Lee; Harry Q.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Harry Q..The latest application filed is for "profile control with multiple instances of contol algorithm during polishing".

Company Profile

9.90.87

Lee; Harry Q. - Los Altos CA
Lee; Harry Q. - Lost Altos CA US
Lee; Harry Q - Los Altos CA
Lee; Harry Q. - Mountain View CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Profile Control During Polishing Of A Stack Of Adjacent Conductive Layers App 20210379721 - Xu; Kun ; et al.	2021-12-09
Compensation For Substrate Doping In Edge Reconstruction For In-situ Electromagnetic Inductive Monitoring App 20210379723 - Xu; Kun ; et al.	2021-12-09
Switching Control Algorithms On Detection Of Exposure Of Underlying Layer During Polishing App 20210379724 - Xu; Kun ; et al.	2021-12-09
Profile Control With Multiple Instances Of Contol Algorithm During Polishing App 20210379722 - Xu; Kun ; et al.	2021-12-09
Using A Trained Neural Network For Use In In-situ Monitoring During Polishing And Polishing System App 20210358819 - Xu; Kun ; et al.	2021-11-18
Technique For Training Neural Network For Use In In-situ Monitoring During Polishing And Polishing System App 20210354265 - Xu; Kun ; et al.	2021-11-18
Polishing Apparatus Using Neural Network For Monitoring App 20210229234 - Xu; Kun ; et al.	2021-07-29
Polishing apparatus using neural network for monitoring Grant 10,994,389 - Xu , et al. May 4, 2	2021-05-04
Display of spectra contour plots versus time for semiconductor processing system control Grant 10,948,900 - David , et al. March 16, 2	2021-03-16
Chattering correction for accurate sensor position determination on wafer Grant 10,898,986 - Lee , et al. January 26, 2	2021-01-26
Compensation For Substrate Doping For In-situ Electromagnetic Inductive Monitoring App 20190389028 - Lu; Wei ; et al.	2019-12-26
Polishing Apparatus Using Machine Learning And Compensation For Pad Thickness App 20190299356 - Xu; Kun ; et al.	2019-10-03
Chattering Correction for Accurate Sensor Position Determination on Wafer App 20190084119 - Lee; Harry Q. ; et al.	2019-03-21
Polishing Apparatus Using Neural Network For Monitoring App 20180304435 - Xu; Kun ; et al.	2018-10-25
Display of Spectra Contour Plots Versus Time For Semiconductor Processing System Control App 20180113440 - David; Jeffrey Drue ; et al.	2018-04-26
Monitoring Of Polishing Pad Thickness For Chemical Mechanical Polishing App 20180056476 - Zhang; Jimin ; et al.	2018-03-01
Endpoint method using peak location of spectra contour plots versus time Grant 9,886,026 - David , et al. February 6, 2	2018-02-06
Dynamically tracking spectrum features for endpoint detection Grant 9,649,743 - David , et al. May 16, 2	2017-05-16
Polishing Apparatus Having Optical Monitoring Of Substrates For Uniformity Control And Separate Endpoint System App 20170100814 - Qian; Jun ; et al.	2017-04-13
Limiting adjustment of polishing rates during substrate polishing Grant 9,607,910 - Benvegnu , et al. March 28, 2	2017-03-28
Automatic generation of reference spectra for optical monitoring of substrates Grant 9,579,767 - Qian , et al. February 28, 2	2017-02-28
Limiting Adjustment of Polishing Rates During Substrate Polishing App 20160372388 - Benvegnu; Dominic J. ; et al.	2016-12-22
Limiting adjustment of polishing rates during substrate polishing Grant 9,490,186 - Benvegnu , et al. November 8, 2	2016-11-08
Techniques for matching spectra Grant 9,482,610 - Shrestha , et al. November 1, 2	2016-11-01
Adjustment of polishing rates during substrate polishing with predictive filters Grant 9,375,824 - Benvegnu , et al. June 28, 2	2016-06-28
