loadpatents
name:-0.062889814376831
name:-0.046288013458252
name:-0.0090479850769043
Osterheld; Thomas H. Patent Filings

Osterheld; Thomas H.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Osterheld; Thomas H..The latest application filed is for "control of processing parameters for substrate polishing with substrate precession".

Company Profile
13.58.76
  • Osterheld; Thomas H. - Mountain View CA
  • Osterheld; Thomas H - Mountain View CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Chemical mechanical polishing apparatus and methods
Grant 11,453,097 - Bajaj , et al. September 27, 2
2022-09-27
Active Acoustic Monitoring For Chemical Mechanical Polishing
App 20220281058 - Wiswell; Nicholas A. ;   et al.
2022-09-08
Control Of Processing Parameters For Substrate Polishing With Angularly Distributed Zones Using Cost Function
App 20220281053 - Lau; Eric ;   et al.
2022-09-08
Passive Acoustic Monitoring And Acoustic Sensors For Chemical Mechanical Polishing
App 20220281057 - Wiswell; Nicholas A. ;   et al.
2022-09-08
Control Of Processing Parameters For Substrate Polishing With Substrate Precession
App 20220283554 - Lau; Eric ;   et al.
2022-09-08
Imaging For Monitoring Thickness In A Substrate Cleaning System
App 20220270889 - Benvegnu; Dominic J. ;   et al.
2022-08-25
Monitoring Of Polishing Pad Texture In Chemical Mechanical Polishing
App 20200298368 - Osterheld; Thomas H. ;   et al.
2020-09-24
Polishing System With Support Post And Annular Platen Or Polishing Pad
App 20200114487 - Butterfield; Paul D. ;   et al.
2020-04-16
Machine Vision As Input To A Cmp Process Control Algorithm
App 20200094370 - Cherian; Benjamin ;   et al.
2020-03-26
Chemical Mechanical Polishing Apparatus and Methods
App 20200086452 - Bajaj; Rajeev ;   et al.
2020-03-19
Textured small pad for chemical mechanical polishing
Grant 10,589,399 - Oh , et al.
2020-03-17
Polishing system with annular platen or polishing pad for substrate monitoring
Grant 10,562,147 - Butterfield , et al. Feb
2020-02-18
Training Spectrum Generation for Machine Learning System for Spectrographic Monitoring
App 20200005140 - Cherian; Benjamin ;   et al.
2020-01-02
Training Spectrum Generation for Machine Learning System for Spectrographic Monitoring
App 20200005139 - Cherian; Benjamin ;   et al.
2020-01-02
Chemical mechanical polishing apparatus and methods
Grant 10,500,694 - Bajaj , et al. Dec
2019-12-10
Acoustic emission monitoring and endpoint for chemical mechanical polishing
Grant 10,478,937 - Tang , et al. Nov
2019-11-19
Consumable Part Monitoring in Chemical Mechanical Polisher
App 20190283209 - Osterheld; Thomas H. ;   et al.
2019-09-19
Monitoring of Vibrations During Chemical Mechanical Polishing
App 20190283204 - Swedek; Boguslaw A. ;   et al.
2019-09-19
Chemical mechanical polishing automated recipe generation
Grant 10,256,111 - Lau , et al.
2019-04-09
Polishing System With Annular Platen Or Polishing Pad For Substrate Monitoring
App 20180056477 - Butterfield; Paul D. ;   et al.
2018-03-01
Chemical Mechanical Polishing Automated Recipe Generation
App 20180005842 - LAU; Eric ;   et al.
2018-01-04
Chemical Mechanical Polishing Apparatus And Methods
App 20170309494 - Osterheld; Thomas H. ;   et al.
2017-10-26
Chemical Mechanical Polishing Apparatus And Methods
App 20170297163 - Bajaj; Rajeev ;   et al.
2017-10-19
Textured Small Pad For Chemical Mechanical Polishing
App 20170274498 - Oh; Jeonghoon ;   et al.
2017-09-28
Acoustic Emission Monitoring and Endpoint for Chemical Mechanical Polishing
App 20160256978 - Tang; Jianshe ;   et al.
