U.S. patent application number 13/482431 was filed with the patent office on 2012-09-20 for electronic device and method for producing a device.
This patent application is currently assigned to INFINEON TECHNOLOGIES AG. Invention is credited to Markus Brunnbauer, Harry Hedler, Thorsten Meyer.
Application Number | 20120235298 13/482431 |
Document ID | / |
Family ID | 38954697 |
Filed Date | 2012-09-20 |
United States Patent
Application |
20120235298 |
Kind Code |
A1 |
Brunnbauer; Markus ; et
al. |
September 20, 2012 |
ELECTRONIC DEVICE AND METHOD FOR PRODUCING A DEVICE
Abstract
An electronic device or devices and method for producing a
device is disclosed. One embodiment provides an integrated
component, a first package body and a contact device. The contact
device penetrates the package body.
Inventors: |
Brunnbauer; Markus;
(Lappersdorf, DE) ; Hedler; Harry; (Germering,
DE) ; Meyer; Thorsten; (Regensburg, DE) |
Assignee: |
INFINEON TECHNOLOGIES AG
Neubiberg
DE
|
Family ID: |
38954697 |
Appl. No.: |
13/482431 |
Filed: |
May 29, 2012 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
11837118 |
Aug 10, 2007 |
8188585 |
|
|
13482431 |
|
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|
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Current U.S.
Class: |
257/738 ;
257/E23.021 |
Current CPC
Class: |
H01L 24/48 20130101;
H01L 2924/01068 20130101; H01L 2924/01075 20130101; H01L 2224/24227
20130101; H01L 2924/00014 20130101; H01L 2225/1058 20130101; H01L
2224/04105 20130101; H01L 2924/15331 20130101; H01L 21/6835
20130101; H01L 24/19 20130101; H01L 2924/01029 20130101; H01L
25/105 20130101; H01L 2924/00014 20130101; H01L 2924/181 20130101;
H01L 24/96 20130101; H01L 2924/014 20130101; H01L 2224/24011
20130101; H01L 2924/19042 20130101; H01L 24/97 20130101; H01L
2224/48235 20130101; H01L 2924/01013 20130101; H01L 2224/97
20130101; H01L 2224/97 20130101; H01L 23/3128 20130101; H01L
2924/19043 20130101; H01L 2924/00 20130101; H01L 2924/1305
20130101; H01L 2224/45015 20130101; H01L 2224/45099 20130101; H01L
2924/00 20130101; H01L 2924/207 20130101; H01L 2924/00014 20130101;
H01L 2224/82 20130101; H01L 2924/01033 20130101; H01L 2924/01005
20130101; H01L 2924/1305 20130101; H01L 2924/01082 20130101; H01L
2924/1532 20130101; H01L 2924/181 20130101; H01L 2924/19041
20130101; H01L 2225/1035 20130101; H01L 2924/01006 20130101; H01L
2924/01079 20130101; H01L 2924/14 20130101; H01L 21/568
20130101 |
Class at
Publication: |
257/738 ;
257/E23.021 |
International
Class: |
H01L 23/48 20060101
H01L023/48 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 10, 2006 |
DE |
10 2006 037 538.6 |
Claims
1. An electronic device, comprising: an integrated component; a
package body; at least one contact device; and the contact device
penetrating the package body.
2. The device of claim 1, comprising: the contact device at a first
end terminating with the package body or protruding beyond the
package body; and the contact device at a second end terminating
with the package body or protruding beyond the package body.
3. The device of claim 1, comprising wherein a surface of the
contact device consists of a metal containing more than 50 atomic
percent.
4. The device of claim 1, comprising wherein the contact device
penetrates the package body from a first side of the package body
to a second side of the package body facing away from the first
side.
5. The device of claim 1, comprising wherein the contact device is
arranged to the side of the integrated component.
6. The device of claim 1, comprising a wiring arrangement, which
overlaps the integrated component, the package body and the contact
device.
7. The device of claim 6, comprising wherein the wiring arrangement
connects the contact device to the integrated component in an
electrically conductive manner.
8. The device of claim 6, comprising wherein the integrated
circuit, the package body and the contact device are arranged on
the same side of the wiring arrangement.
