus
Grant 10,141,265 - Waidhas , et al. Nov | 2018-11-27 |
System-in-Package Devices and Methods for Forming System-in-Package Devices
App 20180331080 - Geissler; Christian ; et al. | 2018-11-15 |
Electrical device and a method for forming an electrical device
App 20180331053 - GEISSLER; Christian ; et al. | 2018-11-15 |
Package Stacking Using Chip To Wafer Bonding
App 20180331070 - SEIDEMANN; Georg ; et al. | 2018-11-15 |
Cooler for semiconductor devices
Grant 10,121,726 - Albers , et al. November 6, 2 | 2018-11-06 |
Microelectronic Package Having A Passive Microelectronic Device Disposed Within A Package Body
App 20180286799 - MEYER; Thorsten ; et al. | 2018-10-04 |
Filler Interface Heat Transfer System And Devices And Methods For Same
App 20180284851 - Seidemann; Georg ; et al. | 2018-10-04 |
Embedded-bridge Substrate Connectors And Methods Of Assembling Same
App 20180277512 - Waidhas; Bernd ; et al. | 2018-09-27 |
Electronic Package With Coil Formed On Core
App 20180226185 - Albers; Sven ; et al. | 2018-08-09 |
Bent-bridge Semiconductive Apparatus
App 20180190589 - Waidhas; Bernd ; et al. | 2018-07-05 |
Microelectronic package having a passive microelectronic device disposed within a package body
Grant 9,997,444 - Meyer , et al. June 12, 2 | 2018-06-12 |
Wearable Computing Device
App 20180150156 - Albers; Sven ; et al. | 2018-05-31 |
Chip package-in-package
Grant 9,985,005 - Meyer , et al. May 29, 2 | 2018-05-29 |
Flexible Band Wearable Electronic Device
App 20180095426 - Albers; Sven ; et al. | 2018-04-05 |
Flexible Band Wearable Electronic Device
App 20180092443 - Albers; Sven ; et al. | 2018-04-05 |
Interconnect Structure For A Microelectronic Device
App 20180096970 - Reingruber; Klaus ; et al. | 2018-04-05 |
Wearable computing device
Grant 9,921,694 - Albers , et al. March 20, 2 | 2018-03-20 |
Electronic package with coil formed on core
Grant 9,865,387 - Albers , et al. January 9, 2 | 2018-01-09 |
Integrated Circuit Package Configurations To Reduce Stiffness
App 20170345678 - Albers; Sven ; et al. | 2017-11-30 |
Bulk acoustic wave resonator tuner circuits
Grant 9,819,327 - Maruthamuthu , et al. November 14, 2 | 2017-11-14 |
Microelectronic Package with Illuminated Backside Exterior
App 20170284636 - Dittes; Marc Stephan ; et al. | 2017-10-05 |
Integrated Circuit Packages Including An Optical Redistribution Layer
App 20170285280 - Seidemann; Georg ; et al. | 2017-10-05 |
Three dimensional structures within mold compound
Grant 9,711,492 - Albers , et al. July 18, 2 | 2017-07-18 |
Electronic Package With Coil Formed On Core
App 20170162314 - Albers; Sven ; et al. | 2017-06-08 |
Conductive Paths Through Dielectric With A High Aspect Ratio For Semiconductor Devices
App 20170148698 - Meyer; Thorsten ; et al. | 2017-05-25 |
Integrated circuit package configurations to reduce stiffness
Grant 9,653,324 - Albers , et al. May 16, 2 | 2017-05-16 |
Cooler For Semiconductor Devices
App 20170062306 - Albers; Sven ; et al. | 2017-03-02 |
Conductive paths through dielectric with a high aspect ratio for semiconductor devices
Grant 9,576,918 - Meyer , et al. February 21, 2 | 2017-02-21 |
Vertical Inductor For Wlcsp
App 20160379747 - Wolter; Andreas ; et al. | 2016-12-29 |
Microelectronic Package Having A Passive Microelectronic Device Disposed Within A Package Body
App 20160358848 - Meyer; Thorsten ; et al. | 2016-12-08 |
Three Dimensional Structures Within Mold Compound
App 20160358897 - ALBERS; Sven ; et al. | 2016-12-08 |
Conductive Paths Through Dielectric With A High Aspect Ratio For Semiconductor Devices
App 20160343677 - MEYER; THORSTEN ; et al. | 2016-11-24 |
Integrated Circuit Package Configurations To Reduce Stiffness
App 20160293453 - Albers; Sven ; et al. | 2016-10-06 |
Antenna On Ceramics For A Packaged Die
App 20160240492 - Wolter; Andreas ; et al. | 2016-08-18 |
Wearable Computing Device
App 20160224148 - ALBERS; Sven ; et al. | 2016-08-04 |
Integrated circuit package configurations to reduce stiffness
Grant 9,397,019 - Albers , et al. July 19, 2 | 2016-07-19 |
Chip Package-in-package
App 20160190107 - Meyer; Thorsten ; et al. | 2016-06-30 |
Chip package-in-package and method thereof
Grant 9,312,198 - Meyer , et al. April 12, 2 | 2016-04-12 |
Bulk Acoustic Wave Resonator Tuner Circuits
App 20150333401 - Maruthamuthu; Saravana ; et al. | 2015-11-19 |
Integrated Circuit Package Configurations To Reduce Stiffness
App 20150243572 - Albers; Sven ; et al. | 2015-08-27 |
Chip Arrangements, Chip Packages, And A Method For Manufacturing A Chip Arrangement
App 20140264808 - Wolter; Andreas ; et al. | 2014-09-18 |