2016-09-08
Multi-Platen Multi-Head Polishing Architecture
App 20160101497 - David; Jeffrey Drue ;   et al.
2016-04-14
Chemical Mechanical Polishing Apparatus And Methods
App 20160027668 - Osterheld; Thomas H. ;   et al.
2016-01-28
Dynamic residue clearing control with in-situ profile control (ISPC)
Grant 9,242,337 - Qian , et al. January 26, 2
2016-01-26
Multi-platen multi-head polishing architecture
Grant 9,227,293 - David , et al. January 5, 2
2016-01-05
Endpointing with selective spectral monitoring
Grant 9,221,147 - Qian , et al. December 29, 2
2015-12-29
Thin polishing pad with window and molding process
Grant 9,138,858 - Benvegnu , et al. September 22, 2
2015-09-22
Path for probe of spectrographic metrology system
Grant 9,056,383 - David , et al. June 16, 2
2015-06-16
Retaining ring monitoring and control of pressure
Grant 9,017,138 - Chen , et al. April 28, 2
2015-04-28
Temperature control of chemical mechanical polishing
Grant 9,005,999 - Xu , et al. April 14, 2
2015-04-14
Weighted regression of thickness maps from spectral data
Grant 8,992,286 - Cherian , et al. March 31, 2
2015-03-31
Selecting reference libraries for monitoring of multiple zones on a substrate
Grant 8,954,186 - Qian , et al. February 10, 2
2015-02-10
Methods And Apparatus Using Energized Fluids To Clean Chemical Mechanical Planarization Polishing Pads
App 20140323017 - Tang; Jianshe ;   et al.
2014-10-30
Dynamic Residue Clearing Control With In-situ Profile Control (ispc)
App 20140273749 - QIAN; Jun ;   et al.
2014-09-18
Pad Conditioning Process Control Using Laser Conditioning
App 20140273752 - BAJAJ; Rajeev ;   et al.
2014-09-18
Path For Probe Of Spectrographic Metrology System
App 20140242879 - David; Jeffrey Drue ;   et al.
2014-08-28
Determination Of Wafer Angular Position For In-sequence Metrology
App 20140242883 - Cherian; Benjamin ;   et al.
2014-08-28
Feed Forward Parameter Values For Use In Theoretically Generating Spectra
App 20140242881 - David; Jeffrey Drue ;   et al.
2014-08-28
Weighted Regression Of Thickness Maps From Spectral Data
App 20140242878 - Cherian; Benjamin ;   et al.
2014-08-28
Chemical Mechanical Polishing Apparatus And Methods
App 20140199840 - Bajaj; Rajeev ;   et al.
2014-07-17
Retaining ring for chemical mechanical polishing
Grant 8,771,460 - Zuniga , et al. July 8, 2
2014-07-08
Polishing System with In-Sequence Sensor
App 20140141696 - David; Jeffrey Drue ;   et al.
2014-05-22
Multi-Platen Multi-Head Polishing Architecture
App 20140141695 - David; Jeffrey Drue ;   et al.
2014-05-22
Endpointing With Selective Spectral Monitoring
App 20140113524 - Qian; Jun ;   et al.
2014-04-24
Temperature Control Of Chemical Mechanical Polishing
App 20140004626 - XU; KUN ;   et al.
2014-01-02
Thin Polishing Pad With Window And Molding Process
App 20130309951 - Benvegnu; Dominic J. ;   et al.
2013-11-21
Retaining Ring For Chemical Mechanical Polishing
App 20130276979 - Zuniga; Steven M. ;   et al.
2013-10-24
Thin polishing pad with window and molding process
Grant 8,562,389 - Benvegnu , et al. October 22, 2
2013-10-22
Retaining Ring Monitoring And Control Of Pressure
App 20130203321 - Chen; Hung Chih ;   et al.
2013-08-08
Engineering Dielectric Films For Cmp Stop
App 20130189841 - Balseanu; Mihaela ;   et al.
2013-07-25
Method of assembly of retaining ring for CMP
Grant 8,486,220 - Zuniga , et al. July 16, 2
2013-07-16
Multilayer retaining ring for chemical mechanical polishing
Grant 8,470,125 - Zuniga , et al. June 25, 2
2013-06-25
Brush Box Module For Chemical Mechanical Polishing Cleaner
App 20130111678 - Chen; Hui ;   et al.