9. The device of claim 1, comprising wherein the contact devices
are balls or balls that are deformed on one side or balls that are
deformed on two sides.
10. The device of claim 1, comprising wherein the contact devices
consist of solder material.
11. The device of claim 1, comprising wherein a number of contact
devices are arranged in a first plane, and the side faces of the
contact devices have a straight line of intersection or a curved
line of intersection with a second plane, which extends in a
direction normal to the first plane.
12. The device of claim 1, comprising wherein the contact device is
adjacent the package body.
13. The device of claim 1, comprising wherein the package body
consists of an epoxy material or contains an epoxy material.
14. The device of claim 1, comprising wherein the package body
consists of a plastic.
15. The device of claim 1, comprising wherein the wiring
arrangement has a layer thickness of less than 50 micrometers, the
wiring arrangement being a wiring arrangement produced by thin-film
technology, which has only one or more metallization layer.
16. The device of claim 1, comprising wherein a lateral dimension
of the first packaged component is less than 30 mm.
17. A device stack, comprising at least two devices of claim 1.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This Utility Patent Application is a divisional application
of U.S. application Ser. No. 11/837,118, filed Aug. 10, 2007, and
claims priority to German Patent Application No. DE 10 2006 037
538.6 filed on Aug. 10, 2006, which is incorporated herein by
reference.
BACKGROUND
[0002] The invention relates to an electronic device, in particular
with an integrated component or chip.
[0003] An integrated component includes, for example, an integrated
circuit, for example with a number of circuit elements, for example
transistors or sensors, or with just one circuit element. Such
integrated components are used, for example, in electronic circuits
of motor vehicles, cellphones, cameras, etc.
[0004] The devices are provided, for example, with a package body.
In spite of the package body, the device is however intended to be
as small as possible.
[0005] There is a need for a simply constructed device which can in
particular be produced in a simple manner. The device is intended
to have a small overall height and/or be simple to mount. In
particular, there is a further need for a device stack.
Furthermore, there is a need for a production method for a device.
There is also a need for the use of a ball placing machine for this
method, in particular a solder ball placing machine.
[0006] For these and other reasons, there is a need for the present
invention.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] The accompanying drawings are included to provide a further
understanding of embodiments and are incorporated in and constitute
a part of this specification. The drawings illustrate embodiments
and together with the description serve to explain principles of
embodiments. Other embodiments and many of the intended advantages
of embodiments will be readily appreciated as they become better
understood by reference to the following detailed description. The
elements of the drawings are not necessarily to scale relative to
each other. Like reference numerals designate corresponding similar
parts.
[0008] FIG. 1 illustrates a device stack including two or three
packaged devices.
[0009] FIGS. 2A to 2J illustrate production stages in the
production of the device stack.
[0010] FIG. 3 illustrates a device according to a further
embodiment.
[0011] FIG. 4 illustrates an alternative production stage in the
production of the device stack.
DETAILED DESCRIPTION
[0012] In the following Detailed Description, reference is made to
the accompanying drawings, which form a part hereof, and in which
is shown by way of illustration specific embodiments in which the
invention may be practiced. In this regard, directional
terminology, such as "top," "bottom," "front," "back," "leading,"
"trailing," etc., is used with reference to the orientation of the
Figure(s) being described. Because components of embodiments can be
positioned in a number of different orientations, the directional
terminology is used for purposes of illustration and is in no way
limiting. It is to be understood that other embodiments may be
utilized and structural or logical changes may be made without
departing from the scope of the present invention. The following
detailed description, therefore, is not to be taken in a limiting
sense, and the scope of the present invention is defined by the
appended claims.
[0013] It is to be understood that the features of the various
exemplary embodiments described herein may be combined with each
other, unless specifically noted otherwise.
[0014] In one embodiment, a component is provided. The component
includes an integrated circuit, a package body, and a first contact
device, the contact device penetrating the package body.
[0015] In another embodiment, a method for producing a device is
provided. The method includes arranging contact devices on the
carrier, arranging an integrated component on the carrier, and
introducing a material into the intermediate spaces between the
contact devices and the circuit.
[0016] One embodiment provides a device with a compression-molded
package body, which is arranged on a device stack or a printed
circuit board. In one embodiment, the stacking of semiconductor
devices or components is a suitable measure for increasing the
packing density of semiconductor components by utilizing the third
dimension. There is the stacking of semiconductor dice or chips
(die stacking) and the stacking of devices or packaged components
(package stacking).
