Hedler; Harry

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hedler; Harry.The latest application filed is for "light emission measuring device".

Company Profile

0.98.127

Hedler; Harry - Germering DE
Hedler; Harry - Deutschland DE
Hedler; Harry - Regensburg DE
Hedler, Harry - Gerrnering DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Light Emission Measuring Device App 20180113074 - Gigler; Alexander Michael ; et al.	2018-04-26
Thermoelement including a three-dimensional microstructure, and method for producing a thermoelement Grant 9,884,759 - Hedler , et al. February 6, 2	2018-02-06
Infrared sensor, thermal imaging camera and method for producing a microstructure from thermoelectric sensor rods Grant 9,887,339 - Hedler , et al. February 6, 2	2018-02-06
Preconcentrator For Absorbing/desorbing At Least One Component Of Gas App 20170189882 - EISELE; Ignaz ; et al.	2017-07-06
Method Of Manufacturing Garnet Interfaces And Articles Containing The Garnets Obtained Therefrom App 20170145305 - Cohen; Peter Carl ; et al.	2017-05-25
Method of manufacturing garnet interfaces and articles containing the garnets obtained therefrom Grant 9,650,569 - Cohen , et al. May 16, 2	2017-05-16
Micromechanical measuring element and method for producing a micromechanical measuring element Grant 9,506,831 - Schiffer , et al. November 29, 2	2016-11-29
Force transducer forming a capacitive load cell Grant 9,335,226 - Amtmann , et al. May 10, 2	2016-05-10
Infrared Sensor Having a Microstructure with a Plurality of Thermocouples and a Carrier Element App 20150316418 - Hedler; Harry ; et al.	2015-11-05
Micromechanical substrate for a diaphragm with a diffusion barrier layer Grant 9,170,226 - Fleischer , et al. October 27, 2	2015-10-27
Radiation detector and imaging system Grant 9,151,850 - Hedler , et al. October 6, 2	2015-10-06
Radiation detector and imaging system Grant 9,097,808 - Hedler , et al. August 4, 2	2015-08-04
Infrared Sensor, Thermal Imaging Camera And Method For Producing A Microstructure From Thermoelectric Sensor Rods App 20150048249 - Hedler; Harry ; et al.	2015-02-19
Micromechanical Measuring Element and Method for Producing a Micromechanical Measuring Element App 20150027224 - Schiffer; Michael ; et al.	2015-01-29
Device and system for selectively detecting gas components or concentrations of gas components in gas to be analyzed and method for operating such device Grant 8,916,827 - Frey , et al. December 23, 2	2014-12-23
Semiconductor chip with integrated via Grant 8,912,654 - Kreupl , et al. December 16, 2	2014-12-16
Component and method for producing a component Grant 8,742,563 - Meyer , et al. June 3, 2	2014-06-03
Force Transducer Forming A Capacitive Load Cell App 20140123772 - Amtmann; Karlheinz ; et al.	2014-05-08
Radiation Detector And Imaging System App 20140124676 - Hedler; Harry ; et al.	2014-05-08
Radiation Detector And Imaging System App 20140103219 - Hedler; Harry ; et al.	2014-04-17
Integrated Circuit With Electrical Through-contact And Method For Producing Electrical Through-contact App 20140084428 - Hedler; Harry ; et al.	2014-03-27
Semiconductor apparatus having stacked semiconductor components Grant 8,598,716 - Hedler , et al. December 3, 2	2013-12-03
Device And System For Selectively Detecting Gas Components Or Concentrations Of Gas Components In Gas To Be Analyzed And Method For Operating Such Device App 20130284928 - Frey; Alexander ; et al.	2013-10-31
Micromechanical Substrate For A Diaphragm With A Diffusion Barrier Layer App 20130264660 - Fleischer; Maximilian ; et al.	2013-10-10
Silicon Photomultiplier And Radiation Detector App 20130249035 - Hedler; Harry ; et al.	2013-09-26
Method for producing chip packages, and chip package produced in this way Grant 8,487,448 - Meyer , et al. July 16, 2	2013-07-16
