Tu; Wen-Chiang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tu; Wen-Chiang.The latest application filed is for "determination of gain for eddy current sensor".

Company Profile

6.49.65

Tu; Wen-Chiang - Mountain View CA
Tu; Wen-chiang - Fremont CA
Tu; Wen-Chiang - US
Tu; Wen-Chiang - Mountainview CA
Tu, Wen Chiang - Sunnyvale CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Inductive monitoring of conductive loops Grant 10,741,459 - Lu , et al. A	2020-08-11
Endpoint control of multiple substrate zones of varying thickness in chemical mechanical polishing Grant 10,589,397 - Duboust , et al.	2020-03-17
Determination of gain for eddy current sensor Grant 10,556,315 - Xu , et al. Feb	2020-02-11
Modifying substrate thickness profiles Grant 10,464,184 - Zhang , et al. No	2019-11-05
Determination Of Gain For Eddy Current Sensor App 20190134775 - Xu; Kun ; et al.	2019-05-09
Determination of gain for eddy current sensor Grant 10,207,386 - Xu , et al. Feb	2019-02-19
Substrate features for inductive monitoring of conductive trench depth Grant 10,199,281 - Lu , et al. Fe	2019-02-05
Inductive Monitoring Of Conductive Loops App 20190035699 - Lu; Wei ; et al.	2019-01-31
Inductive monitoring of conductive trench depth Grant 10,103,073 - Lu , et al. October 16, 2	2018-10-16
Substrate Features For Inductive Monitoring Of Conductive Trench Depth App 20180166347 - Lu; Wei ; et al.	2018-06-14
Substrate features for inductive monitoring of conductive trench depth Grant 9,911,664 - Lu , et al. March 6, 2	2018-03-06
Monitoring Of Polishing Pad Thickness For Chemical Mechanical Polishing App 20180056476 - Zhang; Jimin ; et al.	2018-03-01
Inductive Monitoring Of Conductive Trench Depth App 20170365532 - Lu; Wei ; et al.	2017-12-21
Inductive monitoring of conductive trench depth Grant 9,754,846 - Lu , et al. September 5, 2	2017-09-05
Endpoint Control Of Multiple Substrate Zones Of Varying Thickness In Chemical Mechanical Polishing App 20170151647 - Duboust; Alain ; et al.	2017-06-01
Adjusting eddy current measurements Grant 9,636,797 - Xu , et al. May 2, 2	2017-05-02
Feedback of layer thickness timing and clearance timing for polishing control Grant 9,496,190 - Xu , et al. November 15, 2	2016-11-15
Feedback control using detection of clearance and adjustment for uniform topography Grant 9,472,475 - Xu , et al. October 18, 2	2016-10-18
Determination Of Gain For Eddy Current Sensor App 20160158908 - Xu; Kun ; et al.	2016-06-09
Polishing control using weighting with default sequence Grant 9,296,084 - Zhang , et al. March 29, 2	2016-03-29
Determination of gain for eddy current sensor Grant 9,281,253 - Xu , et al. March 8, 2	2016-03-08
Determination of gain for eddy current sensor Grant 9,275,917 - Xu , et al. March 1, 2	2016-03-01
Endpoint detection during polishing using integrated differential intensity Grant 9,248,544 - Zhang , et al. February 2, 2	2016-02-02
Inductive Monitoring Of Conductive Trench Depth App 20150371913 - Lu; Wei ; et al.	2015-12-24
Substrate Features For Inductive Monitoring Of Conductive Trench Depth App 20150371907 - Lu; Wei ; et al.	2015-12-24
In-situ monitoring system with monitoring of elongated region Grant 9,205,527 - Xu , et al. December 8, 2	2015-12-08
X-ray metrology for control of polishing Grant 9,186,774 - Swedek , et al. November 17, 2	2015-11-17
Modifying Substrate Thickness Profiles App 20150321312 - Zhang; Jimin ; et al.	2015-11-12
Adjusting Eddy Current Measurements App 20150224623 - Xu; Kun ; et al.	2015-08-13
Feedback Of Layer Thickness Timing And Clearance Timing For Polishing Control App 20150194356 - Xu; Kun ; et al.	2015-07-09
Feedback control of polishing using optical detection of clearance Grant 9,073,169 - Xu , et al. July 7, 2	2015-07-07
