U.S. patent application number 13/791733 was filed with the patent office on 2014-05-22 for polishing system with in-sequence sensor.
This patent application is currently assigned to Applied Materials, Inc.. The applicant listed for this patent is Applied Materials, Inc.. Invention is credited to Doyle E. Bennett, Dominic J. Benvegnu, Benjamin Cherian, Allen L. D Ambra, Jeffrey Drue David, Harry Q. Lee, Thomas H. Osterheld, Jagan Rangarajan, Boguslaw A. Swedek.
Application Number | 20140141696 13/791733 |
Document ID | / |
Family ID | 50728361 |
Filed Date | 2014-05-22 |
United States Patent
Application |
20140141696 |
Kind Code |
A1 |
David; Jeffrey Drue ; et
al. |
May 22, 2014 |
Polishing System with In-Sequence Sensor
Abstract
A polishing apparatus includes a plurality of stations supported
on a platform, the plurality of stations including at least two
polishing stations and a transfer station, each polishing station
including a platen to support a polishing pad, a plurality of
carrier heads suspended from and movable along a track such that
each polishing station is selectively positionable at the stations,
and a controller configured to control motion of the carrier heads
along the track such that during polishing at each polishing
station only a single carrier head is positioned in the polishing
station.
Inventors: |
David; Jeffrey Drue; (San
Jose, CA) ; Swedek; Boguslaw A.; (Cupertino, CA)
; Bennett; Doyle E.; (Santa Clara, CA) ;
Osterheld; Thomas H.; (Mountain View, CA) ; Cherian;
Benjamin; (San Jose, CA) ; Benvegnu; Dominic J.;
(La Honda, CA) ; Lee; Harry Q.; (Los Altos,
CA) ; D Ambra; Allen L.; (Burlingame, CA) ;
Rangarajan; Jagan; (Fremont, CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Applied Materials, Inc. |
Santa Clara |
CA |
US |
|
|
Assignee: |
Applied Materials, Inc.
Santa Clara
CA
|
Family ID: |
50728361 |
Appl. No.: |
13/791733 |
Filed: |
March 8, 2013 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
61729195 |
Nov 21, 2012 |
|
|
|
Current U.S.
Class: |
451/11 |
Current CPC
Class: |
B24B 37/005 20130101;
B24B 37/345 20130101; B24B 37/013 20130101; B24B 37/04
20130101 |
Class at
Publication: |
451/11 |
International
Class: |
B24B 37/013 20060101
B24B037/013 |
Claims
1. A polishing apparatus comprising: five stations supported on a
platform and positioned at substantially equal angular intervals
around a center of the platform, the five stations including three
polishing stations, a transfer station and a metrology station,
each polishing station including a platen to support a polishing
pad; a plurality of carrier heads suspended from and movable along
a track such that each polishing station is selectively
positionable at the stations; and an in-sequence metrology system
having a probe located in the metrology station.
2. The polishing apparatus of claim 1, wherein the metrology
station includes a single probe from the in-sequence metrology
system.
3. The polishing apparatus of claim 1, wherein the metrology
station includes a plurality of probes from a plurality of
in-sequence metrology systems.
4. The polishing apparatus of claim 1, wherein the metrology
station is positioned between two of the three polishing
stations.
5. The polishing apparatus of claim 1, wherein the metrology
station is positioned between the transfer station and a polishing
station of the three polishing stations.
6. The polishing apparatus of claim 1, wherein the track is
circular.
7. A polishing apparatus comprising: a plurality of polishing
stations, each polishing station including a platen to support a
polishing pad; a plurality of carrier heads held by a support
structure and movable to the polishing stations in sequence; a
transfer station including a plurality of load cups; and a
plurality of in-sequence metrology systems, each metrology system
of the plurality of metrology systems having a probe located in
different load cup of the plurality of load cups.
8. The polishing apparatus of claim 7, comprising a controller
configured to control the plurality of polishing heads and transfer
station to cause a substrate to be loaded into a carrier head of
the plurality of carrier heads at a first load cup of the plurality
of load cups, move polish the substrate at a polishing station of
the plurality of polishing stations, and unload the substrate from
the carrier head at a second load cup of the plurality of load
cups.
9. The polishing apparatus of claim 8, wherein the controller is
configured to cause a first metrology station to measure the
substrate at the first load cup prior to polishing and to cause a
second metrology station to measure the substrate at the second
load cup after polishing.
10. The polishing apparatus of claim 7, wherein the controller is
configured to cause a first metrology station to measure the
substrate at the first load cup prior to polishing and to cause a
second metrology station to measure the substrate at the second
load cup after polishing.
11. A method of operating a polishing system, comprising:
transporting a substrate forward along a path past a polishing
station to a probe of an in-sequence metrology system without
polishing the substrate at the polishing station; measuring the
substrate with the metrology system; transporting the substrate
backward along the path to the polishing station; and polishing the
substrate at the polishing station.
12. The method of claim 11, further comprising after polishing the
substrate transporting the substrate forward along the path to
another station.
13. The method of claim 12, wherein the another station is another
polishing station.
14. The method of claim 12, wherein the another station is a
transfer station.
15. The method of claim 11, wherein transporting the substrate
along the path comprises supporting a carrier head on a track and
moving the carrier head along the track.
16. A method of controlling a polishing system, comprising:
transporting a substrate forward along a path past a probe of an
in-sequence metrology system to a polishing station without
measuring the substrate with the in-sequence metrology system;
polishing the substrate at the polishing station; transporting the
substrate backward along the path to the probe of the in-sequence
metrology system; and measuring the substrate with the metrology
system.
17. The method of claim 16, further comprising transporting the
substrate forward along the path past the polishing station to
another station.
18. The method of claim 17, wherein the another station comprises
another polishing station.
19. The method of claim 17, wherein the another station comprises a
transfer station.
20. The method of claim 16, wherein transporting the substrate
along the path comprises supporting a carrier head on a track and
moving the carrier head along the track.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims priority to U.S. Provisional
Application Ser. No. 61/729,195, filed Nov. 21, 2012, the entire
disclosure of which is incorporated by reference.
TECHNICAL FIELD
[0002] This disclosure relates to the architecture of a chemical
mechanical polishing (CMP) system and to metrology in a CMP
system.
BACKGROUND
[0003] An integrated circuit is typically formed on a substrate by
the sequential deposition of conductive, semiconductive, or
insulative layers on a silicon wafer. One fabrication step involves
depositing a filler layer over a non-planar surface and planarizing
the filler layer. For certain applications, the filler layer is
planarized until the top surface of a patterned layer is exposed. A
conductive filler layer, for example, can be deposited on a
patterned insulative layer to fill the trenches or holes in the
insulative layer. After planarization, the portions of the metallic
layer remaining between the raised pattern of the insulative layer
form vias, plugs, and lines that provide conductive paths between
thin film circuits on the substrate. For other applications, such
as oxide polishing, the filler layer is planarized until a
predetermined thickness is left over the non planar surface. In
addition, planarization of the substrate surface is usually
required for photolithography.