Electronic component with semiconductor chips, electronic assembly composed of stacked semiconductor chips, and methods for producing an electronic component and an electronic assembly Grant 8,350,364 - Hedler , et al. January 8, 2	2013-01-08
Electronic Device And Method For Producing A Device App 20120235298 - Brunnbauer; Markus ; et al.	2012-09-20
Three-dimensional Micro-structure, Arrangement With At Least Two Three-dimensional Micro-structures, Method For Producing The Micro-structure And Use Of The Micro-structure App 20120183732 - Hedler; Harry ; et al.	2012-07-19
Thermo-electric Energy Converter Having A Three-dimensional Micro-structure, Method For Producing The Energy Converter And Use Of The Energy Converter App 20120180839 - Hedler; Harry ; et al.	2012-07-19
Electronic device and method for producing a device Grant 8,188,585 - Brunnbauer , et al. May 29, 2	2012-05-29
Electrical through contact Grant 8,124,521 - Hedler , et al. February 28, 2	2012-02-28
Reduced-stress through-chip feature and method of making the same Grant 8,106,511 - Hedler , et al. January 31, 2	2012-01-31
Integrated circuit, circuit system, and method of manufacturing Grant 8,072,084 - Irsigler , et al. December 6, 2	2011-12-06
Method For Producing Chip Packages, And Chip Package Produced In This Way App 20110285030 - Meyer; Thorsten ; et al.	2011-11-24
Method for placing material onto a target board by means of a transfer board Grant 8,048,479 - Hedler , et al. November 1, 2	2011-11-01
Semiconductor device with an interconnect element and method for manufacture Grant 8,049,310 - Wolter , et al. November 1, 2	2011-11-01
Semiconductor packaging device Grant 8,035,220 - Hedler , et al. October 11, 2	2011-10-11
Integrated Circuit Device And Method For Fabricating Same With An Interposer Substrate App 20110217812 - Hedler; Harry ; et al.	2011-09-08
Method for producing chip packages, and chip package produced in this way Grant 8,012,807 - Meyer , et al. September 6, 2	2011-09-06
Packaging systems and methods Grant 8,004,072 - Hedler , et al. August 23, 2	2011-08-23
Chip arrangement and method of manufacturing a chip arrangement Grant 7,960,843 - Hedler , et al. June 14, 2	2011-06-14
Integrated circuit with re-route layer and stacked die assembly Grant 7,948,071 - Thomas , et al. May 24, 2	2011-05-24
Integrated circuit package with a heat dissipation device Grant 7,928,590 - Wolter , et al. April 19, 2	2011-04-19
Carrier substrate and integrated circuit Grant 7,919,868 - Hedler , et al. April 5, 2	2011-04-05
Component And Method For Producing A Component App 20110068485 - Meyer; Thorsten ; et al.	2011-03-24
Component and method for producing a component Grant 7,911,068 - Meyer , et al. March 22, 2	2011-03-22
Semiconductor component with improved contact pad and method for forming the same Grant 7,884,488 - Hedler February 8, 2	2011-02-08
Method for manufacturing a wafer level package Grant 7,867,817 - Dobritz , et al. January 11, 2	2011-01-11
Method for manufacturing a multichip module assembly Grant 7,847,415 - Hedler , et al. December 7, 2	2010-12-07
Solder pillar bumping and a method of making the same Grant 7,829,380 - Irsigler , et al. November 9, 2	2010-11-09
Method of producing an electronic component with flexible bonding Grant 7,820,482 - Hedler , et al. October 26, 2	2010-10-26
Packaging Systems and Methods App 20100090322 - Hedler; Harry ; et al.	2010-04-15
Through Substrate Conductors App 20100072579 - Thies; Andreas ; et al.	2010-03-25
Stacked Semiconductor Chips with Through Substrate Vias App 20100065949 - Thies; Andreas ; et al.	2010-03-18
Flip-chip component Grant 7,663,248 - Hedler , et al. February 16, 2	2010-02-16
Method for Manufacturing a Multichip Module Assembly App 20100013101 - Hedler; Harry ; et al.	2010-01-21
