| Patent | Date |
|---|
Semiconductor Device Comprising a Semiconductor Die and a Carrier both Covered by a Parylene Coating
App 20220301959 - Knipper; Richard ; et al. | 2022-09-22 |
Semiconductor Device Having Contact Trenches Extending from Opposite Sides of a Semiconductor Body
App 20220285550 - Zundel; Markus ; et al. | 2022-09-08 |
Compounds for the treatment of bovine or swine respiratory disease
Grant 11,406,617 - Meyer , et al. August 9, 2 | 2022-08-09 |
Method for fabricating a semiconductor flip-chip package
Grant 11,393,742 - Meyer , et al. July 19, 2 | 2022-07-19 |
Semiconductor package with plastic waveguide
Grant 11,387,533 - Wojnowski , et al. July 12, 2 | 2022-07-12 |
Package With Elevated Lead And Structure Extending Vertically From Encapsulant Bottom
App 20220165687 - MEYER; Thorsten ; et al. | 2022-05-26 |
Semiconductor Packages Including Electrical Redistribution Layers Of Different Thicknesses And Methods For Manufacturing Thereof
App 20220157774 - MEYER; Thorsten ; et al. | 2022-05-19 |
Vertical Inductor For Wlcsp
App 20220122756 - WOLTER; Andreas ; et al. | 2022-04-21 |
Multi-purpose non-linear semiconductor package assembly line
Grant 11,302,668 - Meyer , et al. April 12, 2 | 2022-04-12 |
Batch manufacture of packages by sheet separated into carriers after mounting of electronic components
Grant 11,264,356 - Meyer , et al. March 1, 2 | 2022-03-01 |
Vertical inductor for WLCSP
Grant 11,250,981 - Wolter , et al. February 15, 2 | 2022-02-15 |
Compounds Useful for Treating a Mannheimia Haemolytica or Histophilus Somni Infection
App 20220041547 - Berger; Michael ; et al. | 2022-02-10 |
Semiconductor Device Package Comprising a Pin in the Form of a Drilling Screw
App 20220005755 - Scharf; Thorsten ; et al. | 2022-01-06 |
Compounds For The Treatment Of Bovine Or Swine Respiratory Disease
App 20210347730 - Meyer; Thorsten ; et al. | 2021-11-11 |
Semiconductor panels, semiconductor packages, and methods for manufacturing thereof
Grant 11,171,066 - Meyer , et al. November 9, 2 | 2021-11-09 |
Predictive Chip-maintenance
App 20210325445 - Escher-Poeppel; Irmgard ; et al. | 2021-10-21 |
Compounds Useful For The Treatment Of Infection With Mannheimia Haemolytica Or Histophilus Somni
App 20210292284 - Meyer; Thorsten ; et al. | 2021-09-23 |
Semiconductor device with bond pad extensions formed on molded appendage
Grant 11,081,455 - Cha , et al. August 3, 2 | 2021-08-03 |
Compounds useful for treating a Mannheimia haemolytica or Histophilus somni infection
Grant 11,034,650 - Berger , et al. June 15, 2 | 2021-06-15 |
Semiconductor Device Including An Electrical Contact With A Metal Layer Arranged Thereon
App 20210167036 - HELLMUND; Oliver ; et al. | 2021-06-03 |
Semiconductor Package Having A Lead Frame And A Clip Frame
App 20210166998 - Scharf; Thorsten ; et al. | 2021-06-03 |
Package With Separate Substrate Sections
App 20210111108 - Singer; Frank ; et al. | 2021-04-15 |
Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture
Grant 10,964,628 - Scharf , et al. March 30, 2 | 2021-03-30 |
Flat Lead Package Formation Method
App 20210043603 - Meyer; Thorsten ; et al. | 2021-02-11 |
Electronic device including redistribution layer pad having a void
Grant 10,916,484 - Fehler , et al. February 9, 2 | 2021-02-09 |
Integrated circuit packages
Grant 10,903,166 - Ganesan , et al. January 26, 2 | 2021-01-26 |
Processing Of One Or More Carrier Bodies And Electronic Components By Multiple Alignment
App 20210005557 - Meyer; Thorsten ; et al. | 2021-01-07 |
Semiconductor package system
Grant 10,886,186 - Scharf , et al. January 5, 2 | 2021-01-05 |
Method for Fabricating a Semiconductor Flip-Chip Package
App 20200388561 - Meyer; Thorsten ; et al. | 2020-12-10 |
Vertical Inductor For Wlcsp
App 20200381161 - WOLTER; Andreas ; et al. | 2020-12-03 |
Batch Manufacture Of Packages By Sheet Separated Into Carriers After Mounting Of Electronic Components
App 20200365553 - Meyer; Thorsten ; et al. | 2020-11-19 |
Semiconductor Device with Bond Pad Extensions Formed on Molded Appendage
App 20200343205 - Cha; Chan Lam ; et al. | 2020-10-29 |
Vertical inductor for WLCSP
Grant 10,784,033 - Wolter , et al. Sept | 2020-09-22 |
Package comprising carrier with chip and component mounted via opening
Grant 10,777,491 - Scharf , et al. Sept | 2020-09-15 |
Clip Frame Assembly, Semiconductor Package Having a Lead Frame and a Clip Frame, and Method of Manufacture
App 20200273781 - Scharf; Thorsten ; et al. | 2020-08-27 |
Clip Frame Assembly, Semiconductor Package Having a Lead Frame and a Clip Frame, and Method of Manufacture
App 20200273790 - Tay; Bun Kian ; et al. | 2020-08-27 |
