U.S. patent application number 13/198635 was filed with the patent office on 2012-02-09 for techniques for matching measured spectra to reference spectra for in-situ optical monitoring.
Invention is credited to Dominic J. Benvegnu, Jeffrey Drue David, Xiaoyuan Hu, Harry Q. Lee, Wen-Chiang Tu, Zhihong Wang, Jimin Zhang, Zhize Zhu.
Application Number | 20120034845 13/198635 |
Document ID | / |
Family ID | 45556483 |
Filed Date | 2012-02-09 |
United States Patent
Application |
20120034845 |
Kind Code |
A1 |
Hu; Xiaoyuan ; et
al. |
February 9, 2012 |
TECHNIQUES FOR MATCHING MEASURED SPECTRA TO REFERENCE SPECTRA FOR
IN-SITU OPTICAL MONITORING
Abstract
A method of controlling polishing includes storing a library
having a plurality of reference spectra, polishing a substrate,
measuring a sequence of spectra of light from the substrate during
polishing, for each measured spectrum of the sequence of spectra,
finding a best matching reference spectrum using a matching
technique other than sum of squared differences to generate a
sequence of best matching reference spectra, and determining at
least one of a polishing endpoint or an adjustment for a polishing
rate based on the sequence of best matching reference spectra.
Finding a best matching reference spectrum may include performing a
cross-correlation of the measured spectrum with each of two or more
of the plurality of reference spectra from the library and
selecting a reference spectrum with the greatest correlation to the
measured spectrum as a best matching reference spectrum.
Inventors: |
Hu; Xiaoyuan; (Milpitas,
CA) ; Wang; Zhihong; (Santa Clara, CA) ; Lee;
Harry Q.; (Los Altos, CA) ; Zhu; Zhize;
(Cupertino, CA) ; David; Jeffrey Drue; (San Jose,
CA) ; Benvegnu; Dominic J.; (La Honda, CA) ;
Zhang; Jimin; (San Jose, CA) ; Tu; Wen-Chiang;
(Mountain View, CA) |
Family ID: |
45556483 |
Appl. No.: |
13/198635 |
Filed: |
August 4, 2011 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
61371405 |
Aug 6, 2010 |
|
|
|
Current U.S.
Class: |
451/5 ;
451/6 |
Current CPC
Class: |
B24B 37/042 20130101;
B24B 37/107 20130101; B24B 37/013 20130101; B24B 37/205 20130101;
B24B 49/045 20130101; B24B 49/12 20130101 |
Class at
Publication: |
451/5 ;
451/6 |
International
Class: |
B24B 49/00 20120101
B24B049/00; B24B 51/00 20060101 B24B051/00 |
Claims
1. A method of controlling polishing, comprising: storing a library
having a plurality of reference spectra; polishing a substrate;
measuring a sequence of spectra of light from the substrate during
polishing; for each measured spectrum of the sequence of spectra,
finding a best matching reference spectrum using a matching
technique other than sum of squared differences to generate a
sequence of best matching reference spectra; and determining at
least one of a polishing endpoint or an adjustment for a polishing
rate based on the sequence of best matching reference spectra.
2. The method of claim 1, wherein finding a best matching reference
spectrum comprises performing a cross-correlation of the measured
spectrum with each of two or more of the plurality of reference
spectra from the library and selecting a reference spectrum with
the greatest correlation to the measured spectrum as a best
matching reference spectrum.
3. The method of claim 2, wherein each reference spectrum of the
plurality of reference spectra has a stored associated index value,
and further comprising determining the associated index value for
each best matching spectrum from the sequence of best matching
reference spectra to generate a sequence of index values, and
fitting a function to the sequence of index values.
4. The method of claim 3, further comprising halting the polishing
when the linear function matches or exceeds a target index.
5. The method of claim 2, wherein the substrate includes a second
layer overlying a first layer, the first layer having a different
composition than the second layer.
6. The method of claim 5, wherein the second layer is a barrier
layer and the first layer is a dielectric layer.
7. The method of claim 6, wherein the barrier layer is tantalum
nitride or titanium nitride and the dielectric layer is carbon
doped silicon dioxide or is formed from tetraethyl ortho
silicate.
8. The method of claim 5, wherein the function is fit to a portion
of the sequence of index values corresponding to spectra measured
after detection of exposure of the first layer.
9. The method of claim 1, wherein finding a best matching reference
spectrum comprises performing a sum of enclidean vector distances
between the measured spectrum and each of two or more of the
plurality of reference spectra from the library and selecting a
reference spectrum with the lowest sum as a best matching reference
spectrum.
10. The method of claim 1, wherein finding a best matching
reference spectrum comprises performing a sum of derivative
differences between the measured spectrum and each of two or more
of the plurality of reference spectra from the library and
selecting a reference spectrum with the lowest sum as a best
matching reference spectrum.
11. The method of claim 1, wherein measuring the sequence of
spectra of light from the substrate comprises making a plurality of
sweeps of a sensor across the substrate.
12. The method of claim 8, wherein each spectrum from the sequence
of spectra corresponds to a single sweep of the sensor from the
plurality of sweeps.
13. The method of claim 1, wherein the substrate includes a
plurality of zones, and a polishing rate of each zone is
independently controllable by an independently variable polishing
parameter, and further comprising: measuring a sequence of spectra
from each zone during polishing; for each measured spectrum in the
sequence of spectra for each zone, performing a cross-correlation
of the measured spectrum with each of two or more of the plurality
of reference spectra from the library and selecting a reference
spectrum with the greatest correlation to the measured spectrum as
a best matching reference spectrum from the library to generate a
sequence of best matching reference spectra; and adjusting the
polishing parameter for at least one zone to adjust the polishing
rate of the at least one zone such that the plurality of zones have
a smaller difference in thickness at the polishing endpoint than
without such adjustment.
14. A method of controlling polishing, comprising: storing a
library having a plurality of reference spectra; polishing a
substrate; measuring a sequence of spectra of light from the
substrate during polishing; for each measured spectrum of the
sequence of spectra, performing a cross-correlation of the measured
spectrum with each of two or more of the plurality of reference
spectra from the library and selecting a reference spectrum with
the greatest correlation to the measured spectrum as a best
matching reference spectrum to generate a sequence of best matching
reference spectra; and determining at least one of a polishing
endpoint or an adjustment for a polishing rate based on the
sequence of best matching reference spectra.
15. A polishing apparatus, comprising: a support to hold a
polishing pad; a carrier head to hold a substrate against the
polishing pad; a motor to generate relative motion between the
carrier head and the support to polish the substrate; an optical
monitoring system to measure a sequence of spectra of light from
the substrate while the substrate is being polished; and a
controller configured to store a library having a plurality of
reference spectra, each reference spectrum of the plurality of
reference spectra having a stored associated index value, for each
measured spectrum of the sequence of spectra, find a best matching
reference spectrum using a matching technique other than sum of
squared differences to generate a sequence of best matching
reference spectra; and determine at least one of a polishing
endpoint or an adjustment for a polishing rate based on the
sequence of best matching reference spectra.
16. The apparatus of claim 15, wherein the controller is configured
to perform a cross-correlation of the measured spectrum with each
of two or more of the plurality of reference spectra from the
library and select a reference spectrum with the greatest
correlation to the measured spectrum as the best matching reference
spectrum.
17. A computer program product, tangibly embodied in a machine
readable storage device, comprising instructions to: store a
library having a plurality of reference spectra; polish a
substrate; measure a sequence of spectra of light from the
substrate during polishing; for each measured spectrum of the
sequence of spectra, find a best matching reference spectrum using
a matching technique other than sum of squared differences to
generate a sequence of best matching reference spectra; and
determine at least one of a polishing endpoint or an adjustment for
a polishing rate based on the sequence of best matching reference
spectra.
18. The computer program product of claim 17, further comprising
instructions to perform a cross-correlation of the measured
spectrum with each of two or more of the plurality of reference
spectra from the library and select a reference spectrum with the
greatest correlation to the measured spectrum as the best matching
reference spectrum.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims the benefit of priority from
Provisional Application Ser. No. 61/371,405, filed Aug. 6, 2010,
which is incorporated by reference herein in its entirety.
TECHNICAL FIELD
[0002] The present disclosure relates to optical monitoring, e.g.,
during chemical mechanical polishing of substrates.
BACKGROUND
[0003] An integrated circuit is typically formed on a substrate by
the sequential deposition of conductive, semiconductive, or
insulative layers on a silicon wafer. One fabrication step involves
depositing a filler layer over a non-planar surface and planarizing
the filler layer. For certain applications, the filler layer is
planarized until the top surface of a patterned layer is exposed. A
conductive filler layer, for example, can be deposited on a
patterned insulative layer to fill the trenches or holes in the
insulative layer. After planarization, the portions of the
conductive layer remaining between the raised pattern of the
insulative layer form vias, plugs, and lines that provide
conductive paths between thin film circuits on the substrate. For
other applications, such as oxide polishing, the filler layer is
planarized until a predetermined thickness is left over the non
planar surface. In addition, planarization of the substrate surface
is usually required for photolithography.