Semiconductor module for making electrical contact with a connection device via a rewiring device Grant 7,646,090 - Hedler , et al. January 12, 2	2010-01-12
Chip Arrangement and Method of Manufacturing a Chip Arrangement App 20090321959 - Hedler; Harry ; et al.	2009-12-31
Semiconductor Component with Contact Pad App 20090273097 - Hedler; Harry	2009-11-05
Semiconductor device with stacked chips and method for manufacturing thereof Grant 7,605,019 - Simon , et al. October 20, 2	2009-10-20
Semiconductor Chip With Integrated Via App 20090256258 - Kreupl; Franz ; et al.	2009-10-15
Semiconductor Device With an Interconnect Element and Method for Manufacture App 20090243047 - Wolter; Andreas ; et al.	2009-10-01
Reduced-Stress Through-Chip Feature and Method of Making the Same App 20090218690 - Hedler; Harry ; et al.	2009-09-03
Integrated Circuit Device Comprising Conductive Vias And Method Of Making The Same App 20090212438 - Kreupl; Franz ; et al.	2009-08-27
Integrated Circuit Device And Method For Fabricating Same App 20090212420 - Hedler; Harry ; et al.	2009-08-27
Method for Manufacturing a Wafer Level Package App 20090194881 - Dobritz; Stephan ; et al.	2009-08-06
Stacked die package Grant 7,545,048 - Meyer , et al. June 9, 2	2009-06-09
Semiconductor Packaging Device App 20090102035 - Hedler; Harry ; et al.	2009-04-23
Method for connection of an integrated circuit to a substrate, and a corresponding circuit arrangement Grant 7,517,727 - Hedler , et al. April 14, 2	2009-04-14
Method for applying rewiring to a panel while compensating for position errors of semiconductor chips in component positions of the panel Grant 7,514,273 - Hedler , et al. April 7, 2	2009-04-07
Integrated Circuit, Circuit System, And Method Of Manufacturing App 20090072398 - Irsigler; Roland ; et al.	2009-03-19
Carrier Substrate And Integrated Circuit App 20090045512 - Hedler; Harry ; et al.	2009-02-19
Integrated circuit with re-route layer and stacked die assembly Grant 7,422,930 - Thomas , et al. September 9, 2	2008-09-09
Integrated Circuit with Re-Route Layer and Stacked Die Assembly App 20080203575 - Thomas; Jochen ; et al.	2008-08-28
Method For Making An Integrated Circuit Having A Via Hole App 20080164611 - Hedler; Harry ; et al.	2008-07-10
Method For Fabricating A Circuit App 20080150154 - Hedler; Harry ; et al.	2008-06-26
Stacked Die Package App 20080128884 - Meyer; Torsten ; et al.	2008-06-05
Solder pillar bumping and a method of making the same App 20080099925 - Irsigler; Roland ; et al.	2008-05-01
Semiconductor device with semiconductor components connected to one another Grant 7,365,438 - Hedler , et al. April 29, 2	2008-04-29
Circuit board arrangement and method for producing a circuit board arrangement App 20080079149 - Hedler; Harry ; et al.	2008-04-03
Electronic component with semiconductor chips, electronic assembly composed of stacked semiconductor chips, and methods for producing an electronic component and an electronic assembly Grant 7,342,320 - Hedler , et al. March 11, 2	2008-03-11
Method for producing an electronic device connected to a printed circuit board Grant 7,340,826 - Hedler , et al. March 11, 2	2008-03-11
Method for producing an electronic component, especially a memory chip Grant 7,338,843 - Hedler , et al. March 4, 2	2008-03-04
Electronic Component with Semiconductor Chips, Electronic Assembly Composed of Stacked Semiconductor Chips, and Methods for Producing an Electronic Component and an Electronic Assembly App 20080048299 - Hedler; Harry ; et al.	2008-02-28
Integrated Circuit Package With A Heat Dissipation Device And A Method Of Making The Same App 20080042261 - Wolter; Andreas ; et al.	2008-02-21
Electronic Device And Method For Producing A Device App 20080036065 - Brunnbauer; Markus ; et al.	2008-02-14