Metallic interconnect, a method of manufacturing a metallic interconnect, a semiconductor arrangement and a method of manufacturing a semiconductor arrangement
Grant 10,734,352 - Escher-Poeppel , et al. | 2020-08-04 |
Package with vertical interconnect between carrier and clip
Grant 10,707,158 - Heinrich , et al. | 2020-07-07 |
Reinforcement for electrical connectors
Grant 10,700,037 - Cho , et al. | 2020-06-30 |
Semiconductor Panels, Semiconductor Packages, And Methods For Manufacturing Thereof
App 20200203238 - Meyer; Thorsten ; et al. | 2020-06-25 |
Multi-Purpose Non-Linear Semiconductor Package Assembly Line
App 20200203310 - Meyer; Thorsten ; et al. | 2020-06-25 |
Motor vehicle steering system, assembly tool and assembly method for a motor vehicle steering system
Grant 10,625,769 - Hebenstreit , et al. | 2020-04-21 |
Stacked die semiconductor package with electrical interposer
Grant 10,629,575 - Scharf , et al. | 2020-04-21 |
Compounds for the Treatment of Bovine or Swine Respiratory Disease
App 20200085779 - Meyer; Thorsten ; et al. | 2020-03-19 |
Multi-purpose non-linear semiconductor package assembly line
Grant 10,566,309 - Meyer , et al. Feb | 2020-02-18 |
Semiconductor Package With Plastic Waveguide
App 20200021002 - Wojnowski; Maciej ; et al. | 2020-01-16 |
Multi-layer package
Grant 10,535,634 - Nair , et al. Ja | 2020-01-14 |
Microelectronic package having a passive microelectronic device disposed within a package body
Grant 10,522,454 - Meyer , et al. Dec | 2019-12-31 |
Integrated Circuit Packages
App 20190363052 - Ganesan; Sanka ; et al. | 2019-11-28 |
Compounds Useful for Treating a Mannheimia Haemolytica or Histophilus Somni Infection
App 20190352256 - Berger; Michael ; et al. | 2019-11-21 |
Radio die package with backside conductive plate
Grant 10,453,804 - Kamgaing , et al. Oc | 2019-10-22 |
Semiconductor Package System
App 20190304858 - Scharf; Thorsten ; et al. | 2019-10-03 |
Wearable electronic devices and components thereof
Grant 10,394,280 - Meyer , et al. A | 2019-08-27 |
Package Comprising Carrier With Chip And Component Mounted Via Opening
App 20190259688 - Scharf; Thorsten ; et al. | 2019-08-22 |
Integrated circuit package configurations to reduce stiffness
Grant 10,373,844 - Albers , et al. | 2019-08-06 |
On-Chip Antennas for Semiconductor Devices and Related Manufacturing Methods
App 20190221531 - Meyer; Thorsten ; et al. | 2019-07-18 |
Vertical Inductor For Wlcsp
App 20190221349 - Wolter; Andreas ; et al. | 2019-07-18 |
Semiconductor device including at least one lateral IGFET and at least one vertical IGFET and corresponding manufacturing method
Grant 10,354,925 - Meyer , et al. July 16, 2 | 2019-07-16 |
Eplb/ewlb Based Pop For Hbm Or Customized Package Stack
App 20190206833 - MEYER; Thorsten ; et al. | 2019-07-04 |
Antenna on ceramics for a packaged die
Grant 10,319,688 - Wolter , et al. | 2019-06-11 |
Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)
Grant 10,301,176 - Ofner , et al. | 2019-05-28 |
Semiconductor Device Having Contact Trenches Extending from Opposite Sides of a Semiconductor Body
App 20190157449 - Zundel; Markus ; et al. | 2019-05-23 |
Reinforcement For Electrical Connectors
App 20190148332 - Cho; Eung San ; et al. | 2019-05-16 |
Vertical inductor for WLCSP
Grant 10,290,412 - Wolter , et al. | 2019-05-14 |
Metallic Interconnect, a Method of Manufacturing a Metallic Interconnect, a Semiconductor Arrangement and a Method of Manufacturing a Semiconductor Arrangement
App 20190103378 - Escher-Poeppel; Irmgard ; et al. | 2019-04-04 |
Integrated circuit package having wirebonded multi-die stack
Grant 10,249,598 - Meyer , et al. | 2019-04-02 |
Flexible band wearable electronic device
Grant 10,228,725 - Albers , et al. | 2019-03-12 |
Conductive paths through dielectric with a high aspect ratio for semiconductor devices
Grant 10,229,858 - Meyer , et al. | 2019-03-12 |
Connector block with two sorts of through connections, and electronic device comprising a connector block
Grant 10,217,695 - Meyer , et al. Feb | 2019-02-26 |
Package-on-package stacked microelectronic structures
Grant 10,211,182 - Meyer , et al. Feb | 2019-02-19 |
Package on package architecture and method for making
Grant 10,170,409 - Ganesan , et al. J | 2019-01-01 |
Multi-functional interconnect module and carrier with multi-functional interconnect module attached thereto
Grant 10,168,391 - Babulano , et al. J | 2019-01-01 |
Electronic Device Including Redistribution Layer Pad Having A Void
App 20180374769 - Fehler; Robert ; et al. | 2018-12-27 |
Integrated circuit package
Grant 10,157,869 - Meyer , et al. Dec | 2018-12-18 |
Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)