[0004] Chemical mechanical polishing (CMP) is one accepted method
of planarization. This planarization method typically requires that
the substrate be mounted on a carrier or polishing head. The
exposed surface of the substrate is typically placed against a
rotating polishing pad. The carrier head provides a controllable
load on the substrate to push it against the polishing pad. An
abrasive polishing slurry is typically supplied to the surface of
the polishing pad.
[0005] Variations in the slurry distribution, the polishing pad
condition, the relative speed between the polishing pad and the
substrate, and the load on the substrate can cause variations in
the material removal rate. These variations, as well as variations
in the initial thickness of the substrate layer, cause variations
in the time needed to reach the polishing endpoint. Therefore,
determining the polishing endpoint merely as a function of
polishing time can lead to overpolishing or underpolishing of the
substrate. Various in-situ monitoring techniques, such as optical
or eddy current monitoring, can be used to detect a polishing
endpoint.
SUMMARY
[0006] In some systems, a substrate is polished at a sequence of
polishing stations. Some systems polish multiple substrates
simultaneously on a single polishing pad in the polishing station.
However, coordinating endpoint control and cross-contamination can
be problems. An interesting architecture that is adaptable to many
different polishing situations includes four platens, with one
substrate being polished per platen.
[0007] In some systems, the substrate is monitored in-situ during
polishing, e.g., by optically or eddy current techniques. However,
existing monitoring techniques may not reliably halt polishing at
the desired point. A spectrum from the substrate can be measured by
an in-sequence metrology station. That is, the spectrum can be
measured while the substrate is still held by the carrier head, but
at a metrology station positioned between the polishing stations. A
value can be calculated from the spectrum which can be used in
controlling a polishing operation at one or more of the polishing
stations.
[0008] In one aspect, a polishing apparatus includes N polishing
stations, an even number of carrier heads held by a support
structure and movable to the N polishing stations in sequence, a
transfer station, and a controller. N is an even number equal to or
greater than 4. Each polishing station including a platen to
support a polishing pad. The controller is configured to cause two
substrates to be loaded into two of the carrier heads in the
transfer station, move the two of the carrier heads to a first pair
of the N polishing stations, simultaneously polish the two
substrates in a first polishing step at the first pair of the N
polishing stations, move the two of the carrier heads to a second
pair of the N polishing stations, simultaneously polish the two
substrates in a second polishing step at the second pair of the N
polishing stations, move the two of the carrier heads to the
transfer station, and cause the two substrates to be unloaded from
the two of the carrier heads.
[0009] Implementations may include one or more of the following
features. The number of carrier heads may equal N or N+2. N may be
4. The transfer station may include two load cups. The controller
may be configured to cause a first substrate of the two substrates
to be loaded at a first load cup of the two load cups, moved past a
first polishing station of the first pair to a second polishing
station of the first pair, polished at the second polishing station
of the first pair, moved past a first polishing station of the
second pair to a second polishing station of the second pair, and
polished at the second polishing station of the first pair. The
polishing stations and transfer station may be supported on a
platform and positioned at substantially equal angular intervals
around a center of the platform. The controller may beconfigured
operate in one of a plurality of modes. In a first mode of the
plurality of modes the controller may cause the two of the carrier
heads to move to the first pair of the N polishing stations. In a
second mode of the plurality of modes the controller may cause a
carrier head to move sequentially to each of the N polishing
stations and cause the substrate to be polished at each of the N
polishing stations.
[0010] The apparatus may include two in-sequence metrology
stations. A first probe of the two in-sequence metrology stations
may be positioned between a first station and a second station of
the second pair of polishing stations and a second probe of the two
in-sequence metrology stations may be positioned between the second
station and the transfer station. A first probe of the two
in-sequence metrology stations may be positioned between a first
station of the first pair of polishing stations and the transfer
station and a second probe of the two in-sequence metrology
stations may be positioned between the first station and a second
station of the first pair of polishing stations.
[0011] In another aspect, a polishing apparatus includes five
stations supported on a platform and positioned at substantially
equal angular intervals around a center of the platform, and a
plurality of carrier heads suspended from and movable along a track
such that each polishing station is selectively positionable at the
stations. The five stations including four polishing stations and a
transfer station, each polishing station including a platen to
support a polishing pad.
[0012] In another aspect, a polishing apparatus includes a
plurality of stations supported on a platform, the plurality of
stations including at least two polishing stations and a transfer
station, each polishing station including a platen to support a
polishing pad, a plurality of carrier heads suspended from and
movable along a track such that each polishing station is
selectively positionable at the stations, and a controller
configured to control motion of the carrier heads along the track
such that during polishing at each polishing station only a single
carrier head is positioned in the polishing station.
[0013] Implementations may include one or more of the following
features. The controller may be configured to operate in one of a
plurality of modes. In a first mode of the plurality of modes the
controller may be configured to cause two substrates to be loaded
into two of the carrier heads in the transfer station, move the two
of the carrier heads to a first pair of the plurality of polishing
stations, and simultaneously polish the two substrates in a first
polishing step at the first pair of the polishing stations. In the
first mode the controller may be configured to move the two of the
carrier heads to a second pair of the plurality of polishing
stations, simultaneously polish the two substrates in a second
polishing step at the second pair of the plurality of polishing
stations, move the two of the carrier heads to the transfer
station, and cause the two substrates to be unloaded from the two
of the carrier heads. In a second mode of the plurality of modes
the controller may be configured to cause a carrier head to move
sequentially to each of the plurality of polishing stations and
cause the substrate to be polished at each of the polishing
stations.
[0014] In another aspect, a polishing apparatus includes five
stations supported on a platform and positioned at substantially
equal angular intervals around a center of the platform, the five
stations including three polishing stations, a transfer station and
a metrology station, each polishing station including a platen to
support a polishing pad, a plurality of carrier heads suspended
from and movable along a track such that each polishing station is
selectively positionable at the stations, and an in-sequence
metrology system having a probe located in the metrology
station.
[0015] Implementations may include one or more of the following
features. The metrology station may include a single probe from the
in-sequence metrology system. The metrology station may include a
plurality of probes from a plurality of in-sequence metrology
systems.
[0016] In another aspect, a polishing apparatus includes a
plurality of polishing stations, each polishing station including a
platen to support a polishing pad, a plurality of carrier heads
held by a support structure and movable to the polishing stations
in sequence, a transfer station including a plurality of load cups,
and a plurality of in-sequence metrology systems, each metrology
system of the plurality of metrology systems having a probe located
in different load cup of the plurality of load cups.
[0017] In another aspect, a method of operating a polishing system
includes transporting a substrate forward along a path past a
polishing station to a probe of an in-sequence metrology system
without polishing the substrate at the polishing station, measuring
the substrate with the metrology system, transporting the substrate
backward along the path to the polishing station; and polishing the
substrate at the polishing station.