Method for placing material onto a target board by means of a transfer board App 20080029849 - Hedler; Harry ; et al.	2008-02-07
Semiconductor device with stacked chips and method for manufacturing thereof App 20080032448 - Simon; Juergen ; et al.	2008-02-07
Electrical Through Contact App 20080029850 - Hedler; Harry ; et al.	2008-02-07
Stacked die package Grant 7,326,592 - Meyer , et al. February 5, 2	2008-02-05
Component and method for producing a component App 20080012152 - Meyer; Thorsten ; et al.	2008-01-17
Method For Producing Chip Packages, And Chip Package Produced In This Way App 20080012144 - Meyer; Thorsten ; et al.	2008-01-17
Electronic component with flexible contacting pads and method for producing the electronic component Grant 7,312,533 - Haimerl , et al. December 25, 2	2007-12-25
Method For Fabricating A Module Having An Electrical Contact-connection App 20070273011 - Singleton; Laurence Edward ; et al.	2007-11-29
Method for Applying Rewiring to a Panel While Compensating for Position Errors of Semiconductor Chips in Component Positions of the Panel App 20070249067 - Hedler; Harry ; et al.	2007-10-25
Semiconductor component having a CSP housing Grant 7,274,110 - Meyer , et al. September 25, 2	2007-09-25
Semiconductor device Grant 7,274,107 - Hedler , et al. September 25, 2	2007-09-25
Semiconductor and method for producing a semiconductor Grant 7,265,451 - Hedler , et al. September 4, 2	2007-09-04
Semiconductor device and method for fabricating the semiconductor device Grant 7,247,948 - Hedler , et al. July 24, 2	2007-07-24
Intermediate connection for flip chip in packages App 20070120268 - Irsigler; Roland ; et al.	2007-05-31
Integrated device and electronic system Grant 7,221,053 - Meyer , et al. May 22, 2	2007-05-22
Method for connecting an integrated circuit to a substrate and corresponding circuit arrangement Grant 7,217,646 - Hedler , et al. May 15, 2	2007-05-15
Three-dimensionally integrated electronic assembly App 20070096249 - Roeper; Heiko ; et al.	2007-05-03
Process for producing a component module Grant 7,211,451 - Meyer , et al. May 1, 2	2007-05-01
Method for producing a multichip module and multichip module Grant 7,211,472 - Hedler , et al. May 1, 2	2007-05-01
Method of manufacturing a semiconductor device comprising stacked chips and a corresponding semiconductor device Grant 7,208,345 - Meyer , et al. April 24, 2	2007-04-24
Methods for aligning a device and for stacking two devices in an aligned manner and device for improved stacking App 20070084944 - Hedler; Harry ; et al.	2007-04-19
Method for fabricating a chip module and a device module fabricated therefrom App 20070075122 - Singleton; Laurence Edward ; et al.	2007-04-05
Electronic plug unit App 20070066139 - Roeper; Heiko ; et al.	2007-03-22
Method of manufacturing a semiconductor structure having a wafer through-contact and a corresponding semiconductor structure App 20070032059 - Hedler; Harry ; et al.	2007-02-08
Method For Producing A Chip Arrangement, A Chip Arrangement And A Multichip Device App 20070023886 - Hedler; Harry ; et al.	2007-02-01
Manufacturing method for an electronic component assembly and corresponding electronic component assembly App 20060270109 - Blaszczak; Stephan ; et al.	2006-11-30
Method of manufacturing a semiconductor device comprising stacked chips and a corresponding semiconductor device App 20060258044 - Meyer; Thorsten ; et al.	2006-11-16
Method for fabricating connection regions of an integrated circuit, and integrated circuit having connection regions App 20060244109 - Hedler; Harry ; et al.	2006-11-02
Stacked die package App 20060220262 - Meyer; Torsten ; et al.	2006-10-05
Integrated device and electronic system App 20060208357 - Meyer; Thorsten ; et al.	2006-09-21
