| Patent | Date |
|---|
Passive Acoustic Monitoring And Acoustic Sensors For Chemical Mechanical Polishing
App 20220281057 - Wiswell; Nicholas A. ; et al. | 2022-09-08 |
Active Acoustic Monitoring For Chemical Mechanical Polishing
App 20220281058 - Wiswell; Nicholas A. ; et al. | 2022-09-08 |
Imaging For Monitoring Thickness In A Substrate Cleaning System
App 20220270889 - Benvegnu; Dominic J. ; et al. | 2022-08-25 |
Endpoint Detection For Chemical Mechanical Polishing Based On Spectrometry
App 20220077006 - Benvegnu; Dominic J. ; et al. | 2022-03-10 |
Resistivity-based Adjustment Of Thresholds For In-situ Monitoring
App 20220043095 - Xu; Kun ; et al. | 2022-02-10 |
Multi-toothed, Magnetically Controlled Retaining Ring
App 20220009053 - SWEDEK; Boguslaw A. | 2022-01-13 |
Resistivity-based adjustment of measurements from in-situ monitoring
Grant 11,199,605 - Xu , et al. December 14, 2 | 2021-12-14 |
Endpointing detection for chemical mechanical polishing based on spectrometry
Grant 11,183,435 - Benvegnu , et al. November 23, 2 | 2021-11-23 |
Thickness Measurement of Substrate Using Color Metrology
App 20210358113 - Motamedi; Nojan ; et al. | 2021-11-18 |
Thickness measurement of substrate using color metrology
Grant 11,100,628 - Motamedi , et al. August 24, 2 | 2021-08-24 |
Resistivity-based calibration of in-situ electromagnetic inductive monitoring
Grant 11,079,459 - Xu , et al. August 3, 2 | 2021-08-03 |
Polishing Apparatus Using Neural Network For Monitoring
App 20210229234 - Xu; Kun ; et al. | 2021-07-29 |
Core configuration with alternating posts for in-situ electromagnetic induction monitoring system
Grant 11,004,708 - Iravani , et al. May 11, 2 | 2021-05-11 |
Polishing apparatus using neural network for monitoring
Grant 10,994,389 - Xu , et al. May 4, 2 | 2021-05-04 |
Display of spectra contour plots versus time for semiconductor processing system control
Grant 10,948,900 - David , et al. March 16, 2 | 2021-03-16 |
Spectra based endpointing for chemical mechanical polishing
Grant 10,766,119 - Swedek , et al. Sep | 2020-09-08 |
Thickness Measurement of Substrate Using Color Metrology
App 20200258214 - A1 | 2020-08-13 |
Inductive monitoring of conductive loops
Grant 10,741,459 - Lu , et al. A | 2020-08-11 |
Color Imaging For Cmp Monitoring
App 20200151868 - Benvegnu; Dominic J. ; et al. | 2020-05-14 |
Machine Vision As Input To A Cmp Process Control Algorithm
App 20200094370 - Cherian; Benjamin ; et al. | 2020-03-26 |
Endpoint control of multiple substrate zones of varying thickness in chemical mechanical polishing
Grant 10,589,397 - Duboust , et al. | 2020-03-17 |
Color imaging for CMP monitoring
Grant 10,565,701 - Benvegnu , et al. Feb | 2020-02-18 |
Determination of gain for eddy current sensor
Grant 10,556,315 - Xu , et al. Feb | 2020-02-11 |
Core Configuration For In-situ Electromagnetic Induction Monitoring System
App 20190358770 - Iravani; Hassan G. ; et al. | 2019-11-28 |
Monitoring of Vibrations During Chemical Mechanical Polishing
App 20190283204 - Swedek; Boguslaw A. ; et al. | 2019-09-19 |
Core configuration for in-situ electromagnetic induction monitoring system
Grant 10,391,610 - Iravani , et al. A | 2019-08-27 |
Endpointing Detection For Chemical Mechanical Polishing Based On Spectrometry
App 20190252274 - Benvegnu; Dominic J. ; et al. | 2019-08-15 |
Thickness Measurement Of Substrate Using Color Metrology
App 20190244374 - Benvegnu; Dominic J. ; et al. | 2019-08-08 |
Determination Of Gain For Eddy Current Sensor
App 20190134775 - Xu; Kun ; et al. | 2019-05-09 |
Endpointing detection for chemical mechanical polishing based on spectrometry
Grant 10,276,460 - Benvegnu , et al. | 2019-04-30 |
Determination of gain for eddy current sensor
Grant 10,207,386 - Xu , et al. Feb | 2019-02-19 |
Substrate features for inductive monitoring of conductive trench depth
Grant 10,199,281 - Lu , et al. Fe | 2019-02-05 |
Inductive Monitoring Of Conductive Loops
App 20190035699 - Lu; Wei ; et al. | 2019-01-31 |
Grouping Spectral Data From Polishing Substrates
App 20180321026 - David; Jeffrey Drue ; et al. | 2018-11-08 |
Polishing Apparatus Using Neural Network For Monitoring
App 20180304435 - Xu; Kun ; et al. | 2018-10-25 |
Eddy current system having an elongated core for in-situ profile measurement
Grant 10,105,811 - Miller , et al. October 23, 2 | 2018-10-23 |
Inductive monitoring of conductive trench depth
Grant 10,103,073 - Lu , et al. October 16, 2 | 2018-10-16 |
Applying dimensional reduction to spectral data from polishing substrates
Grant 10,086,492 - David , et al. October 2, 2 | 2018-10-02 |
Resistivity-based Calibration Of In-situ Electromagnetic Inductive Monitoring
App 20180203090 - Xu; Kun ; et al. | 2018-07-19 |