Adjusting polishing rates by using spectrographic monitoring of a substrate during processing Grant 9,346,146 - David , et al. May 24, 2	2016-05-24
Dynamically Tracking Spectrum Features For Endpoint Detection App 20160129550 - David; Jeffrey Drue ; et al.	2016-05-12
Multi-Platen Multi-Head Polishing Architecture App 20160101497 - David; Jeffrey Drue ; et al.	2016-04-14
Polishing control using weighting with default sequence Grant 9,296,084 - Zhang , et al. March 29, 2	2016-03-29
Feed forward and feed-back techniques for in-situ process control Grant 9,289,875 - David , et al. March 22, 2	2016-03-22
Dynamically tracking spectrum features for endpoint detection Grant 9,283,653 - David , et al. March 15, 2	2016-03-15
Endpoint detection during polishing using integrated differential intensity Grant 9,248,544 - Zhang , et al. February 2, 2	2016-02-02
Multi-platen multi-head polishing architecture Grant 9,227,293 - David , et al. January 5, 2	2016-01-05
User-input functions for data sequences in polishing endpoint detection Grant 9,168,630 - Lee , et al. October 27, 2	2015-10-27
Using spectra to determine polishing endpoints Grant 9,142,466 - Lee , et al. September 22, 2	2015-09-22
Endpoint Method Using Peak Location Of Spectra Contour Plots Versus Time App 20150160649 - David; Jeffrey Drue ; et al.	2015-06-11
Adjustment of Polishing Rates During Substrate Polishing With Predictive Filters App 20150147940 - Benvegnu; Dominic J. ; et al.	2015-05-28
Limiting Adjustment of Polishing Rates During Substrate Polishing App 20150147829 - Benvegnu; Dominic J. ; et al.	2015-05-28
Endpoint method using peak location of spectra contour plots versus time Grant 8,977,379 - David , et al. March 10, 2	2015-03-10
Selecting reference libraries for monitoring of multiple zones on a substrate Grant 8,954,186 - Qian , et al. February 10, 2	2015-02-10
Adaptively tracking spectrum features for endpoint detection Grant 8,930,013 - David , et al. January 6, 2	2015-01-06
Dynamically Tracking Spectrum Features For Endpoint Detection App 20140329440 - David; Jeffrey Drue ; et al.	2014-11-06
Spectrographic monitoring of a substrate during processing using index values Grant 8,874,250 - David , et al. October 28, 2	2014-10-28
Detection of layer clearing using spectral monitoring Grant 8,860,932 - Zhang , et al. October 14, 2	2014-10-14
Dynamically tracking spectrum features for endpoint detection Grant 8,834,229 - David , et al. September 16, 2	2014-09-16
Tracking spectrum features in two dimensions for endpoint detection Grant 8,814,631 - David , et al. August 26, 2	2014-08-26
Automatic Initiation Of Reference Spectra Library Generation For Optical Monitoring App 20140176949 - David; Jeffrey Drue ; et al.	2014-06-26
Feedback for polishing rate correction in chemical mechanical polishing Grant 8,755,927 - Qian , et al. June 17, 2	2014-06-17
Automatic selection of reference spectra library Grant 8,755,928 - Zhang , et al. June 17, 2	2014-06-17
Adaptive tracking spectrum features for endpoint detection Grant 8,751,033 - David , et al. June 10, 2	2014-06-10
Multi-Platen Multi-Head Polishing Architecture App 20140141695 - David; Jeffrey Drue ; et al.	2014-05-22
Polishing System with In-Sequence Sensor App 20140141696 - David; Jeffrey Drue ; et al.	2014-05-22
Techniques For Matching Spectra App 20140134758 - Shrestha; Kiran Lall ; et al.	2014-05-15
Semi-quantitative thickness determination Grant 8,718,810 - Benvegnu , et al. May 6, 2	2014-05-06
Using optical metrology for within wafer feed forward process control Grant 8,679,979 - David , et al. March 25, 2	2014-03-25
Automatic initiation of reference spectra library generation for optical monitoring Grant 8,666,665 - David , et al. March 4, 2	2014-03-04