Semiconductor module and method for producing a semiconductor module App 20060177964 - Hedler; Harry ; et al.	2006-08-10
Method for fabricating connection regions of an integrated circuit, and integrated circuit having connection regions Grant 7,087,512 - Hedler , et al. August 8, 2	2006-08-08
Method for connection of an integrated circuit to a substrate, and a corresponding circuit arrangement App 20060163717 - Hedler; Harry ; et al.	2006-07-27
Semiconductor device App 20060163727 - Hedler; Harry ; et al.	2006-07-27
Flexible contact-connection device Grant 7,080,988 - Hedler , et al. July 25, 2	2006-07-25
Method for producing an integrated circuit with a rewiring device and corresponding integrated circuit Grant 7,074,649 - Hedler , et al. July 11, 2	2006-07-11
Semiconductor circuit module and method for fabricating semiconductor circuit modules Grant 7,074,696 - Frankowsky , et al. July 11, 2	2006-07-11
Flip-chip component App 20060102998 - Hedler; Harry ; et al.	2006-05-18
Method for fabricating semiconductor components App 20060094165 - Hedler; Harry ; et al.	2006-05-04
Electronic component comprising external surface contacts and a method for producing the same App 20060091561 - Dangelmaier; Jochen ; et al.	2006-05-04
Method of producing an electronic component Grant 7,037,761 - Hedler , et al. May 2, 2	2006-05-02
Method for connecting an integrated circuit to a substrate and corresponding arrangement Grant 7,022,549 - Hedler , et al. April 4, 2	2006-04-04
Semiconductor and method for producing a semiconductor App 20060043573 - Hedler; Harry ; et al.	2006-03-02
Semiconductor apparatus having stacked semiconductor components App 20060043561 - Hedler; Harry ; et al.	2006-03-02
Semiconductor device with semiconductor components connected to one another App 20060027935 - Hedler; Harry ; et al.	2006-02-09
Semiconductor component having a CSP housing App 20060022338 - Meyer; Thorsten ; et al.	2006-02-02
Method for connecting an integrated circuit to a substrate and corresponding circuit arrangement App 20050285152 - Hedler, Harry ; et al.	2005-12-29
Connection of integrated circuits Grant 6,979,591 - Hedler , et al. December 27, 2	2005-12-27
Flexible contact-connection device App 20050282410 - Hedler, Harry ; et al.	2005-12-22
Method for fabricating connection regions of an integrated circuit, and integrated circuit having connection regions App 20050250304 - Hedler, Harry ; et al.	2005-11-10
Electronic component with flexible bonding pads and method of producing such a component Grant 6,956,287 - Hedler , et al. October 18, 2	2005-10-18
Method of producing a semiconductor component having a compliant buffer layer Grant 6,953,708 - Hedler , et al. October 11, 2	2005-10-11
Method of producing an electronic component with flexible bonding pads App 20050208703 - Hedler, Harry ; et al.	2005-09-22
Integrated circuit with re-route layer and stacked die assembly App 20050194674 - Thomas, Jochen ; et al.	2005-09-08
Semiconductor component and method for its production Grant 6,936,928 - Hedler , et al. August 30, 2	2005-08-30
Integrated circuit and method for producing a composite comprising a tested integrated circuit and an electrical device Grant 6,927,157 - Hedler , et al. August 9, 2	2005-08-09
Process for producing a semiconductor chip Grant 6,919,232 - Hedler , et al. July 19, 2	2005-07-19
Configuration having an electronic device electrically connected to a printed circuit board App 20050150685 - Hedler, Harry ; et al.	2005-07-14
Connection of integrated circuit to a substrate Grant 6,916,185 - Hedler , et al. July 12, 2	2005-07-12
Electronic component with flexible contacting pads and method for producing the electronic component App 20050127527 - Haimerl, Alfred ; et al.	2005-06-16