Resistivity-based Adjustment Of Measurements From In-situ Monitoring
App 20180203089 - Xu; Kun ; et al. | 2018-07-19 |
Grouping spectral data from polishing substrates
Grant 10,012,494 - David , et al. July 3, 2 | 2018-07-03 |
Substrate Features For Inductive Monitoring Of Conductive Trench Depth
App 20180166347 - Lu; Wei ; et al. | 2018-06-14 |
Core Configuration With Alternating Posts For In-situ Electromagnetic Induction Monitoring System
App 20180122667 - Iravani; Hassan G. ; et al. | 2018-05-03 |
Core Configuration For In-situ Electromagnetic Induction Monitoring System
App 20180111251 - Iravani; Hassan G. ; et al. | 2018-04-26 |
Display of Spectra Contour Plots Versus Time For Semiconductor Processing System Control
App 20180113440 - David; Jeffrey Drue ; et al. | 2018-04-26 |
Applying Dimensional Reduction To Spectral Data From Polishing Substrates
App 20180071886 - David; Jeffrey Drue ; et al. | 2018-03-15 |
Substrate features for inductive monitoring of conductive trench depth
Grant 9,911,664 - Lu , et al. March 6, 2 | 2018-03-06 |
Endpoint method using peak location of spectra contour plots versus time
Grant 9,886,026 - David , et al. February 6, 2 | 2018-02-06 |
Inductive Monitoring Of Conductive Trench Depth
App 20170365532 - Lu; Wei ; et al. | 2017-12-21 |
Applying dimensional reduction to spectral data from polishing substrates
Grant 9,833,874 - David , et al. December 5, 2 | 2017-12-05 |
Peak-based endpointing for chemical mechanical polishing
Grant 9,799,578 - Benvegnu , et al. October 24, 2 | 2017-10-24 |
Inductive monitoring of conductive trench depth
Grant 9,754,846 - Lu , et al. September 5, 2 | 2017-09-05 |
Endpoint Control Of Multiple Substrate Zones Of Varying Thickness In Chemical Mechanical Polishing
App 20170151647 - Duboust; Alain ; et al. | 2017-06-01 |
Color Imaging For Cmp Monitoring
App 20170140525 - Benvegnu; Dominic J. ; et al. | 2017-05-18 |
Endpointing Detection For Chemical Mechanical Polishing Based On Spectrometry
App 20170125313 - Benvegnu; Dominic J. ; et al. | 2017-05-04 |
Adjusting eddy current measurements
Grant 9,636,797 - Xu , et al. May 2, 2 | 2017-05-02 |
Applying Dimensional Reduction To Spectral Data From Polishing Substrates
App 20170113320 - David; Jeffrey Drue ; et al. | 2017-04-27 |
Peak-based Endpointing For Chemical Mechanical Polishing
App 20170092551 - Benvegnu; Dominic J. ; et al. | 2017-03-30 |
Endpointing detection for chemical mechanical polishing based on spectrometry
Grant 9,583,405 - Benvegnu , et al. February 28, 2 | 2017-02-28 |
Peak-based endpointing for chemical mechanical polishing
Grant 9,564,377 - Benvegnu , et al. February 7, 2 | 2017-02-07 |
Reducing noise in spectral data from polishing substrates
Grant 9,551,567 - David , et al. January 24, 2 | 2017-01-24 |
Feedback of layer thickness timing and clearance timing for polishing control
Grant 9,496,190 - Xu , et al. November 15, 2 | 2016-11-15 |
Techniques for matching spectra
Grant 9,482,610 - Shrestha , et al. November 1, 2 | 2016-11-01 |
Feedback control using detection of clearance and adjustment for uniform topography
Grant 9,472,475 - Xu , et al. October 18, 2 | 2016-10-18 |
Determination Of Gain For Eddy Current Sensor
App 20160158908 - Xu; Kun ; et al. | 2016-06-09 |
Adjusting polishing rates by using spectrographic monitoring of a substrate during processing
Grant 9,346,146 - David , et al. May 24, 2 | 2016-05-24 |
Polishing pad for endpoint detection and related methods
Grant 9,333,621 - Swedek , et al. May 10, 2 | 2016-05-10 |
Multi-Platen Multi-Head Polishing Architecture
App 20160101497 - David; Jeffrey Drue ; et al. | 2016-04-14 |
Determination of gain for eddy current sensor
Grant 9,281,253 - Xu , et al. March 8, 2 | 2016-03-08 |
Determination of gain for eddy current sensor
Grant 9,275,917 - Xu , et al. March 1, 2 | 2016-03-01 |
In-Situ Acoustic Monitoring of Chemical Mechanical Polishing
App 20160013085 - Chew; Xiong Yeu ; et al. | 2016-01-14 |
Multi-platen multi-head polishing architecture
Grant 9,227,293 - David , et al. January 5, 2 | 2016-01-05 |
Endpointing with selective spectral monitoring
Grant 9,221,147 - Qian , et al. December 29, 2 | 2015-12-29 |
Substrate Features For Inductive Monitoring Of Conductive Trench Depth
App 20150371907 - Lu; Wei ; et al. | 2015-12-24 |
Inductive Monitoring Of Conductive Trench Depth
App 20150371913 - Lu; Wei ; et al. | 2015-12-24 |
Endpointing Detection For Chemical Mechanical Polishing Based On Spectrometry
App 20150364390 - Benvegnu; Dominic J. ; et al. | 2015-12-17 |
In-situ monitoring system with monitoring of elongated region
Grant 9,205,527 - Xu , et al. December 8, 2 | 2015-12-08 |
X-ray metrology for control of polishing
Grant 9,186,774 - Swedek , et al. November 17, 2 | 2015-11-17 |