[0017] When stacking semiconductor dice, previously exposed, i.e.
unpackaged, semiconductor dice or chips are stacked in a single
package body. This has the advantage that the stack has a small
height and small lateral dimensions. Furthermore, the stack can be
produced at low cost. However, the semiconductor die used must be
one which has already been found to be defect-free, i.e. a "known
good die" (KGD), in order to solve a problem with the yield in
semiconductor die stacking However, it is not possible, or only
with considerable effort, to test an exposed semiconductor die in
the same way as a semiconductor die already provided with a
package.
[0018] When stacking devices or packaged components, semiconductor
components are first provided with a package and then tested. After
that, these devices are then stacked one on top of the other to
form a device stack. For this purpose, a connection in the vertical
direction is required in the device stack.
[0019] The integrated component may, for example, include a
semiconductor substrate, in particular a silicon substrate or a
compound semiconductor substrate. However, SOI (silicon on
insulator) substrates may also be used. The integrated component
may include a multiplicity of electronic semiconductor components,
for example, bipolar transistors or CMOS (complementary metal oxide
semiconductor) transistors.
[0020] The package body may, for example, consist of or contain an
electrically insulating material or else, given appropriate
electrical insulation with respect to the contact devices, an
electrically conductive material. Polymers, such as resins or
plastic materials, can be used, for example, as a package body. The
package body holds the constituent parts of the device together and
protects the chip from environmental influences, such as moisture
or mechanical stress. The package body can be produced, for
example, by compression molding, printing, spin-coating or pouring
and possibly subsequent curing.
[0021] In the case of one embodiment, the contact devices may
consist completely of a metal or a metal alloy or have a metallic
surface. Suitable metals are, for example, copper, copper alloys
with more than 80 atomic percent of copper or solder materials.
Solder balls may be used, for example, as contact devices. For
example, lead-free solders are used, but also other solders.
[0022] The penetration of the package body may be understood, or is
understood, as meaning that the contact element penetrates right
through the package body from one surface region to another surface
region. The penetration of the package body may mean, or does mean,
that the contact element is enclosed or encapsulated by the package
body, except for two ends of the contact element.
[0023] For example, the contact devices are completely filled
bodies, in particular of a homogeneous material. The contact
devices have a hollow core or a core of a different material than a
metallic shell of the contact devices. For example, the core is
likewise electrically conductive or electrically insulating.
[0024] For example, conducting structures included in a wiring
arrangement may connect the integrated circuit to the contact
devices. The conducting structures may, for example, be conducting
tracks or plated-through holes or vias.
[0025] In one embodiment of a device, the integrated circuit and
the filling material as well as the contact devices may lie in a
first plane. The chip, the filling material and the contact devices
are on the same side of the wiring arrangement. This measure
already allows the overall height of a packaged component to be
reduced considerably. In one embodiment, in the case of a compact
construction, the wiring arrangement extends along its width in a
second plane, which lies parallel or substantially parallel to the
first plane.
[0026] The contact devices may advantageously be balls. The ball
form is used because spherical contact devices can be produced in a
simple manner, for example by solidifying metal drops. The molten
metal thereby assumes the ball form of its own accord, to minimize
the surface tension. The use of balls also offers the advantage
that, when soldering the contact devices, the contact devices can
be securely held in the package body. Should the contact devices
become soft, for example during soldering, they will not change
their shape again on account of the surface tension, so that no
intermediate spaces occur between the contact devices and the
package body.
[0027] The balls may in each case have a deformed side. For
example, in each case a piece of the balls has first been removed
in a planarizing process and then solder material has been
re-applied to these locations. In another embodiment, deformed
locations may also be present on two sides of the balls that are
facing away from each other.
[0028] In one embodiment, the contact devices may consist
completely or to 100 percent of solder material, i.e. of a material
with a melting temperature lower than 400.degree. C. (degrees
Celsius). The contact devices may contain solder material, for
example to at least 75 atomic percent. Smaller proportions than 75
atomic percent of solder material are sufficient, for example if a
coating of a solid core with solder material is chosen. The use of
solder material ensures good solderability in the mounting of the
package device.
