| Patent | Date |
|---|
Wafer level package structure with internal conductive layer
Grant 11,424,209 - Albers , et al. August 23, 2 | 2022-08-23 |
Radio-frequency Devices And Methods For Producing Radio-frequency Devices
App 20220247089 - HARTNER; Walter ; et al. | 2022-08-04 |
Fastening device for a child's seat in a motor vehicle, and motor vehicle with such a fastening device
Grant 11,376,998 - Geissler , et al. July 5, 2 | 2022-07-05 |
Package Stacking Using Chip To Wafer Bonding
App 20220108976 - SEIDEMANN; Georg ; et al. | 2022-04-07 |
Package stacking using chip to wafer bonding
Grant 11,239,199 - Seidemann , et al. February 1, 2 | 2022-02-01 |
Semiconductor devices having cutouts in an encapsulation material and associated production methods
Grant 11,145,563 - Geissler , et al. October 12, 2 | 2021-10-12 |
Electronic device including redistribution layer pad having a void
Grant 10,916,484 - Fehler , et al. February 9, 2 | 2021-02-09 |
Integration Of Stress Decoupling And Particle Filter On A Single Wafer Or In Combination With A Waferlevel Package
App 20210032097 - BRANDL; Florian ; et al. | 2021-02-04 |
Integration of stress decoupling and particle filter on a single wafer or in combination with a waferlevel package
Grant 10,899,604 - Brandl , et al. January 26, 2 | 2021-01-26 |
Fastening Device for a Child's Seat in a Motor Vehicle, and Motor Vehicle With Such a Fastening Device
App 20200384899 - GEISSLER; Christian ; et al. | 2020-12-10 |
Semiconductor die package with more than one hanging die
Grant 10,854,590 - Albers , et al. December 1, 2 | 2020-12-01 |
Integrated circuit packages including an optical redistribution layer
Grant 10,816,742 - Seidemann , et al. October 27, 2 | 2020-10-27 |
Integration Of Stress Decoupling And Particle Filter On A Single Wafer Or In Combination With A Waferlevel Package
App 20200331748 - BRANDL; Florian ; et al. | 2020-10-22 |
Method for producing packaged MEMS assemblies at the wafer level, and packaged MEMS assembly
Grant 10,793,429 - Steiert , et al. October 6, 2 | 2020-10-06 |
Wafer Level Package Structure With Internal Conductive Layer
App 20200273832 - ALBERS; Sven ; et al. | 2020-08-27 |
Electronic components having three-dimensional capacitors in a metallization stack
Grant 10,741,486 - Reingruber , et al. A | 2020-08-11 |
Semiconductor Die Package With More Than One Hanging Die
App 20200176436 - ALBERS; Sven ; et al. | 2020-06-04 |
Wafer level package structure with internal conductive layer
Grant 10,672,731 - Albers , et al. | 2020-06-02 |
Method For Producing Packaged Mems Assemblies At The Wafer Level, And Packaged Mems Assembly
App 20200156933 - Steiert; Matthias ; et al. | 2020-05-21 |
Interposer with conductive routing exposed on sidewalls
Grant 10,651,102 - Reingruber , et al. | 2020-05-12 |
Method for producing packaged MEMS assemblies at the wafer level, and packaged MEMS assembly
Grant 10,584,028 - Steiert , et al. | 2020-03-10 |
Semiconductor package with a through port for sensor applications
Grant 10,549,985 - Maier , et al. Fe | 2020-02-04 |
Semiconductor Devices Having Cutouts In An Encapsulation Material And Associated Production Methods
App 20200006174 - GEISSLER; Christian ; et al. | 2020-01-02 |
Electrical device and a method for forming an electrical device
Grant 10,522,485 - Geissler , et al. Dec | 2019-12-31 |
Microelectronic package having a passive microelectronic device disposed within a package body
Grant 10,522,454 - Meyer , et al. Dec | 2019-12-31 |
Vertical wire connections for integrated circuit package
Grant 10,490,527 - Geissler , et al. Nov | 2019-11-26 |
Advanced node cost reduction by ESD interposer
Grant 10,446,541 - Seidemann , et al. Oc | 2019-10-15 |
Steering column having an adaptable pivot support
Grant 10,442,457 - Gstohl , et al. Oc | 2019-10-15 |
Steering column with a bearing seat which can be mounted in a flexible manner
Grant 10,427,706 - Gstohl , et al. October 1, 2 | 2019-10-01 |
System-in-package devices and methods for forming system-in-package devices
Grant 10,403,609 - Geissler , et al. Sep | 2019-09-03 |
Production method for a modular steering column having extruded profiled elements
Grant 10,370,023 - Gstohl , et al. | 2019-08-06 |
Integrated circuit package configurations to reduce stiffness
Grant 10,373,844 - Albers , et al. | 2019-08-06 |