User-input functions for data sequences in polishing endpoint detection
Grant 9,168,630 - Lee , et al. October 27, 2 | 2015-10-27 |
Using spectra to determine polishing endpoints
Grant 9,142,466 - Lee , et al. September 22, 2 | 2015-09-22 |
Thin polishing pad with window and molding process
Grant 9,138,858 - Benvegnu , et al. September 22, 2 | 2015-09-22 |
Endpointing detection for chemical mechanical polishing based on spectrometry
Grant 9,117,751 - Benvegnu , et al. August 25, 2 | 2015-08-25 |
Adjusting Eddy Current Measurements
App 20150224623 - Xu; Kun ; et al. | 2015-08-13 |
Reflectivity measurements during polishing using a camera
Grant 9,095,952 - Benvegnu , et al. August 4, 2 | 2015-08-04 |
Feedback Of Layer Thickness Timing And Clearance Timing For Polishing Control
App 20150194356 - Xu; Kun ; et al. | 2015-07-09 |
Feedback control of polishing using optical detection of clearance
Grant 9,073,169 - Xu , et al. July 7, 2 | 2015-07-07 |
Path for probe of spectrographic metrology system
Grant 9,056,383 - David , et al. June 16, 2 | 2015-06-16 |
Endpoint Method Using Peak Location Of Spectra Contour Plots Versus Time
App 20150160649 - David; Jeffrey Drue ; et al. | 2015-06-11 |
High sensitivity eddy current monitoring system
Grant 9,023,667 - Iravani , et al. May 5, 2 | 2015-05-05 |
Determination Of Gain For Eddy Current Sensor
App 20150118766 - Xu; Kun ; et al. | 2015-04-30 |
Grouping Spectral Data From Polishing Substrates
App 20150120242 - David; Jeffrey Drue ; et al. | 2015-04-30 |
Determination Of Gain For Eddy Current Sensor
App 20150118765 - Xu; Kun ; et al. | 2015-04-30 |
Reducing Noise In Spectral Data From Polishing Substrates
App 20150120243 - David; Jeffrey Drue ; et al. | 2015-04-30 |
Weighted regression of thickness maps from spectral data
Grant 8,992,286 - Cherian , et al. March 31, 2 | 2015-03-31 |
GST film thickness monitoring
Grant 8,989,890 - Xu , et al. March 24, 2 | 2015-03-24 |
Endpoint method using peak location of spectra contour plots versus time
Grant 8,977,379 - David , et al. March 10, 2 | 2015-03-10 |
Selecting reference libraries for monitoring of multiple zones on a substrate
Grant 8,954,186 - Qian , et al. February 10, 2 | 2015-02-10 |
Gathering spectra from multiple optical heads
Grant 8,932,107 - David , et al. January 13, 2 | 2015-01-13 |
Polishing Pad With Two-section Window Having Recess
App 20150004888 - Swedek; Boguslaw A. ; et al. | 2015-01-01 |
Spectrographic monitoring of a substrate during processing using index values
Grant 8,874,250 - David , et al. October 28, 2 | 2014-10-28 |
Spectra Based Endpointing for Chemical Mechanical Polishing
App 20140316550 - Swedek; Boguslaw A. ; et al. | 2014-10-23 |
Polishing pad with two-section window having recess
Grant 8,858,298 - Swedek , et al. October 14, 2 | 2014-10-14 |
X-ray Metrology For Control Of Polishing
App 20140273745 - Swedek; Boguslaw A. ; et al. | 2014-09-18 |
Path For Probe Of Spectrographic Metrology System
App 20140242879 - David; Jeffrey Drue ; et al. | 2014-08-28 |
Feed Forward Parameter Values For Use In Theoretically Generating Spectra
App 20140242881 - David; Jeffrey Drue ; et al. | 2014-08-28 |
Weighted Regression Of Thickness Maps From Spectral Data
App 20140242878 - Cherian; Benjamin ; et al. | 2014-08-28 |
Determination Of Wafer Angular Position For In-sequence Metrology
App 20140242883 - Cherian; Benjamin ; et al. | 2014-08-28 |
Spectra based endpointing for chemical mechanical polishing
Grant 8,815,109 - Swedek , et al. August 26, 2 | 2014-08-26 |
Endpoint Control Of Multiple Substrates Of Varying Thickness On The Same Platen In Chemical Mechanical Polishing
App 20140222188 - Duboust; Alain ; et al. | 2014-08-07 |
Reflectivity Measurements During Polishing Using A Camera
App 20140206259 - Benvegnu; Dominic J. ; et al. | 2014-07-24 |
Friction sensor for polishing system
Grant 8,758,086 - Miller , et al. June 24, 2 | 2014-06-24 |
Automatic selection of reference spectra library
Grant 8,755,928 - Zhang , et al. June 17, 2 | 2014-06-17 |
Adaptive tracking spectrum features for endpoint detection
Grant 8,751,033 - David , et al. June 10, 2 | 2014-06-10 |
Multi-Platen Multi-Head Polishing Architecture
App 20140141695 - David; Jeffrey Drue ; et al. | 2014-05-22 |
Polishing System with In-Sequence Sensor
App 20140141696 - David; Jeffrey Drue ; et al. | 2014-05-22 |
Techniques For Matching Spectra
App 20140134758 - Shrestha; Kiran Lall ; et al. | 2014-05-15 |
In-situ Monitoring System With Monitoring Of Elongated Region
App 20140127971 - Xu; Kun ; et al. | 2014-05-08 |
Semi-quantitative thickness determination
Grant 8,718,810 - Benvegnu , et al. May 6, 2 | 2014-05-06 |
Endpointing With Selective Spectral Monitoring