[0029] Furthermore, solder balls offer the advantage that they
retain their ball form when heated, because this is a low-energy
state. For example, cylindrical contact devices of solder material
have a greater tendency when heated for a solder ball to form at an
end of a cylindrical bore or opening. In this embodiment, however,
solder would be sucked out from the bore or opening, so that
solder-free locations may also occur, and these would lead to
incorrect contacting.
[0030] The contact devices may have in each case a curved line of
intersection with a plane that extends in the direction normal to
the first plane. This requirement is also met, for example, by
contact devices of an ellipsoid form, barrel form etc. The
aforementioned technical effects consequently continue to apply,
albeit to a reduced extent.
[0031] In one embodiment, the contact devices may be adjacent the
filling material or the package body, or the first component or the
circuit and the contact devices are enclosed by the package body.
This is the consequence of a production method explained below for
producing a packaged component which includes the package body, the
integrated component and the contact devices. In one embodiment,
the package body is homogeneous, in particular with regard to its
composition.
[0032] The package body may consist of a resin, or it contains a
resin. In one embodiment, epoxy resins are particularly well suited
for compression-molding processes, with which devices for high
requirements can be produced in a simple and low-cost manner.
[0033] The wiring arrangement may have a layer thickness of less
than 15 micrometers or even of less than 10 micrometers.
Consequently, the wiring arrangement is not a printed circuit board
which contains, for example, FR4 (flame retardant type 4) or FR5 or
BT material (bismaleimide triazine). This is because such printed
circuit boards have thicknesses of greater than 150 micrometers,
even if they only include one or two layers. The wiring arrangement
with the small thickness of less than 50 micrometers is, in
particular, a wiring arrangement produced by the thin-film
technique, which is preferably produced directly on the circuit or
on the package body. Consequently, there are no bonding processes
or flip-chip processes at this point, and very high-quality
connections can be produced between the circuit and the contact
devices. Furthermore, the thin-film technique is particularly
suitable for producing the packaged components at wafer level, i.e.
a number of devices are processed in a slice that has the outer
dimensions of a semiconductor wafer.
[0034] Also used, however, are wiring arrangements not produced by
the thin-film technique on the package body, in particular wiring
devices of the materials mentioned, such as FR4, FR5, BT or else of
ceramic, etc. The wiring arrangement may, for example, also be
formed from bonding wires or in some other manner.
[0035] In one embodiment, at least one lateral dimension, i.e. the
width and/or the length, of the packaged component may be less than
30 mm (millimeters) or less than 20 mm. Typical packages even have
dimensions of less than 7 mm. The height of the packaged component
is also very small, for example less than 1 mm. For example, the
package is only less than 10 percent higher than the contact
devices. The package body has the same height as the integrated
component. On one embodiment, devices of small dimensions are
inserted in small, portable devices, such as for example
cellphones, with a largest dimension of less than 10 cm
(centimeters).
[0036] The package device also includes a second packaged component
or even more than two packaged components. The second packaged
component has preferably been produced by the same method as the
first packaged component or as the first device. The two packaged
components preferably lie parallel to each other, deviations
occurring within the limits of mounting tolerances, which however
are smaller than, for example, 3.degree. (angular degrees). In one
embodiment, the device stack is also particularly flat, in
particular in comparison with a device stack with devices in which
contact devices and chips are respectively arranged on sides of the
wiring arrangement that are facing away from each other.
[0037] The contact devices of the one package may preferably be
soldered, for example, onto conducting structures of the wiring
arrangement of the other package. Consequently, the two components
can be connected in a simple manner to form a component stack, in
particular by flip-chip processes.
[0038] Furthermore, an embodiment of a method for producing a
component is provided, performing the processes of:
[0039] providing a carrier,
[0040] arranging a multiplicity of contact devices on the
carrier,
[0041] after arranging the contact devices or before arranging the
contact devices, arranging an integrated circuit on the carrier,
and
[0042] after arranging the circuit and the contact devices,
introducing a material into the intermediate spaces between the
contact devices or between the contact devices and the circuit. The
material is preferably electrically insulating.
[0043] The method serves in particular for producing an
aforementioned circuit arrangement, so that the technical effects
mentioned there also apply to the method.