Low thermal resistance hanging die package
Grant 10,347,558 - Geissler , et al. July 9, 2 | 2019-07-09 |
Eplb/ewlb Based Pop For Hbm Or Customized Package Stack
App 20190206833 - MEYER; Thorsten ; et al. | 2019-07-04 |
Semiconductor Apparatuses With Radio-frequency Line Elements, And Associated Manufacturing Methods
App 20190198455 - HARTNER; Walter ; et al. | 2019-06-27 |
Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)
Grant 10,301,176 - Ofner , et al. | 2019-05-28 |
Optical Fiber Connection On Package Edge
App 20190121041 - Albers; Sven ; et al. | 2019-04-25 |
Flexible band wearable electronic device
Grant 10,228,725 - Albers , et al. | 2019-03-12 |
Integrated Circuit Packages Including An Optical Redistribution Layer
App 20190072732 - Seidemann; Georg ; et al. | 2019-03-07 |
Integrated circuit packages including an optical redistribution layer
Grant 10,209,466 - Seidemann , et al. Feb | 2019-02-19 |
Vertical Wire Connections For Integrated Circuit Package
App 20180374819 - Geissler; Christian ; et al. | 2018-12-27 |
Electronic Device Including Redistribution Layer Pad Having A Void
App 20180374769 - Fehler; Robert ; et al. | 2018-12-27 |
Integrated circuit package
Grant 10,157,869 - Meyer , et al. Dec | 2018-12-18 |
Wafer Level Package Structure With Internal Conductive Layer
App 20180358317 - ALBERS; Sven ; et al. | 2018-12-13 |
Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)
Grant 10,150,668 - Ofner , et al. Dec | 2018-12-11 |
Interposer With Conductive Routing Exposed On Sidewalls
App 20180342431 - Reingruber; Klaus ; et al. | 2018-11-29 |
Method For Producing Packaged Mems Assemblies At The Wafer Level, And Packaged Mems Assembly
App 20180327258 - Steiert; Matthias ; et al. | 2018-11-15 |
System-in-Package Devices and Methods for Forming System-in-Package Devices
App 20180331080 - Geissler; Christian ; et al. | 2018-11-15 |
Package Stacking Using Chip To Wafer Bonding
App 20180331070 - SEIDEMANN; Georg ; et al. | 2018-11-15 |
Electrical device and a method for forming an electrical device
App 20180331053 - GEISSLER; Christian ; et al. | 2018-11-15 |
Cooler for semiconductor devices
Grant 10,121,726 - Albers , et al. November 6, 2 | 2018-11-06 |
Microelectronic Package Having A Passive Microelectronic Device Disposed Within A Package Body
App 20180286799 - MEYER; Thorsten ; et al. | 2018-10-04 |
Production Method For A Modular Steering Column Having Extruded Profiled Elements
App 20180273082 - GSTOHL; Eric ; et al. | 2018-09-27 |
Steering Column Having An Adaptable Pivot Support
App 20180265115 - GSTOHL; Eric ; et al. | 2018-09-20 |
Robust Intermetallic Compound Layer Interface For Package In Package Embedding
App 20180226377 - GEISSLER; Christian ; et al. | 2018-08-09 |
Low Thermal Resistance Hanging Die Package
App 20180218962 - GEISSLER; Christian ; et al. | 2018-08-02 |
Advanced Node Cost Reduction By Esd Interposer
App 20180204831 - SEIDEMANN; Georg ; et al. | 2018-07-19 |
Microelectromechanical System (mems) On Application Specific Integrated Circuit (asic)
App 20180186627 - Ofner; Gerald ; et al. | 2018-07-05 |
Microelectronic package having a passive microelectronic device disposed within a package body
Grant 9,997,444 - Meyer , et al. June 12, 2 | 2018-06-12 |
Semiconductor Package with a Through Port for Sensor Applications and Methods of Manufacture
App 20180148322 - Maier; Dominic ; et al. | 2018-05-31 |
Flexible Band Wearable Electronic Device
App 20180092443 - Albers; Sven ; et al. | 2018-04-05 |
Flexible Band Wearable Electronic Device
App 20180095426 - Albers; Sven ; et al. | 2018-04-05 |
Redistribution Layer Lines
App 20180068939 - Reingruber; Klaus ; et al. | 2018-03-08 |
Steering Column With A Bearing Seat Which Can Be Mounted In A Flexible Manner
App 20180001922 - GSTOHL; Eric ; et al. | 2018-01-04 |
Chip arrangement and method for manufacturing a chip arrangement
Grant 9,856,136 - Meyer , et al. January 2, 2 | 2018-01-02 |
Integrated Circuit Package Configurations To Reduce Stiffness
App 20170345678 - Albers; Sven ; et al. | 2017-11-30 |
Integrated Circuit Packages Including An Optical Redistribution Layer
App 20170285280 - Seidemann; Georg ; et al. | 2017-10-05 |
Microelectronic Interconnect Adaptor
App 20170278778 - Geissler; Christian ; et al. | 2017-09-28 |