Monitoring retaining ring thickness and pressure control Grant 9,067,295 - Deshpande , et al. June 30, 2	2015-06-30
High sensitivity eddy current monitoring system Grant 9,023,667 - Iravani , et al. May 5, 2	2015-05-05
Determination Of Gain For Eddy Current Sensor App 20150118766 - Xu; Kun ; et al.	2015-04-30
Determination Of Gain For Eddy Current Sensor App 20150118765 - Xu; Kun ; et al.	2015-04-30
Temperature control of chemical mechanical polishing Grant 9,005,999 - Xu , et al. April 14, 2	2015-04-14
GST film thickness monitoring Grant 8,989,890 - Xu , et al. March 24, 2	2015-03-24
Interconnect Fabrication At An Integrated Semiconductor Processing Station App 20140315381 - Wang; You ; et al.	2014-10-23
Chemical Mechanical Polishing Methods And Systems Including Pre-treatment Phase And Pre-treatment Compositions App 20140308814 - Gage; David Maxwell ; et al.	2014-10-16
Detection of layer clearing using spectral monitoring Grant 8,860,932 - Zhang , et al. October 14, 2	2014-10-14
X-ray Metrology For Control Of Polishing App 20140273745 - Swedek; Boguslaw A. ; et al.	2014-09-18
Endpoint Control Of Multiple Substrates Of Varying Thickness On The Same Platen In Chemical Mechanical Polishing App 20140222188 - Duboust; Alain ; et al.	2014-08-07
In-Sequence Spectrographic Sensor App 20140141694 - Zhang; Jimin ; et al.	2014-05-22
In-situ Monitoring System With Monitoring Of Elongated Region App 20140127971 - Xu; Kun ; et al.	2014-05-08
Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishing Grant 8,694,144 - Duboust , et al. April 8, 2	2014-04-08
Residue Detection with Spectrographic Sensor App 20140093987 - David; Jeffrey Drue ; et al.	2014-04-03
Using optical metrology for within wafer feed forward process control Grant 8,679,979 - David , et al. March 25, 2	2014-03-25
Monitoring Retaining Ring Thickness And Pressure Control App 20140027407 - Deshpande; Sameer ; et al.	2014-01-30
Control Of Polishing Of Multiple Substrates On The Same Platen In Chemical Mechanical Polishing App 20140030956 - Zhang; Jimin ; et al.	2014-01-30
Metrology for GST film thickness and phase Grant 8,639,377 - Xu , et al. January 28, 2	2014-01-28
Polishing Pad and Multi-Head Polishing System App 20140024299 - Tu; Wen-Chiang ; et al.	2014-01-23
Polishing Control Using Weighting With Default Sequence App 20140024292 - Zhang; Jimin ; et al.	2014-01-23
Endpoint Detection During Polishing Using Integrated Differential Intensity App 20140024291 - Zhang; Jimin ; et al.	2014-01-23
Temperature Control Of Chemical Mechanical Polishing App 20140004626 - XU; KUN ; et al.	2014-01-02
Chemical planarization of copper wafer polishing Grant 8,586,481 - Wang , et al. November 19, 2	2013-11-19
Methods of using optical metrology for feed back and feed forward process control Grant 8,579,675 - David , et al. November 12, 2	2013-11-12
Feedback Control Using Detection Of Clearance And Adjustment For Uniform Topography App 20130224890 - Xu; Kun ; et al.	2013-08-29
Slurry For Planarizing Photoresist App 20130189843 - Wang; You ; et al.	2013-07-25
Slurry For Cobalt Applications App 20130186850 - Wang; You ; et al.	2013-07-25
Eddy Current Monitoring Of Metal Residue Or Metal Pillars App 20120276817 - Iravani; Hassan G. ; et al.	2012-11-01
Eddy Current Monitoring Of Metal Features App 20120276662 - Iravani; Hassan G. ; et al.	2012-11-01
High Sensitivity Eddy Current Monitoring System App 20120276661 - Iravani; Hassan G. ; et al.	2012-11-01
Using optical metrology for wafer to wafer feed back process control Grant 8,292,693 - David , et al. October 23, 2	2012-10-23
Dishing and defect control of chemical mechanical polishing using real-time adjustable additive delivery Grant 8,210,900 - Tu , et al. July 3, 2	2012-07-03