App 20140113524 - Qian; Jun ; et al. | 2014-04-24 |
Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishing
Grant 8,694,144 - Duboust , et al. April 8, 2 | 2014-04-08 |
Residue Detection with Spectrographic Sensor
App 20140093987 - David; Jeffrey Drue ; et al. | 2014-04-03 |
Using optical metrology for within wafer feed forward process control
Grant 8,679,979 - David , et al. March 25, 2 | 2014-03-25 |
Peak-based Endpointing For Chemical Mechanical Polishing
App 20140080232 - Benvegnu; Dominic J. ; et al. | 2014-03-20 |
Endpoint detection using spectrum feature trajectories
Grant 8,657,646 - Benvegnu , et al. February 25, 2 | 2014-02-25 |
Using Spectra to Determine Polishing Endpoints
App 20140045282 - Lee; Harry Q. ; et al. | 2014-02-13 |
Spectrographic Monitoring Of A Substrate During Processing Using Index Values
App 20140039660 - David; Jeffrey Drue ; et al. | 2014-02-06 |
Control Of Polishing Of Multiple Substrates On The Same Platen In Chemical Mechanical Polishing
App 20140030956 - Zhang; Jimin ; et al. | 2014-01-30 |
Control Of Overpolishing Of Multiple Substrates On the Same Platen In Chemical Mechanical Polishing
App 20140024293 - Zhang; Jimin ; et al. | 2014-01-23 |
In-line wafer thickness sensing
Grant 8,628,376 - Sin , et al. January 14, 2 | 2014-01-14 |
Gathering Spectra From Multiple Optical Heads
App 20140011429 - David; Jeffrey Drue ; et al. | 2014-01-09 |
Control of overpolishing of multiple substrates on the same platen in chemical mechanical polishing
Grant 8,616,935 - Zhang , et al. December 31, 2 | 2013-12-31 |
Endpointing Detection For Chemical Mechanical Polishing Based On Spectrometry
App 20130344625 - Benvegnu; Dominic J. ; et al. | 2013-12-26 |
Peak-based endpointing for chemical mechanical polishing
Grant 8,591,698 - Benvegnu , et al. November 26, 2 | 2013-11-26 |
Thin Polishing Pad With Window And Molding Process
App 20130309951 - Benvegnu; Dominic J. ; et al. | 2013-11-21 |
Treatment of polishing pad window
Grant 8,585,790 - Swedek , et al. November 19, 2 | 2013-11-19 |
Methods of using optical metrology for feed back and feed forward process control
Grant 8,579,675 - David , et al. November 12, 2 | 2013-11-12 |
Polishing Pad For Endpoint Detection And Related Methods
App 20130295826 - Swedek; Boguslaw A. ; et al. | 2013-11-07 |
Using spectra to determine polishing endpoints
Grant 8,569,174 - Lee , et al. October 29, 2 | 2013-10-29 |
Method Of Controlling Polishing Using In-situ Optical Monitoring And Fourier Transform
App 20130280827 - Benvegnu; Dominic J. ; et al. | 2013-10-24 |
User-input Functions For Data Sequences In Polishing Endpoint Detection
App 20130280989 - Lee; Harry Q. ; et al. | 2013-10-24 |
Thin polishing pad with window and molding process
Grant 8,562,389 - Benvegnu , et al. October 22, 2 | 2013-10-22 |
Method of controlling polishing using in-situ optical monitoring and fourier transform
Grant 8,563,335 - Benvegnu , et al. October 22, 2 | 2013-10-22 |
Spectrographic monitoring of a substrate during processing using index values
Grant 8,554,351 - David , et al. October 8, 2 | 2013-10-08 |
Gathering spectra from multiple optical heads
Grant 8,535,115 - David , et al. September 17, 2 | 2013-09-17 |
Polishing Pad With Two-section Window Having Recess
App 20130231032 - Swedek; Boguslaw A. ; et al. | 2013-09-05 |
Feedback Control Using Detection Of Clearance And Adjustment For Uniform Topography
App 20130224890 - Xu; Kun ; et al. | 2013-08-29 |
Spectrum based endpointing for chemical mechanical polishing
Grant 8,518,827 - Benvegnu , et al. August 27, 2 | 2013-08-27 |
Adjusting Polishing Rates by Using Spectrographic Monitoring of a Substrate During Processing
App 20130204424 - David; Jeffrey Drue ; et al. | 2013-08-08 |
Polishing pad for endpoint detection and related methods
Grant 8,485,862 - Swedek , et al. July 16, 2 | 2013-07-16 |
Friction Sensor For Polishing System
App 20130167614 - Miller; Gabriel Lorimer ; et al. | 2013-07-04 |
Polishing pad with partially recessed window
Grant 8,475,228 - Benvegnu , et al. July 2, 2 | 2013-07-02 |
Computer-implemented process control in chemical mechanical polishing
Grant 8,460,057 - Swedek , et al. June 11, 2 | 2013-06-11 |
Molding windows in thin pads
Grant 8,393,940 - Swedek , et al. March 12, 2 | 2013-03-12 |
Polishing pad and system with window support
Grant 8,393,933 - Qian , et al. March 12, 2 | 2013-03-12 |
Semi-Quantitative Thickness Determination
App 20130059499 - Benvegnu; Dominic J. ; et al. | 2013-03-07 |
Multiple libraries for spectrographic monitoring of zones of a substrate during processing
Grant 8,392,012 - David , et al. March 5, 2 | 2013-03-05 |
Adjusting polishing rates by using spectrographic monitoring of a substrate during processing