Electronic Components Having Three-dimensional Capacitors In A Metallization Stack
App 20170256480 - Reingruber; Klaus ; et al. | 2017-09-07 |
Redistribution Layer Lines
App 20170243815 - Reingruber; Klaus ; et al. | 2017-08-24 |
Redistribution layer lines
Grant 9,741,651 - Reingruber , et al. August 22, 2 | 2017-08-22 |
Microelectromechanical System (mems) On Application Specific Integrated Circuit (asic)
App 20170217766 - Ofner; Gerald ; et al. | 2017-08-03 |
Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)
Grant 9,663,353 - Ofner , et al. May 30, 2 | 2017-05-30 |
Integrated circuit package configurations to reduce stiffness
Grant 9,653,324 - Albers , et al. May 16, 2 | 2017-05-16 |
MOS transistor having a cell array edge zone arranged partially below and having an interface with a trench in an edge region of the cell array
Grant 9,627,520 - Hirler , et al. April 18, 2 | 2017-04-18 |
Integrated Circuit Package
App 20170103956 - Meyer; Thorsten ; et al. | 2017-04-13 |
Cooler For Semiconductor Devices
App 20170062306 - Albers; Sven ; et al. | 2017-03-02 |
Stress buffer layer for integrated microelectromechanical systems (MEMS)
Grant 9,550,670 - Geissler , et al. January 24, 2 | 2017-01-24 |
Opossum-die Package-on-package Apparatus
App 20160358891 - GEISSLER; Christian ; et al. | 2016-12-08 |
Microelectronic Package Having A Passive Microelectronic Device Disposed Within A Package Body
App 20160358848 - Meyer; Thorsten ; et al. | 2016-12-08 |
Stacked Semiconductor Device Package With Improved Interconnect Bandwidth
App 20160329272 - GEISSLER; Christian ; et al. | 2016-11-10 |
Integrated circuit package
Grant 9,472,515 - Meyer , et al. October 18, 2 | 2016-10-18 |
Integrated Circuit Package Configurations To Reduce Stiffness
App 20160293453 - Albers; Sven ; et al. | 2016-10-06 |
Microelectronic Interconnect Adaptor
App 20160240435 - Geissler; Christian ; et al. | 2016-08-18 |
Semiconductor Component With A Space Saving Edge Structure
App 20160225884 - Hirler; Franz ; et al. | 2016-08-04 |
Integrated circuit package configurations to reduce stiffness
Grant 9,397,019 - Albers , et al. July 19, 2 | 2016-07-19 |
Microelectromechanical System (mems) On Application Specific Integrated Circuit (asic)
App 20160200566 - Ofner; Gerald ; et al. | 2016-07-14 |
Semiconductor component with a space saving edge structure
Grant 9,252,251 - Hirler , et al. February 2, 2 | 2016-02-02 |
Stress Buffer Layer For Integrated Microelectromechanical Systems (mems)
App 20150266728 - Geissler; Christian ; et al. | 2015-09-24 |
Integrated Circuit Package
App 20150262866 - Meyer; Thorsten ; et al. | 2015-09-17 |
Integrated Circuit Package Configurations To Reduce Stiffness
App 20150243572 - Albers; Sven ; et al. | 2015-08-27 |
Stress buffer layer for integrated microelectromechanical systems (MEMS)
Grant 9,056,763 - Geissler , et al. June 16, 2 | 2015-06-16 |
Stress Buffer Layer For Integrated Microelectromechanical Systems (mems)
App 20150091167 - Geissler; Christian ; et al. | 2015-04-02 |
Chip Arrangement And Method For Manufacturing A Chip Arrangement
App 20140361387 - Meyer; Thorsten ; et al. | 2014-12-11 |
Semiconductor device with chip having low-k-layers
Grant 8,786,105 - Meyer , et al. July 22, 2 | 2014-07-22 |
Semiconductor Device With Chip Having Low-k-layers
App 20140197530 - Meyer; Thorsten ; et al. | 2014-07-17 |
Method and system for routing electrical connections of semiconductor chips
Grant 8,598,709 - Meyer , et al. December 3, 2 | 2013-12-03 |
Semiconductor Component With A Space Saving Edge Structure
App 20120153386 - Hirler; Franz ; et al. | 2012-06-21 |
Method And System For Routing Electrical Connections Of Semiconductor Chips
App 20120049375 - MEYER; Thorsten ; et al. | 2012-03-01 |
Semiconductor component having a space saving edge structure
Grant 8,080,858 - Hirler , et al. December 20, 2 | 2011-12-20 |
Memory transistor and memory unit with asymmetrical pocket doping region
Grant 7,433,232 - Geissler , et al. October 7, 2 | 2008-10-07 |
Semiconductor Component Having A Space Saving Edge Structure
App 20080042172 - Hirler; Franz ; et al. | 2008-02-21 |
Memory transistor and memory unit with asymmetrical pocket doping region
App 20070080390 - Geissler; Christian ; et al. | 2007-04-12 |
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