Brunnbauer; Markus

Patent Applications and Registrations

Patent applications and USPTO patent grants for Brunnbauer; Markus.The latest application filed is for "carrier arrangement and method for processing a carrier".

Company Profile

4.69.69

Brunnbauer; Markus - Lappersdorf DE
Brunnbauer; Markus - Lapperdorf DE
- Lappersdorf DE
Brunnbauer; Markus - Lappersdof N/A DE
Brunnbauer; Markus - Regensburg DE
Brunnbauer; Markus - Lapersdorf DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Carrier arrangement and method for processing a carrier by generating a crack structure Grant 10,748,801 - Mackh , et al. A	2020-08-18
Method of separating semiconductor dies from a semiconductor substrate, semiconductor substrate assembly and semiconductor die assembly Grant 10,373,871 - Brunnbauer , et al.	2019-08-06
Carrier Arrangement and Method for Processing a Carrier App 20180286735 - Mackh; Gunther ; et al.	2018-10-04
Method Of Separating Semiconductor Dies From A Semiconductor Substrate, Semiconductor Substrate Assembly And Semiconductor Die Assembly App 20180247872 - Brunnbauer; Markus ; et al.	2018-08-30
Handling Thin Wafer During Chip Manufacture App 20180233470 - Killer; Thomas ; et al.	2018-08-16
Method of separating semiconductor dies from a semiconductor substrate, semiconductor substrate assembly and semiconductor die assembly Grant 9,972,535 - Brunnbauer , et al. May 15, 2	2018-05-15
Method of dicing a wafer and semiconductor chip Grant 9,911,655 - Brunnbauer , et al. March 6, 2	2018-03-06
Method of Separating Semiconductor Dies from a Semiconductor Substrate, Semiconductor Substrate Assembly and Semiconductor Die Assembly App 20170345716 - Brunnbauer; Markus ; et al.	2017-11-30
Method Of Manufacturing Semiconductor Devices App 20170309577 - Brunnbauer; Markus	2017-10-26
Method Of Dicing A Wafer And Semiconductor Chip App 20170110371 - BRUNNBAUER; Markus ; et al.	2017-04-20
Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips Grant 9,601,475 - Brunnbauer , et al. March 21, 2	2017-03-21
Method of dicing a wafer and semiconductor chip Grant 9,570,352 - Brunnbauer , et al. February 14, 2	2017-02-14
Method Of Dicing A Wafer And Semiconductor Chip App 20160211178 - BRUNNBAUER; Markus ; et al.	2016-07-21
Workpiece With Semiconductor Chips, Semiconductor Device And Method For Producing A Workpiece With Semiconductor Chips App 20160163682 - Brunnbauer; Markus ; et al.	2016-06-09
Article and panel comprising semiconductor chips, casting mold and methods of producing the same Grant 9,362,144 - Meyer , et al. June 7, 2	2016-06-07
Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips Grant 9,293,423 - Brunnbauer , et al. March 22, 2	2016-03-22
Semiconductor device Grant 9,093,322 - Meyer , et al. July 28, 2	2015-07-28
Semiconductor Device App 20140357075 - Meyer; Thorsten ; et al.	2014-12-04
Workpiece With Semiconductor Chips, Semiconductor Device And Method For Producing A Workpiece With Semiconductor Chips App 20140332937 - Brunnbauer; Markus ; et al.	2014-11-13
Stackable semiconductor package with encapsulant and electrically conductive feed-through Grant 8,829,663 - Pohl , et al. September 9, 2	2014-09-09
Semiconductor device with chip having low-k-layers Grant 8,786,105 - Meyer , et al. July 22, 2	2014-07-22
Semiconductor Device With Chip Having Low-k-layers App 20140197530 - Meyer; Thorsten ; et al.	2014-07-17
Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips Grant 8,779,563 - Brunnbauer , et al. July 15, 2	2014-07-15
Chip Package And A Method For Manufacturing A Chip Package App 20140151700 - Meyer; Thorsten ; et al.	2014-06-05
Component and method for producing a component Grant 8,742,563 - Meyer , et al. June 3, 2	2014-06-03
On-Chip RF shields with front side redistribution lines Grant 8,617,929 - Barth , et al. December 31, 2	2013-12-31
On-Chip RF shields with front side redistribution lines Grant 08617929 -	2013-12-31
Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device Grant 8,604,622 - Meyer , et al. December 10, 2	2013-12-10
Semiconductor module having a semiconductor chip stack and method Grant 8,587,110 - Brunnbauer , et al. November 19, 2	2013-11-19
Workpiece with Semiconductor Chips, Semiconductor Device and Method for Producing a Workpiece with Semiconductor Chips App 20130228904 - Brunnbauer; Markus ; et al.	2013-09-05
Blank including a composite panel with semiconductor chips and plastic package molding compound and method and mold for producing the same Grant 8,524,542 - Brunnbauer , et al. September 3, 2	2013-09-03
Method for producing chip packages, and chip package produced in this way Grant 8,487,448 - Meyer , et al. July 16, 2	2013-07-16
Semiconductor component including a semiconductor chip and a passive component Grant 8,471,393 - Meyer , et al. June 25, 2	2013-06-25
Heat treatment for a panel and apparatus for carrying out the heat treatment method Grant 8,431,063 - Beer , et al. April 30, 2	2013-04-30
Mold method Grant 8,394,308 - Brunnbauer , et al. March 12, 2	2013-03-12
Semiconductor device including molding compound layer forms a common plane with the surface of the semiconductor chip Grant 8,330,273 - Brunnbauer , et al. December 11, 2	2012-12-11
Blank Including A Composite Panel With Semiconductor Chips And Plastic Package Molding Compound And Method And Mold For Producing The Same App 20120286434 - Brunnbauer; Markus ; et al.	2012-11-15
Structure for electrostatic discharge in embedded wafer level packages Grant 8,309,454 - Brunnbauer , et al. November 13, 2	2012-11-13
Article and Panel Comprising Semiconductor Chips, Casting Mold and Methods of Producing the Same App 20120261841 - Meyer; Thorsten ; et al.	2012-10-18
Semiconductor Chip Package, Semiconductor Chip Assembly, And Method For Fabricating A Device App 20120256315 - Meyer; Thorsten ; et al.	2012-10-11
Electronic Device And Method For Producing A Device App 20120235298 - Brunnbauer; Markus ; et al.	2012-09-20
Blank including a composite panel with semiconductor chips and plastic package molding compound and method and mold for producing the same Grant 8,247,897 - Brunnbauer , et al. August 21, 2	2012-08-21
On-Chip RF Shields with Front Side Redistribution Lines App 20120208320 - Barth; Hans-Joachim ; et al.	2012-08-16
Mold Apparatus And Method App 20120202319 - Brunnbauer; Markus ; et al.	2012-08-09
Article and panel comprising semiconductor chips, casting mold and methods of producing the same Grant 8,217,504 - Meyer , et al. July 10, 2	2012-07-10
Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device Grant 8,202,763 - Meyer , et al. June 19, 2	2012-06-19
Electronic device and method for producing a device Grant 8,188,585 - Brunnbauer , et al. May 29, 2	2012-05-29
On-chip RF shields with front side redistribution lines Grant 8,178,953 - Barth , et al. May 15, 2	2012-05-15
Semiconductor Module Having A Semiconductor Chip Stack And Method App 20120104592 - Brunnbauer; Markus ; et al.	2012-05-03
Mold apparatus and method Grant 8,158,046 - Brunnbauer , et al. April 17, 2	2012-04-17
Semiconductor module having a semiconductor chip stack and method Grant 8,106,497 - Brunnbauer , et al. January 31, 2	2012-01-31
Semiconductor device Grant 8,093,711 - Zudock , et al. January 10, 2	2012-01-10
Semiconductor device with arrangement of parallel conductor lines being insulated, between and orthogonal to external contact pads Grant 8,080,880 - Brunnbauer , et al. December 20, 2	2011-12-20
Stacked semiconductor chips Grant 8,076,784 - Brunnbauer , et al. December 13, 2	2011-12-13
Semiconductor device Grant 8,071,428 - Pohl , et al. December 6, 2	2011-12-06
Semiconductor device including conductive element Grant 8,072,071 - Steiner , et al. December 6, 2	2011-12-06