Grant 8,369,978 - David , et al. February 5, 2 | 2013-02-05 |
Semi-quantitative thickness determination
Grant 8,352,061 - Benvegnu , et al. January 8, 2 | 2013-01-08 |
Friction sensor for polishing system
Grant 8,342,906 - Miller , et al. January 1, 2 | 2013-01-01 |
Wafer edge characterization by successive radius measurements
Grant 8,337,278 - Palou-Rivera , et al. December 25, 2 | 2012-12-25 |
Spectrographic Monitoring Of A Substrate During Processing Using Index Values
App 20120323355 - David; Jeffrey Drue ; et al. | 2012-12-20 |
Endpoint Detection Using Spectrum Feature Trajectories
App 20120289124 - Benvegnu; Dominic J. ; et al. | 2012-11-15 |
High Sensitivity Eddy Current Monitoring System
App 20120276661 - Iravani; Hassan G. ; et al. | 2012-11-01 |
Eddy Current Monitoring Of Metal Residue Or Metal Pillars
App 20120276817 - Iravani; Hassan G. ; et al. | 2012-11-01 |
Eddy Current Monitoring Of Metal Features
App 20120276662 - Iravani; Hassan G. ; et al. | 2012-11-01 |
Automatic Selection Of Reference Spectra Library
App 20120276814 - Zhang; Jimin ; et al. | 2012-11-01 |
Endpoint control of multiple-wafer chemical mechanical polishing
Grant 8,295,967 - Zhang , et al. October 23, 2 | 2012-10-23 |
Using optical metrology for wafer to wafer feed back process control
Grant 8,292,693 - David , et al. October 23, 2 | 2012-10-23 |
Reducing polishing pad deformation
Grant 8,287,330 - Bennett , et al. October 16, 2 | 2012-10-16 |
Eddy current sensor with enhanced edge resolution
Grant 8,284,560 - Iravani , et al. October 9, 2 | 2012-10-09 |
Automatic Gain Control
App 20120227903 - Swedek; Boguslaw A. ; et al. | 2012-09-13 |
Spectrographic monitoring of a substrate during processing using index values
Grant 8,260,446 - David , et al. September 4, 2 | 2012-09-04 |
Gathering Spectra From Multiple Optical Heads
App 20120196511 - David; Jeffrey Drue ; et al. | 2012-08-02 |
Automatic gain control
Grant 8,187,977 - Swedek , et al. May 29, 2 | 2012-05-29 |
Spectra Based Endpointing for Chemical Mechanical Polishing
App 20120100642 - SWEDEK; Boguslaw A. ; et al. | 2012-04-26 |
Feedback Control of Polishing Using Optical Detection of Clearance
App 20120064801 - Xu; Kun ; et al. | 2012-03-15 |
Endpoint Control Of Multiple Substrates Of Varying Thickness On The Same Platen In Chemical Mechanical Polishing
App 20120053717 - Duboust; Alain ; et al. | 2012-03-01 |
Methods and apparatus for measuring substrate edge thickness during polishing
Grant 8,125,654 - Benvegnu , et al. February 28, 2 | 2012-02-28 |
Using Optical Metrology For Within Wafer Feed Forward Process Control
App 20120028377 - David; Jeffrey Drue ; et al. | 2012-02-02 |
Selecting Reference Libraries For Monitoring Of Multiple Zones On A Substrate
App 20120028813 - Qian; Jun ; et al. | 2012-02-02 |
Spectra based endpointing for chemical mechanical polishing
Grant 8,088,298 - Swedek , et al. January 3, 2 | 2012-01-03 |
Control of Overpolishing of Multiple Substrates on the Same Platen in Chemical Mechanical Polishing
App 20110300775 - Zhang; Jimin ; et al. | 2011-12-08 |
Determining Physical Property of Substrate
App 20110294400 - Ravid; Abraham ; et al. | 2011-12-01 |
Eddy Current System for In-Situ Profile Measurement
App 20110294402 - Miller; G. Laurie ; et al. | 2011-12-01 |
Endpoint Control Of Multiple Substrates With Multiple Zones On The Same Platen In Chemical Mechanical Polishing
App 20110282477 - Lee; Harry Q. ; et al. | 2011-11-17 |
Pad Window Insert
App 20110281510 - Swedek; Boguslaw A. ; et al. | 2011-11-17 |
Molding Windows in Thin Pads
App 20110256818 - Swedek; Boguslaw A. ; et al. | 2011-10-20 |
Adaptively Tracking Spectrum Features For Endpoint Detection
App 20110256805 - David; Jeffrey Drue ; et al. | 2011-10-20 |
Using optical metrology for within wafer feed forward process control
Grant 8,039,397 - David , et al. October 18, 2 | 2011-10-18 |
Determining physical property of substrate
Grant 8,014,004 - Ravid , et al. September 6, 2 | 2011-09-06 |
Polishing Pad With Partially Recessed Window
App 20110212673 - Benvegnu; Dominic J. ; et al. | 2011-09-01 |
Eddy current apparatus and method for in-situ profile measurement
Grant 7,999,540 - Miller , et al. August 16, 2 | 2011-08-16 |
Polishing System With In-line And In-situ Metrology
App 20110195528 - Swedek; Boguslaw A. ; et al. | 2011-08-11 |
High Sensitivity Real Time Profile Control Eddy Current Monitoring System
App 20110189856 - Xu; Kun ; et al. | 2011-08-04 |
High Sensitivity Real Time Profile Control Eddy Current Monitoring System
App 20110189925 - Iravani; Hassan G. ; et al. | 2011-08-04 |
High throughput measurement system
Grant 7,952,708 - Ravid , et al. May 31, 2 | 2011-05-31 |
Polishing pad with window having multiple portions