[0004] Chemical mechanical polishing (CMP) is one accepted method
of planarization. This planarization method typically requires that
the substrate be mounted on a carrier head. The exposed surface of
the substrate is typically placed against a rotating polishing pad.
The carrier head provides a controllable load on the substrate to
push it against the polishing pad. A polishing liquid, such as a
slurry with abrasive particles, is typically supplied to the
surface of the polishing pad.
[0005] One problem in CMP is determining whether the polishing
process is complete, i.e., whether a substrate layer has been
planarized to a desired flatness or thickness, or when a desired
amount of material has been removed. Variations in the initial
thickness of the substrate layer, the slurry composition, the
polishing pad condition, the relative speed between the polishing
pad and the substrate, and the load on the substrate can cause
variations in the material removal rate. These variations cause
variations in the time needed to reach the polishing endpoint.
Therefore, it may not be possible to determine the polishing
endpoint merely as a function of polishing time.
[0006] In some systems, a substrate is optically monitored in-situ
during polishing, e.g., through a window in the polishing pad.
However, existing optical monitoring techniques may not satisfy
increasing demands of semiconductor device manufacturers.
SUMMARY
[0007] In some optical monitoring processes, a spectrum measured
in-situ, e.g., during the polishing processes, is compared to a
library of reference spectra to find the best matching reference
spectrum. One technique to find the best match is to calculate the
sum of squares difference between the measured spectrum and each
reference spectrum in the library; the reference spectrum with the
lowest sum of squared differences is the best match. However, for
polishing of some substrates, e.g., where multiple dielectric
layers are to be removed at the same platen, the matching algorithm
may be unreliable. Without being limited to any particular theory,
the sum of squared differences may be highly sensitive to the
position of peaks in the spectra, and variations in the thickness
of an underlying layer may cause shifts in the positions of the
peaks. However, it may be possible to reduce or avoid these
problems if another technique, such as cross-correlation, is used
to find the best matching reference spectrum.
[0008] In one aspect, a method of controlling polishing includes
storing a library having a plurality of reference spectra,
polishing a substrate, measuring a sequence of spectra of light
from the substrate during polishing, for each measured spectrum of
the sequence of spectra, finding a best matching reference spectrum
using a matching technique other than sum of squared differences to
generate a sequence of best matching reference spectra, and
determining at least one of a polishing endpoint or an adjustment
for a polishing rate based on the sequence of best matching
reference spectra.
[0009] Implementations can include one ore more of the following
features. Finding a best matching reference spectrum may include
performing a cross-correlation of the measured spectrum with each
of two or more of the plurality of reference spectra from the
library and selecting a reference spectrum with the greatest
correlation to the measured spectrum as a best matching reference
spectrum. Each reference spectrum of the plurality of reference
spectra may have a stored associated index value, and the
associated index value for each best matching spectrum from the
sequence of best matching reference spectra may be determined to
generate a sequence of index values, and a function may be fit to
the sequence of index values. Polishing may be halted when the
linear function matches or exceeds a target index. The substrate
may include a second layer overlying a first layer, the first layer
having a different composition than the second layer. The second
layer may be a barrier layer and the first layer may be a
dielectric layer. The barrier layer may be tantalum nitride or
titanium nitride and the dielectric layer may be carbon doped
silicon dioxide or may be formed from tetraethyl orthosilicate. The
function may be fit to a portion of the sequence of index values
corresponding to spectra measured after detection of exposure of
the first layer. Finding a best matching reference spectrum may
include performing a sum of enclidean vector distances between the
measured spectrum and each of two or more of the plurality of
reference spectra from the library and selecting a reference
spectrum with the lowest sum as a best matching reference spectrum.
Finding a best matching reference spectrum may include performing a
sum of derivative differences between the measured spectrum and
each of two or more of the plurality of reference spectra from the
library and selecting a reference spectrum with the lowest sum as a
best matching reference spectrum. Measuring the sequence of spectra
of light from the substrate may include making a plurality of
sweeps of a sensor across the substrate. Each spectrum from the
sequence of spectra may correspond to a single sweep of the sensor
from the plurality of sweeps. The substrate may include a plurality
of zones, and a polishing rate of each zone may be independently
controllable by an independently variable polishing parameter. A
sequence of spectra may be measured from each zone during
polishing. For each measured spectrum in the sequence of spectra
for each zone, a cross-correlation of the measured spectrum with
each of two or more of the plurality of reference spectra from the
library may be performed, and a reference spectrum with the
greatest correlation to the measured spectrum may be selected as a
best matching reference spectrum from the library to generate a
sequence of best matching reference spectra. The polishing
parameter for at least one zone may be adjusted to adjust the
polishing rate of the at least one zone such that the plurality of
zones have a smaller difference in thickness at the polishing
endpoint than without such adjustment.
[0010] In another aspect, a computer program product, tangibly
embodied in a machine readable storage device, includes
instructions to carry out the method.
[0011] In another aspect, a polishing apparatus includes a support
to hold a polishing pad, a carrier head to hold a substrate against
the polishing pad, a motor to generate relative motion between the
carrier head and the support to polish the substrate, an optical
monitoring system to measure a sequence of spectra of light from
the substrate while the substrate is being polished, and a
controller. The controller is configured to store a library having
a plurality of reference spectra, each reference spectrum of the
plurality of reference spectra having a stored associated index
value, for each measured spectrum of the sequence of spectra, find
a best matching reference spectrum using a matching technique other
than sum of squared differences to generate a sequence of best
matching reference spectra, and determine at least one of a
polishing endpoint or an adjustment for a polishing rate based on
the sequence of best matching reference spectra.
[0012] Implementations may optionally include one or more of the
following advantages. The matching technique can be less sensitive
to positions of peaks in the measured spectra, thereby reducing
sensitivity to underlying thickness variation. Reliability of the
endpoint system to detect a desired polishing endpoint can be
improved, and within-wafer and wafer-to-wafer thickness
non-uniformity (WTWNU and WTWNU) can be reduced.
[0013] The details of one or more embodiments are set forth in the
accompanying drawings and the description below. Other features,
aspects, and advantages will become apparent from the description,
the drawings, and the claims.
BRIEF DESCRIPTION OF THE DRAWINGS
[0014] FIGS. 1A and 1B are schematic cross-sectional views of a
substrate before and after polishing.
[0015] FIG. 2 illustrates a schematic cross-sectional view of an
example of a polishing apparatus.
[0016] FIG. 3 illustrates a schematic top view of a substrate
having multiple zones.
[0017] FIG. 4 illustrates a top view of a polishing pad and shows
locations where in-situ measurements are taken on a substrate.
[0018] FIG. 5 illustrates a measured spectrum from the in-situ
optical monitoring system.
[0019] FIG. 6 illustrates a library of reference spectra.
[0020] FIG. 7 illustrates an index trace.
[0021] FIG. 8 illustrates an index trace having a linear function
fit to index values collected after clearance of an overlying layer
is detected.
[0022] FIG. 9 is a flow diagram of an example process for
fabricating a substrate and detecting a polishing endpoint.
[0023] FIG. 10 illustrates a plurality of index traces.
[0024] FIG. 11 illustrates a calculation of a plurality of desired
slopes for a plurality of adjustable zones based on a time that an
index trace of a reference zone reaches a target index.
[0025] FIG. 12 illustrates a calculation of an endpoint for based
on a time that an index trace of a reference zone reaches a target
index.
[0026] FIG. 13 is a flow diagram of an example process for
adjusting the polishing rate of a plurality of zones in a plurality
of substrates such that the plurality of zones have approximately
the same thickness at the target time.
[0027] FIG. 14 shows a flow chart for detecting clearance of an
overlying layer.
[0028] FIG. 15A shows a graph of spectra collected during a single
sweep at the beginning of polishing.
[0029] FIG. 15B shows a graph of spectra collected during a single
sweep near barrier clearing.
[0030] FIG. 16 shows a graph of standard deviation of spectra as a
function of polishing time.
[0031] FIG. 17 is a graph showing a comparison of different
techniques for determining a best matching reference spectrum.
[0032] Like reference numbers and designations in the various
drawings indicate like elements.
DETAILED DESCRIPTION
[0033] One optical monitoring technique is to measure spectra of
light reflected from a substrate during polishing, and identify a
matching reference spectra from a library. The matching reference
spectra provide a series of index values, and a function, e.g., a
line, is fit to the series of index values. The projection of the
function to a target value can be used to determine endpoint or to
change a polishing rate.