2013-05-09
Eddy current gain compensation
Grant 8,408,965 - Bennett , et al. April 2, 2
2013-04-02
Polishing pad and system with window support
Grant 8,393,933 - Qian , et al. March 12, 2
2013-03-12
Method Of Assembly Of Retaining Ring For Cmp
App 20120325395 - Zuniga; Steven M. ;   et al.
2012-12-27
Endpoint control of multiple-wafer chemical mechanical polishing
Grant 8,295,967 - Zhang , et al. October 23, 2
2012-10-23
Use of pad conditioning in temperature controlled CMP
Grant 8,292,691 - Xu , et al. October 23, 2
2012-10-23
Selecting Reference Libraries For Monitoring Of Multiple Zones On A Substrate
App 20120028813 - Qian; Jun ;   et al.
2012-02-02
Real-time Monitoring Of Retaining Ring Thickness And Lifetime
App 20120021671 - McReynolds; Peter ;   et al.
2012-01-26
Multilayer Retaining Ring For Chemical Mechanical Polishing
App 20120018093 - Zuniga; Steven M. ;   et al.
2012-01-26
Multilayer retaining ring for chemical mechanical polishing
Grant 8,029,640 - Zuniga , et al. October 4, 2
2011-10-04
Temperature Control Of Chemical Mechanical Polishing
App 20100279435 - Xu; Kun ;   et al.
2010-11-04
Pad conditioner
Grant 7,815,495 - Xu , et al. October 19, 2
2010-10-19
Polishing Pad and System with Window Support
App 20100184357 - Qian; Jun ;   et al.
2010-07-22
Endpoint Control Of Multiple-wafer Chemical Mechanical Polishing
App 20100120330 - Zhang; Jimin ;   et al.
2010-05-13
Endpoint Control Of Multiple-wafer Chemical Mechanical Polishing
App 20100120331 - Carlsson; Ingemar ;   et al.
2010-05-13
Eddy Current Gain Compensation
App 20100099334 - Bennett; Doyle E. ;   et al.
2010-04-22
Use Of Pad Conditioning In Temperature Controlled Cmp
App 20100081360 - Xu; Kun ;   et al.
2010-04-01
Endpoint Detection In Chemical Mechanical Polishing Using Multiple Spectra
App 20090275265 - Qian; Jun ;   et al.
2009-11-05
Multilayer Retaining Ring For Chemical Mechanical Polishing
App 20090221223 - Zuniga; Steven M. ;   et al.
2009-09-03
Methods for a multilayer retaining ring
Grant 7,534,364 - Zuniga , et al. May 19, 2
2009-05-19
Carrier head with a multilayer retaining ring for chemical mechanical polishing
Grant 7,520,955 - Zuniga , et al. April 21, 2
2009-04-21
Thin Polishing Pad With Window And Molding Process
App 20080305729 - Benvegnu; Dominic J. ;   et al.
2008-12-11
Pad Conditioner
App 20080254722 - Xu; Kun ;   et al.
2008-10-16
Chemical mechanical polishing a substrate having a filler layer and a stop layer
Grant 7,201,636 - Jin , et al. April 10, 2
2007-04-10
Profile control platen
Grant 7,115,024 - Chen , et al. October 3, 2
2006-10-03
Polishing processes for shallow trench isolation substrates
Grant 7,063,597 - Prabhu , et al. June 20, 2
2006-06-20
Profile control platen
App 20050186892 - Chen, Hung Chih ;   et al.
2005-08-25
Chemical mechanical polishing a substrate having a filler layer and a stop layer
App 20050153561 - Jin, Raymond R. ;   et al.