[0018] Implementations may include one or more of the following
features. After polishing the substrate, the substrate may be
transported forward along the path to another station. The another
station may be another polishing station or a transfer station.
Transporting the substrate along the path may include supporting a
carrier head on a track and moving the carrier head along the
track.
[0019] In another aspect, a method of controlling a polishing
system includes transporting a substrate forward along a path past
a probe of an in-sequence metrology system to a polishing station
without measuring the substrate with the in-sequence metrology
system, polishing the substrate at the polishing station,
transporting the substrate backward along the path to the probe of
the in-sequence metrology system, and measuring the substrate with
the metrology system.
[0020] Implementations may include one or more of the following
features. The substrate may be transported forward along the path
past the polishing station to another station. The another station
may be another polishing station or a transfer station.
Transporting the substrate along the path may include supporting a
carrier head on a track and moving the carrier head along the
track.
[0021] Implementations can include one or more of the following
potential advantages. The system be adaptable to the needs of many
different polishing situations, and can provide high through-put
for common two-step polishing recipes. Polishing endpoints can be
determined more reliably, and within-wafer non-uniformity (WTWNU)
and wafer-to-wafer non-uniformity (WTWNU) can be reduced.
[0022] The details of one or more implementations are set forth in
the accompanying drawings and the description below. Other aspects,
features and advantages will be apparent from the description and
drawings, and from the claims.
DESCRIPTION OF DRAWINGS
[0023] FIG. 1 is a schematic plan view of an example of a polishing
apparatus.
[0024] FIG. 2 is a schematic cross-sectional view of an example of
a polishing apparatus.
[0025] FIGS. 3A-3C illustrate a method of operation of the
polishing apparatus.
[0026] FIG. 4 is a schematic cross-sectional view of an example of
an in-sequence optical metrology system.
[0027] FIG. 5 illustrates another implementation of a polishing
apparatus.
[0028] FIG. 6 illustrates another implementation of a polishing
apparatus having four in-sequence metrology stations.
[0029] FIG. 7 illustrates another implementation of a polishing
apparatus having in-sequence metrology stations integrated into the
transfer station.
[0030] FIG. 8 illustrates another implementation of a polishing
apparatus in which a polishing station is replaced with an
in-sequence metrology station.
[0031] FIG. 9 illustrates an example spectrum.
[0032] FIG. 10 is a schematic cross-sectional view of a wet-process
optical metrology system.
[0033] FIG. 11 is a schematic cross-sectional view of another
implementation of a wet-process optical metrology system.
[0034] FIG. 12 is a schematic top view of a substrate.
[0035] Like reference symbols in the various drawings indicate like
elements.
DETAILED DESCRIPTION
[0036] As integrated circuits continue to develop, line widths
continue to shrink and layers in the integrated circuit continue to
accumulate, requiring ever more stringent thickness control. Thus,
polishing process control techniques, whether utilizing in-situ
monitoring or run-to run process control, face challenges to
maintain keep the post-polishing thickness within
specification.
[0037] For example, when performing in-situ spectrographic
monitoring of a multi-layer product substrate, an incident optical
beam from the spectrographic monitoring system can penetrate a
several dielectric layers before being reflected by metal lines.
The reflected beam can thus be a result of the thickness and
critical dimensions of multiple layers. A spectrum resulting from
such a complex layer stack often presents a significant challenge
in determining the thickness of the outermost layer that is being
polishing. In addition, the outermost layer thickness is an
indirect parameter for process control. This is because in many
applications the metal line thickness--a parameter that may be more
critical to yield--can vary even if the outermost layer thickness
is on target, if other dimensions such as etch depth or critical
dimension vary.
[0038] A control scheme for determining a polishing endpoint
incorporates wet metrology between CMP steps and feedforward or
feedback control. The dimensional variations in the substrate are
captured after each polishing step at an in-sequence metrology
station and used either to determine whether there is a need to
rework the substrate, or fed forward or fed back to control the
polishing operation or endpoint at a previous or subsequent
polishing station.
[0039] The polishing apparatus is configured such that a carrier
head holds a substrate during polishing at the first and second
polishing stations and moves the substrate from the first polishing
station to the second polishing station. The in-sequence metrology
station is situated to measure the substrate when the carrier head
is holding the substrate and when the substrate is not in contact
with a polishing pad of either the first polishing station or the
second polishing station.
[0040] FIG. 1 is a plan view of a chemical mechanical polishing
apparatus 100 for processing one or more substrates. The polishing
apparatus 100 includes a polishing platform 106 that at least
partially supports and houses a plurality of polishing stations
124. The number of polishing stations can be an even number equal
to or greater than four. For example, the polishing apparatus can
include four polishing stations 124a, 124b, 124c and 124d. Each
polishing station 124 is adapted to polish a substrate that is
retained in a carrier head 126.
[0041] The polishing apparatus 100 also includes a multiplicity of
carrier heads 126, each of which is configured to carry a
substrate. The number of carrier heads can be an even number equal
to or greater than the number of polishing stations, e.g., four
carrier heads or six carrier heads. For example, the number of
carrier heads can be two greater than the number of polishing
stations. This permits loading and unloading of substrates to be
performed from two of the carrier heads while polishing occurs with
the other carrier heads at the remainder of the polishing stations,
thereby providing improved throughput.
[0042] The polishing apparatus 100 also includes a transfer station
122 for loading and unloading substrates from the carrier heads.
The transfer station 122 can include a plurality of load cups 123,
e.g., two load cups 123a, 123b, adapted to facilitate transfer of a
substrate between the carrier heads 126 and a factory interface
(not shown) or other device (not shown) by a transfer robot 110.
The load cups 123 generally facilitate transfer between the robot
110 and each of the carrier heads 126.
[0043] The stations of the polishing apparatus 100, including the
transfer station 122 and the polishing stations 124, can be
positioned at substantially equal angular intervals around the
center of the platform 106. This is not required, but can provide
the polishing apparatus with a good footprint.
[0044] Each polishing station 124 includes a polishing pad 130
supported on a platen 120 (see FIG. 2). The polishing pad 110 can
be a two-layer polishing pad with an outer polishing layer 130a and
a softer backing layer 130b (see FIG. 2).
[0045] For a polishing operation, one carrier head 126 is
positioned at each polishing station. Two additional carrier heads
can be positioned in the loading and unloading station 122 to
exchange polished substrates for unpolished substrates while the
other substrates are being polished at the polishing stations
124.
[0046] The carrier heads 126 are held by a support structure that
can cause each carrier head to move along a path that passes, in
order, the first polishing station 124a, the second polishing
station 124b, the third polishing station 124c, and the fourth
polishing station 126d. This permits each carrier head to be
selectively positioned over the polishing stations 124 and the load
cups 123.