[0034] One potential problem, for polishing of some types of
substrates, e.g., substrates in which multiple layers of material
are to be polished at the same platen, is that the technique used
to find the best matching spectrum from the library, e.g.,
selecting the reference spectrum with the lowest sum of squared
differences, can be unreliable. Without being limited to any
particular theory, a sum of squares difference may be highly
sensitive to the position of peaks in the spectra, and variations
in the thickness of an underlying layer may cause shifts in the
positions of the peaks. However, it may be possible to reduce or
avoid these problems if another technique, e.g., cross-correlation,
is used to find the best matching reference spectrum.
[0035] As an example, referring to FIG. 1A, a substrate 10 can
include a patterned first layer 12 (this layer can also be referred
to as an underlying layer) of a first dielectric material, e.g., a
low-k material, e.g., carbon doped silicon dioxide, e.g., Black
Diamond.TM. (from Applied Materials, Inc.) or Coral.TM. (from
Novellus Systems, Inc.). Disposed over the first layer 12 is a
second layer 16 (this layer can also be referred to as an overlying
layer) of a different second dielectric material, e.g., a barrier
layer, e.g., a nitride, e.g., tantalum nitride or titanium nitride.
Optionally disposed between the first layer and the second layer
are one or more additional layers 14 of another dielectric
material, different from both the first and second dielectric
materials, e.g., a low-k capping material, e.g., a material formed
from tetraethyl orthosilicate (TEOS). Together, the first layer 12
and the one or more additional layers 14 provide a layer stack
below the second layer. Disposed over the second layer (and in
trenches provided by the pattern of the first layer) is a
conductive material 18, e.g., a metal, e.g., copper.
[0036] Chemical mechanical polishing can be used to planarize the
substrate until the first layer of the first dielectric material is
exposed. For example, referring to FIG. 1B, after planarization,
the portions of the conductive material 18 remaining between the
raised pattern of the first layer 12 form vias and the like. In
addition, it is sometimes desired to remove the first dielectric
material until a target thickness remains or a target amount of
material has been removed.
[0037] One method of polishing is to polish the conductive material
on a first polishing pad at least until the second layer, e.g., the
barrier layer, is exposed. In addition, a portion of the thickness
of the second layer can be removed, e.g., during an overpolishing
step at the first polishing pad. The substrate is then transferred
to a second polishing pad, where the second layer, e.g., the
barrier layer is completely removed, and a portion of the thickness
of the underlying first layer, e.g., the low-k dielectric, is also
removed. In addition, if present, the additional layer or layers,
e.g., the capping layer, between the first and second layer can be
removed in the same polishing operation at the second polishing
pad.
[0038] FIG. 2 illustrates an example of a polishing apparatus 100.
The polishing apparatus 100 includes a rotatable disk-shaped platen
120 on which a polishing pad 110 is situated.
[0039] The platen is operable to rotate about an axis 125. For
example, a motor 121 can turn a drive shaft 124 to rotate the
platen 120. The polishing pad 110 can be a two-layer polishing pad
with an outer polishing layer 112 and a softer backing layer
114.
[0040] The polishing apparatus 100 can include a port 130 to
dispense polishing liquid 132, such as a slurry, onto the polishing
pad 110 to the pad. The polishing apparatus can also include a
polishing pad conditioner to abrade the polishing pad 110 to
maintain the polishing pad 110 in a consistent abrasive state.
[0041] The polishing apparatus 100 includes one or more carrier
heads 140. Each carrier head 140 is operable to hold a substrate 10
against the polishing pad 110. Each carrier head 140 can have
independent control of the polishing parameters, for example
pressure, associated with each respective substrate.
[0042] In particular, each carrier head 140 can include a retaining
ring 142 to retain the substrate 10 below a flexible membrane 144.
Each carrier head 140 also includes a plurality of independently
controllable pressurizable chambers defined by the membrane, e.g.,
3 chambers 146a-146c, which can apply independently controllable
pressurizes to associated zones 148a-148c on the flexible membrane
144 and thus on the substrate 10 (see FIG. 3). Referring to FIG. 2,
the center zone 148a can be substantially circular, and the
remaining zones 148b-148e can be concentric annular zones around
the center zone 148a. Although only three chambers are illustrated
in FIGS. 2 and 3 for ease of illustration, there could be one or
two chambers, or four or more chambers, e.g., five chambers.
[0043] Returning to FIG. 2, each carrier head 140 is suspended from
a support structure 150, e.g., a carousel, and is connected by a
drive shaft 152 to a carrier head rotation motor 154 so that the
carrier head can rotate about an axis 155. Optionally each carrier
head 140 can oscillate laterally, e.g., on sliders on the carousel
150; or by rotational oscillation of the carousel itself. In
operation, the platen is rotated about its central axis 125, and
each carrier head is rotated about its central axis 155 and
translated laterally across the top surface of the polishing
pad.
[0044] While only one carrier head 140 is shown, more carrier heads
can be provided to hold additional substrates so that the surface
area of polishing pad 110 may be used efficiently. Thus, the number
of carrier head assemblies adapted to hold substrates for a
simultaneous polishing process can be based, at least in part, on
the surface area of the polishing pad 110.
[0045] The polishing apparatus also includes an in-situ optical
monitoring system 160, e.g., a spectrographic monitoring system,
which can be used to determine whether to adjust a polishing rate
or an adjustment for the polishing rate as discussed below. An
optical access through the polishing pad is provided by including
an aperture (i.e., a hole that runs through the pad) or a solid
window 118. The solid window 118 can be secured to the polishing
pad 110, e.g., as a plug that fills an aperture in the polishing
pad, e.g., is molded to or adhesively secured to the polishing pad,
although in some implementations the solid window can be supported
on the platen 120 and project into an aperture in the polishing
pad.
[0046] The optical monitoring system 160 can include a light source
162, a light detector 164, and circuitry 166 for sending and
receiving signals between a remote controller 190, e.g., a
computer, and the light source 162 and light detector 164. One or
more optical fibers can be used to transmit the light from the
light source 162 to the optical access in the polishing pad, and to
transmit light reflected from the substrate 10 to the detector 164.
For example, a bifurcated optical fiber 170 can be used to transmit
the light from the light source 162 to the substrate 10 and back to
the detector 164. The bifurcated optical fiber an include a trunk
172 positioned in proximity to the optical access, and two branches
174 and 176 connected to the light source 162 and detector 164,
respectively.
[0047] In some implementations, the top surface of the platen can
include a recess 128 into which is fit an optical head 168 that
holds one end of the trunk 172 of the bifurcated fiber. The optical
head 168 can include a mechanism to adjust the vertical distance
between the top of the trunk 172 and the solid window 118.
[0048] The output of the circuitry 166 can be a digital electronic
signal that passes through a rotary coupler 129, e.g., a slip ring,
in the drive shaft 124 to the controller 190 for the optical
monitoring system. Similarly, the light source can be turned on or
off in response to control commands in digital electronic signals
that pass from the controller 190 through the rotary coupler 129 to
the optical monitoring system 160. Alternatively, the circuitry 166
could communicate with the controller 190 by a wireless signal.
[0049] The light source 162 can be operable to emit white light. In
one implementation, the white light emitted includes light having
wavelengths of 200-800 nanometers. A suitable light source is a
xenon lamp or a xenon mercury lamp.
[0050] The light detector 164 can be a spectrometer. A spectrometer
is an optical instrument for measuring intensity of light over a
portion of the electromagnetic spectrum. A suitable spectrometer is
a grating spectrometer. Typical output for a spectrometer is the
intensity of the light as a function of wavelength (or
frequency).
[0051] As noted above, the light source 162 and light detector 164
can be connected to a computing device, e.g., the controller 190,
operable to control their operation and receive their signals. The
computing device can include a microprocessor situated near the
polishing apparatus, e.g., a programmable computer. With respect to
control, the computing device can, for example, synchronize
activation of the light source with the rotation of the platen
120.
[0052] In some implementations, the light source 162 and detector
164 of the in-situ monitoring system 160 are installed in and
rotate with the platen 120. In this case, the motion of the platen
will cause the sensor to scan across each substrate. In particular,
as the platen 120 rotates, the controller 190 can cause the light
source 162 to emit a series of flashes starting just before and
ending just after the optical access passes below the substrate 10.
Alternatively, the computing device can cause the light source 162
to emit light continuously starting just before and ending just
after each substrate 10 passes over the optical access. In either
case, the signal from the detector can be integrated over a
sampling period to generate spectra measurements at a sampling
frequency.
[0053] In operation, the controller 190 can receive, for example, a
signal that carries information describing a spectrum of the light
received by the light detector for a particular flash of the light
source or time frame of the detector. Thus, this spectrum is a
spectrum measured in-situ during polishing.