Using Spectra to Determine Polishing Endpoints App 20140045282 - Lee; Harry Q. ; et al.	2014-02-13
Spectrographic Monitoring Of A Substrate During Processing Using Index Values App 20140039660 - David; Jeffrey Drue ; et al.	2014-02-06
Polishing Control Using Weighting With Default Sequence App 20140024292 - Zhang; Jimin ; et al.	2014-01-23
Endpoint Detection During Polishing Using Integrated Differential Intensity App 20140024291 - Zhang; Jimin ; et al.	2014-01-23
Methods of using optical metrology for feed back and feed forward process control Grant 8,579,675 - David , et al. November 12, 2	2013-11-12
Feed Forward And Feed-back Techniques For In-situ Process Control App 20130288571 - David; Jeffrey Drue ; et al.	2013-10-31
Using spectra to determine polishing endpoints Grant 8,569,174 - Lee , et al. October 29, 2	2013-10-29
User-input Functions For Data Sequences In Polishing Endpoint Detection App 20130280989 - Lee; Harry Q. ; et al.	2013-10-24
Feedback For Polishing Rate Correction In Chemical Mechanical Polishing App 20130273812 - Qian; Jun ; et al.	2013-10-17
Spectrographic monitoring of a substrate during processing using index values Grant 8,554,351 - David , et al. October 8, 2	2013-10-08
Chemical mechanical polishing retaining ring Grant RE44,491 - Shendon , et al. September 10, 2	2013-09-10
Adjusting Polishing Rates by Using Spectrographic Monitoring of a Substrate During Processing App 20130204424 - David; Jeffrey Drue ; et al.	2013-08-08
Feedback for polishing rate correction in chemical mechanical polishing Grant 8,467,896 - Qian , et al. June 18, 2	2013-06-18
Semi-Quantitative Thickness Determination App 20130059499 - Benvegnu; Dominic J. ; et al.	2013-03-07
Multiple libraries for spectrographic monitoring of zones of a substrate during processing Grant 8,392,012 - David , et al. March 5, 2	2013-03-05
Adjusting polishing rates by using spectrographic monitoring of a substrate during processing Grant 8,369,978 - David , et al. February 5, 2	2013-02-05
Semi-quantitative thickness determination Grant 8,352,061 - Benvegnu , et al. January 8, 2	2013-01-08
Spectrographic Monitoring Of A Substrate During Processing Using Index Values App 20120323355 - David; Jeffrey Drue ; et al.	2012-12-20
Automatic Selection Of Reference Spectra Library App 20120276814 - Zhang; Jimin ; et al.	2012-11-01
Using optical metrology for wafer to wafer feed back process control Grant 8,292,693 - David , et al. October 23, 2	2012-10-23
Feedback For Polishing Rate Correction In Chemical Mechanical Polishing App 20120231701 - Qian; Jun ; et al.	2012-09-13
Spectrographic monitoring of a substrate during processing using index values Grant 8,260,446 - David , et al. September 4, 2	2012-09-04
Endpoint method using peak location of modified spectra Grant 8,202,738 - David , et al. June 19, 2	2012-06-19
Feedback for polishing rate correction in chemical mechanical polishing Grant 8,190,285 - Qian , et al. May 29, 2	2012-05-29
Multiple Matching Reference Spectra For In-situ Optical Monitoring App 20120100781 - Zhang; Jimin ; et al.	2012-04-26
Techniques For Matching Measured Spectra To Reference Spectra For In-situ Optical Monitoring App 20120034845 - Hu; Xiaoyuan ; et al.	2012-02-09
Spectrographic Monitoring Using Index Tracking After Detection Of Layer Clearing App 20120034844 - Zhang; Jimin ; et al.	2012-02-09
Detection Of Layer Clearing Using Spectral Monitoring App 20120026492 - Zhang; Jimin ; et al.	2012-02-02
Selecting Reference Libraries For Monitoring Of Multiple Zones On A Substrate App 20120028813 - Qian; Jun ; et al.	2012-02-02