Method for producing a semiconductor device and corresponding semiconductor device Grant 6,905,954 - Hedler , et al. June 14, 2	2005-06-14
Method of producing an electronic component App 20050124094 - Hedler, Harry ; et al.	2005-06-09
Method for connecting circuit devices Grant 6,897,088 - Hedler , et al. May 24, 2	2005-05-24
Electronic component with flexible contacting pads and method for producing the electronic component Grant 6,897,568 - Haimerl , et al. May 24, 2	2005-05-24
Method for connecting an integrated circuit to a substrate and corresponding circuit arrangement Grant 6,887,777 - Hedler May 3, 2	2005-05-03
Compliant relief wafer level packaging Grant 6,888,256 - Hedler , et al. May 3, 2	2005-05-03
Method for producing a multichip module and multichip module App 20050077632 - Hedler, Harry ; et al.	2005-04-14
Semiconductor module and method for producing a semiconductor module App 20050067689 - Hedler, Harry ; et al.	2005-03-31
Electronic interface structures and methods Grant 6,864,575 - Hedler , et al. March 8, 2	2005-03-08
Method for producing an electronic component, especially a memory chip App 20050048676 - Hedler, Harry ; et al.	2005-03-03
Method producing a contact connection between a semiconductor chip and a substrate and the contact connection Grant 6,861,291 - Hedler , et al. March 1, 2	2005-03-01
Electronic component with a semiconductor chip and method of producing the electronic component Grant 6,858,799 - Hedler , et al. February 22, 2	2005-02-22
Electronic component with a semiconductor chip and method for producing the electronic component Grant 6,851,598 - Gebauer , et al. February 8, 2	2005-02-08
Configuration having an electronic device electrically connected to a printed circuit board Grant 6,852,931 - Hedler , et al. February 8, 2	2005-02-08
Method for connection of circuit units Grant 6,845,554 - Frankowsky , et al. January 25, 2	2005-01-25
Method for producing an integrated circuit with a rewiring device and corresponding integrated circuit App 20050014309 - Hedler, Harry ; et al.	2005-01-20
Contact-connection device for electronic circuit units and production method App 20050014394 - Hedler, Harry ; et al.	2005-01-20
Electronic structure Grant 6,826,037 - Hedler , et al. November 30, 2	2004-11-30
Semiconductor device and method for fabricating the semiconductor device App 20040217483 - Hedler, Harry ; et al.	2004-11-04
Electronic component with at least one semiconductor chip and method for producing the electronic component Grant 6,807,064 - Hedler , et al. October 19, 2	2004-10-19
Carrier for receiving and electrically contacting individually separated dies App 20040189333 - Dobritz, Stephan ; et al.	2004-09-30
Method for connecting an integrated circuit to a substrate and corresponding arrangement App 20040191958 - Hedler, Harry ; et al.	2004-09-30
Semiconductor component and method for producing same App 20040159938 - Hedler, Harry ; et al.	2004-08-19
Method for connecting an integrated circuit to a substrate and corresponding circuit arrangement App 20040130012 - Hedler, Harry	2004-07-08
Self-adhering chip Grant 6,756,540 - Hedler , et al. June 29, 2	2004-06-29
Semiconductor component having a compliant buffer layer App 20040113270 - Hedler, Harry ; et al.	2004-06-17
Semiconductor chip, memory module and method for testing the semiconductor chip Grant 6,744,127 - Hedler , et al. June 1, 2	2004-06-01
Transfer wafer level packaging Grant 6,727,576 - Hedler , et al. April 27, 2	2004-04-27
Method for producing a semiconductor device and corresponding semiconductor device App 20040070085 - Hedler, Harry ; et al.	2004-04-15
Integrated circuit and method for producing a composite comprising a tested integrated circuit and an electrical device App 20040070075 - Hedler, Harry ; et al.	2004-04-15