Method For Producing Chip Packages, And Chip Package Produced In This Way App 20110285030 - Meyer; Thorsten ; et al.	2011-11-24
On-chip radio frequency shield with interconnect metallization Grant 8,063,469 - Barth , et al. November 22, 2	2011-11-22
Method for producing chip packages, and chip package produced in this way Grant 8,012,807 - Meyer , et al. September 6, 2	2011-09-06
Semiconductor module with a dielectric layer including a fluorocarbon compound on a chip Grant 7,952,188 - Brunnbauer , et al. May 31, 2	2011-05-31
Reconfigured wafer alignment Grant 7,943,423 - Pohl , et al. May 17, 2	2011-05-17
Encapsulation method Grant 7,915,089 - Fuergut , et al. March 29, 2	2011-03-29
Component And Method For Producing A Component App 20110068485 - Meyer; Thorsten ; et al.	2011-03-24
Component and method for producing a component Grant 7,911,068 - Meyer , et al. March 22, 2	2011-03-22
Semiconductor device Grant 7,906,860 - Meyer , et al. March 15, 2	2011-03-15
Stacked Semiconductor Chips App 20110024918 - Brunnbauer; Markus ; et al.	2011-02-03
Semiconductor Device App 20110024915 - Brunnbauer; Markus ; et al.	2011-02-03
Semiconductor Chip Package, Semiconductor Chip Assembly, And Method For Fabricating A Device App 20110024906 - Meyer; Thorsten ; et al.	2011-02-03
Stacked semiconductor chips Grant 7,867,878 - Brunnbauer , et al. January 11, 2	2011-01-11
Semiconductor device including covering a semiconductor with a molding compound and forming a through hole in the molding compound Grant 7,863,088 - Brunnbauer , et al. January 4, 2	2011-01-04
Semiconductor device having an adhesion promoting layer and method for producing it Grant 7,843,055 - Bauer , et al. November 30, 2	2010-11-30
Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device Grant 7,834,464 - Meyer , et al. November 16, 2	2010-11-16
Method for producing a device and device Grant 7,811,860 - Mahler , et al. October 12, 2	2010-10-12
Semiconductor Device And Manufacturing Method Thereof App 20100237506 - Brunnbauer; Markus ; et al.	2010-09-23
Reconfigured Wafer Alignment App 20100233831 - Pohl; Jens ; et al.	2010-09-16
Semiconductor Device Including Conductive Element App 20100207272 - Steiner; Rainer ; et al.	2010-08-19
Semiconductor Device App 20100193928 - Zudock; Frank ; et al.	2010-08-05
Integrated circuit including parylene material layer Grant 7,759,792 - Meyer , et al. July 20, 2	2010-07-20
Semiconductor module Grant 7,759,163 - Kroeninger , et al. July 20, 2	2010-07-20
Composite board with semiconductor chips and plastic housing composition and method Grant 7,732,242 - Brunnbauer , et al. June 8, 2	2010-06-08
On-Chip RF Shields with Front Side Redistribution Lines App 20100078778 - Barth; Hans-Joachim ; et al.	2010-04-01
On-Chip Radio Frequency Shield with Interconnect Metallization App 20100078777 - Barth; Hans-Joachim ; et al.	2010-04-01
Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chips Grant 7,687,895 - Brunnbauer , et al. March 30, 2	2010-03-30
Producing thin integrated semiconductor devices Grant 7,674,654 - Brunnbauer , et al. March 9, 2	2010-03-09
Electronic structure with components connected by way of solderable connecting elements and method Grant 7,666,777 - Bauer , et al. February 23, 2	2010-02-23
Semiconductor Device App 20090294961 - Meyer; Thorsten ; et al.	2009-12-03
Semiconductor Module App 20090261468 - Kroeninger; Werner ; et al.	2009-10-22
Semiconductor module comprising semiconductor chips and method for producing the same Grant 7,592,689 - Brunnbauer September 22, 2	2009-09-22
Carrier sheet with adhesive film and method for producing semiconductor devices using the carrier sheet with adhesive film Grant 7,585,701 - Beer , et al. September 8, 2	2009-09-08
Semiconductor Device App 20090155956 - Pohl; Jens ; et al.	2009-06-18
Semiconductor Device App 20090108440 - Meyer; Thorsten ; et al.	2009-04-30