Using Optical Metrology For Within Wafer Feed Forward Process Control App 20120028377 - David; Jeffrey Drue ; et al.	2012-02-02
Tracking Spectrum Features In Two Dimensions For Endpoint Detection App 20120021672 - David; Jeffrey Drue ; et al.	2012-01-26
Adaptively Tracking Spectrum Features For Endpoint Detection App 20110318992 - David; Jeffrey Drue ; et al.	2011-12-29
Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion Grant 8,079,894 - Tolles , et al. December 20, 2	2011-12-20
Automatic Initiation Of Reference Spectra Library Generation For Optical Monitoring App 20110301847 - David; Jeffrey Drue ; et al.	2011-12-08
Determining Physical Property of Substrate App 20110294400 - Ravid; Abraham ; et al.	2011-12-01
Endpoint Control Of Multiple Substrates With Multiple Zones On The Same Platen In Chemical Mechanical Polishing App 20110282477 - Lee; Harry Q. ; et al.	2011-11-17
Feedback For Polishing Rate Correction In Chemical Mechanical Polishing App 20110281501 - Qian; Jun ; et al.	2011-11-17
Endpoint Method Using Peak Location Of Modified Spectra App 20110275167 - David; Jeffrey Drue ; et al.	2011-11-10
Dynamically Tracking Spectrum Features For Endpoint Detection App 20110275281 - David; Jeffrey Drue ; et al.	2011-11-10
Automatic Generation of Reference Spectra for Optical Monitoring of Substrates App 20110269377 - Qian; Jun ; et al.	2011-11-03
Adaptively Tracking Spectrum Features For Endpoint Detection App 20110256805 - David; Jeffrey Drue ; et al.	2011-10-20
Using optical metrology for within wafer feed forward process control Grant 8,039,397 - David , et al. October 18, 2	2011-10-18
Determining physical property of substrate Grant 8,014,004 - Ravid , et al. September 6, 2	2011-09-06
High throughput measurement system Grant 7,952,708 - Ravid , et al. May 31, 2	2011-05-31
Endpoint Method Using Peak Location Of Spectra Contour Plots Versus Time App 20110104987 - David; Jeffrey Drue ; et al.	2011-05-05
Methods And Apparatus For Generating A Library Of Spectra App 20110046918 - Ravid; Abraham ; et al.	2011-02-24
Methods Of Using Optical Metrology For Feed Back And Feed Forward Process Control App 20100297916 - David; Jeffrey Drue ; et al.	2010-11-25
Methods and apparatus for generating a library of spectra Grant 7,840,375 - Ravid , et al. November 23, 2	2010-11-23
Determining Physical Property of Substrate App 20100261413 - Ravid; Abraham ; et al.	2010-10-14
Spectrographic Monitoring Of A Substrate During Processing Using Index Values App 20100217430 - David; Jeffrey Drue ; et al.	2010-08-26
Substrate thickness measuring during polishing Grant 7,774,086 - David , et al. August 10, 2	2010-08-10
Determining copper concentration in spectra Grant 7,768,659 - Benvegnu , et al. August 3, 2	2010-08-03
Determining physical property of substrate Grant 7,746,485 - Ravid , et al. June 29, 2	2010-06-29
Using Optical Metrology For Wafer To Wafer Feed Back Process Control App 20100130100 - David; Jeffrey Drue ; et al.	2010-05-27
Using Optical Metrology For Within Wafer Feed Forward Process Control App 20100129939 - David; Jeffrey Drue ; et al.	2010-05-27
Semi-Quantitative Thickness Determination App 20100124870 - Benvegnu; Dominic J. ; et al.	2010-05-20
Weighted Spectrographic Monitoring Of A Substrate During Processing App 20100114532 - David; Jeffrey Drue ; et al.	2010-05-06
Multiple Libraries For Spectrographic Monitoring Of Zones Of A Substrate During Processing App 20100105288 - David; Jeffrey Drue ; et al.	2010-04-29
Goodness Of Fit In Spectrographic Monitoring Of A Substrate During Processing App 20100103422 - David; Jeffrey Drue ; et al.	2010-04-29