[0044] The contact devices may be arranged on the carrier in the
solid state. Solid means here that the contact devices are not
applied as a paste, i.e. in a pasty state.
[0045] Solder balls may preferably be arranged as contact devices.
Used, for example, in this case is a commercially available machine
that is also used for the placing of solder balls on intermediate
printed circuit boards, for example in the production of what is
known as a BGA (ball grid array). The solder balls are sucked by
the machine, for example with the aid of a negative pressure or a
vacuum, onto a holding device, which contains bores at the
locations at which solder balls are to be arranged. The holding
device is then set down on the carrier, where the solder balls are
released from the holding device, for example by switching off the
negative pressure. This procedure is likewise suitable for
processes that are carried out at wafer level, i.e. here a wafer
formed by the filling material or package bodies. In this case, for
example, over 1000 solder balls are placed simultaneously.
[0046] In one embodiment, a filling material for the package body
may be introduced by a compression-molding process. These
compression-molding processes are likewise suitable for the
production of wafers from the filling material or package bodies.
Consequently, after the compression-molding, the filling material
has dimensions like a semiconductor wafer, for example a diameter
of 20 cm (centimeters), 30 cm or more than 30 cm. Consequently,
machines that are otherwise used or could be used for the
processing of semiconductor wafers are used or can be used in
particular for producing the wiring arrangement.
[0047] The filling material or the package body is or may
preferably be worked back, so that the contact devices are exposed
on the worked-back side of the filling material or package body.
For example, an etching-back process or a chemical-mechanical
polishing process is used. Just mechanical polishing processes may
also be suitable. The working-back process produces a planar
surface, which facilitates later mounting. Furthermore, the planar
surface is particularly suitable for carrying out further method
processes, for example, as part of a thin-film technique or screen
printing to apply a solder paste to the contact devices.
[0048] In one embodiment, a wiring arrangement may be produced by
the thin-film technique on the circuit or on the contact devices
and on the package body. Consequently, layer depositing processes
and lithography processes such as are used in the case of
integrated circuits are used, although in the case of the thin-film
technique the minimum dimensions are typically greater than or
equal to the minimum dimensions in the upper metallization layer of
an integrated circuit. A very flat packaged component is obtained,
in particular requiring no printed circuit board. The thin-film
technique is also suitable for processing at wafer level, i.e. here
a number of packaged components can be produced from or in a
filling-material wafer.
[0049] The contact devices may also be provided with a solder
material, for example, with solder paste, on the side that is
facing away from the wiring arrangement. The solder paste is
applied, for example, by using screen printing. The thermal loading
is particularly low when solder paste is used in this method.
[0050] In particular, the packaged component or the device may be
soldered onto a further device after singulating or before
singulating, the further device likewise including an integrated
component. This produces a device stack of a small overall
height.
[0051] The stated method processes may be carried out
simultaneously in joint operations for a number of devices, in
particular at wafer level. Consequently, the devices can be
produced in a very low-cost way.
[0052] Furthermore, protection is afforded to the use of a ball
placing machine for carrying out one of the stated processes, in
particular a machine which places more than 1000 balls
simultaneously.
[0053] To sum up, the proposed solutions mean that an intermediate
carrier board (interposer) and wire bond connections can, but do
not have to be, substituted by thin-film rerouting. Furthermore,
the conductive filling for the instances of contacting in the z
direction can be carried out at the same time as the production of
the packaged component. In particular, known, commercially
available and inexpensive materials are used, for example preformed
solder balls or compression-molding compounds that are available on
the market.
[0054] The production is also possible at wafer level, which
ensures a high degree of parallelism, and consequently low costs.
The lateral dimensions of the packaged component can likewise be
kept adequately small on account of high-precision placement
processes. A very small package height is also obtained on account
of the embedding of the contact devices in the filling material. In
addition, matching of the coefficient of thermal expansion (CTE)
allows, for example, solder balls of a small diameter to be used in
the case of comparatively large dimensions of the packaged
component, of, for example, greater than 7 millimeters in width,
and the thermomechanical reliability is nevertheless great. In
particular, the diameter lies below 500 micrometers, below 400
micrometers or even below 200 micrometers. However, the diameter is
greater than, for example, 100 micrometers.