Grant 10,150,668 - Ofner , et al. Dec | 2018-12-11 |
Method of embedding WLCSP components in E-WLB and E-PLB
Grant 10,147,710 - Nair , et al. De | 2018-12-04 |
Embedded die flip-chip package assembly
Grant 10,128,205 - Meyer , et al. November 13, 2 | 2018-11-13 |
Wireless in-chip and chip to chip communication
Grant 10,122,420 - Meyer , et al. November 6, 2 | 2018-11-06 |
Integrated Circuit Package Having Wirebonded Multi-die Stack
App 20180315737 - Meyer; Thorsten ; et al. | 2018-11-01 |
Method for producing a power semiconductor module
Grant 10,096,584 - Hohlfeld , et al. October 9, 2 | 2018-10-09 |
Microelectronic Package Having A Passive Microelectronic Device Disposed Within A Package Body
App 20180286799 - MEYER; Thorsten ; et al. | 2018-10-04 |
Method Of Embedding Wlcsp Components In E-wlb And E-plb
App 20180269190 - NAIR; Vijay K. ; et al. | 2018-09-20 |
High density chip-to-chip connection
Grant 10,056,352 - Meyer August 21, 2 | 2018-08-21 |
Semiconductor device and method of manufacture thereof
Grant 10,043,768 - Meyer , et al. August 7, 2 | 2018-08-07 |
Integrated Circuit Package Having Wirebonded Multi-die Stack
App 20180197840 - Meyer; Thorsten ; et al. | 2018-07-12 |
Microelectromechanical System (mems) On Application Specific Integrated Circuit (asic)
App 20180186627 - Ofner; Gerald ; et al. | 2018-07-05 |
Microelectronic package having a passive microelectronic device disposed within a package body
Grant 9,997,444 - Meyer , et al. June 12, 2 | 2018-06-12 |
Wearable Electronic Devices And Components Thereof
App 20180157289 - Meyer; Thorsten ; et al. | 2018-06-07 |
Method of embedding WLCSP components in e-WLB and e-PLB
Grant 9,991,239 - Nair , et al. June 5, 2 | 2018-06-05 |
Chip package-in-package
Grant 9,985,005 - Meyer , et al. May 29, 2 | 2018-05-29 |
Semiconductor device including at least one element
Grant 9,984,900 - Meyer , et al. May 29, 2 | 2018-05-29 |
Integrated circuit package having wirebonded multi-die stack
Grant 9,972,601 - Meyer , et al. May 15, 2 | 2018-05-15 |
Flexible Band Wearable Electronic Device
App 20180092443 - Albers; Sven ; et al. | 2018-04-05 |
Flexible Band Wearable Electronic Device
App 20180095426 - Albers; Sven ; et al. | 2018-04-05 |
Multi-Purpose Non-Linear Semiconductor Package Assembly Line
App 20180096966 - Meyer; Thorsten ; et al. | 2018-04-05 |
Wearable electronic devices and components thereof
Grant 9,904,321 - Meyer , et al. February 27, 2 | 2018-02-27 |
Passive electrical devices with a polymer carrier
Grant 9,888,577 - Meyer , et al. February 6, 2 | 2018-02-06 |
System and process for fabricating semiconductor packages
Grant 9,874,820 - Meyer January 23, 2 | 2018-01-23 |
Chip arrangement and method for manufacturing a chip arrangement
Grant 9,856,136 - Meyer , et al. January 2, 2 | 2018-01-02 |
Semiconductor device and method of manufacturing the same
Grant 9,837,530 - Decker , et al. December 5, 2 | 2017-12-05 |
Integrated Circuit Package Configurations To Reduce Stiffness
App 20170345678 - Albers; Sven ; et al. | 2017-11-30 |
Semiconductor device comprising an isolation trench
Grant 9,825,148 - Meiser , et al. November 21, 2 | 2017-11-21 |
Bulk acoustic wave resonator tuner circuits
Grant 9,819,327 - Maruthamuthu , et al. November 14, 2 | 2017-11-14 |
Package with vertical interconnect between carrier and clip
App 20170317016 - HEINRICH; Alexander ; et al. | 2017-11-02 |
Semiconductor Devices with On-Chip Antennas and Manufacturing Thereof
App 20170309582 - Meyer; Thorsten ; et al. | 2017-10-26 |
Semiconductor Device Including A Mems Die
App 20170283247 - Meyer; Thorsten ; et al. | 2017-10-05 |
Method of manufacturing an integrated circuit having field effect transistors including a peak in a body dopant concentration
Grant 9,761,665 - Meyer , et al. September 12, 2 | 2017-09-12 |
Microelectromechanical System (mems) On Application Specific Integrated Circuit (asic)
App 20170217766 - Ofner; Gerald ; et al. | 2017-08-03 |
Semiconductor device
Grant 9,716,068 - Meyer July 25, 2 | 2017-07-25 |
Multi-layer Package
App 20170207170 - NAIR; Vijay K. ; et al. | 2017-07-20 |
Trench transistor having a doped semiconductor region
Grant 9,711,621 - Hirler , et al. July 18, 2 | 2017-07-18 |
Three dimensional structures within mold compound
Grant 9,711,492 - Albers , et al. July 18, 2 | 2017-07-18 |
Wireless In-chip And Chip To Chip Communication
App 20170180014 - Meyer; Thorsten ; et al. | 2017-06-22 |
Electronic component and methods of manufacturing the same
App 20170178993 - MEYER; Thorsten ; et al. | 2017-06-22 |
Connector block with two sorts of through connections, and electronic device comprising a connector block
App 20170162476 - MEYER; Thorsten ; et al. | 2017-06-08 |
Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)
Grant 9,663,353 - Ofner , et al. May 30, 2 | 2017-05-30 |
Conductive Paths Through Dielectric With A High Aspect Ratio For Semiconductor Devices
App 20170148698 - Meyer; Thorsten ; et al. | 2017-05-25 |
Integrated circuit package configurations to reduce stiffness
Grant 9,653,324 - Albers , et al. May 16, 2 | 2017-05-16 |
Method of manufacturing a semiconductor device including removing a relief layer from back surface of semiconductor chip
Grant 9,646,856 - Meyer , et al. May 9, 2 | 2017-05-09 |
Method for Producing a Power Semiconductor Module
App 20170125395 - Hohlfeld; Olaf ; et al. | 2017-05-04 |
Method For Providing Data
App 20170113450 - Nass; Andreas ; et al. | 2017-04-27 |
Integrated Circuit Package
App 20170103956 - Meyer; Thorsten ; et al. | 2017-04-13 |
Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips
Grant 9,601,475 - Brunnbauer , et al. March 21, 2 | 2017-03-21 |
Motor Vehicle Steering System, Assembly Tool and Assembly Method for a Motor Vehicle Steering System
App 20170066469 - HEBENSTREIT; Axel ; et al. | 2017-03-09 |
Radio Die Package With Backside Conductive Plate
App 20170062357 - KAMGAING; Teleshpor ; et al. | 2017-03-02 |
Conductive paths through dielectric with a high aspect ratio for semiconductor devices
Grant 9,576,918 - Meyer , et al. February 21, 2 | 2017-02-21 |
Methods of forming stacked microelectronic dice embedded in a microelectronic substrate
Grant 9,564,400 - Mahnkopf , et al. February 7, 2 | 2017-02-07 |
Semiconductor package with integrated magnetic field sensor
Grant 9,564,578 - Meyer , et al. February 7, 2 | 2017-02-07 |
Integrated transistor structure having a power transistor and a bipolar transistor
Grant 9,564,425 - Kadow , et al. February 7, 2 | 2017-02-07 |
Stress buffer layer for integrated microelectromechanical systems (MEMS)
Grant 9,550,670 - Geissler , et al. January 24, 2 | 2017-01-24 |
Semiconductor Device Including at Least One Lateral IGFET and at Least One Vertical IGFET and Corresponding Manufacturing Method
App 20170018461 - Meyer; Thorsten ; et al. | 2017-01-19 |
Hybrid exposure for semiconductor devices
Grant 9,543,224 - Meyer , et al. January 10, 2 | 2017-01-10 |
Semiconductor Package with Integrated Magnetic Field Sensor
App 20160380181 - Meyer; Thorsten ; et al. | 2016-12-29 |
Vertical Inductor For Wlcsp
App 20160379747 - Wolter; Andreas ; et al. | 2016-12-29 |
Semiconductor Device And Methods Of Manufacturing Semiconductor Devices
App 20160379940 - MEYER; Thorsten | 2016-12-29 |
Multi-Functional Interconnect Module and Carrier with Multi-Functional Interconnect Module Attached Thereto
App 20160377689 - Babulano; Giuliano Angelo ; et al. | 2016-12-29 |
Opossum-die Package-on-package Apparatus
App 20160358891 - GEISSLER; Christian ; et al. | 2016-12-08 |
Three Dimensional Structures Within Mold Compound
App 20160358897 - ALBERS; Sven ; et al. | 2016-12-08 |
Microelectronic Package Having A Passive Microelectronic Device Disposed Within A Package Body
App 20160358848 - Meyer; Thorsten ; et al. | 2016-12-08 |
Conductive Paths Through Dielectric With A High Aspect Ratio For Semiconductor Devices
App 20160343677 - MEYER; THORSTEN ; et al. | 2016-11-24 |
Semiconductor Device Including At Least One Element
App 20160343616 - Meyer; Thorsten ; et al. | 2016-11-24 |
Semiconductor Device and Manufacturing Method
App 20160307849 - Meyer; Thorsten ; et al. | 2016-10-20 |
Integrated circuit package
Grant 9,472,515 - Meyer , et al. October 18, 2 | 2016-10-18 |
Integrated Circuit Package Configurations To Reduce Stiffness
App 20160293453 - Albers; Sven ; et al. | 2016-10-06 |
Semiconductor device and method of manufacturing the same
Grant 9,461,164 - Meyer , et al. October 4, 2 | 2016-10-04 |
Package On Package Architecture And Method For Making
App 20160284642 - GANESAN; Sanka ; et al. | 2016-09-29 |
Semiconductor device and methods of manufacturing semiconductor devices
Grant 9,455,161 - Meyer September 27, 2 | 2016-09-27 |
Integrated Circuit Package Having Wirebonded Multi-die Stack
App 20160276311 - Meyer; Thorsten ; et al. | 2016-09-22 |
Wearable Electronic Devices And Components Thereof
App 20160274621 - Meyer; Thorsten ; et al. | 2016-09-22 |
Method Of Embedding Wlcsp Components In E-wlb And E-plb
App 20160276325 - NAIR; Vijay K. ; et al. | 2016-09-22 |
Semiconductor Device
App 20160276279 - Meyer; Thorsten | 2016-09-22 |
Method of Manufacturing a Semiconductor Device
App 20160268397 - Meiser; Andreas ; et al. | 2016-09-15 |
Package-on-package Stacked Microelectronic Structures
App 20160260689 - Meyer; Thorsten ; et al. | 2016-09-08 |