Semiconductor Chip Package, Semiconductor Chip Assembly, And Method For Fabricating A Device App 20090091022 - Meyer; Thorsten ; et al.	2009-04-09
Stacked Semiconductor Chips App 20090079089 - Brunnbauer; Markus ; et al.	2009-03-26
Integrated Circuit Device App 20090079057 - Mengel; Manfred ; et al.	2009-03-26
Integrated Circuit Including Parylene Material Layer App 20090045511 - Meyer; Thorsten ; et al.	2009-02-19
Semiconductor Device App 20090014871 - Meyer; Thorsten ; et al.	2009-01-15
Semiconductor Device App 20090008793 - Pohl; Jens ; et al.	2009-01-08
Semiconductor Device App 20080284035 - Brunnbauer; Markus ; et al.	2008-11-20
Structure for Electrostatic Discharge in Embedded Wafer Level Packages App 20080265421 - Brunnbauer; Markus ; et al.	2008-10-30
Workpiece with Semiconductor Chips, Semiconductor Device and Method for Producing a Workpiece with Semiconductor Chips App 20080265383 - Brunnbauer; Markus ; et al.	2008-10-30
Encapsulation Method And Apparatus App 20080254575 - Fuergut; Edward ; et al.	2008-10-16
Semiconductor stack block comprising semiconductor chips and methods for producing the same Grant 7,429,782 - Brunnbauer , et al. September 30, 2	2008-09-30
Article and Panel Comprising Semiconductor Chips, Casting Mold and Methods of Producing the Same App 20080224296 - Meyer; Thorsten ; et al.	2008-09-18
Method For Producing A Device And Device App 20080179760 - Mahler; Joachim ; et al.	2008-07-31
Semiconductor module App 20080164599 - Brunnbauer; Markus ; et al.	2008-07-10
Semiconductor component including a semiconductor chip and a passive component App 20080135977 - Meyer; Thorsten ; et al.	2008-06-12
Electronic Device And Method For Producing A Device App 20080036065 - Brunnbauer; Markus ; et al.	2008-02-14
Method For Producing Chip Packages, And Chip Package Produced In This Way App 20080012144 - Meyer; Thorsten ; et al.	2008-01-17
Component and method for producing a component App 20080012152 - Meyer; Thorsten ; et al.	2008-01-17
Producing Thin Integrated Semiconductor Devices App 20070278653 - Brunnbauer; Markus ; et al.	2007-12-06
Panel And Semiconductor Device Having A Structure With A Low-k Dielectric App 20070249102 - Brunnbauer; Markus ; et al.	2007-10-25
Mold Apparatus And Method App 20070235897 - Brunnbauer; Markus ; et al.	2007-10-11
Semiconductor Device Having An Adhesion Promoting Layer And Method For Producing It App 20070235857 - Bauer; Michael ; et al.	2007-10-11
Blank Including A Composite Panel With Semiconductor Chips And Plastic Package Molding Compound And Method And Mold For Producing The Same App 20070216004 - Brunnbauer; Markus ; et al.	2007-09-20
Composite Board With Semiconductor Chips And Plastic Housing Composition And Method App 20070205513 - Brunnbauer; Markus ; et al.	2007-09-06
Semiconductor Module Having A Semiconductor Chip Stack And Method App 20070176277 - Brunnbauer; Markus ; et al.	2007-08-02
Semiconductor Module Comprising Semiconductor Chips and Method for Producing the Same App 20070164418 - Brunnbauer; Markus	2007-07-19
Electronic structure with components connected by way of solderable connecting elements and method App 20070117424 - Bauer; Michael ; et al.	2007-05-24
Heat treatment for a panel and apparatus for carrying out the heat treatment method App 20070094982 - Beer; Gottfried ; et al.	2007-05-03
Semiconductor stack block comprising semiconductor chips and methods for producing the same App 20070023883 - Brunnbauer; Markus ; et al.	2007-02-01
Optoelectronic semiconductor assembly with an optically transparent cover, and a method for producing optoelectronic semiconductor assembly with an optically transparent cover App 20060273437 - Beer; Gottfried ; et al.	2006-12-07
Carrier sheet with adhesive film and method for producing semiconductor devices using the carrier sheet with adhesive film App 20060273469 - Beer; Gottfried ; et al.	2006-12-07

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