[0055] In one embodiment, a universal package wafer
compression-molding concept is provided, with solder balls also
being embedded in a molding compound in addition to chips. This
allows low-cost, flexible and very simple contacting in the z
direction to be achieved. In one embodiment, a package-on-package
stack can be constructed in a simple manner. The matching of the
coefficients of thermal expansion of the materials used, for
example the coefficient of thermal expansion of the molding
compound is equal to the coefficient of thermal expansion of a
printed circuit board onto which the packaged component is
soldered, allows solder balls of a comparatively small diameter to
be used, so that a particularly flat PoP (package on package) can
be produced.
[0056] Whenever "can" or "may" is mentioned in this application,
both the possibility and the actual realization of the stated
measure in an embodiment are meant. Several embodiments of the
invention are presented below on the basis of figures, which serve
merely for purposes of illustration and are not intended to
restrict the scope of the invention.
[0057] FIG. 1 illustrates a device stack 10, which includes two
devices 12 and 14. The device 14 has been soldered onto the device
12, as explained in more detail below. As an alternative to solder,
a conductive adhesive may be used for example. The device 12 has
also been soldered or mounted in some other way on a printed
circuit board 16, which also carries further electronic components,
for example resistors, capacitors or coils, or further integrated
circuits.
[0058] In the case of an alternative exemplary embodiment, the
device stack 10 also includes a third device 20, see line 18. The
third device 20 has then been soldered or mounted in some other way
on the device 14.
[0059] The device 12 includes an integrated component 22 or an
integrated circuit 22, for example based on a silicon substrate, in
particular on an already ground-thin silicon substrate. The
integrated component 22 includes a multiplicity of active
semiconductor components, see, for example, transistor 23. In the
exemplary embodiment, the active side of the component 22 is
arranged toward a wiring arrangement 30. However, this is not
necessarily so. The integrated component 22 also includes at least
one or more metallization layers, which however are not represented
and lie between the active components and a wiring arrangement 30
explained in more detail further below.
[0060] Furthermore, the device 12 also includes solder balls 26 and
27, which lie in the cross section of the device 12 that is
represented in FIG. 1, and further solder balls that are not
represented. All the solder balls 26 and 27 are arranged in a
package body 24 or enclosed by a filling material of the package
body 24. The production of the device 12 is explained in more
detail below on the basis of FIGS. 2A to 2J.
[0061] The device 12 has been soldered onto the printed circuit
board 16 by soldered connections 28, 29. The soldered connections
28 and 29 have been produced, for example, from a solder paste.
Arranged on the side of the device 12 that is facing away from the
printed circuit board 16 is a wiring arrangement 30, which in the
example is produced by the thin-film technique. The wiring
arrangement 30 includes, for example, an electrically insulating
layer 32, for example a silicon dioxide layer, and a multiplicity
of conducting tracks, of which two conducting tracks 34 and 36 are
represented in FIG. 1. The wiring arrangement 30 also includes an
optional solder resist layer 38 with openings 40, 42 for soldered
connections toward the device 14.
[0062] In the exemplary embodiment, the device 14 is constructed in
a way similar to the device 12, in particular solder balls 126 and
127 and an integrated component 122 are arranged in a package body
124. However, the component 122 has, for example, different
functions than the component 22. The functions of the components 22
and 122 are the same, for example a memory function. A transistor
123 of the component 122 is represented in FIG. 1, in particular in
order to identify the active side of the component 122. A wiring
arrangement 130 includes conducting structures, which are arranged
differently than the conducting structures in the wiring
arrangement 30. However, wiring arrangements 30, 130 with the
conducting structures following the same path are also used in a
device stack.
[0063] In the case of the exemplary embodiment, the device 20 also
has a construction similar to that of the devices 12 and 14. In one
embodiment, there is an integrated component 222, a package body
224, solder balls 226, 227 and a wiring arrangement 230.
[0064] FIGS. 2A to 2J illustrate production stages in the
production of the device 12 together with further devices 12a to
12b, see FIG. 2J. In one embodiment, the method processes are
carried out at what is known as wafer level. However, the method
processes may also be carried out separately for individual
packages.