2005-07-14
Profile control platen
Grant 6,913,518 - Chen , et al. July 5, 2
2005-07-05
Chemical mechanical polishing a substrate having a filler layer and a stop layer
Grant 6,863,593 - Jin , et al. March 8, 2
2005-03-08
Carrier head with a modified flexible membrane
Grant 6,855,043 - Tang , et al. February 15, 2
2005-02-15
Closed loop control over delivery of liquid material to semiconductor processing tool
Grant 6,834,777 - Osterheld , et al. December 28, 2
2004-12-28
Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
Grant 6,824,455 - Osterheld , et al. November 30, 2
2004-11-30
Profile control platen
App 20040224615 - Chen, Hung Chih ;   et al.
2004-11-11
Methods and compositions for chemical mechanical polishing shallow trench isolation substrates
Grant 6,811,470 - Bonner , et al. November 2, 2
2004-11-02
Methods for a multilayer retaining ring
App 20040209556 - Zuniga, Steven M. ;   et al.
2004-10-21
Polishing processes for shallow trench isolation substrates
App 20040142640 - Prabhu, Gopalakrishna B. ;   et al.
2004-07-22
Platen with patterned surface for chemical mechanical polishing
App 20040072518 - Prabhu, Gopalakrishna B. ;   et al.
2004-04-15
Polishing pad having a grooved pattern for use in chemical mechanical polishing apparatus
App 20040072516 - Osterheld, Thomas H. ;   et al.
2004-04-15
Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
Grant 6,699,115 - Osterheld , et al. March 2, 2
2004-03-02
Grid relief in CMP polishing pad to accurately measure pad wear, pad profile and pad wear profile
App 20040033760 - Osterheld, Thomas H.
2004-02-19
Polishing pad having a grooved pattern for use in chemical mechanical polishing
Grant 6,645,061 - Bennett , et al. November 11, 2
2003-11-11
Closed loop control over delivery of liquid material to semiconductor processing tool
App 20030189060 - Osterheld, Thomas H. ;   et al.
2003-10-09
Grid relief in CMP polishing pad to accurately measure pad wear, pad profile and pad wear profile
Grant 6,616,513 - Osterheld September 9, 2
2003-09-09
Chemical mechanical polishing pad conditioning element with discrete points and compliant membrane
Grant 6,572,446 - Osterheld , et al. June 3, 2
2003-06-03
Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
App 20030092371 - Osterheld, Thomas H. ;   et al.
2003-05-15
Closed loop control over delivery of liquid material to semiconductor processing tool
Grant 6,561,381 - Osterheld , et al. May 13, 2
2003-05-13
Methods and compositions for chemical mechanical polishing shallow trench isolation substrates
App 20030036339 - Bonner, Benjamin A. ;   et al.
2003-02-20
Polishing pad having a grooved pattern for use in chemical mechanical polishing
Grant 6,520,847 - Osterheld , et al. February 18, 2
2003-02-18
Polishing pad having a grooved pattern for use in chemical mechanical polishing apparatus
App 20020137450 - Osterheld, Thomas H. ;   et al.
2002-09-26
Multi-step polish process to control uniformity when using a selective slurry on patterned wafers
App 20020100743 - Bonner, Benjamin A. ;   et al.
2002-08-01
Utility wafer for chemical mechanical polishing
Grant 6,361,405 - David , et al. March 26, 2
2002-03-26
Utility wafer for chemical mechanical polishing
App 20020028635 - David, Jeffrey D. ;   et al.
2002-03-07
Method of post CMP defect stability improvement
Grant 6,319,098 - Osterheld , et al. November 20, 2
2001-11-20
Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
Grant 6,273,806 - Bennett , et al. August 14, 2
2001-08-14
Carrier head with a multilayer retaining ring for chemical mechanical polishing
Grant 6,251,215 - Zuniga , et al. June 26, 2
2001-06-26
Method and apparatus for chemical mechanical polishing using a patterned pad
Grant 6,241,596 - Osterheld , et al. June 5, 2
2001-06-05
Technique for chemical mechanical polishing silicon
App 20010000586 - Li, Shijian ;   et al.
2001-05-03
Method of post CMP defect stability improvement
Grant 6,220,941 - Fishkin , et al. April 24, 2
2001-04-24
Technique for chemical mechanical polishing silicon
Grant 6,162,368 - Li , et al. December 19, 2
2000-12-19
Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
Grant 5,984,769 - Bennett , et al. November 16, 1
1999-11-16

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