[0047] In some implementations, each carrier head 126 is coupled to
a carriage 108 that is mounted to an overhead track 128. By moving
a carriage 108 along the overhead track 128, the carrier head 126
can be positioned over a selected polishing station 124 or load cup
123. A carrier head 126 that moves along the track will traverse
the path past each of the polishing stations.
[0048] In the implementation depicted in FIG. 1, the overhead track
128 has a circular configuration (shown in phantom) which allows
the carriages 108 retaining the carrier heads 126 to be selectively
orbited over and/or clear of the load cups 122 and the polishing
stations 124. The overhead track 128 may have other configurations
including elliptical, oval, linear or other suitable orientation.
Alternatively, in some implementations the carrier heads 126 are
suspended from a carousel, and rotation of the carousel moves all
of the carrier heads simultaneously along a circular path.
[0049] Each polishing station 124 of the polishing apparatus 100
can include a port, e.g., at the end of an arm 134, to dispense
polishing liquid 136 (see FIG. 2), such as abrasive slurry, onto
the polishing pad 130. Each polishing station 124 of the polishing
apparatus 100 can also include pad conditioning apparatus 132 to
abrade the polishing pad 130 to maintain the polishing pad 130 in a
consistent abrasive state.
[0050] As shown in FIG. 2, the platen 120 at each polishing station
124 is operable to rotate about an axis 121. For example, a motor
150 can turn a drive shaft 152 to rotate the platen 120.
[0051] Each carrier head 126 is operable to hold a substrate 10
against the polishing pad 130. Each carrier head 126 can have
independent control of the polishing parameters, for example
pressure, associated with each respective substrate. In particular,
each carrier head 126 can include a retaining ring 142 to retain
the substrate 10 below a flexible membrane 144. Each carrier head
126 also includes a plurality of independently controllable
pressurizable chambers defined by the membrane, e.g., three
chambers 146a-146c, which can apply independently controllable
pressurizes to associated zones on the flexible membrane 144 and
thus on the substrate 10. Although only three chambers are
illustrated in FIG. 2 for ease of illustration, there could be one
or two chambers, or four or more chambers, e.g., five chambers.
[0052] Each carrier head 126 is suspended from the track 128, and
is connected by a drive shaft 154 to a carrier head rotation motor
156 so that the carrier head can rotate about an axis 127.
Optionally each carrier head 140 can oscillate laterally, e.g., by
driving the carriage 108 on the track 128, or by rotational
oscillation of the carousel itself. In operation, the platen is
rotated about its central axis 121, and each carrier head is
rotated about its central axis 127 and translated laterally across
the top surface of the polishing pad. The lateral sweep is in a
direction parallel to the polishing surface 212. The lateral sweep
can be a linear or arcuate motion.
[0053] A controller 190, such as a programmable computer, is
connected to each motor 152, 156 to independently control the
rotation rate of the platen 120 and the carrier heads 126. For
example, each motor can include an encoder that measures the
angular position or rotation rate of the associated drive shaft.
Similarly, the controller 190 is connected to an actuator in each
carriage 108 to independently control the lateral motion of each
carrier head 126. For example, each actuator can include a linear
encoder that measures the position of the carriage 108 along the
track 128.
[0054] The controller 190 can include a central processing unit
(CPU) 192, a memory 194, and support circuits 196, e.g.,
input/output circuitry, power supplies, clock circuits, cache, and
the like. The memory is connected to the CPU 192. The memory is a
non-transitory computable readable medium, and can be one or more
readily available memory such as random access memory (RAM), read
only memory (ROM), floppy disk, hard disk, or other form of digital
storage. In addition, although illustrated as a single computer,
the controller 190 could be a distributed system, e.g., including
multiple independently operating processors and memories.
[0055] This architecture is adaptable to various polishing
situations based on programming of the controller 190 to control
the order and timing that the carrier heads are positioned at the
polishing stations.
[0056] For example, some polishing recipes are complex and require
three of four polishing steps. Thus, a mode of operation is for the
controller to cause a substrate to be loaded into a carrier head
126 at one of the load cups 123, and for the carrier head 126 to be
positioned in turn at each polishing station 124a, 124b, 124c, 124d
so that the substrate is polished at each polishing station in
sequence. After polishing at the last station, the carrier head 126
is returned to one of the load cups 123 and the substrate is
unloaded from the carrier head 126.
[0057] On the other hand, some polishing recipes require only two
polishing steps. Thus, another mode of operation is for a first
substrate to be loaded into a first carrier head 126 at a first
load cup 123a, and a second substrate to be loaded into a second
carrier head 126 at a second load cup 123b (see FIG. 3A). Then the
two carrier heads are moved into position over the first two
polishing stations. That is, the first carrier head 126 is moved to
the second polishing station 124b, and the second carrier head 126
is moved to the first polishing station 124a (see FIG. 3B). Thus,
the first carrier head 126 bypasses the first polishing station
124a (the first substrate is not polished at the first polishing
station 124a). Similarly, the second polishing head 126 bypasses
the second load cup 123b (the second substrate is not loaded or
unloaded at the second load cup 123b). The first substrate is
polished at the second polishing station 124b and the second
substrate is polished at the first polishing station 124a
simultaneously.
[0058] Once polishing is completed at the first two polishing
stations, the two carrier heads are moved into position over the
next two polishing stations. That is, the first carrier head 126 is
moved to the fourth polishing station 124d, and the second carrier
head 126 is moved to the third polishing station 124c (see FIG.
3C). Thus, the first carrier head 126 bypasses the third polishing
station 124a (the first substrate is not polished at the third
polishing station 124c). Similarly, the second polishing head 126
bypasses the second polishing station 124b (the second substrate is
not loaded or unloaded at the second polishing station 124b). The
first substrate is polished at the fourth polishing station 124d
and the second substrate is polished at the third polishing station
124c simultaneously.
[0059] Once polishing of the first substrate is completed at the
fourth polishing station 124d, the first carrier head 126 is moved
to the second load cup 123b. Similarly, once polishing of the
second substrate is completed at the third polishing station 124c,
the second carrier head 126 is move to the first load cup. Thus,
the first carrier head 126 bypasses the first load cup 123a (the
first substrate is not loaded or unloaded at the first load cup
123a). Similarly, the second polishing head 126 bypasses the fourth
polishing station 124d (the second substrate is not polished at the
fourth polishing station 124d).
[0060] An advantage of this mode of operation is that it can
provide high throughput at a reasonable footprint of the base 106,
while avoiding problems such as coordinating endpoint control and
cross-contamination that can occur when multiple substrates are
polished on the same polishing pad.
[0061] An example of a polishing process that can use this mode of
operation is metal polishing, e.g., copper polishing. For example,
bulk polishing of a metal layer can be performed at the first
polishing station 124a and the second polishing station 124b, and
metal clearing and removal of the barrier layer can be performed at
the third polishing station 124c and the second polishing station
124d.