[0065] As represented in FIG. 2A, first a carrier sheet 300 is
provided. The carrier sheet 300 consists, for example, of a metal,
of silicone, of a polymer or of a ceramic or of some other
material. An adhesive material, for example a double-sided adhesive
film 302, is applied to the carrier sheet 300.
[0066] As represented in FIG. 2B, solder balls 26, 27, 26a, 27a,
26b, 27b and further solder balls that are not represented are
subsequently placed on the exposed side of the film 302. This
placement is carried out with the aid of a machine which
automatically places the solder balls in one operation, for
example, a Shibuya SBM. Alternatively, the solder balls for a
single device are simultaneously placed, after which the solder
balls for a neighboring component are then placed on the carrier
sheet 300, and so on.
[0067] As represented in FIG. 2C, a multiplicity of integrated
circuits or semiconductor dice 22, 22a, 22b, etc. are placed on the
film 302, for example, with the aid of what is known as picking and
placing. In this case, frontend-tested circuits are used in
particular.
[0068] In the case of another configuration, the sequence of the
method processes is changed over, so that the circuits 22, 22a, 22b
are placed first and then the solder balls 26, 27, etc.
[0069] As represented in FIG. 2D, a compression-molding process is
subsequently carried out, involving pressing a punch against the
carrier sheet 300 and forcing a compression-molding compound for a
package body 324 into the intermediate spaces between the solder
balls 26, 27 and the circuit 22. Subsequently, for example, the
pressing device is heated in the region of the filling material 324
until the latter has cured. The filling material may also be cured
without additional heating. Epoxy resin filled with a filler to
ensure a predetermined coefficient of thermal expansion is used,
for example, as the compression-molding compound. The value of the
coefficient of thermal expansion is matched, for example, to the
value of the coefficient of thermal expansion of the printed
circuit board 16, in particular is equal to the value of this
coefficient of expansion.
[0070] As illustrated in FIG. 2E, after the curing of the package
body 324, a working-back process is performed, for example, by
grinding material away, until the solder balls 26, 27, etc. are
exposed on one side. At the point in time at which the removal is
stopped, the package body 324 in the exemplary embodiment still
easily covers the circuits 22, 22a, etc. In the case of other
exemplary embodiments, however, as illustrated in FIG. 4, the
semiconductor substrates of the components 22, 22a, etc., for
example, are also exposed, possibly even further thinned.
[0071] FIG. 2F illustrates the thinned package bodies 324a,
although the filling-material wafer has been turned over in
comparison with FIG. 2E, so that now the active side of the
components 22, etc. is facing up. Furthermore, the carrier 300 and
the film 302 have been removed, for example, by using a chemical
solvent or by using ultraviolet radiation. The filling-material
wafer represented in FIG. 2F has the dimensions of a semiconductor
wafer, but, for example, a smaller height than a semiconductor
wafer. However, the height of the filling-material wafer may also
be equal to the height of a semiconductor wafer or greater.
[0072] As represented in FIG. 2G, after the production of wiring
arrangements, for example the wiring arrangement 30, an insulating
layer 332 is applied. After that, the conducting structures 34, 36,
34a, 36a, 34b, 36b are produced, for example, from copper, in
particular with the aid of a galvanic process. In the case of
another exemplary embodiment, the conducting structures are applied
directly, i.e. without an insulating layer 332 lying in between, to
the components 22 and to the package body 324a.
[0073] As represented in FIG. 2H, after the production of
single-layer or multi-layer wiring structure arrangements 30, etc.,
an optional solder resist layer 328 is also applied. Openings 340,
342, 340a, 342a, 340b, 342b, etc., at which soldered connections to
a further packaged component or to an unpackaged integrated
component or circuit can be established, are made in the solder
resist layer 328.
[0074] As represented in FIG. 2I, the filling-material wafer
represented in FIG. 2H is turned over once again, so that the
active side of the components 22, etc. is facing down again.
[0075] For example, solder paste projections 328, 329, etc. are
applied with the aid of a screen-printing process at the locations
at which the contact devices 26, 27, etc. are exposed.
[0076] As represented in FIG. 2J, the solder paste projections 328,
329 are liquefied in a thermal step, at, for example, 260.degree.