Method Of Manufacturing An Integrated Circuit Having Field Effect Transistors Including A Peak In A Body Dopant Concentration
App 20160260803 - Meyer; Thorsten ; et al. | 2016-09-08 |
Integrated circuit package configurations to reduce stiffness
Grant 9,397,019 - Albers , et al. July 19, 2 | 2016-07-19 |
Microelectromechanical System (mems) On Application Specific Integrated Circuit (asic)
App 20160200566 - Ofner; Gerald ; et al. | 2016-07-14 |
Sensor Hierarchy
App 20160203398 - MEYER; THORSTEN ; et al. | 2016-07-14 |
Semiconductor Device Having Contact Trenches Extending from Opposite Sides of a Semiconductor Body
App 20160197070 - Zundel; Markus ; et al. | 2016-07-07 |
Semiconductor devices
Grant 9,385,105 - Meyer , et al. July 5, 2 | 2016-07-05 |
Chip Package-in-package
App 20160190107 - Meyer; Thorsten ; et al. | 2016-06-30 |
Stacked microelectronic dice embedded in a microelectronic substrate
Grant 9,373,588 - Mahnkopf , et al. June 21, 2 | 2016-06-21 |
Field plate trench transistor and method for producing it
Grant 9,373,700 - Hirler , et al. June 21, 2 | 2016-06-21 |
Workpiece With Semiconductor Chips, Semiconductor Device And Method For Producing A Workpiece With Semiconductor Chips
App 20160163682 - Brunnbauer; Markus ; et al. | 2016-06-09 |
Article and panel comprising semiconductor chips, casting mold and methods of producing the same
Grant 9,362,144 - Meyer , et al. June 7, 2 | 2016-06-07 |
Method of manufacturing an integrated circuit having field effect transistors including a peak in a body dopant concentration
Grant 9,355,909 - Meyer , et al. May 31, 2 | 2016-05-31 |
Stacked Microelectronic Dice Embedded In A Microelectronic Substrate
App 20160148920 - Mahnkopf; Reinhard ; et al. | 2016-05-26 |
Method of manufacturing a semiconductor device
Grant 9,349,834 - Meiser , et al. May 24, 2 | 2016-05-24 |
Semiconductor device
Grant 9,331,057 - Meyer , et al. May 3, 2 | 2016-05-03 |
Chip package-in-package and method thereof
Grant 9,312,198 - Meyer , et al. April 12, 2 | 2016-04-12 |
Semiconductor Device and Method of Manufacturing the Same
App 20160093728 - Decker; Stefan ; et al. | 2016-03-31 |
Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips
Grant 9,293,423 - Brunnbauer , et al. March 22, 2 | 2016-03-22 |
Semiconductor device comprising contact trenches
Grant 9,281,359 - Zundel , et al. March 8, 2 | 2016-03-08 |
System And Process For Fabricating Semiconductor Packages
App 20160048086 - Meyer; Thorsten | 2016-02-18 |
Chip interposer, semiconductor device, and method for manufacturing a semiconductor device
Grant 9,263,376 - Meyer , et al. February 16, 2 | 2016-02-16 |
Field Plate Trench Transistor And Method For Producing It
App 20160035862 - Hirler; Franz ; et al. | 2016-02-04 |
High Density Chip-to-chip Connection
App 20160013153 - Meyer; Thorsten | 2016-01-14 |
Semiconductor module having deflecting conductive layer over a spacer structure
Grant 9,219,034 - Meyer , et al. December 22, 2 | 2015-12-22 |
Steering spindle arrangement
Grant 9,205,868 - Hebenstreit , et al. December 8, 2 | 2015-12-08 |
Bulk Acoustic Wave Resonator Tuner Circuits
App 20150333401 - Maruthamuthu; Saravana ; et al. | 2015-11-19 |
Method of Manufacturing a Semiconductor Device
App 20150311317 - Meiser; Andreas ; et al. | 2015-10-29 |
Integrated Transistor Structure Having a Power Transistor and a Bipolar Transistor
App 20150311195 - Kadow; Christoph ; et al. | 2015-10-29 |
Field plate trench transistor and method for producing it
Grant 9,171,841 - Hirler , et al. October 27, 2 | 2015-10-27 |
System and process for fabricating semiconductor packages
Grant 9,164,404 - Meyer October 20, 2 | 2015-10-20 |
System and process for fabricating semiconductor packages
Grant 9,165,841 - Meyer October 20, 2 | 2015-10-20 |
Electronic Assembly That Includes Stacked Electronic Components
App 20150282367 - Barth; Hans-Joachim ; et al. | 2015-10-01 |
Passive Electrical Devices With A Polymer Carrier
App 20150282308 - Meyer; Thorsten ; et al. | 2015-10-01 |
Stress Buffer Layer For Integrated Microelectromechanical Systems (mems)
App 20150266728 - Geissler; Christian ; et al. | 2015-09-24 |
Semiconductor Device And Method Of Manufacturing A Semiconductor Device Including Grinding Sets
App 20150262844 - Meyer; Thorsten ; et al. | 2015-09-17 |
Integrated Circuit Package
App 20150262866 - Meyer; Thorsten ; et al. | 2015-09-17 |
Embedded Die Flip-chip Package Assembly
App 20150255412 - Meyer; Thorsten ; et al. | 2015-09-10 |
Steering arrangement
Grant 9,126,622 - Hebenstreit , et al. September 8, 2 | 2015-09-08 |
Semiconductor device, integrated circuit and method of manufacturing a semiconductor device