Grant 7,942,724 - Benvegnu , et al. May 17, 2 | 2011-05-17 |
Endpoint Method Using Peak Location Of Spectra Contour Plots Versus Time
App 20110104987 - David; Jeffrey Drue ; et al. | 2011-05-05 |
Polishing system with in-line and in-situ metrology
Grant 7,927,182 - Swedek , et al. April 19, 2 | 2011-04-19 |
Methods And Apparatus For Generating A Library Of Spectra
App 20110046918 - Ravid; Abraham ; et al. | 2011-02-24 |
Methods Of Using Optical Metrology For Feed Back And Feed Forward Process Control
App 20100297916 - David; Jeffrey Drue ; et al. | 2010-11-25 |
Methods and apparatus for generating a library of spectra
Grant 7,840,375 - Ravid , et al. November 23, 2 | 2010-11-23 |
Treatment Of Polishing Pad Window
App 20100269417 - Swedek; Boguslaw A. ; et al. | 2010-10-28 |
Determining Physical Property of Substrate
App 20100261413 - Ravid; Abraham ; et al. | 2010-10-14 |
Spectrographic Monitoring Of A Substrate During Processing Using Index Values
App 20100217430 - David; Jeffrey Drue ; et al. | 2010-08-26 |
Substrate thickness measuring during polishing
Grant 7,774,086 - David , et al. August 10, 2 | 2010-08-10 |
Determining copper concentration in spectra
Grant 7,768,659 - Benvegnu , et al. August 3, 2 | 2010-08-03 |
Polishing Pad and System with Window Support
App 20100184357 - Qian; Jun ; et al. | 2010-07-22 |
GST Film Thickness Monitoring
App 20100185314 - Xu; Kun ; et al. | 2010-07-22 |
Determining physical property of substrate
Grant 7,746,485 - Ravid , et al. June 29, 2 | 2010-06-29 |
Using Optical Metrology For Within Wafer Feed Forward Process Control
App 20100129939 - David; Jeffrey Drue ; et al. | 2010-05-27 |
Using Optical Metrology For Wafer To Wafer Feed Back Process Control
App 20100130100 - David; Jeffrey Drue ; et al. | 2010-05-27 |
Semi-Quantitative Thickness Determination
App 20100124870 - Benvegnu; Dominic J. ; et al. | 2010-05-20 |
Eddy Current Sensor With Enhanced Edge Resolution
App 20100124792 - Iravani; Hassan G. ; et al. | 2010-05-20 |
Endpoint Control Of Multiple-wafer Chemical Mechanical Polishing
App 20100120331 - Carlsson; Ingemar ; et al. | 2010-05-13 |
In-Line Wafer Thickness Sensing
App 20100120333 - Sin; Garrett H. ; et al. | 2010-05-13 |
Endpoint Control Of Multiple-wafer Chemical Mechanical Polishing
App 20100120330 - Zhang; Jimin ; et al. | 2010-05-13 |
Weighted Spectrographic Monitoring Of A Substrate During Processing
App 20100114532 - David; Jeffrey Drue ; et al. | 2010-05-06 |
Multiple Libraries For Spectrographic Monitoring Of Zones Of A Substrate During Processing
App 20100105288 - David; Jeffrey Drue ; et al. | 2010-04-29 |
Goodness Of Fit In Spectrographic Monitoring Of A Substrate During Processing
App 20100103422 - David; Jeffrey Drue ; et al. | 2010-04-29 |
Integrated endpoint detection system with optical and eddy current monitoring
Grant 7,682,221 - Swedek , et al. March 23, 2 | 2010-03-23 |
Polishing System With In-line And In-situ Metrology
App 20100062684 - Swedek; Boguslaw A. ; et al. | 2010-03-11 |
Adjusting Polishing Rates by Using Spectrographic Monitoring of a Substrate During Processing
App 20100056023 - David; Jeffrey Drue ; et al. | 2010-03-04 |
Multiple Window Pad Assembly
App 20090305610 - Yilmaz; Alpay ; et al. | 2009-12-10 |
Reducing polishing pad deformation
Grant 7,621,798 - Bennett , et al. November 24, 2 | 2009-11-24 |
Methods And Apparatus For Measuring Substrate Edge Thickness During Polishing
App 20090262353 - Benvegnu; Dominic J. ; et al. | 2009-10-22 |
Friction Sensor For Polishing System
App 20090253351 - Miller; Gabriel Lorimer ; et al. | 2009-10-08 |
Method and apparatus of eddy current monitoring for chemical mechanical polishing
Grant 7,591,708 - Birang , et al. September 22, 2 | 2009-09-22 |
Computer-implemented method for process control in chemical mechanical polishing
Grant 7,585,202 - Swedek , et al. September 8, 2 | 2009-09-08 |
Automatic Gain Control
App 20090156098 - Swedek; Boguslaw A. ; et al. | 2009-06-18 |
Wafer Edge Characterization By Successive Radius Measurements
App 20090149115 - Palou-Rivera; Ignacio ; et al. | 2009-06-11 |
Polishing endpoint detection system and method using friction sensor
Grant 7,513,818 - Miller , et al. April 7, 2 | 2009-04-07 |
Data processing for monitoring chemical mechanical polishing
Grant 7,500,901 - Swedek , et al. March 10, 2 | 2009-03-10 |
Automatic gain control
Grant 7,494,929 - Swedek , et al. February 24, 2 | 2009-02-24 |
Determining Physical Property of Substrate
App 20090033942 - Ravid; Abraham ; et al. | 2009-02-05 |
Substrate Thickness Measuring During Polishing
App 20090036026 - David; Jeffrey Drue ; et al. | 2009-02-05 |
Spectra Based Endpointing For Chemical Mechanical Polishing