C., so as to form hemispherical solder regions 428, 429, 428a,
429a, 428b, 429b, etc., which lie directly against the solder balls
26, 27, etc. The solder regions 428, 429, 428a, 429a, 428b, 429b
preferably have a smaller diameter or a smaller volume than the
solder balls 26, 27; in particular, the volume is less than 20
percent.
[0077] Subsequently, the devices 12, 12a, 12b, etc. are separated
from one another at separating lines 450, 452. This is followed by
mounting, the component 12, for example, being introduced into the
device stack 10. Subsequently, the device stack 10 is soldered on
the printed circuit board 16. In this soldering operation, the
soldered connections 28, 29, etc. are produced from the solder
regions 428, 429, etc., see FIG. 1. It is also possible for the
devices only to be separated from one another and attached on the
printed circuit board after the stack.
[0078] In other exemplary embodiments, at first only one device of
the device stack is mounted on the printed circuit board 16. Only
after that is a further device, or are further devices, soldered or
mounted on the first-mounted device.
[0079] In other exemplary embodiments, underfillings are used, for
example, between the device 12 and the printed circuit board 16 or
else between the devices 12 and 14.
[0080] In one or more embodiments, there are a number of layers of
conducting tracks in the wiring arrangements 30, 130, etc. It is
also not imperative that in each case a solder ball 26 and a solder
ball 126 are arranged one above the other. Devices with solder
balls that are offset in relation to one another can also be
connected to one another by using the wiring arrangements lying in
between.
[0081] In another exemplary embodiment, the component 12 is
individually soldered onto the printed circuit board 16, without
further components 14, etc. being soldered on or mounted later. In
this case, the wiring arrangement 30 preferably does not include a
solder resist layer and/or any openings in the solder resist
layer.
[0082] In another exemplary embodiment, different dimensions are
used, in particular the devices 12, 14, etc. may have dimensions
that are different from one another. Furthermore, in the case of
other exemplary embodiments, a different arrangement of contact
devices is chosen, for example, more than one row is arranged
around the circuit, for example two rows, three rows or more than
three rows, but preferably, for example, fewer than twenty
rows.
[0083] In a further exemplary embodiment, integrated components
with functions that are different from one another are arranged in
a package body 324, 324a, and then the method processes explained
on the basis of FIGS. 2A to 2J are carried out for these
components.
[0084] It is also possible for a number of integrated components to
be arranged next to one another for each device.
[0085] FIG. 3 illustrates a device 500 according to a further
exemplary embodiment. A transistor 501 is contained in an
integrated component 502, and is intended to illustrate the active
side of the integrated component 502. The device 200 also includes
an optional contact arrangement 504 with respect to a wiring
arrangement 506. The contact arrangement 504 includes, for example,
soldered connections.
[0086] The wiring arrangement 506 is, for example,
[0087] a thin-film wiring arrangement,
[0088] a printed circuit board, for example plastic-based or
ceramic-based,
[0089] another wiring arrangement, for example initially
self-supporting, see, for example, bonding wires 514, 516 of, for
example, Au, Al or Cu.
[0090] The device also includes a package body 508, for example
epoxy-based. Arranged in the package body 508, to the side of the
component 502, are contact devices, which penetrate the package
body, for example:
[0091] contact cylinders 510, for example of copper, copper alloy,
aluminum or an aluminum alloy.
[0092] The contact cylinders 510, the package body 508 includes
contact bodies 512, which are likewise arranged to the side of the
component 502 and penetrate the package body 508. The contact body
512 has, for example, a barrel form or an ellipsoid form. In one
embodiment, the contact cylinder 510 or the contact body 513 may
protrude somewhat from the package body 508 toward the wiring
arrangement 506 or terminate with the package body 508. Otherwise,
for example, the production processes explained above are carried
out to produce the device 500.
[0093] If a self-supporting wiring device 506 is used, the bonding
wires 514, 516, for example, are only attached after the package
body 508 is produced.
[0094] Although specific embodiments have been illustrated and
described herein, it will be appreciated by those of ordinary skill
in the art that a variety of alternate and/or equivalent
implementations may be substituted for the specific embodiments
shown and described without departing from the scope of the present
invention. This application is intended to cover any adaptations or
variations of the specific embodiments discussed herein. Therefore,
it is intended that this invention be limited only by the claims
and the equivalents thereof.
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