[0054] As shown by in FIG. 4, if the detector is installed in the
platen, due to the rotation of the platen (shown by arrow 204), as
the window 108 travels below a carrier head, the optical monitoring
system making spectra measurements at a sampling frequency will
cause the spectra measurements to be taken at locations 201 in an
arc that traverses the substrate 10. For example, each of points
201a-201k represents a location of a spectrum measurement by the
monitoring system (the number of points is illustrative; more or
fewer measurements can be taken than illustrated, depending on the
sampling frequency). The sampling frequency can be selected so that
between five and twenty spectra are collected per sweep of the
window 108. For example, the sampling period can be between 3 and
100 milliseconds.
[0055] As shown, over one rotation of the platen, spectra are
obtained from different radii on the substrate 10. That is, some
spectra are obtained from locations closer to the center of the
substrate 10 and some are closer to the edge. Thus, for any given
scan of the optical monitoring system across a substrate, based on
timing, motor encoder information, and optical detection of the
edge of the substrate and/or retaining ring, the controller 190 can
calculate the radial position (relative to the center of the
substrate being scanned) for each measured spectrum from the scan.
The polishing system can also include a rotary position sensor,
e.g., a flange attached to an edge of the platen that will pass
through a stationary optical interrupter, to provide additional
data for determination of which substrate and the position on the
substrate of the measured spectrum. The controller can thus
associate the various measured spectra with the controllable zones
148b-148e (see FIG. 2) on the substrates 10a and 10b. In some
implementations, the time of measurement of the spectrum can be
used as a substitute for the exact calculation of the radial
position.
[0056] Over multiple rotations of the platen, for each zone, a
sequence of spectra can be obtained over time. Without being
limited to any particular theory, the spectrum of light reflected
from the substrate 10 evolves as polishing progresses (e.g., over
multiple rotations of the platen, not during a single sweep across
the substrate) due to changes in the thickness of the outermost
layer, thus yielding a sequence of time-varying spectra. Moreover,
particular spectra are exhibited by particular thicknesses of the
layer stack.
[0057] In some implementations, the controller, e.g., the computing
device, can be programmed to compare a measured spectrum to
multiple reference spectra and to determine which reference
spectrum provides the best match. In particular, the controller can
be programmed to compare each spectrum from a sequence of measured
spectra from each zone to multiple reference spectra to generate a
sequence of best matching reference spectra for each zone.
[0058] As used herein, a reference spectrum is a predefined
spectrum generated prior to polishing of the substrate. A reference
spectrum can have a pre-defined association, i.e., defined prior to
the polishing operation, with a value representing a time in the
polishing process at which the spectrum is expected to appear,
assuming that the actual polishing rate follows an expected
polishing rate. Alternatively or in addition, the reference
spectrum can have a pre-defined association with a value of a
substrate property, such as a thickness of the outermost layer.
[0059] A reference spectrum can be generated empirically, e.g., by
measuring the spectra from a test substrate, e.g., a test substrate
having a known initial layer thicknesses. For example, to generate
a plurality of reference spectra, a set-up substrate is polished
using the same polishing parameters that would be used during
polishing of device wafers while a sequence of spectra are
collected. For each spectrum, a value is recorded representing the
time in the polishing process at which the spectrum was collected.
For example, the value can be an elapsed time, or a number of
platen rotations. The substrate can be overpolished, i.e., polished
past a desired thickness, so that the spectrum of the light that
reflected from the substrate when the target thickness is achieved
can be obtained.
[0060] In order to associate each spectrum with a value of a
substrate property, e.g., a thickness of the outermost layer, the
initial spectra and property of a "set-up" substrate with the same
pattern as the product substrate can be measured pre-polish at a
metrology station. The final spectrum and property can also be
measured post-polish with the same metrology station or a different
metrology station. The properties for spectra between the initial
spectra and final spectra can be determined by interpolation, e.g.,
linear interpolation based on elapsed time at which the spectra of
the test substrate was measured.
[0061] In addition to being determined empirically, some or all of
the reference spectra can be calculated from theory, e.g., using an
optical model of the substrate layers. For example, and optical
model can be used to calculate a reference spectrum for a given
outer layer thickness D. A value representing the time in the
polishing process at which the reference spectrum would be
collected can be calculated, e.g., by assuming that the outer layer
is removed at a uniform polishing rate. For example, the time Ts
for a particular reference spectrum can be calculated simply by
assuming a starting thickness D0 and uniform polishing rate R
(Ts=(D0-D)/R). As another example, linear interpolation between
measurement times T1, T2 for the pre-polish and post-polish
thicknesses D1, D2 (or other thicknesses measured at the metrology
station) based on the thickness D used for the optical model can be
performed (Ts=T2-T1*(D1-D)/(D1-D2)).
[0062] Referring to FIGS. 5 and 6, a measured spectrum 300 (see
FIG. 5) can be compared to reference spectra 320 from one or more
libraries 310 (see FIG. 6). As used herein, a library of reference
spectra is a collection of reference spectra which represent
substrates that share a property in common. However, the property
shared in common in a single library may vary across multiple
libraries of reference spectra. For example, two different
libraries can include reference spectra that represent substrates
with two different underlying thicknesses. For a given library of
reference spectra, variations in the upper layer thickness, rather
than other factors (such as differences in wafer pattern,
underlying layer thickness, or layer composition), can be primarily
responsible for the differences in the spectral intensities.
[0063] Reference spectra 320 for different libraries 310 can be
generated by polishing multiple "set-up" substrates with different
substrate properties (e.g., underlying layer thicknesses, or layer
composition) and collecting spectra as discussed above; the spectra
from one set-up substrate can provide a first library and the
spectra from another substrate with a different underlying layer
thickness can provide a second library. Alternatively or in
addition, reference spectra for different libraries can be
calculated from theory, e.g., spectra for a first library can be
calculated using the optical model with the underlying layer having
a first thickness, and spectra for a second library can be
calculated using the optical model with the underlying layer having
a different one thickness.
[0064] In some implementations, each reference spectrum 320 is
assigned an index value 330. In general, each library 310 can
include many reference spectra 320, e.g., one or more, e.g.,
exactly one, reference spectra for each platen rotation over the
expected polishing time of the substrate. This index 330 can be the
value, e.g., a number, representing the time in the polishing
process at which the reference spectrum 320 is expected to be
observed. The spectra can be indexed so that each spectrum in a
particular library has a unique index value. The indexing can be
implemented so that the index values are sequenced in an order in
which the spectra of a test substrate were measured. An index value
can be selected to change monotonically, e.g., increase or
decrease, as polishing progresses. In particular, the index values
of the reference spectra can be selected so that they form a linear
function of time or number of platen rotations (assuming that the
polishing rate follows that of the model or test substrate used to
generate the reference spectra in the library). For example, the
index value can be proportional, e.g., equal, to a number of platen
rotations at which the reference spectra was measured for the test
substrate or would appear in the optical model. Thus, each index
value can be a whole number. The index number can represent the
expected platen rotation at which the associated spectrum would
appear.
[0065] The reference spectra and their associated index values can
be stored in a reference library. For example, each reference
spectrum 320 and its associated index value 330 can be stored in a
record 340 of database 350. The database 350 of reference libraries
of reference spectra can be implemented in memory of the computing
device of the polishing apparatus.
[0066] As noted above, for each zone of each substrate, based on
the sequence of measured spectra or that zone and substrate, the
controller 190 can be programmed to generate a sequence of best
matching spectra. A best matching reference spectrum can be
determined by comparing a measured spectrum to the reference
spectra from a particular library.
[0067] In some implementations, the best matching reference
spectrum can be determined by calculating, for each reference
spectrum, a sum of squared differences between the measured
spectrum and the reference spectrum. The reference spectrum with
the lowest sum of squared differences has the best fit. Other
techniques for finding a best matching reference spectrum are
possible, e.g., lowest sum of absolute differences.
[0068] In some implementations, the best matching reference
spectrum can be determined by using a matching technique other than
sum of squared differences. In one implementation, for each
reference spectrum, a cross-correlation between the measured
spectrum and the reference spectrum is calculated, and the
reference spectrum with the greatest correlation is selected as the
matching reference spectrum. A potential advantage of
cross-correlation is that it is less sensitive to lateral shift of
a spectrum, and thus can be less sensitive to underlying thickness
variation. In order to perform the cross-correlation, the leading
and trailing ends of the measured spectrum can be padded with
"zeros" to provide data to compare against the reference spectrum
as the reference spectrum is shifted relative to the measured
spectrum. Alternatively, the leading end of the measured spectrum
can be padded with values equal to the value at the leading edge of
the measured spectrum, and he trailing end of the measured spectrum
can be padded with values equal to the value at the trailing edge
of the measured spectrum. Fast Fourier transforms can be used to
increase the speed of calculation of the cross-correlation for
real-time application of the matching technique.