App 20090017726 - Swedek; Boguslaw A. ; et al. | 2009-01-15 |
Thin Polishing Pad With Window And Molding Process
App 20080305729 - Benvegnu; Dominic J. ; et al. | 2008-12-11 |
Determining physical property of substrate
Grant 7,444,198 - Ravid , et al. October 28, 2 | 2008-10-28 |
Methods And Apparatus For Generating A Library Of Spectra
App 20080243433 - Ravid; Abraham ; et al. | 2008-10-02 |
High Throughput Measurement System
App 20080239308 - Ravid; Abraham ; et al. | 2008-10-02 |
System for endpoint detection with polishing pad
Grant 7,429,207 - Swedek , et al. September 30, 2 | 2008-09-30 |
Using Spectra to Determine Polishing Endpoints
App 20080206993 - Lee; Harry Q. ; et al. | 2008-08-28 |
Substrate thickness measuring during polishing
Grant 7,409,260 - David , et al. August 5, 2 | 2008-08-05 |
Spectra based endpointing for chemical mechanical polishing
Grant 7,406,394 - Swedek , et al. July 29, 2 | 2008-07-29 |
Determining Physical Property Of Substrate
App 20080146120 - Ravid; Abraham ; et al. | 2008-06-19 |
Detection Of Clearance Of Polysilicon Residue
App 20080138988 - David; Jeffrey Drue ; et al. | 2008-06-12 |
Determining Copper Concentration In Spectra
App 20080130000 - Benvegnu; Dominic J. ; et al. | 2008-06-05 |
Polishing pads useful for endpoint detection in chemical mechanical polishing
Grant 7,374,477 - Birang , et al. May 20, 2 | 2008-05-20 |
Reducing polishing pad deformation
Grant 7,354,334 - Birang , et al. April 8, 2 | 2008-04-08 |
Method and Apparatus Of Eddy Current Monitoring For Chemical Mechanical Polishing
App 20080064301 - Birang; Manoocher ; et al. | 2008-03-13 |
Polishing System With In-Line and In-Situ Metrology
App 20080064300 - Swedek; Boguslaw A. ; et al. | 2008-03-13 |
Reducing Polishing Pad Deformation
App 20080020690 - Birang; Manoocher ; et al. | 2008-01-24 |
Polishing Pad With Window Having Multiple Portions
App 20080003923 - Benvegnu; Dominic J. ; et al. | 2008-01-03 |
Polishing Pad For Eddy Current Monitoring
App 20080003936 - Swedek; Boguslaw A. ; et al. | 2008-01-03 |
Polishing system with in-line and in-situ metrology
Grant 7,294,039 - Swedek , et al. November 13, 2 | 2007-11-13 |
Automatic gain control
App 20070251922 - Swedek; Boguslaw A. ; et al. | 2007-11-01 |
Substrate Thickness Measuring During Polishing
App 20070224915 - David; Jeffrey Drue ; et al. | 2007-09-27 |
Feedback controlled polishing processes
Grant 7,247,080 - Bennett , et al. July 24, 2 | 2007-07-24 |
Eddy current system for in-situ profile measurement
App 20070139043 - Miller; G. Laurie ; et al. | 2007-06-21 |
Integrated Endpoint Detection System With Optical And Eddy Current Monitoring
App 20070135958 - Swedek; Boguslaw A. ; et al. | 2007-06-14 |
System for Endpoint Detection with Polishing Pad
App 20070077862 - Swedek; Boguslaw A. ; et al. | 2007-04-05 |
In-situ substrate imaging
App 20070077671 - David; Jeffrey Drue ; et al. | 2007-04-05 |
Metrology for chemical mechanical polishing
Grant 7,195,535 - Swedek , et al. March 27, 2 | 2007-03-27 |
Integrated endpoint detection system with optical and eddy current monitoring
Grant 7,195,536 - Swedek , et al. March 27, 2 | 2007-03-27 |
Spectra based endpointing for chemical mechanical polishing
App 20070039925 - Swedek; Boguslaw A. ; et al. | 2007-02-22 |
Substrate edge detection
Grant 7,153,185 - Birang , et al. December 26, 2 | 2006-12-26 |
Polishing System With In-Line and In-Situ Metrology
App 20060286904 - Swedek; Boguslaw A. ; et al. | 2006-12-21 |
System and method for in-line metal profile measurement
App 20060246822 - Swedek; Boguslaw A. ; et al. | 2006-11-02 |
Method of forming a polishing pad for endpoint detection
Grant 7,118,457 - Swedek , et al. October 10, 2 | 2006-10-10 |
Eddy current system for in-situ profile measurement
Grant 7,112,960 - Miller , et al. September 26, 2 | 2006-09-26 |
System and method for in-line metal profile measurement
Grant 7,101,254 - Swedek , et al. September 5, 2 | 2006-09-05 |
Polishing system with in-line and in-situ metrology
Grant 7,101,251 - Swedek , et al. September 5, 2 | 2006-09-05 |
Determination of position of sensor measurements during polishing
Grant 7,097,537 - David , et al. August 29, 2 | 2006-08-29 |
Chemical mechanical polishing control system and method
Grant 7,074,109 - Bennett , et al. July 11, 2 | 2006-07-11 |
Feedback controlled polishing processes
Grant 7,024,268 - Bennett , et al. April 4, 2 | 2006-04-04 |
Signal improvement in eddy current sensing
Grant 7,016,795 - Swedek , et al. March 21, 2 | 2006-03-21 |
Combined eddy current sensing and optical monitoring for chemical mechanical polishing
Grant 7,008,297 - Johansson , et al. March 7, 2 | 2006-03-07 |
Substrate monitoring during chemical mechanical polishing