[0062] Because the carrier heads 126 are on a track 128, each
carrier head cannot advance on the path past the carrier head that
is in front of it. Thus, some coordination is necessary by the
controller 190 so a carrier head does not advance until the
operation is complete at the next station.
[0063] Referring to FIGS. 1, 3A-3C and 4, the polishing apparatus
100 also one or more in-sequence (also referred to as in-line)
metrology systems 160 (see FIG. 4), e.g., optical metrology
systems, e.g., spectrographic metrology systems. An in-sequence
metrology system is positioned within the polishing apparatus 100,
but does not performs measurements during the polishing operation;
rather measurements are collected between polishing operations,
e.g., while the substrate is being moved from one polishing station
to another. Alternatively, one or more of the in-sequence metrology
systems 160 could be a non-optical metrology system, e.g., an eddy
current metrology system or capacitive metrology system.
[0064] In some implementations, the polishing system includes two
in-sequence metrology systems. The two in-sequence metrology
systems could be on the path on opposite sides of a polishing
station. For example, in some implementations (shown in FIGS. 1 and
3A) the polishing system 100 includes a first metrology system with
a first probe 180a located between the third polishing station 124c
and the fourth polishing station 124d, and a second metrology
system with a second probe 180b located between the fourth
polishing station 124d and the transfer station 122. As another
example, in some implementations (shown in FIG. 5) the polishing
system 100 includes a first metrology system with a first probe
180a located between the transfer station 122 and the first
polishing station 124a, and a second metrology system with a second
probe 180b located between the first polishing station 124a and the
second polishing station 124b.
[0065] Each in-line metrology system 160 includes a probe 180
supported on the platform 106 at a position on the path taken by
the carrier heads 126 and between two of the stations, e.g.,
between two polishing stations 124, or between a polishing station
124 and the transfer station g stations 122. In particular, the
probe 180 is located at a position such that a carrier head 126
supported by the track 128 can position the substrate 10 over the
probe 180.
[0066] In some modes of operation, the substrate is measured an
in-sequence metrology station 160 before polishing at a station. In
this case, in some implementations, the probe 180 of the metrology
station 160 can be positioned on the path after the polishing
station. Thus, the carrier head 126 with an attached substrate is
moved along the path past the polishing station 124 to the probe
180 of the in-sequence monitoring station, the substrate is
measured with the probe 180, and the carrier head is moved back
along the path (in a reverse direction) to the polishing station
124.
[0067] For example, referring to FIGS. 3B and 3C, once polishing of
the first substrate is completed at the second polishing station
124b, the substrate can be moved past the third polishing station
124c and fourth polishing station 124d to the second probe 180b,
measured with the second probe 180b, and moved back along the path
to the fourth polishing station 124d. Similarly, once polishing of
the second substrate is completed at the first polishing station
124a, the substrate can be moved past the second polishing station
124b and third polishing station 124c to the first probe 180a,
measured with the first probe 180a, and moved back along the path
to the third polishing station 124c.
[0068] In some modes of operation, the substrate is measured an
in-sequence metrology station 160 after polishing at a station. In
this case, in some implementations, the probe 180 of the metrology
station 160 can be positioned on the path before the polishing
station. Thus, the carrier head 126 with an attached substrate is
moved along the path past the probe 180 of the in-sequence
monitoring station to the polishing station 124, the substrate is
polished at the polishing station 124, the carrier head is moved
back along the path (in a reverse direction) to the probe 180, the
substrate is measured, and the carrier head is forward again along
the path past the polishing station 124 to the next station.
[0069] For example, referring to FIG. 5, once the first substrate
is loaded into the carrier head 126 at the second loading cup 123b,
the first substrate is moved past the first probe 180a, the first
polishing station 124a and the second probe 180b to the second
polishing station 124b. Once the first substrate is completed at
the second polishing station 124b, the first substrate is moved
back along the path to the second probe 180b, measured with the
second probe 180b, and then moved forward along the path to the
fourth polishing station 124d. Similarly, once the second substrate
is loaded into the carrier head 126 at the first loading cup 123a,
the second substrate is moved past second loading cup 123b, and the
first probe 180a to the first polishing station 124a. Once
polishing of the second substrate is completed at the first
polishing station 124a, the substrate is moved back along the path
to the first probe 180a, measured with the first probe 180a, and
then forward along the path to the third polishing station
124c.
[0070] In some implementations, the probe 180 of the metrology
station 160 can be positioned on the path after the polishing
station and be used for a measurement after polishing of the
substrate at the polishing station. For example, in the
implementations shown in FIGS. 1 and 3A, the first probe 180a and
second probe 180b can be used for measuring the second substrate
and first substrate after polishing at the third polishing station
124c and fourth polishing station 124d, respectively.
[0071] In some implementations, the probe 180 of the metrology
station 160 can be positioned on the path before the polishing
station and be used for a measurement before polishing of the
substrate at the polishing station. For example, in the
implementations shown in FIG. 5, the first probe 180a and second
probe 180b can be used for measuring the second substrate and first
substrate before polishing at the first polishing station 124a and
second polishing station 124b, respectively.
[0072] Referring to FIG. 6, in some implementations, the polishing
system 100 includes four in-sequence metrology stations. For
example, the polishing system 100 can include a first probe 180a
between the second load cup 123b and the first polishing station
124a, a second probe 180b between the first polishing station 124a
and the second polishing station 124b, a third probe 180b between
the third polishing station 124c and the fourth polishing station
124d, and fourth probe 180d between the fourth polishing station
124d and the first load cup 123a.
[0073] An advantage of having two (or four) in-sequence metrology
stations 160 is that measurements can be performed simultaneously
on the two substrates. However, the techniques of moving a carrier
head backward on the path to a probe or a polishing station can be
applied even if there is only one in-sequence metrology station. In
addition, although this examples focus on a polishing system with
four polishing stations, the techniques can be applied to nearly
any system with multiple polishing stations.
[0074] For example, a polishing system could include the four
platens as shown in FIG. 1, but only a single in-sequence metrology
station, e.g., with the probe positioned between the third
polishing station 124c and the fourth polishing station 124d. In
this case, for a measurement before the second polishing step, the
first substrate would be measured with the probe and then move
forward along the path to the fourth polishing station 124d,
whereas the third substrate would be measured with the probe and
then move backward along the path to the third polishing station
124c.
[0075] As another example, a polishing system could include the
four platens as shown in FIG. 1, but only a single in-sequence
metrology station, e.g., with the probe positioned between the
first polishing station 124a and the second polishing station 124b.
In this case, for a measurement after the first polishing step, the
first substrate would move backwards from the second polishing
station 124b to the probe, be measured with the probe and then move
forward along the path to the fourth polishing station 124d,
whereas the third substrate would move forward from the first
polishing station 124a, be measured with the probe and then move
forward to the third polishing station 124c.
[0076] As another example, a polishing system could include the
four platens as shown in FIG. 2 and two in-sequence metrology
station, but with a first probe positioned between the first
polishing station 124a and the second polishing station 124b and a
second probe positioned between the third polishing station 124c
and the fourth polishing station 124d. Such as system could
function as provided in either of the two prior examples.