Method for producing an electronic component having a plurality of chips that are stacked one above the other and contact-connected to one another Grant 6,714,418 - Frankowsky , et al. March 30, 2	2004-03-30
Connection of integrated circuit to a substrate App 20040036181 - Hedler, Harry ; et al.	2004-02-26
Connection of integrated circuits App 20040012080 - Hedler, Harry ; et al.	2004-01-22
Connecting circuit devices and assemblies thereof App 20040007782 - Hedler, Harry ; et al.	2004-01-15
Method of making pad-rerouting for integrated circuit chips Grant 6,664,176 - Hedler , et al. December 16, 2	2003-12-16
Method producing a contact connection between a semiconductor chip and a substrate and the contact connection App 20030201452 - Hedler, Harry ; et al.	2003-10-30
Forming a structure on a wafer Grant 6,638,870 - Brintzinger , et al. October 28, 2	2003-10-28
Laser programming of integrated circuits Grant 6,630,723 - Hedler , et al. October 7, 2	2003-10-07
Method of producing semiconductor chips with a chip edge guard, in particular for wafer level packaging chips App 20030143819 - Hedler, Harry ; et al.	2003-07-31
Forming a structure on a wafer App 20030129841 - Brintzinger, Axel ; et al.	2003-07-10
Method for connection of circuit units App 20030110628 - Frankowsky, Gerd ; et al.	2003-06-19
Method for producing an electronic component having a plurality of chips that are stacked one above the other and contact-connected to one another App 20030112610 - Frankowsky, Gerd ; et al.	2003-06-19
Process for producing a component module App 20030109072 - Meyer, Thorsten ; et al.	2003-06-12
Process for producing a semiconductor chip App 20030094695 - Hedler, Harry ; et al.	2003-05-22
Compliant relief wafer level packaging App 20030080425 - Hedler, Harry ; et al.	2003-05-01
Transfer wafer level packaging App 20030080399 - Hedler, Harry ; et al.	2003-05-01
Electronic component with at least one semiconductor chip and method for producing the electronic component App 20030067062 - Hedler, Harry ; et al.	2003-04-10
Electronic component with flexible contacting pads and method for producing the electronic component App 20030067755 - Haimerl, Alfred ; et al.	2003-04-10
Semiconductor component and method for its production App 20030057567 - Hedler, Harry ; et al.	2003-03-27
Electronic component App 20030052407 - Hedler, Harry ; et al.	2003-03-20
Pad- rerouting for integrated circuit chips App 20030042620 - Hedler, Harry ; et al.	2003-03-06
Electronic component with a semiconductor chip and method for producing the electronic component App 20030038157 - Gebauer, Uta ; et al.	2003-02-27
Self-adhering chip App 20030035276 - Hedler, Harry ; et al.	2003-02-20
Laser programming of integrated circuits App 20030006479 - Hedler, Harry ; et al.	2003-01-09
Semiconductor chip, memory module and method for testing the semiconductor chip App 20030001236 - Hedler, Harry ; et al.	2003-01-02
Electronic structure App 20020181218 - Hedler, Harry ; et al.	2002-12-05
Electronic component with semiconductor chips, electronic assembly composed of stacked semiconductor chips, and methods for producing an electronic component and an electronic assembly App 20020158345 - Hedler, Harry ; et al.	2002-10-31
Configuration having an electronic device electrically connected to a printed circuit board App 20020134580 - Hedler, Harry ; et al.	2002-09-26
Electronic component with a semiconductor chip and method of producing the electronic component App 20020096349 - Hedler, Harry ; et al.	2002-07-25
Electronic configuration with flexible bonding pads App 20020094707 - Hedler, Harry	2002-07-18
Electronic component with flexible bonding pads and method of producing such a component App 20020089058 - Hedler, Harry ; et al.	2002-07-11