Chip package-in-package and method thereof
App 20140264914 - Meyer; Thorsten ; et al. | 2014-09-18 |
Semiconductor device with chip having low-k-layers
Grant 8,786,105 - Meyer , et al. July 22, 2 | 2014-07-22 |
Semiconductor Device With Chip Having Low-k-layers
App 20140197530 - Meyer; Thorsten ; et al. | 2014-07-17 |
Semiconductor device with capacitive coupling structure
Grant 8,779,564 - Knudsen , et al. July 15, 2 | 2014-07-15 |
Method and system for routing electrical connections of semiconductor chips
Grant 8,598,709 - Meyer , et al. December 3, 2 | 2013-12-03 |
Process for the synthesis of oligonucleotides
Grant 8,138,330 - Leuck , et al. March 20, 2 | 2012-03-20 |
Method And System For Routing Electrical Connections Of Semiconductor Chips
App 20120049375 - MEYER; Thorsten ; et al. | 2012-03-01 |
Semiconductor device
Grant 8,093,711 - Zudock , et al. January 10, 2 | 2012-01-10 |
Semiconductor device with an interconnect element and method for manufacture
Grant 8,049,310 - Wolter , et al. November 1, 2 | 2011-11-01 |
Integrated Circuit Device And Method For Fabricating Same With An Interposer Substrate
App 20110217812 - Hedler; Harry ; et al. | 2011-09-08 |
Integrated circuit package with a heat dissipation device
Grant 7,928,590 - Wolter , et al. April 19, 2 | 2011-04-19 |
Activators for oligonucleotide and phosphoramidite synthesis
Grant 7,897,758 - Wolter , et al. March 1, 2 | 2011-03-01 |
Semiconductor Device
App 20100193928 - Zudock; Frank ; et al. | 2010-08-05 |
Semiconductor Device With an Interconnect Element and Method for Manufacture
App 20090243047 - Wolter; Andreas ; et al. | 2009-10-01 |
Integrated Circuit Device And Method For Fabricating Same
App 20090212420 - Hedler; Harry ; et al. | 2009-08-27 |
Method for immobilizing oligonucleotides employing the cycloaddition bioconjugation method
Grant 7,427,678 - Pieken , et al. September 23, 2 | 2008-09-23 |
Process For The Synthesis Of Oligonucleotides
App 20080064867 - Leuck; Michael ; et al. | 2008-03-13 |
Integrated Circuit Package With A Heat Dissipation Device And A Method Of Making The Same
App 20080042261 - Wolter; Andreas ; et al. | 2008-02-21 |
Solid support for the synthesis of 3'-amino oligonucleotides
Grant 7,329,515 - Leuck , et al. February 12, 2 | 2008-02-12 |
Phosphorylation reagents for improved processes to convert terminal hydroxyl groups of oligonucleotides into phosphate monoesters
Grant 7,276,598 - Vagle , et al. October 2, 2 | 2007-10-02 |
Contacting device, testing method and corresponding production method
Grant 7,274,102 - Wolter , et al. September 25, 2 | 2007-09-25 |
Semiconductor device
Grant 7,274,107 - Hedler , et al. September 25, 2 | 2007-09-25 |
Activators For Oligonucleotide And Phosphoramidite Synthesis
App 20060247431 - Wolter; Andreas ; et al. | 2006-11-02 |
Contacting device, testing method and corresponding production method
App 20060214279 - Wolter; Andreas ; et al. | 2006-09-28 |
Methods for the integrated synthesis and purification of oligonucleotides
Grant 7,098,326 - Pieken , et al. August 29, 2 | 2006-08-29 |
Semiconductor device
App 20060163727 - Hedler; Harry ; et al. | 2006-07-27 |
Flexible contact-connection device
Grant 7,080,988 - Hedler , et al. July 25, 2 | 2006-07-25 |
Flexible contact-connection device
App 20050282410 - Hedler, Harry ; et al. | 2005-12-22 |
Nucleic acid probes and methods to detect and/or quantify nucleic acid analytes
App 20050233360 - Davies, Martin ; et al. | 2005-10-20 |
Nucleic acid probes and methods to detect and/or quantify nucleic acid analytes
Grant 6,902,900 - Davies , et al. June 7, 2 | 2005-06-07 |
Novel phosphorylation reagents for improved processes to convert terminal hydroxyl groups of oligonucleotides into phosphate monoesters
App 20040230047 - Vagle, Kurt ; et al. | 2004-11-18 |
Solid support for the synthesis of 3'-amino oligonucleotides
App 20040220397 - Leuck, Michael ; et al. | 2004-11-04 |
Method for immobilizing oligonucleotides employing the cycloaddition bioconjugation method
App 20030215801 - Pieken, Wolfgang ; et al. | 2003-11-20 |
Methods for the integrated synthesis and purification of oligonucleotides
App 20030195351 - Pieken, Wolfgang ; et al. | 2003-10-16 |
Nucleic acid probes and methods to detect and/or quantify nucleic acid analytes
App 20030143591 - Davies, Martin ; et al. | 2003-07-31 |
Microcalorimetric detection of analytes and binding events
App 20030059807 - Roach, Jeffrey Shawn ; et al. | 2003-03-27 |
Detergent and method for producing the same
Grant 4,655,952 - Mesmer , et al. April 7, 1 | 1987-04-07 |
| 