[0077] In some implementations, the probe 180 should be positioned
adjacent a station at which the filler layer is expected to be
cleared. For example, where the controller 190 is configured with a
recipe to perform bulk polishing (but not clearance) of the filler
layer at the first and second polishing stations, and removal or
clearing of an underlying layer at the third and fourth polishing
stations, the probe 180 can be positioned adjacent either the third
or fourth polishing stations.
[0078] Referring to FIG. 7, in another implementation, at least one
probe 180 of an in-sequence metrology system is positioned in the
transfer station 122. For example, two probes 180a and 180b of two
in-sequence metrology systems are positioned in the respective load
cups 123a and 123b of the transfer station 122. In operation, two
substrates held by the two carrier heads 126 could be measured at
the two load cups 123a and 123b. The measurement could occur before
the substrate is polished at the first polishing station 124a, or
after the substrate is polished at the last polishing station
124d.
[0079] Alternatively or in addition, one or both carrier heads
could be moved back along the track 128 after polishing at the
first station 124a or second station 124b to be measured and then
transported forward to the third station 124b or fourth station
124d, and/or one or both carrier heads could be moved forward along
the track past the third station 124c or the fourth station 124d
prior to polishing at those stations to be measured and then
transported back to the third station 124b or fourth station
124d.
[0080] Referring to FIG. 8, in another implementation, one of the
polishing stations is replaced by a metrology station 161, with the
probe 180 of the in-sequence metrology system positioned in the
metrology station. The stations of the polishing apparatus 100,
including the transfer station 122, the polishing stations 124 and
the metrology station 161, can be positioned at substantially equal
angular intervals around the center of the platform 106. In the
example shown in FIG. 8, there are three polishing stations 124a,
124b and 124c. In general, the polishing apparatus illustrated in
FIG. 8 could be used in a sequential polishing operation, e.g., a
carrier head 126 would move to each polishing station 124a, 124b,
124c in turn and perform a polishing operation at that polishing
station. An advantage of this architecture is compact size while
enabling common three-step polishing processes and permitting
in-sequence metrology.
[0081] In operation, the metrology station 161 could simply be used
to measure the substrate between polishing operations at the first
station 124a and the second polishing station 124b. However, the
backtracking approach discussed above can also be applied. For
example, a carrier heads could be moved back along the track 128
after polishing at the second station 124b to measure the substrate
at the station 161, and then the carrier head 126 can be
transported forward to the third station 124b. As another example,
a carrier head could be moved forward along the track past the
first station 124a prior to polishing at that station, the
substrate could be measured at the metrology station 161, and then
the carrier head can be transported back along the track 128 to the
first station 124a.
[0082] Although only one probe 180a is illustrated in FIG. 8, the
metrology station 161 could include two probes for two separate
in-sequence metrology systems to permit two substrates to be
measured simultaneously at the metrology station 161. In addition,
the metrology station 161 could be positioned between the second
station 124b and the third station 124c, with appropriate
modification of the order of transfer between the stations.
[0083] Returning to FIG. 4, the optical metrology system 160 can
include a light source 162, a light detector 164, and circuitry 166
for sending and receiving signals between the controller 190 and
the light source 162 and light detector 164.
[0084] One or more optical fibers can be used to transmit the light
from the light source 162 to the optical access in the polishing
pad, and to transmit light reflected from the substrate 10 to the
detector 164. For example, a bifurcated optical fiber 170 can be
used to transmit the light from the light source 162 to the
substrate 10 and back to the detector 164. The bifurcated optical
fiber can include a trunk 172 having an end in the probe 180 to
measure the substrate 10, and two branches 174 and 176 connected to
the light source 162 and detector 164, respectively. In some
implementations, rather than a bifurcated fiber, two adjacent
optical fibers can be used.
[0085] In some implementations, the probe 180 holds an end of the
trunk 172 of the bifurcated fiber. In operation, the carrier head
126 positions a substrate 10 over the probe 180. Light from the
light source 162 is emitted from the end of the trunk 172,
reflected by the substrate 10 back into the trunk 172, and the
reflected light is received by the detector 164. In some
implementations, one or more other optical elements, e.g., a
focusing lens, are positioned over the end of the trunk 172, but
these may not be necessary.
[0086] The probe 180 can include a mechanism to adjust the vertical
height of the end the trunk 172, e.g., the vertical distance
between the end of the trunk 172 and the top surface of the
platform 106. In some implementations, the probe 180 is supported
on an actuator system 182 that is configured to move the probe 180
laterally in a plane parallel to the plane of the track 128. The
actuator system 182 can be an XY actuator system that includes two
independent linear actuators to move probe 180 independently along
two orthogonal axes.
[0087] The output of the circuitry 166 can be a digital electronic
signal that passes to the controller 190 for the optical metrology
system. Similarly, the light source 162 can be turned on or off in
response to control commands in digital electronic signals that
pass from the controller 190 to the optical metrology system 160.
Alternatively, the circuitry 166 could communicate with the
controller 190 by a wireless signal.
[0088] The light source 162 can be operable to emit white light. In
one implementation, the white light emitted includes light having
wavelengths of 200-800 nanometers. A suitable light source is a
xenon lamp or a xenon mercury lamp.
[0089] The light detector 164 can be a spectrometer. A spectrometer
is an optical instrument for measuring intensity of light over a
portion of the electromagnetic spectrum. A suitable spectrometer is
a grating spectrometer. Typical output for a spectrometer is the
intensity of the light as a function of wavelength (or frequency).
FIG. 9 illustrates an example of a measured spectrum 300.
[0090] As noted above, the light source 162 and light detector 164
can be connected to a computing device, e.g., the controller 190,
operable to control their operation and receive their signals. The
computing device can include a microprocessor situated near the
polishing apparatus, e.g., a programmable computer. With respect to
control, the computing device can, for example, synchronize
activation of the light source with the motion of the carrier head
126.
[0091] Optionally, the in-sequence metrology system 160 can be a
wet metrology system. In a wet-metrology system, measurement of the
surface of the substrate is conducted while a layer of liquid
covers the portion of the surface being measured. An advantage of
wet metrology is that the liquid can have a similar index of
refraction as the optical fiber 170. The liquid can provide a
homogeneous medium through which light can travel to and from the
surface of the film that is to be or that has been polished. The
wet metrology system 169 can be configured such that the liquid is
flowing during the measurement. A flowing liquid can flush away
polishing residue, e.g., slurry, from the surface of the substrate
being measured.