Grant 9,123,801 - Meiser , et al. September 1, 2 | 2015-09-01 |
Integrated Circuit Package Configurations To Reduce Stiffness
App 20150243572 - Albers; Sven ; et al. | 2015-08-27 |
Chip arrangement with a recessed chip housing region and a method for manufacturing the same
Grant 9,111,947 - O'Sullivan , et al. August 18, 2 | 2015-08-18 |
High voltage bipolar transistor with trench field plate
Grant 9,112,021 - Kadow , et al. August 18, 2 | 2015-08-18 |
Anthelmintic agents and their use
Grant 9,096,524 - Chassaing , et al. August 4, 2 | 2015-08-04 |
Semiconductor device
Grant 9,093,322 - Meyer , et al. July 28, 2 | 2015-07-28 |
Die Package Architecture With Embedded Die And Simplified Redistribution Layer
App 20150187608 - GANESAN; Sanka ; et al. | 2015-07-02 |
Integrated antennas in wafer level package
Grant 9,064,787 - Boeck , et al. June 23, 2 | 2015-06-23 |
Chip with encapsulated sides and exposed surface
Grant 9,064,883 - Meyer , et al. June 23, 2 | 2015-06-23 |
Stress buffer layer for integrated microelectromechanical systems (MEMS)
Grant 9,056,763 - Geissler , et al. June 16, 2 | 2015-06-16 |
Enhanced flip chip package
Grant 9,059,304 - Meyer , et al. June 16, 2 | 2015-06-16 |
Semiconductor device and method of manufacture thereof
Grant 9,030,019 - Meyer , et al. May 12, 2 | 2015-05-12 |
Stress Buffer Layer For Integrated Microelectromechanical Systems (mems)
App 20150091167 - Geissler; Christian ; et al. | 2015-04-02 |
Stacked Microelectronic Dice Embedded In A Microelectronic Substrate
App 20150084165 - Mahnkopf; Reinhard ; et al. | 2015-03-26 |
Semiconductor Device and Method of Manufacturing the Same
App 20150076591 - Meyer; Thorsten ; et al. | 2015-03-19 |
Semiconductor Device, Integrated Circuit and Method of Manufacturing a Semiconductor Device
App 20150076590 - Meiser; Andreas ; et al. | 2015-03-19 |
Chip Arrangement And A Method For Manufacturing A Chip Arrangement
App 20150061130 - Meyer; Thorsten | 2015-03-05 |
Semiconductor Devices
App 20150028478 - Meyer; Thorsten ; et al. | 2015-01-29 |
Semiconductor device including a diode and method of manufacturing a semiconductor device
Grant 8,941,206 - Meyer , et al. January 27, 2 | 2015-01-27 |
Chip Arrangement And Method For Manufacturing A Chip Arrangement
App 20140361387 - Meyer; Thorsten ; et al. | 2014-12-11 |
Chip arrangements
Grant 8,907,480 - Meyer , et al. December 9, 2 | 2014-12-09 |
Chip Arrangements And A Method For Manufacturing A Chip Arrangement
App 20140353836 - O'Sullivan; David ; et al. | 2014-12-04 |
Semiconductor Device
App 20140357075 - Meyer; Thorsten ; et al. | 2014-12-04 |
Workpiece With Semiconductor Chips, Semiconductor Device And Method For Producing A Workpiece With Semiconductor Chips
App 20140332937 - Brunnbauer; Markus ; et al. | 2014-11-13 |
Trench Transistor Having a Doped Semiconductor Region
App 20140332885 - Hirler; Franz ; et al. | 2014-11-13 |
Stacked fan-out semiconductor chip
Grant 8,878,360 - Meyer , et al. November 4, 2 | 2014-11-04 |
Method and system for providing fusing after packaging of semiconductor devices
Grant 8,878,335 - Meyer , et al. November 4, 2 | 2014-11-04 |
Chip Interposer, Semiconductor Device, And Method For Manufacturing A Semiconductor Device
App 20140306355 - Meyer; Thorsten ; et al. | 2014-10-16 |
Field Plate Trench Transistor And Method For Producing It
App 20140284702 - Hirler; Franz ; et al. | 2014-09-25 |
Chip Arrangements
App 20140264832 - Meyer; Thorsten ; et al. | 2014-09-18 |
Chip Arrangement And A Method For Manufacturing A Chip Arrangement
App 20140264831 - Meyer; Thorsten | 2014-09-18 |
Chip package-in-package and method thereof
App 20140264914 - Meyer; Thorsten ; et al. | 2014-09-18 |
Chip Arrangements, Chip Packages, And A Method For Manufacturing A Chip Arrangement
App 20140264808 - Wolter; Andreas ; et al. | 2014-09-18 |
Semiconductor Devices
App 20140252632 - Barth; Hans-Joachim ; et al. | 2014-09-11 |
Vehicle interior fitting part and method for the production thereof
Grant 8,827,354 - Wolff , et al. September 9, 2 | 2014-09-09 |
Stackable semiconductor package with encapsulant and electrically conductive feed-through
Grant 8,829,663 - Pohl , et al. September 9, 2 | 2014-09-09 |
Steering Spindle Arrangement
App 20140246839 - Hebenstreit; Axel ; et al. | 2014-09-04 |
Steering Arrangement
App 20140241795 - Hebenstreit; Axel ; et al. | 2014-08-28 |
Lateral trench transistor, as well as a method for its production
Grant 8,815,686 - Hirler , et al. August 26, 2 | 2014-08-26 |
Flip-chip Wafer Level Package And Methods Thereof
App 20140206142 - Meyer; Thorsten | 2014-07-24 |
Steering Spindle Arrangement
App 20140205375 - Hebenstreit; Axel ; et al. | 2014-07-24 |