Grant 7,008,295 - Wiswesser , et al. March 7, 2 | 2006-03-07 |
Data processing for monitoring chemical mechanical polishing
Grant 7,008,296 - Swedek , et al. March 7, 2 | 2006-03-07 |
Method and apparatus of eddy current monitoring for chemical mechanical polishing
Grant 7,001,242 - Birang , et al. February 21, 2 | 2006-02-21 |
Method and apparatus of eddy current monitoring for chemical mechanical polishing
App 20060025052 - Birang; Manoocher ; et al. | 2006-02-02 |
Chemical mechanical polishing with multi-stage monitoring of metal clearing
Grant 6,991,516 - David , et al. January 31, 2 | 2006-01-31 |
Chemical mechanical polishing apparatus with non-conductive elements
App 20060009132 - Bennett; Doyle E. ; et al. | 2006-01-12 |
Data processing for monitoring chemical mechanical polishing
App 20060009131 - Swedek; Boguslaw A. ; et al. | 2006-01-12 |
Integrated endpoint detection system with optical and eddy current monitoring
App 20050287929 - Swedek, Boguslaw A. ; et al. | 2005-12-29 |
Integrated endpoint detection system with optical and eddy current monitoring
Grant 6,966,816 - Swedek , et al. November 22, 2 | 2005-11-22 |
Polishing system with in-line and in-situ metrology
App 20050245170 - Swedek, Boguslaw A. ; et al. | 2005-11-03 |
Chemical mechanical polishing apparatus with non-conductive elements
Grant 6,945,845 - Bennett , et al. September 20, 2 | 2005-09-20 |
Polishing system with in-line and in-situ metrology
Grant 6,939,198 - Swedek , et al. September 6, 2 | 2005-09-06 |
Endpoint system for electro-chemical mechanical polishing
App 20050173259 - Mavliev, Rashid ; et al. | 2005-08-11 |
Polishing endpoint detection system and method using friction sensor
App 20050136800 - Miller, Gabriel Lorimer ; et al. | 2005-06-23 |
Method of forming a polishing pad for endpoint detection
App 20050124273 - Swedek, Boguslaw A. ; et al. | 2005-06-09 |
Combined eddy current sensing and optical monitoring for chemical mechanical polishing
App 20050101224 - Johansson, Nils ; et al. | 2005-05-12 |
Combined eddy current sensing and optical monitoring for chemical mechanical polishing
Grant 6,878,038 - Johansson , et al. April 12, 2 | 2005-04-12 |
System and method for in-line metal profile measurement
App 20050048874 - Swedek, Boguslaw A. ; et al. | 2005-03-03 |
Eddy current system for in-situ profile measurement
App 20050024047 - Miller, G. Laurie ; et al. | 2005-02-03 |
Data processing for monitoring chemical mechanical polishing
App 20040259470 - Swedek, Boguslaw A. ; et al. | 2004-12-23 |
Polishing pad with window
Grant 6,832,950 - Wright , et al. December 21, 2 | 2004-12-21 |
System and method for in-line metal profile measurement
Grant 6,811,466 - Swedek , et al. November 2, 2 | 2004-11-02 |
Chemical mechanical polishing apparatus with non-conductive elements
App 20040176014 - Bennett, Doyle E. ; et al. | 2004-09-09 |
Substrate monitoring during chemical mechanical polishing
App 20040152396 - Wiswesser, Andreas Norbert ; et al. | 2004-08-05 |
Signal improvement in eddy current sensing
App 20040152310 - Swedek, Boguslaw A. ; et al. | 2004-08-05 |
Polishing pad with window
App 20040082271 - Wiswesser, Andreas Norbert ; et al. | 2004-04-29 |
Polishing pad with window
App 20040082287 - Wright, Jason R. ; et al. | 2004-04-29 |
Polishing pad with transparent window
Grant 6,716,085 - Wiswesser , et al. April 6, 2 | 2004-04-06 |
Polishing pad for endpoint detection and related methods
App 20030236055 - Swedek, Boguslaw A. ; et al. | 2003-12-25 |
Optical monitoring in a two-step chemical mechanical polishing process
Grant 6,632,124 - Adams , et al. October 14, 2 | 2003-10-14 |
Method and apparatus of eddy current monitoring for chemical mechanical polishing
App 20030148706 - Birang, Manoocher ; et al. | 2003-08-07 |
Polishing pads useful for endpoint detection in chemical mechanical polishing
App 20030148721 - Birang, Manoocher ; et al. | 2003-08-07 |
Polishing pad with transparent window
App 20030124956 - Wiswesser, Andreas Norbert ; et al. | 2003-07-03 |
Optical Monitoring In A Two-step Chemical Mechanical Polishing Process
App 20030104760 - Adams, Bret W. ; et al. | 2003-06-05 |
Optical monitoring in a two-step chemical mechanical polishing process
Grant 6,506,097 - Adams , et al. January 14, 2 | 2003-01-14 |
Optical Monitoring In A Two-step Chemical Mechanical Polishing Process
App 20030003845 - Adams, Bret W. ; et al. | 2003-01-02 |
Integrated endpoint detection system with optical and eddy current monitoring
App 20020164925 - Swedek, Boguslaw A. ; et al. | 2002-11-07 |
Combined eddy current sensing and optical monitoring for chemical mechanical polishing
App 20020077031 - Johansson, Nils ; et al. | 2002-06-20 |
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