[0069] In another implementation, a sum of enclidean vector
distances, e.g.,
D=1/(.lamda.a-.lamda.b)[.SIGMA..sub..lamda.=.lamda.a to
.lamda.b.sym.I.sub.M(.lamda.).sup.2-I.sub.R(.lamda.).sup.2|], where
.lamda.a to .lamda.b is wavelength summed over, calculated,
I.sub.M(.lamda.) is the measured spectrum, and I.sub.R(.lamda.) is
the reference spectrum. In another implementation, for each
reference spectrum, a sum of derivative differences, e.g.,
D=1/(.lamda.a-.lamda.b)[.SIGMA..sub..lamda.=.lamda.a to
.lamda.b|dI.sub.M(.lamda.)/d.lamda.-dI.sub.R(.lamda.)/d.lamda.|],
and the reference spectrum with the lowest sum is selected as the
matching reference spectrum.
[0070] FIG. 17 illustrates a comparison of index traces (indexes of
best matching reference spectra as a function number of platen
rotations) for spectra matching using cross-correlation and sum of
squared differences methods for substrates with different
thicknesses of the TEOS layer. The data was generated for product
substrates having a stack of 1500 {acute over (.ANG.)} thick layer
of Black Diamond, a 130 {acute over (.ANG.)} thick layer of Blok,
and a TEOS layer that is 5200 {acute over (.ANG.)}, 5100 {acute
over (.ANG.)} or 5000 {acute over (.ANG.)} thick. A reference
library was generated for a reference substrate having a TEOS layer
that is 5200 {acute over (.ANG.)} thick. As shown by trace 1702,
where the product substrate and the reference substrate have a TEOS
layer of the same thickness, i.e., 5200 {acute over (.ANG.)}, the
two index traces overlap with no appreciable difference. However,
where product substrate has a TEOS layer that is 5100 {acute over
(.ANG.)} thick and the reference substrate has a TEOS layer 5200
{acute over (.ANG.)} thick, the index trace 1704 generated using
sum of squared differences has some departure from linear behavior.
In contrast, the index trace generated using cross-correlation
overlaps the index trace 1702 (and is thus not visible in the
graph). Finally, where product substrate has a TEOS layer that is
5000 {acute over (.ANG.)} thick and the reference substrate has a
TEOS layer 5200 {acute over (.ANG.)} thick, the index trace 1706
generated using sum of squared differences has a significant
departure from linear behavior and the trace 1702, whereas the
index trace 1708 generated using cross-correlation remains
generally linear and much closer to the trace 1702. In sum, this
shows that using cross-correlation to determine the best matching
spectrum results in a trace that better matches the ideal when
there are variations in the thickness of the underlying layer.
[0071] A method that can be applied to decrease computer processing
is to limit the portion of the library that is searched for
matching spectra. The library typically includes a wider range of
spectra than will be obtained while polishing a substrate. During
substrate polishing, the library searching is limited to a
predetermined range of library spectra. In some embodiments, the
current rotational index N of a substrate being polished is
determined. For example, in an initial platen rotation, N can be
determined by searching all of the reference spectra of the
library. For the spectra obtained during a subsequent rotation, the
library is searched within a range of freedom of N. That is, if
during one rotation the index number is found to be N, during a
subsequent rotation which is X rotations later, where the freedom
is Y, the range that will be searched from (N+X)-Y to (N+X)+Y.
[0072] Referring to FIG. 7, which illustrates the results for only
a single zone of a single substrate, the index value of each of the
best matching spectra in the sequence can be determined to generate
a time-varying sequence of index values 212. This sequence of index
values can be termed an index trace 210. In some implementations,
an index trace is generated by comparing each measured spectrum to
the reference spectra from exactly one library. In general, the
index trace 210 can include one, e.g., exactly one, index value per
sweep of the optical monitoring system below the substrate.
[0073] For a given index trace 210, where there are multiple
spectra measured for a particular zone in a single sweep of the
optical monitoring system (termed "current spectra"), a best match
can be determined between each of the current spectra and the
reference spectra of one or more, e.g., exactly one, library. In
some implementations, each selected current spectra is compared
against each reference spectra of the selected library or
libraries. Given current spectra e, f, and g, and reference spectra
E, F, and G, for example, a matching coefficient could be
calculated for each of the following combinations of current and
reference spectra: e and E, e and F, e and G, f and E, f and F, f
and G, g and E, g and F, and g and G. Whichever matching
coefficient indicates the best match, e.g., is the smallest,
determines the best-matching reference spectrum, and thus the index
value. Alternatively, in some implementations, the current spectra
can be combined, e.g., averaged, and the resulting combined
spectrum is compared against the reference spectra to determine the
best match, and thus the index value.
[0074] In some implementations, for at least some zones of some
substrates, a plurality of index traces can be generated. For a
given zone of a given substrate, an index trace can be generated
for each reference library of interest. That is, for each reference
library of interest to the given zone of the given substrate, each
measured spectrum in a sequence of measured spectra is compared to
reference spectra from a given library, a sequence of the best
matching reference spectra is determined, and the index values of
the sequence of best matching reference spectra provide the index
trace for the given library.
[0075] In summary, each index trace includes a sequence 210 of
index values 212, with each particular index value 212 of the
sequence being generated by selecting the index of the reference
spectrum from a given library that is the closest fit to the
measured spectrum. The time value for each index of the index trace
210 can be the same as the time at which the measured spectrum was
measured.
[0076] An in-situ monitoring technique is used to detect clearing
of the second layer and exposure of the underlying layer or layer
structure. For example, exposure of the first layer at a time TC
can be detected by a sudden change in the motor torque or total
intensity of light reflected from the substrate, or from dispersion
of the collected spectra as discussed in greater detail below.
[0077] As shown in FIG. 8, a function, e.g., a polynomial function
of known order, e.g., a first-order function (e.g., a line 214) is
fit to the sequence of index values of spectra collected after time
TC, e.g., using robust line fitting. Index values for spectra
collected before the time TC are ignored when fitting the function
to the sequence of index values. Other functions can be used, e.g.,
polynomial functions of second-order, but a line provides ease of
computation. Polishing can be halted at an endpoint time TE that
the line 214 crosses a target index IT.
[0078] FIG. 9 shows a flow chart of a method of fabricating and
polishing a product substrate. The product substrate can have at
least the same layer structure and the same pattern, as the test
substrates used to generate the reference spectra of the
library.
[0079] Initially, the first layer is deposited on the substrate and
patterned (step 902). As noted above, the first layer can be a
dielectric, e.g., a low-k material, e.g., carbon doped silicon
dioxide, e.g., Black Diamond.TM. (from Applied Materials, Inc.) or
Coral.TM. (from Novellus Systems, Inc.).
[0080] Optionally, depending on the composition of the first
material, one or more additional layers of another dielectric
material, different from both the first and second dielectric
materials, e.g., a low-k capping material, e.g., tetraethyl
orthosilicate (TEOS), is deposited over the first layer on the
product substrate (step 903). Together, the first layer and the one
or more additional layers provide a layer stack. Optionally,
patterning can occur after depositing of the one or more additional
layers (so that the one or more additional layers do not extend
into the trench in the first layer, as shown in FIG. 1A).
[0081] Next, the second layer of a different second dielectric
material, e.g., a barrier layer, e.g., a nitride, e.g., tantalum
nitride or titanium nitride, is deposited over the first layer or
layer stack of the product substrate (step 904). In addition, a
conductive layer, e.g., a metal layer, e.g., copper, can be
deposited over the second layer of the product substrate (and in
trenches provided by the pattern of the first layer) (step 906).
Optionally, patterning of the first layer can occur after
depositing of the second layer (in which case the second layer
would not extend into the trench in the first layer).
[0082] The product substrate is polished (step 908). For example,
the conductive layer and a portion of the second layer can be
polished and removed at a first polishing station using a first
polishing pad (step 908a). Then the second layer and a portion of
the first layer can be polished and removed at a second polishing
station using a second polishing pad (step 908b). However, it
should be noted that for some implementations, there is no
conductive layer, e.g., the second layer is the outermost layer
when polishing begins. Of course, steps 902-906 can be performed
elsewhere, so that the process for a particular operator of the
polishing apparatus begins with step 908.
[0083] An in-situ monitoring technique is used to detect clearing
of the second layer and exposure of the first layer (step 910). For
example, exposure of the first layer at a time TC (see FIG. 8) can
be detected by a sudden change in the motor torque or total
intensity of light reflected from the substrate, or from dispersion
of the collected spectra as discussed in greater detail below.
[0084] Beginning at least with detection of the clearance of second
layer (and potentially earlier, e.g., from the beginning of
polishing of the product substrate with the second polishing pad),
a sequence of measured spectra are obtained during polishing (step
912), e.g., using the in-situ monitoring system described
above.