[0092] FIG. 10 shows an implementation of a wet in-sequence
metrology system 160. In this implementation, the trunk 172 of the
optical fiber 170 is situated inside a tube 186. A liquid 188,
e.g., de-ionized water, can be pumped from a liquid source 189 into
and through the tube 186. During the measurement, the substrate 10
can positioned over the end of the optical fiber 170. The height of
the substrate 10 relative to the top of the tube 186 and the flow
rate of the liquid 188 is selected such that as the liquid 188
overflows the tube 186, the liquid 188 fills the space between the
end of the optical fiber 170 and the substrate 10.
[0093] Alternatively, as shown in FIG. 11, the carrier head 126 can
be lowered into a reservoir defined by a housing 189. Thus, the
substrate 10 and a portion of the carrier head 126 can be submerged
in a liquid 188, e.g., de-ionized water, in the reservoir. The end
of the optical fiber 170 can be submerged in the liquid 188 below
the substrate 10.
[0094] In either case, in operation, light travels from the light
source 162, travels through the liquid 188 to the surface of the
substrate 10, is reflected from the surface of the substrate 10,
enters the end of the optical fiber, and returns to the detector
164.
[0095] Referring to FIG. 12, a typical substrate 10 includes
multiple dies 12. In some implementations, the controller 190
causes the substrate 10 and the probe 180 to undergo relative
motion so that the optical metrology system 160 can make multiple
measurements within an area 18 on the substrate 10. In particular,
the optical metrology system 160 can take multiple measurements at
spots 184 (only one spot is shown on FIG. 5 for clarity) that are
spread out with a substantially uniform density over the area 18.
The area 18 can be equivalent to the area of a die 12. In some
implementations, the die 12 (and the area 18) can be considered to
include half of any adjacent scribe line. In some implementations,
at least one-hundred measurements are made within the area 18. For
example, if a die is 1 cm on a side, then the measurements can be
made at 1 mm intervals across the area. The edges of the area 18
need not be aligned with the edges of a particular die 12 on the
substrate.
[0096] In some implementations, the XY actuator system 182 causes
the measurement spot 184 of the probe 180 to traverse a path across
the area 18 on the substrate 10 while the carrier head 126 holds
the substrate 10 in a fixed position (relative to the platform
106). For example, the XY actuator system 182 can cause the
measurement spot 184 to traverse a path which traverses the area 18
on a plurality of evenly spaced parallel line segments. This
permits the optical metrology system 160 to take measurements that
are evenly spaced over the area 18.
[0097] In some implementations, there is no actuator system 182,
and the probe 180 remains stationary (relative to the platform 106)
while the carrier head 126 moves to cause the measurement spot 184
to traverse the area 18. For example, the carrier head could
undergo a combination of rotation (from motor 156) translation
(from carriage 108 moving along track 128) to cause the measurement
spot 184 to traverse the area 18. For example, the carrier head 126
can rotate while carriage 108 causes the center of the substrate to
move outwardly from the probe 180, which causes the measurement
spot 184 to traverse a spiral path on the substrate 10. By making
measurements while the spot 184 is over the area 18, measurements
can be made at a substantially uniform density over the area
18.
[0098] In some implementations, the relative motion is caused by a
combination of motion of the carrier head 126 and motion of the
probe 180, e.g., rotation of the carrier head 126 and linear
translation of the probe 180.
[0099] The controller 190 receives a signal from the optical
metrology system 160 that carries information describing a spectrum
of the light received by the light detector for each flash of the
light source or time frame of the detector. For each measured
spectrum, a characterizing value can be calculated from the
measured spectrum. The characterizing value can be used in
controlling a polishing operation at one or more of the polishing
stations.
[0100] One technique to calculate a characterizing value is, for
each measured spectrum, to identify a matching reference spectrum
from a library of reference spectra. Each reference spectrum in the
library can have an associated characterizing value, e.g., a
thickness value or an index value indicating the time or number of
platen rotations at which the reference spectrum is expected to
occur. By determining the associated characterizing value for the
matching reference spectrum, a characterizing value can be
generated. This technique is described in U.S. Patent Publication
No. 2010-0217430, which is incorporated by reference. Another
technique is to analyze a characteristic of a spectral feature from
the measured spectrum, e.g., a wavelength or width of a peak or
valley in the measured spectrum. The wavelength or width value of
the feature from the measured spectrum provides the characterizing
value. This technique is described in U.S. Patent Publication No.
2011-0256805, which is incorporated by reference. Another technique
is to fit an optical model to the measured spectrum. In particular,
a parameter of the optical model is optimized to provide the best
fit of the model to the measured spectrum. The parameter value
generated for the measured spectrum generates the characterizing
value. This technique is described in U.S. Patent Application No.
61/608,284, filed Mar. 8, 2012, which is incorporated by reference.
Another technique is to perform a Fourier transform of the measured
spectrum. A position of one of the peaks from the transformed
spectrum is measured. The position value generated for measured
spectrum generates the characterizing value. This technique is
described in U.S. patent application Ser. No. 13/454,002, filed
Apr. 23, 2012, which is incorporated by reference.
[0101] As noted above, the characterizing value can be used in
controlling a polishing operation at one or more of the polishing
stations. The controller can, for example, calculate the
characterizing value and adjust the polishing time, polishing
pressure, or polishing endpoint of: (i) the previous polishing
step, i.e., for a subsequent substrate at the polishing station
that the substrate being measured just left, (ii) the subsequent
polishing step, i.e., at the polishing station to which the
substrate being measured will be transferred, or (iii) both of
items (i) and (ii), based on the characterizing value.
[0102] In some implementations, prior to the first CMP step,
substrate dimension information (layer thickness, critical
dimensions) from upstream non-polishing steps, if available, is fed
forward to the controller 190.
[0103] After a CMP step, the substrate is measured using wet
metrology at the in-sequence metrology station 180 located between
the polishing station at which the substrate was polishing and the
next polishing station. A characterizing value, e.g., layer
thickness or copper line critical dimension, is captured and sent
to the controller.
[0104] In some implementations, the controller 190 uses the
characterizing value to adjust the polishing operation for the
substrate at the next polishing station. For example, if the
characterizing value indicates that the etch trench depth is
greater, the post thickness target for the subsequent polishing
station can be adjusted with more removal amount to keep the
remaining metal line thickness constant. If the characterizing
value indicates that the underlying layer thickness has changed,
the reference spectrum for in-situ endpoint detection at the
subsequent polishing station can be modified so that endpoint
occurs closer to the target metal line thickness.
[0105] In some implementations, the controller 190 uses the
characterizing value to adjust the polishing operation for a
subsequent substrate at the previous polishing station. For
example, if the characterizing value indicates that the etch trench
depth is greater, the post thickness target for the previous
polishing station can be adjusted with more removal amount to keep
the remaining metal line thickness constant. If the characterizing
value indicates that the underlying layer thickness has changed,
the reference spectrum for in-situ endpoint detection at the
previous polishing station can be modified so that endpoint occurs
closer to the target metal line thickness.