Multiple Matching Reference Spectra For In-situ Optical Monitoring App 20120100781 - Zhang; Jimin ; et al.	2012-04-26
Feedback Control of Polishing Using Optical Detection of Clearance App 20120064801 - Xu; Kun ; et al.	2012-03-15
Endpoint Control Of Multiple Substrates Of Varying Thickness On The Same Platen In Chemical Mechanical Polishing App 20120053717 - Duboust; Alain ; et al.	2012-03-01
Techniques For Matching Measured Spectra To Reference Spectra For In-situ Optical Monitoring App 20120034845 - Hu; Xiaoyuan ; et al.	2012-02-09
Spectrographic Monitoring Using Index Tracking After Detection Of Layer Clearing App 20120034844 - Zhang; Jimin ; et al.	2012-02-09
Detection Of Layer Clearing Using Spectral Monitoring App 20120026492 - Zhang; Jimin ; et al.	2012-02-02
Using Optical Metrology For Within Wafer Feed Forward Process Control App 20120028377 - David; Jeffrey Drue ; et al.	2012-02-02
Endpoint Control During Chemical Mechanical Polishing By Detecting Interface Between Different Layers Through Selectivity Change App 20120003759 - Hu; Xiaoyuan ; et al.	2012-01-05
Chemical Planarization Of Copper Wafer Polishing App 20110294293 - Wang; You ; et al.	2011-12-01
Using optical metrology for within wafer feed forward process control Grant 8,039,397 - David , et al. October 18, 2	2011-10-18
High Sensitivity Real Time Profile Control Eddy Current Monitoring System App 20110189856 - Xu; Kun ; et al.	2011-08-04
High Sensitivity Real Time Profile Control Eddy Current Monitoring System App 20110189925 - Iravani; Hassan G. ; et al.	2011-08-04
Methods Of Using Optical Metrology For Feed Back And Feed Forward Process Control App 20100297916 - David; Jeffrey Drue ; et al.	2010-11-25
GST Film Thickness Monitoring App 20100185314 - Xu; Kun ; et al.	2010-07-22
Using Optical Metrology For Wafer To Wafer Feed Back Process Control App 20100130100 - David; Jeffrey Drue ; et al.	2010-05-27
Two-line Mixing Of Chemical And Abrasive Particles With Endpoint Control For Chemical Mechanical Polishing App 20100130101 - WANG; YUCHUN ; et al.	2010-05-27
Using Optical Metrology For Within Wafer Feed Forward Process Control App 20100129939 - David; Jeffrey Drue ; et al.	2010-05-27
Slurry Composition For Gst Phase Change Memory Materials Polishing App 20100130013 - Liu; Feng Q. ; et al.	2010-05-27
Metrology For Gst Film Thickness And Phase App 20100116990 - Xu; Kun ; et al.	2010-05-13
Dishing And Defect Control Of Chemical Mechanical Polishing Using Real-time Adjustable Additive Delivery App 20100112903 - TU; WEN-CHIANG ; et al.	2010-05-06
Method Of Soft Pad Preparation To Reduce Removal Rate Ramp-up Effect And To Stabilize Defect Rate App 20090061743 - JEW; STEPHEN ; et al.	2009-03-05
Method and composition for polishing a substrate Grant 7,323,416 - Liu , et al. January 29, 2	2008-01-29
Method and composition for polishing a substrate App 20060006074 - Liu; Feng Q. ; et al.	2006-01-12
System, Method And Apparatus For Applying Liquid To A Cmp Polishing Pad App 20050070212 - Pham, Xuyen ; et al.	2005-03-31
System, method and apparatus for applying liquid to a CMP polishing pad Grant 6,872,128 - Pham , et al. March 29, 2	2005-03-29
Method and apparatus for forming metal interconnects App 20020058408 - Maydan, Dan ; et al.	2002-05-16
Robot blade for handling of semiconductor substrates Grant 6,199,927 - Shamlou , et al. March 13, 2	2001-03-13
Post-etch treatment of plasma-etched feature surfaces to prevent corrosion Grant 6,153,530 - Ye , et al. November 28, 2	2000-11-28
Robot blade for handling of semiconductor substrate Grant 6,024,393 - Shamlou , et al. February 15, 2	2000-02-15

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