[0085] The measured spectra are analyzed to generate a sequence of
index values, and a function is fit to the sequence of index
values. In particular, for each measured spectrum in the sequence
of measured spectra, the index value for the reference spectrum
that is the best fit is determined to generate the sequence of
index values (step 914). A function, e.g., a linear function, is
fit to the sequence of index values for the spectra collected after
the time TC at which clearance of the second layer is detected
(step 916). In other words, index values for spectra collected
before the time TC at which clearance of the second layer is
detected are not used in the calculation of the function.
[0086] Polishing can be halted once the index value (e.g., a
calculated index value generated from the linear function fit to
the new sequence of index values) reaches target index (step 918).
The target thickness IT can be set by the user prior to the
polishing operation and stored. Alternatively, a target amount to
remove can be set by the user, and a target index IT can be
calculated from the target amount to remove. For example, an index
difference ID can be calculated from the target amount to remove,
e.g., from an empirically determined ratio of amount removed to the
index (e.g., the polishing rate), and adding the index difference
ID to the index value IC at the time TC that clearance of the
overlying layer is detected (see FIG. 8).
[0087] It is also possible to use the function fit to the index
values from spectra collected after clearance of the second layer
is detected to adjust the polishing parameters, e.g., to adjust the
polishing rate of one or more zones on a substrate to improve
polishing uniformity.
[0088] Referring to FIG. 10, a plurality of index traces is
illustrated. As discussed above, an index trace can be generated
for each zone. For example, a first sequence 210 of index values
212 (shown by hollow circles) can be generated for a first zone, a
second sequence 220 of index values 222 (shown by hollow squares)
can be generated for a second zone, and a third sequence 230 of
index values 232 (shown by hollow triangles) can be generated for a
third zone. Although three zones are shown, there could be two
zones or four or more zones. All of the zones can be on the same
substrate, or some of the zones can be from different substrates
being polished simultaneously on the same platen.
[0089] As discussed above, an in-situ monitoring technique is used
to detect clearing of the second layer and exposure of the
underlying layer or layer structure. For example, exposure of the
first layer at a time TC can be detected by a sudden change in the
motor torque or total intensity of light reflected from the
substrate, or from dispersion of the collected spectra as discussed
in greater detail below.
[0090] For each substrate index trace, a polynomial function of
known order, e.g., a first-order function (e.g., a line) is fit to
the sequence of index values of spectra collected after time TC for
the associated zone, e.g., using robust line fitting. For example,
a first line 214 can be fit to index values 212 for the first zone,
a second line 224 can be fit to the index values 222 of the second
zone, and a third line 234 can be fit to the index values 232 of
the third zone. Fitting of a line to the index values can include
calculation of the slope S of the line and an x-axis intersection
time T at which the line crosses a starting index value, e.g., 0.
The function can be expressed in the form I(t)=S(t-T), where t is
time. The x-axis intersection time T can have a negative value,
indicating that the starting thickness of the substrate layer is
less than expected. Thus, the first line 214 can have a first slope
S1 and a first x-axis intersection time T1, the second line 224 can
have a second slope S2 and a second x-axis intersection time T2,
and the third line 234 can have a third slope S3 and a third x-axis
intersection time T3.
[0091] At some during the polishing process, e.g., at a time T0, a
polishing parameter for at least one zone is adjusted to adjust the
polishing rate of the zone of the substrate such that at a
polishing endpoint time, the plurality of zones are closer to their
target thickness than without such adjustment. In some embodiments,
each zone can have approximately the same thickness at the endpoint
time.
[0092] Referring to FIG. 11, in some implementations, one zone is
selected as a reference zone, and a projected endpoint time TE at
which the reference zone will reach a target index IT is
determined. For example, as shown in FIG. 11, the first zone is
selected as the reference zone, although a different zone and/or a
different substrate could be selected. The target thickness IT is
set by the user prior to the polishing operation and stored.
Alternatively, a target amount to remove TR can be set by the user,
and a target index IT can be calculated from the target amount to
remove TR. For example, an index difference ID can be calculated
from the target amount to remove, e.g., from an empirically
determined ratio of amount removed to the index (e.g., the
polishing rate), and adding the index difference ID to the index
value IC at the time TC that clearance of the overlying layer is
detected.
[0093] In order to determine the projected time at which the
reference zone will reach the target index, the intersection of the
line of the reference zone, e.g., line 214, with the target index,
IT, can be calculated. Assuming that the polishing rate does not
deviate from the expected polishing rate through the remainder
polishing process, then the sequence of index values should retain
a substantially linear progression. Thus, the expected endpoint
time TE can be calculated as a simple linear interpolation of the
line to the target index IT, e.g., IT=S(TE-T). Thus, in the example
of FIG. 11 in which the first zone is selected as the reference
zone, with associated first line 214, IT=S1(TE-T1), i.e.,
TE=IT/S1-T1.
[0094] One or more zones, e.g., all zones, other than the reference
zone (including zones on other substrates) can be defined as
adjustable zones. Where the lines for the adjustable zones meet the
expected endpoint time TE define projected endpoint for the
adjustable zones. The linear function of each adjustable zone,
e.g., lines 224 and 234 in FIG. 11, can thus be used to extrapolate
the index, e.g., EI2 and EI3, that will be achieved at the expected
endpoint time ET for the associated zone. For example, the second
line 224 can be used to extrapolate the expected index, EI2, at the
expected endpoint time ET for the second zone, and the third line
234 can be used to extrapolate the expected index, EI3, at the
expected endpoint time ET for the third zone.
[0095] As shown in FIG. 11, if no adjustments are made to the
polishing rate of any of the zones after time T0, then if endpoint
is forced at the same time for all zones, then each zone can have a
different thickness (which is not desirable because it can lead to
defects and loss of throughput).
[0096] If the target index will be reached at different times for
different zones (or equivalently, the adjustable zones will have
different expected indexes at the projected endpoint time of the
reference zone), the polishing rate can be adjusted upwardly or
downwardly, such that the zones would reach the target index (and
thus target thickness) closer to the same time than without such
adjustment, e.g., at approximately the same time, or would have
closer to the same index value (and thus same thickness), at the
target time than without such adjustment, e.g., approximately the
same index value (and thus approximately the same thickness).
[0097] Thus, in the example of FIG. 11, commencing at a time T0, at
least one polishing parameter for the second zone is modified so
that the polishing rate of the zone is increased (and as a result
the slope of the index trace 220 is increased). Also, in this
example, at least one polishing parameter for the third zone is
modified so that the polishing rate of the third zone is decreased
(and as a result the slope of the index trace 230 is decreased). As
a result the zones would reach the target index (and thus the
target thickness) at approximately the same time (or if pressure to
the zones halts at the same time, the zones will end with
approximately the same thickness).
[0098] In some implementations, if the projected index at the
expected endpoint time ET indicate that a zone of the substrate is
within a predefined range of the target thickness, then no
adjustment may be required for that zone. The range may be 2%,
e.g., within 1%, of the target index.
[0099] The polishing rates for the adjustable zones can be adjusted
so that all of the zones are closer to the target index at the
expected endpoint time than without such adjustment. For example, a
reference zone of the reference substrate might be chosen and the
processing parameters for all of the other zone adjusted such that
all of the zones will endpoint at approximately the projected time
of the reference substrate. The reference zone can be, for example,
a predetermined zone, e.g., the center zone 148a or the zone 148b
immediately surrounding the center zone, the zone having the
earliest or latest projected endpoint time of any of the zones of
any of the substrates, or the zone of a substrate having the
desired projected endpoint. The earliest time is equivalent to the
thinnest substrate if polishing is halted at the same time.
Likewise, the latest time is equivalent to the thickest substrate
if polishing is halted at the same time. The reference substrate
can be, for example, a predetermined substrate, a substrate having
the zone with the earliest or latest projected endpoint time of the
substrates. The earliest time is equivalent to the thinnest zone if
polishing is halted at the same time. Likewise, the latest time is
equivalent to the thickest zone if polishing is halted at the same
time.
[0100] For each of the adjustable zones, a desired slope for the
index trace can be calculated such that the adjustable zone reaches
the target index at the same time as the reference zone. For
example, the desired slope SD can be calculated from
(IT-I)=SD*(TE-T0), where I is the index value (calculated from the
linear function fit to the sequence of index values) at time T0
polishing parameter is to be changed, IT is the target index, and
TE is the calculated expected endpoint time. In the example of FIG.
11, for the second zone the desired slope SD2 can be calculated
from (IT-I2)=SD2*(TE-T0), and for the third zone the desired slope
SD3 can be calculated from (IT-I3)=SD3*(TE-T0).