Adjusting Polishing Rates by Using Spectrographic Monitoring of a Substrate During Processing App 20100056023 - David; Jeffrey Drue ; et al.	2010-03-04
Chemical Mechanical Polishing System Having Multiple Polishing Stations And Providing Relative Linear Polishing Motion App 20100035526 - Tolles; Robert D. ; et al.	2010-02-11
Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion Grant 7,614,939 - Tolles , et al. November 10, 2	2009-11-10
Endpoint Detection In Chemical Mechanical Polishing Using Multiple Spectra App 20090275265 - Qian; Jun ; et al.	2009-11-05
Determining Physical Property of Substrate App 20090033942 - Ravid; Abraham ; et al.	2009-02-05
Substrate Thickness Measuring During Polishing App 20090036026 - David; Jeffrey Drue ; et al.	2009-02-05
Determining physical property of substrate Grant 7,444,198 - Ravid , et al. October 28, 2	2008-10-28
Methods And Apparatus For Generating A Library Of Spectra App 20080243433 - Ravid; Abraham ; et al.	2008-10-02
High Throughput Measurement System App 20080239308 - Ravid; Abraham ; et al.	2008-10-02
Using Spectra to Determine Polishing Endpoints App 20080206993 - Lee; Harry Q. ; et al.	2008-08-28
Substrate thickness measuring during polishing Grant 7,409,260 - David , et al. August 5, 2	2008-08-05
Determining Physical Property Of Substrate App 20080146120 - Ravid; Abraham ; et al.	2008-06-19
Determining Copper Concentration In Spectra App 20080130000 - Benvegnu; Dominic J. ; et al.	2008-06-05
Chemical Mechanical Polishing System Having Multiple Polishing Stations And Providing Relative Linear Polishing Motion App 20070238399 - Tolles; Robert D. ; et al.	2007-10-11
Substrate Thickness Measuring During Polishing App 20070224915 - David; Jeffrey Drue ; et al.	2007-09-27
Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion Grant 7,255,632 - Tolles , et al. August 14, 2	2007-08-14
Polishing apparatus having a trough Grant 7,238,090 - Tolles , et al. July 3, 2	2007-07-03
Method for adjusting substrate processing times in a substrate polishing system Grant 7,175,505 - Ko , et al. February 13, 2	2007-02-13
Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion App 20060194525 - Tolles; Robert D. ; et al.	2006-08-31
Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion Grant 7,097,544 - Tolles , et al. August 29, 2	2006-08-29
Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion App 20050048880 - Tolles, Robert D. ; et al.	2005-03-03
System for chemical mechanical polishing having multiple polishing stations Grant 6,126,517 - Tolles , et al. October 3, 2	2000-10-03
Underwater wafer storage and wafer picking for chemical mechanical polishing Grant 6,080,046 - Shendon , et al. June 27, 2	2000-06-27
Radially oscillating carousel processing system for chemical mechanical polishing Grant 5,804,507 - Perlov , et al. September 8, 1	1998-09-08
Method and apparatus for using a retaining ring to control the edge effect Grant 5,795,215 - Guthrie , et al. August 18, 1	1998-08-18
Continuous processing system for chemical mechanical polishing Grant 5,738,574 - Tolles , et al. April 14, 1	1998-04-14
Carrier head design for a chemical mechanical polishing apparatus Grant 5,681,215 - Sherwood , et al. October 28, 1	1997-10-28
Apparatus and method for simulating and optimizing a chemical mechanical polishing system Grant 5,599,423 - Parker , et al. February 4, 1	1997-02-04
Method for automatically establishing a wafer coordinate system Grant 5,497,007 - Uritsky , et al. March 5, 1	1996-03-05
Particle analysis of notched wafers Grant 5,381,004 - Uritsky , et al. January 10, 1	1995-01-10
Method of particle analysis on a mirror wafer Grant 5,267,017 - Uritsky , et al. November 30, 1	1993-11-30