Semiconductor device with chip having low-k-layers
Grant 8,786,105 - Meyer , et al. July 22, 2 | 2014-07-22 |
Semiconductor Device With Chip Having Low-k-layers
App 20140197530 - Meyer; Thorsten ; et al. | 2014-07-17 |
Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips
Grant 8,779,563 - Brunnbauer , et al. July 15, 2 | 2014-07-15 |
Semiconductor device with capacitive coupling structure
Grant 8,779,564 - Knudsen , et al. July 15, 2 | 2014-07-15 |
Field effect trench transistor having active trenches
Grant 8,772,861 - Zundel , et al. July 8, 2 | 2014-07-08 |
Semiconductor Device Including At Least One Element
App 20140175625 - Meyer; Thorsten ; et al. | 2014-06-26 |
Deriving Environmental Context And Actions From Ad-hoc State Broadcast
App 20140179295 - Luebbers; Enno ; et al. | 2014-06-26 |
Field plate trench transistor and method for producing it
Grant 8,759,905 - Hirler , et al. June 24, 2 | 2014-06-24 |
Repairable semiconductor device and method
Grant 8,754,522 - Meyer , et al. June 17, 2 | 2014-06-17 |
Sensor Hierarchy
App 20140159856 - MEYER; THORSTEN ; et al. | 2014-06-12 |
Chip Package And A Method For Manufacturing A Chip Package
App 20140151700 - Meyer; Thorsten ; et al. | 2014-06-05 |
Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads
Grant 8,741,690 - Meyer , et al. June 3, 2 | 2014-06-03 |
Component and method for producing a component
Grant 8,742,563 - Meyer , et al. June 3, 2 | 2014-06-03 |
Enhanced Flip Chip Package
App 20140138827 - Meyer; Thorsten ; et al. | 2014-05-22 |
Flip-chip wafer level package and methods thereof
Grant 8,729,714 - Meyer May 20, 2 | 2014-05-20 |
Enhanced flip chip package
Grant 8,716,859 - Meyer , et al. May 6, 2 | 2014-05-06 |
Integrated Circuit Having Field Effect Transistors And Manufacturing Method
App 20140120673 - Meyer; Thorsten ; et al. | 2014-05-01 |
System And Process For Fabricating Semiconductor Packages
App 20140106507 - Meyer; Thorsten | 2014-04-17 |
Method Of Modulating The Degree Of Adipose Tissue Deposited Intramuscularly
App 20140094512 - Gunkel; Nikolas ; et al. | 2014-04-03 |
Semiconductor device including adhesive covered element
Grant 8,659,154 - Meyer , et al. February 25, 2 | 2014-02-25 |
Vehicle door
Grant 8,656,646 - Mieglitz , et al. February 25, 2 | 2014-02-25 |
Semiconductor Device, Integrated Circuit and Manufacturing Method Thereof
App 20140048904 - Zundel; Markus ; et al. | 2014-02-20 |
Integrated circuit having field effect transistors and manufacturing method
Grant 8,643,068 - Meyer , et al. February 4, 2 | 2014-02-04 |
Semiconductor Device Including a Diode and Method of Manufacturing a Semiconductor Device
App 20140027773 - Meyer; Thorsten ; et al. | 2014-01-30 |
Integrated circuit technology with different device epitaxial layers
Grant 8,637,954 - Meyer , et al. January 28, 2 | 2014-01-28 |
Stacked Fan-out Semiconductor Chip
App 20140015131 - Meyer; Thorsten ; et al. | 2014-01-16 |
Enantioselective synthesis of 6-amino-7-hydroxy-4,5,6,7-tetrahydro-imidazo[4,5,1-jk][1]-benzazepin-2[1H- ]-one and zilpaterol
Grant 8,629,134 - Almena-Perea , et al. January 14, 2 | 2014-01-14 |
On-Chip RF shields with front side redistribution lines
Grant 8,617,929 - Barth , et al. December 31, 2 | 2013-12-31 |
Door module for a vehicle door, and mounting method
Grant 8,616,611 - Schidan , et al. December 31, 2 | 2013-12-31 |
Door module for a vehicle door, and mounting method
Grant 08616611 - | 2013-12-31 |
On-Chip RF shields with front side redistribution lines
Grant 08617929 - | 2013-12-31 |
Heater For Semiconductor Device
App 20130342263 - MEYER; Thorsten | 2013-12-26 |
Cte Adaption In A Semiconductor Package
App 20130328191 - Meyer; Thorsten ; et al. | 2013-12-12 |
Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device
Grant 8,604,622 - Meyer , et al. December 10, 2 | 2013-12-10 |
Semiconductor apparatus having stacked semiconductor components
Grant 8,598,716 - Hedler , et al. December 3, 2 | 2013-12-03 |
Method and system for routing electrical connections of semiconductor chips
Grant 8,598,709 - Meyer , et al. December 3, 2 | 2013-12-03 |
Anthelmintic agents and their use
Grant 8,569,495 - Chassaing , et al. October 29, 2 | 2013-10-29 |
Rotated Semiconductor Device Fan-out Wafer Level Packages And Methods Of Manufacturing Rotated Semiconductor Device Fan-out Wafer Level Packages
App 20130256883 - Meyer; Thorsten ; et al. | 2013-10-03 |
Grid Fan-out Wafer Level Package And Methods Of Manufacturing A Grid Fan-out Wafer Level Package
App 20130256884 - Meyer; Thorsten | 2013-10-03 |
Integrated Antennas in Wafer Level Package
App 20130241059 - Boeck; Josef ; et al. | 2013-09-19 |