[0101] Alternatively, in some implementations, there is no
reference zone, and the expected endpoint time can be a
predetermined time, e.g., set by the user prior to the polishing
process, or can be calculated from an average or other combination
of the expected endpoint times of two or more zones (as calculated
by projecting the lines for various zones to the target index) from
one or more substrates. In this implementation, the desired slopes
are calculated substantially as discussed above, although the
desired slope for the first zone of the first substrate must also
be calculated, e.g., the desired slope SD1 can be calculated from
(IT-I1)=SD1*(TE'-T0).
[0102] Alternatively, in some implementations, there are different
target indexes for different zones. This permits the creation of a
deliberate but controllable non-uniform thickness profile on the
substrate. The target indexes can be entered by user, e.g., using
an input device on the controller. For example, the first zone of
the first substrate can have a first target index, the second zone
of the first substrate can have a second target index, the first
zone of the second substrate can have a third target index, and the
second zone of the second substrate can have a fourth target
index.
[0103] For any of the above methods described above, the polishing
rate is adjusted to bring the slope of index trace closer to the
desired slope. The polishing rates can be adjusted by, for example,
increasing or decreasing the pressure in a corresponding chamber of
a carrier head. The change in polishing rate can be assumed to be
directly proportional to the change in pressure, e.g., a simple
Prestonian model. For example, for each zone of each substrate,
where zone was polished with a pressure Pold prior to the time T0,
a new pressure Pnew to apply after time T0 can be calculated as
Pnew=Pold*(SD/S), where S is the slope of the line prior to time T0
and SD is the desired slope.
[0104] For example, assuming that pressure Pold1 was applied to the
first zone of the first substrate, pressure Pold2 was applied to
the second zone of the first substrate, pressure Pold3 was applied
to the first zone of the second substrate, and pressure Pold4 was
applied to the second zone of the second substrate, then new
pressure Pnew1 for the first zone of the first substrate can be
calculated as Pnew1=Pold1*(SD1/S1), the new pressure Pnew2 for the
second zone of the first substrate clan be calculated as
Pnew2=Pold2*(SD2/S2), the new pressure Pnew3 for the first zone of
the second substrate clan be calculated as Pnew3=Pold3*(SD3/S3),
and the new pressure Pnew4 for the second zone of the second
substrate clan be calculated as Pnew4=Pold4*(SD4/S4).
[0105] The process of determining projected times that the
substrates will reach the target thickness, and adjusting the
polishing rates, can be performed just once during the polishing
process, e.g., at a specified time, e.g., 40 to 60% through the
expected polishing time, or performed multiple times during the
polishing process, e.g., every thirty to sixty seconds. At a
subsequent time during the polishing process, the rates can again
be adjusted, if appropriate. During the polishing process, changes
in the polishing rates can be made only a few times, such as four,
three, two or only one time. The adjustment can be made near the
beginning, at the middle or toward the end of the polishing
process.
[0106] Polishing continues after the polishing rates have been
adjusted, e.g., after time T0, the optical monitoring system
continues to collect spectra for at least the reference zone and
determine index values for the reference zone. In some
implementations, the optical monitoring system continues to collect
spectra and determine index values for each zone. Once the index
trace of a reference zone reaches the target index, endpoint is
called and the polishing operation stops.
[0107] For example, as shown in FIG. 12, after time T0, the optical
monitoring system continues to collect spectra for the reference
zone and determine index values 312 for the reference zone. If the
pressure on the reference zone did not change (e.g., as in the
implementation of FIG. 11), then the linear function can be
calculated using data points from both before T0 (but not before
TC) and after T0 to provide an updated linear function 314, and the
time at which the linear function 314 reaches the target index IT
indicates the polishing endpoint time. On the other hand, if the
pressure on the reference zone changed at time T0, then a new
linear function 314 with a slope S' can be calculated from the
sequence of index values 312 after time T0, and the time at which
the new linear function 314 reaches the target index IT indicates
the polishing endpoint time. The reference zone used for
determining endpoint can be the same reference zone used as
described above to calculate the expected endpoint time, or a
different zone (or if all of the zones were adjusted as described
with reference to FIG. 11, then a reference zone can be selected
for the purpose of endpoint determination). If the new linear
function 314 reaches the target index IT slightly later (as shown
in FIG. 12) or earlier than the projected time calculated from the
original linear function 214, then one or more of the zones may be
slightly overpolished or underpolished, respectively. However,
since the difference between the expected endpoint time and the
actual polishing time should be less than a couple seconds, this
need not severely impact the polishing uniformity.
[0108] In some implementations, e.g., for copper polishing, after
detection of the endpoint for a substrate, the substrate is
immediately subjected to an overpolishing process, e.g., to remove
copper residue. The overpolishing process can be at a uniform
pressure for all zones of the substrate, e.g., 1 to 1.5 psi. The
overpolishing process can have a preset duration, e.g., 10 to 15
seconds.
[0109] Where multiple index traces are generated for a particular
zone, e.g., one index trace for each library of interest to the
particular zone, then one of the index traces can be selected for
use in the endpoint or pressure control algorithm for the
particular zone. For example, the each index trace generated for
the same zone, the controller 190 can fit a linear function to the
index values of that index trace, and determine a goodness of fit
of that linear function to the sequence of index values. The index
trace generated having the line with the best goodness of fit its
own index values can be selected as the index trace for the
particular zone and substrate. For example, when determining how to
adjust the polishing rates of the adjustable zones, e.g., at time
T0, the linear function with the best goodness of fit can be used
in the calculation. As another example, endpoint can be called when
the calculated index (as calculated from the linear function fit to
the sequence of index values) for the line with the best goodness
of fit matches or exceeds the target index. Also, rather than
calculating an index value from the linear function, the index
values themselves could be compared to the target index to
determine the endpoint.
[0110] Determining whether an index trace associated with a spectra
library has the best goodness of fit to the linear function
associated with the library can include determining whether the
index trace of the associated spectra library has the least amount
of difference from the associated robust line, relatively, as
compared to the differences from the associated robust line and
index trace associated with another library, e.g., the lowest
standard deviation, the greatest correlation, or other measure of
variance. In one implementation, the goodness of fit is determined
by calculating a sum of squared differences between the index data
points and the linear function; the library with the lowest sum of
squared differences has the best fit.
[0111] Referring to FIG. 13, a summary flow chart 1300 is
illustrated. A plurality of zones of a substrate are polished in a
polishing apparatus simultaneously with the same polishing pad
(step 1302) as described above. During this polishing operation,
each zone has its polishing rate controllable independently of the
other substrates by an independently variable polishing parameter,
e.g., the pressure applied by the chamber in carrier head above the
particular zone. During the polishing operation, the substrate is
monitored (step 1304) as described above, e.g., with a sequence of
measure spectra obtained from each zone. For each measured spectrum
in the sequence, the reference spectrum that is the best match is
determined (step 1306). The index value for each reference spectrum
that is the best fit is determined to generate sequence of index
values (step 1308).
[0112] Clearance of the second layer is detected (step 1310). For
each zone, a linear function is fit to the sequence of index values
for spectra collected after clearance of the second layer is
detected (step 1302). In one implementation, an expected endpoint
time that the linear function for a reference zone will reach a
target index value is determined, e.g., by linear interpolation of
the linear function (step 1314). In other implementations, the
expected endpoint time is predetermined or calculated as a
combination of expected endpoint times of multiple zones. If
needed, the polishing parameters for the other zones are adjusted
to adjust the polishing rate of that substrate such that the
plurality of zones reach the target thickness at approximately the
same time or such that the plurality of zones have approximately
the same thickness (or a target thickness) at the target time (step
1316). Polishing continues after the parameters are adjusted, and
for each zone, measuring a spectrum, determining the best matching
reference spectrum from a library, determining the index value for
the best matching spectrum to generate a new sequence of index
values for the time period after the polishing parameter has been
adjusted, and fitting a linear function to index values (step
1318). Polishing can be halted once the index value for a reference
zone (e.g., a calculated index value generated from the linear
function fit to the new sequence of index values) reaches target
index (step 1330).
[0113] In some implementations, the sequence of index values is
used to adjust the polishing rate of one or more zones of a
substrate, but another in-situ monitoring system or technique is
used to detect the polishing endpoint.
[0114] As discussed above, for some techniques and some layer
stacks, detection of clearance of the overlying layer and exposure
of the underlying layer can be difficult. In some implementations,
a sequence of groups of spectra are collected, and a value of a
dispersion parameter is calculated for a each group of spectra to
generate sequence of dispersion values. The clearance of the
overlying layer can be detected from the sequence of dispersion
values. This technique can be used to detect clearing of the second
layer and exposure of the first layer, e.g., in steps 910 or 1310
of the polishing operations described above.