[0106] In some implementations, the controller 190 analyzes the
measured spectra and determines the proper substrate route. For
example, the controller 190 can compare the characterizing value to
a threshold, or determine whether the characterizing value falls
within a predetermined range. If the characterizing value indicates
that polishing is incomplete, e.g., if it falls within the
predetermined range indicating an underpolished substrate or does
not exceed a threshold indicating a satisfactorily polished
substrate, then the substrate can be routed back to previous
polishing station for rework. For example, Once the rework is
completed, the substrate can be measured again at the metrology
station, or transported to the next polishing station. If the
characterizing value does not indicate that polishing is
incomplete, the substrate can be transported to the next polishing
station.
[0107] For example, a parameter such as metal residue can be
measured using wet metrology at the in-sequence metrology station
180. If metal residue detected, the substrate can be routed back to
previous polishing station for rework. Otherwise, the substrate can
be transported to the next polishing station.
[0108] In order to detect metal residue, the controller 190 can
evaluate the percentage of the area that is covered by the filler
material. Each measured spectrum 300 is compared to a reference
spectrum. The reference spectrum can be the spectrum from a thick
layer of the filler material, e.g., a spectrum from a metal, e.g.,
a copper or tungsten reference spectrum. The comparison generates a
similarity value for each measured spectrum 300. A single scalar
value representing the amount of filler material within the area 18
can be calculated from the similarity values, e.g., by averaging
the similarity values. The scalar value can then be compared to a
threshold to determine the presence and/or amount of residue in the
area.
[0109] In some implementations, the similarity value is calculated
from a sum of squared differences between the measured spectrum and
the reference spectrum. In some implementations, the similarity
value is calculated from a cross-correlation between the measured
spectrum and the reference spectrum.
[0110] For example, in some implementation a sum of squared
differences (SSD) between each measured spectrum and the reference
spectrum is calculated to generate an SSD value for each
measurement spot. The SSD values can then be normalized by dividing
all SSD values by the highest SSD value obtained in the scan to
generate normalized SSD values (so that the highest SSD value is
equal to 1). The normalized SSD values are then subtracted from 1
to generate the similarity value. The spectrum that had the highest
SSD value, and thus the smallest copper contribution, is now equal
to 0.
[0111] Then the average of all similarity values generated in the
prior step is calculated to generate the scalar value. This scalar
value will be higher if residue is present.
[0112] As another example, in some implementation a sum of squared
differences (SSD) between each measured spectrum and the reference
spectrum is calculated to generate an SSD value for each
measurement spot. The SSD values can then be normalized by dividing
all SSD values by the highest SSD value obtained in the scan to
generate normalized SSD values (so that the highest SSD value is
equal to 1). The normalized SSD values are then subtracted from 1
to generate inverted normalized SSD values. For a given spectrum,
if the inverted normalized SSD value generated in the previous step
is less than a user-defined threshold, then it is set to 0. The
user-defined threshold can be 0.5 to 0.8, e.g., 0.7. Then the
average of all values generated in the prior step is calculated to
generate the scalar value. Again, this similarity value will be
higher if residue is present.
[0113] If the calculated scalar value is greater than a threshold
value, then the controller 190 can designate the substrate as
having residue. On the other hand, if the scalar value is equal or
less than the threshold value, then the controller 190 can
designate the substrate as not having residue.
[0114] If the controller 190 does not designate the substrate as
having residue, then the controller can cause the substrate to be
processed at the next polishing station normally. On the other
hand, controller 190 designates the substrate as having residue,
then the controller can take a variety of actions. In some
implementations, the substrate can be returned immediately to the
previous polishing station for rework. In some implementations, the
substrate is returned to the cassette (without being processed at a
subsequent polishing station) and designated for rework once other
substrates in the queue have completed polishing. In some
implementations, the substrate is returned to the cassette (without
being processed at a subsequent polishing station), and an entry
for the substrate in a tracking database is generated to indicate
that the substrate has residue. In some implementations, the scalar
value can be used to adjust a subsequent polishing operation to
ensure complete removal of the residue. In some implementations,
the scalar value can be used to flag the operator that something
has gone wrong in the polishing process, and that the operator's
attention is required. The tool can enter into a number of
error/alarm states, e.g. return all substrates to a cassette and
await operator intervention.
[0115] In another implementation, the calculated similarity value
for each measurement value is compared to a threshold value. Based
on the comparison, each measurement spot is designated as either
filler material or not filler material. For example, if an inverted
normalized SSD value is generated for each measurement spot as
discussed above, then the user-defined threshold can be 0.5 to 0.8,
e.g., 0.7.
[0116] The percentage of measurement spots within the area 18 that
are designated as filler material can be calculated. For example,
the number of measurement spots designated as filler material can
be divided by the total number of measurement spots.
[0117] This calculated percentage can be compared to a threshold
percentage. The threshold percentage can be calculated either from
knowledge of pattern of the die on the substrate, or empirically by
measuring (using the measurement process described above) for a
sample substrate that is known to not have residue. The sample
substrate could be verified as not having residue by a dedicated
metrology station.
[0118] If the calculated percentage is greater than the threshold
percentage, then the substrate can be designated as having residue.
On the other hand, if the percentage is equal or less than the
threshold percentage, then the substrate can be designated as not
having residue. The controller 190 can then take action as
discussed above.
[0119] In some implementations a probe 180' of an optical metrology
system 160 is positioned between the loading and unloading station
and one of the polishing stations. If the probe 180' is positioned
between the loading station and the first polishing station, then a
characterizing value can be measured by the metrology system and
fed forward to adjust polishing of the substrate at first polishing
station. If the probe 180' is positioned between the last polishing
station and the unloading station, then a characterizing value can
be measured by the metrology system and fed back to adjust
polishing of a subsequent substrate at the last polishing station,
or if residue is detected then the substrate can be sent back to
the last polishing station for rework.
[0120] The control schemes described above can more reliably
maintain product substrates within manufacture specification, and
can reduce rework, and can provide rerouting of the substrate to
provide rework with less disruption of throughput. This can provide
an improvement in both productivity and yield performance.
[0121] The above described polishing apparatus and methods can be
applied in a variety of polishing systems. For example, rather than
be suspended from a track, multiple carrier heads can be suspended
from a carousel, and lateral motion of the carrier heads can be
provided by a carriage that is suspend from and can move relative
to the carousel. The platen may orbit rather than rotate. The
polishing pad can be a circular (or some other shape) pad secured
to the platen. Some aspects of the endpoint detection system may be
applicable to linear polishing systems (e.g., where the polishing
pad is a continuous or a reel-to-reel belt that moves linearly).
The polishing layer can be a standard (for example, polyurethane
with or without fillers) polishing material, a soft material, or a
fixed-abrasive material. Terms of relative positioning are used; it
should be understood that the polishing surface and substrate can
be held in a vertical orientation or some other orientations.
[0122] While the foregoing is directed to embodiments of the
present invention, other and further embodiments of the invention
may be devised without departing from the basic scope thereof, and
the scope thereof is determined by the claims that follow.
* * * * *