Duplex Toothed Chain And Arrangement Comprising Such A Toothed Chain And An External Toothing Of A Toothed Chain Engagement Device
App 20130237357 - Meyer; Thorsten ; et al. | 2013-09-12 |
Workpiece with Semiconductor Chips, Semiconductor Device and Method for Producing a Workpiece with Semiconductor Chips
App 20130228904 - Brunnbauer; Markus ; et al. | 2013-09-05 |
Lateral Trench Transistor, As Well As A Method For Its Production
App 20130224921 - Hirler; Franz ; et al. | 2013-08-29 |
Anthelmintic agents and their use
Grant 8,507,474 - Chassaing , et al. August 13, 2 | 2013-08-13 |
Vertical power semiconductor carrier having laterally isolated circuit areas
Grant 8,502,307 - Kadow , et al. August 6, 2 | 2013-08-06 |
Method for producing chip packages, and chip package produced in this way
Grant 8,487,448 - Meyer , et al. July 16, 2 | 2013-07-16 |
Field Plate Trench Transistor And Method For Producing It
App 20130175605 - Hirler; Franz ; et al. | 2013-07-11 |
Enhanced Flip Chip Package
App 20130175686 - Meyer; Thorsten ; et al. | 2013-07-11 |
Semiconductor component including a semiconductor chip and a passive component
Grant 8,471,393 - Meyer , et al. June 25, 2 | 2013-06-25 |
Chip-packaging module for a chip and a method for forming a chip-packaging module
Grant 8,461,691 - Meyer June 11, 2 | 2013-06-11 |
Semiconductor Device And Methods Of Manufacturing Semiconductor Devices
App 20130134573 - MEYER; Thorsten | 2013-05-30 |
Integrated antennas in wafer level package
Grant 8,451,618 - Boeck , et al. May 28, 2 | 2013-05-28 |
Lateral trench transistor, as well as a method for its production
Grant 8,431,988 - Hirler , et al. April 30, 2 | 2013-04-30 |
Device including an encapsulated semiconductor chip and manufacturing method thereof
Grant 8,421,226 - Meyer , et al. April 16, 2 | 2013-04-16 |
Vehicle Interior Fitting Part And Method For The Production Thereof
App 20130057024 - Wolff; Martin ; et al. | 2013-03-07 |
Semiconductor device and methods of manufacturing semiconductor devices
Grant 8,390,107 - Meyer March 5, 2 | 2013-03-05 |
Semiconductor Device and Method of Manufacturing a Semiconductor Device Including Grinding Steps
App 20130049205 - Meyer; Thorsten ; et al. | 2013-02-28 |
High Voltage Bipolar Transistor with Trench Field Plate
App 20130009252 - Kadow; Christoph ; et al. | 2013-01-10 |
Field plate trench transistor and method for producing it
Grant 8,334,564 - Hirler , et al. December 18, 2 | 2012-12-18 |
High-voltage bipolar transistor with trench field plate
Grant 8,319,282 - Kadow , et al. November 27, 2 | 2012-11-27 |
Structure for electrostatic discharge in embedded wafer level packages
Grant 8,309,454 - Brunnbauer , et al. November 13, 2 | 2012-11-13 |
Chip-packaging Module For A Chip And A Method For Forming A Chip-packaging Module
App 20120273957 - Meyer; Thorsten | 2012-11-01 |
Article and Panel Comprising Semiconductor Chips, Casting Mold and Methods of Producing the Same
App 20120261841 - Meyer; Thorsten ; et al. | 2012-10-18 |
Semiconductor Chip Package, Semiconductor Chip Assembly, And Method For Fabricating A Device
App 20120256315 - Meyer; Thorsten ; et al. | 2012-10-11 |
Electronic Device And Method For Producing A Device
App 20120235298 - Brunnbauer; Markus ; et al. | 2012-09-20 |
Zilpaterol enantiomer compositions and methods of making and using such compositions
Grant 8,268,813 - Miculka , et al. September 18, 2 | 2012-09-18 |
Semiconductor package and multichip arrangement having a polymer layer and an encapsulant
Grant 8,258,633 - Sezi , et al. September 4, 2 | 2012-09-04 |
Packaged Semiconductor Device with Encapsulant Embedding Semiconductor Chip that Includes Contact Pads
App 20120208319 - Meyer; Thorsten ; et al. | 2012-08-16 |
Article and panel comprising semiconductor chips, casting mold and methods of producing the same
Grant 8,217,504 - Meyer , et al. July 10, 2 | 2012-07-10 |
Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device
Grant 8,202,763 - Meyer , et al. June 19, 2 | 2012-06-19 |
Electronic device and method for producing a device
Grant 8,188,585 - Brunnbauer , et al. May 29, 2 | 2012-05-29 |
Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads
Grant 8,183,696 - Meyer , et al. May 22, 2 | 2012-05-22 |
On-chip RF shields with front side redistribution lines
Grant 8,178,953 - Barth , et al. May 15, 2 | 2012-05-15 |
Semiconductor module having deflecting conductive layer over a spacer structure
Grant 8,178,965 - Meyer , et al. May 15, 2 | 2012-05-15 |
Electrical through contact
Grant 8,124,521 - Hedler , et al. February 28, 2 | 2012-02-28 |
Anthelmintic Agents And Their Use
App 20110319393A1 - | 2011-12-29 |
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