[0115] FIG. 14 shows a method 1400 for detecting clearance of the
second layer and exposure of the first layer. As the substrate is
being polished (step 1402), a sequence of groups of spectra are
collected (step 1404). As shown in FIG. 4, if the optical
monitoring system is secured to a rotating platen, then in a single
sweep of the optical monitoring system across the substrate,
spectra can be collected from multiple different locations
201b-201j on the substrate. The spectra collected from a single
sweep provides a group of spectra. As polishing progresses,
multiple sweeps of the optical monitoring system provide a sequence
of groups of spectra. One group of spectra can be collected for
each platen rotation, e.g., the groups can be collected at
frequency equal to the platen rotation rate. Typically, each group
will include five to twenty spectra. The spectra can be collected
using the same optical monitoring system that is used to collect
spectra for the peak tracking technique discussed above.
[0116] FIG. 15A provides an example of a group of measured spectra
1500a of light reflected from the substrate 10 at the beginning of
polishing, e.g., when a significant thickness of the overlying
layer remains over the underlying layer. The group of spectra 1500a
can include spectra 202a-204a collected at different locations on
the substrate in a first sweep of the optical monitoring system
across the substrate. FIG. 15B provides an example of a group of
measured spectra 1500b of light reflected from the substrate 10 at
or near clearance of the overlying layer. The group of spectra
1500b can include spectra 202b-204b collected at different
locations on the substrate in a different second sweep of the
optical monitoring system across the substrate (the spectra 1500a
can be collected from different locations on the substrate than the
spectra 1500b).
[0117] Initially, as shown in FIG. 15A, the spectra 1500a are
fairly similar. However, as shown in FIG. 15B, as the overlying
layer, e.g., a barrier layer, is cleared, and the underlying layer,
e.g., a low-k or capping layer, is exposed, differences between the
spectra 1500b from different locations on the substrate tend to
become more pronounced.
[0118] For each group of spectra, a value of a dispersion parameter
of the spectra in the group is calculated (step 1406). This
generates a sequence of dispersion values.
[0119] In one implementation, to calculate a dispersion parameter
for a group of spectra, the intensity values (as a function of
wavelength) are averaged together to provide an average spectrum.
That is I.sub.AVE(.lamda.)=(1/N)[.SIGMA..sub.i=1 to N
I.sub.i(.lamda.)], where N is the number of spectra in the group
and I.sub.i(.lamda.) are the spectra. For each spectrum in the
group, a total difference between the spectrum and the average
spectrum can then be calculated, e.g., using a sum of squares
difference or sum of absolute values difference, e.g.,
D.sub.i=[1/(.lamda.a-.lamda.b)[.SIGMA..sub..lamda.=.lamda.a to
.lamda.b [I.sub.i (.lamda.)-I.sub.AVE(.lamda.)].sup.2]].sup.1/2 or
D.sub.i=[1/(.lamda.a-.lamda.b)[.SIGMA..sub..lamda.=.lamda.a to
.lamda.b)|I.sub.i(.lamda.)-I.sub.AVE(.lamda.)|]], where .lamda.a to
.lamda.b is the wavelength range being summed over.
[0120] Once a difference value has been calculated for each
spectrum in the group of spectra, the value of the dispersion
parameter can be calculated for the group from the difference
values. A variety of dispersion parameters are possible, such as
standard deviation, interquartile range, range (maximum value minus
minimum value), mean difference, median absolute deviation and
average absolute deviation.
[0121] The sequence of dispersion values can be analyzed and used
to detect clearance of the overlying layer (step 1408).
[0122] FIG. 16 shows a graph 1600 of the standard deviation of the
spectra as a function of polishing time (with each standard
deviation calculated from the difference values of a group of
spectra). Thus, each plotted point 1602 in the graph is a standard
deviation for the difference values of the group of spectra
collected at a given sweep of the optical monitoring system. As
illustrated, the standard deviation values remain fairly low during
a first time period 1610. However, after time period 1610, the
standard deviation values become larger and more disperse. Without
being limited to any particular theory, a thick barrier layer may
tend to dominate the reflected spectrum, masking differences in
thickness of the barrier layer itself and any underlying layer. As
polishing progresses, the barrier layer becomes thinner or is
completely removed, and the reflected spectrum becomes more
sensitive to variations in the underlying layer thickness. As a
result, the dispersion of the spectra will tend to increase as the
barrier layer is cleared.
[0123] A variety of algorithms can be used to detect the change in
behavior of the dispersion values when the overlying layer is
clearing. For example, the sequence of dispersion values can be
compared to a threshold, and if a dispersion value exceeds the
threshold, then a signal is generated indicating that the overlying
layer has cleared. As another example, a slope of a portion of the
sequence of dispersion values within a moving window can be
calculated, and if the slope exceeds a threshold value then a
signal is generated indicating that the overlying layer has
cleared.
[0124] As part of the algorithm to detect the increase in
dispersion, the sequence of dispersion values can be subject to a
filter, e.g., a low-pass or band filter, in order to remove high
frequency noise. Examples of low-pass filters include moving
average and Butterworth filters.
[0125] Although the discussion above focuses on detection of
clearance of a barrier layer, the technique can be used detection
clearance of an overlying layer in other contexts, e.g., clearance
of an overlying layer in another type semiconductor process that
uses dielectric layer stacks, e.g., interlayer dielectric (ILD), or
clearance of a thin metal layer over a dielectric layer.
[0126] In addition to use as trigger for initiating feature
tracking as discussed above, this technique for detecting clearance
of an overlying layer can be used for other purposes in a polishing
operation, e.g., to be used as the endpoint signal itself, to
trigger a timer so that the underlying layer is polished for a
predetermined duration following exposure, or as a trigger to
modify polishing parameter, e.g., to change carrier head pressure
or slurry composition upon exposure of the underlying layer.
[0127] In addition, although the discussion above assumes a
rotating platen with an optical endpoint monitor installed in the
platen, system could be applicable to other types of relative
motion between the monitoring system and the substrate. For
example, in some implementations, e.g., orbital motion, the light
source traverses different positions on the substrate, but does not
cross the edge of the substrate. In such cases, the collected
spectra can still be grouped, e.g., spectra can be collected at a
certain frequency and spectra collected within a time period can be
considered part of a group. The time period should be sufficiently
long that five to twenty spectra are collected for each group.
[0128] As used in the instant specification, the term substrate can
include, for example, a product substrate (e.g., which includes
multiple memory or processor dies), a test substrate, a bare
substrate, and a gating substrate. The substrate can be at various
stages of integrated circuit fabrication, e.g., the substrate can
be a bare wafer, or it can include one or more deposited and/or
patterned layers. The term substrate can include circular disks and
rectangular sheets.
[0129] Embodiments of the invention and all of the functional
operations described in this specification can be implemented in
digital electronic circuitry, or in computer software, firmware, or
hardware, including the structural means disclosed in this
specification and structural equivalents thereof, or in
combinations of them. Embodiments of the invention can be
implemented as one or more computer program products, i.e., one or
more computer programs tangibly embodied in a machine-readable
storage media, for execution by, or to control the operation of,
data processing apparatus, e.g., a programmable processor, a
computer, or multiple processors or computers. A computer program
(also known as a program, software, software application, or code)
can be written in any form of programming language, including
compiled or interpreted languages, and it can be deployed in any
form, including as a stand-alone program or as a module, component,
subroutine, or other unit suitable for use in a computing
environment. A computer program does not necessarily correspond to
a file. A program can be stored in a portion of a file that holds
other programs or data, in a single file dedicated to the program
in question, or in multiple coordinated files (e.g., files that
store one or more modules, sub-programs, or portions of code). A
computer program can be deployed to be executed on one computer or
on multiple computers at one site or distributed across multiple
sites and interconnected by a communication network.
[0130] The processes and logic flows described in this
specification can be performed by one or more programmable
processors executing one or more computer programs to perform
functions by operating on input data and generating output. The
processes and logic flows can also be performed by, and apparatus
can also be implemented as, special purpose logic circuitry, e.g.,
an FPGA (field programmable gate array) or an ASIC
(application-specific integrated circuit).
[0131] The above described polishing apparatus and methods can be
applied in a variety of polishing systems. Either the polishing
pad, or the carrier heads, or both can move to provide relative
motion between the polishing surface and the substrate. For
example, the platen may orbit rather than rotate. The polishing pad
can be a circular (or some other shape) pad secured to the platen.
Some aspects of the endpoint detection system may be applicable to
linear polishing systems, e.g., where the polishing pad is a
continuous or a reel-to-reel belt that moves linearly. The
polishing layer can be a standard (for example, polyurethane with
or without fillers) polishing material, a soft material, or a
fixed-abrasive material. Terms of relative positioning are used; it
should be understood that the polishing surface and substrate can
be held in a vertical orientation or some other orientation.
[0132] Particular embodiments of the invention have been described.
Other embodiments are within the scope of the following claims.
* * * * *