U.S. patent application number 10/240265 was filed with the patent office on 2003-08-28 for adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device.
Invention is credited to Hasegawa, Yuuji, Hatakeyama, Keiichi, Inada, Teiichi, Iwakura, Tetsurou, Kuriya, Hiroyuki, Matsuzaki, Takayuki, Nishiyama, Masaya, Shimada, Yasushi, Sumiya, Keiji, Suzuki, Masao, Tanaka, Yuuko, Tomiyama, Takeo, Uruno, Michio, Yasuda, Masaaki.
Application Number | 20030159773 10/240265 |
Document ID | / |
Family ID | 27481187 |
Filed Date | 2003-08-28 |
United States Patent
Application |
20030159773 |
Kind Code |
A1 |
Tomiyama, Takeo ; et
al. |
August 28, 2003 |
Adhesive composition, method for preparing the same, adhesive film
using the same, substrate for carrying semiconductor and
semiconductor device
Abstract
There are disclosed an adhesive composition comprising: (a) an
epoxy resin, (b) a curing agent and (c) a polymer compound with a
weight average molecular weight of 100,000 or more, wherein a ratio
of A/B exceeds 1 and is 10 or less, where A represents the total
weight of (a) the epoxy resin and (b) the curing agent and B
represents a weight of (c) the polymer compound; an adhesive
composition, whose compositions are separated into a sea phase and
an island phase, when viewed at a section in a cured state, and a
ratio X/Y is in a range of 0.1 to 1.0, where X is an area of the
sea phase and Y is an area of the island phase; a process for
producing said adhesive composition; an adhesive film wherein said
adhesive composition is formed into a film form; an adhesive film
for bonding a semiconductor chip and a wiring board for mounting a
semiconductor or for bonding semiconductor chips themselves,
wherein the adhesive film can perform bonding by heat-pressing with
a pressure of 0.01 to 0.5 MPa; a wiring board for mounting a
semiconductor equipped with said adhesive film on a surface for
mounting a semiconductor chip; and a semiconductor device using
said adhesive film or said wiring board for mounting a
semiconductor.
Inventors: |
Tomiyama, Takeo; (Ibaraki,
JP) ; Inada, Teiichi; (Ibaraki, JP) ; Yasuda,
Masaaki; (Ibaraki, JP) ; Hatakeyama, Keiichi;
(Ibaraki, JP) ; Hasegawa, Yuuji; (Ibaraki, JP)
; Nishiyama, Masaya; (Ibaraki, JP) ; Matsuzaki,
Takayuki; (Chiba, JP) ; Uruno, Michio; (Chiba,
JP) ; Suzuki, Masao; (Ibaraki, JP) ; Iwakura,
Tetsurou; (Ibaraki, JP) ; Shimada, Yasushi;
(Ibaraki, JP) ; Tanaka, Yuuko; (Ibaraki, JP)
; Kuriya, Hiroyuki; (Ibaraki, JP) ; Sumiya,
Keiji; (Ibaraki, JP) |
Correspondence
Address: |
ANTONELLI TERRY STOUT AND KRAUS
SUITE 1800
1300 NORTH SEVENTEENTH STREET
ARLINGTON
VA
22209
|
Family ID: |
27481187 |
Appl. No.: |
10/240265 |
Filed: |
February 21, 2003 |
PCT Filed: |
March 30, 2001 |
PCT NO: |
PCT/JP01/02716 |
Current U.S.
Class: |
156/248 ;
156/330; 257/E21.505 |
Current CPC
Class: |
H01L 2224/8385 20130101;
H01L 2924/351 20130101; H05K 1/0271 20130101; H01L 2924/15311
20130101; C08L 2666/02 20130101; H01L 2924/01015 20130101; H01L
2924/01027 20130101; H01L 2224/83192 20130101; H01L 2924/0102
20130101; H01L 2924/01045 20130101; H01L 2924/01074 20130101; H01L
2924/01087 20130101; H01L 2924/014 20130101; C09J 7/35 20180101;
H01L 2924/01033 20130101; H01L 2924/01051 20130101; H01L 2924/01006
20130101; H01L 2924/01077 20130101; C09J 7/10 20180101; H01L 24/73
20130101; H01L 2924/01005 20130101; H01L 24/29 20130101; H01L
2224/2919 20130101; Y10T 156/1052 20150115; H01L 2224/48227
20130101; H01L 2924/0104 20130101; H01L 2924/01082 20130101; H01L
21/6835 20130101; H01L 2924/01078 20130101; H01L 2224/73265
20130101; H01L 2924/01013 20130101; H01L 24/32 20130101; H01L
2924/01029 20130101; Y10T 428/24 20150115; C09J 2463/00 20130101;
H01L 2924/01023 20130101; H01L 2224/48091 20130101; H01L 2924/01012
20130101; H01L 2924/181 20130101; C09J 163/00 20130101; H01L
2924/01039 20130101; H01L 2924/15787 20130101; H01L 24/83 20130101;
H01L 2924/07802 20130101; H01L 2224/32225 20130101; H01L 2924/01047
20130101; H01L 2924/0665 20130101; H01L 2224/32145 20130101; H01L
2224/48091 20130101; H01L 2924/00014 20130101; H01L 2224/2919
20130101; H01L 2924/0665 20130101; H01L 2924/00 20130101; H01L
2924/0665 20130101; H01L 2924/00 20130101; H01L 2224/83192
20130101; H01L 2924/3512 20130101; H01L 2224/32225 20130101; H01L
2924/00 20130101; H01L 2924/00012 20130101; H01L 2924/3512
20130101; H01L 2224/73265 20130101; H01L 2224/32145 20130101; H01L
2924/00 20130101; H01L 2224/48227 20130101; H01L 2924/00012
20130101; H01L 2224/73265 20130101; H01L 2224/32225 20130101; H01L
2224/32145 20130101; H01L 2224/48227 20130101; H01L 2924/00012
20130101; H01L 2924/15311 20130101; H01L 2224/73265 20130101; H01L
2224/73265 20130101; H01L 2224/32225 20130101; H01L 2224/48227
20130101; H01L 2224/32225 20130101; H01L 2924/00012 20130101; H01L
2224/48227 20130101; H01L 2924/00012 20130101; H01L 2924/351
20130101; H01L 2924/15311 20130101; H01L 2224/73265 20130101; H01L
2924/00 20130101; H01L 2224/32225 20130101; H01L 2224/48227
20130101; H01L 2924/00012 20130101; H01L 2924/15787 20130101; H01L
2924/351 20130101; H01L 2924/00 20130101; H01L 2924/181 20130101;
H01L 2924/15787 20130101; H01L 2924/00 20130101; H01L 2924/00012
20130101; C09J 163/00 20130101; H01L 2924/181 20130101; C08L
2666/02 20130101; H01L 2924/00012 20130101; C09J 163/00 20130101;
C08L 2666/02 20130101 |
Class at
Publication: |
156/248 ;
156/330 |
International
Class: |
B32B 031/00 |
Foreign Application Data
Date |
Code |
Application Number |
Mar 31, 2000 |
JP |
2000101253 |
Mar 31, 2000 |
JP |
2000101254 |
Mar 15, 2001 |
JP |
2001074268 |
Mar 19, 2001 |
JP |
2001078587 |
Claims
1. An adhesive composition comprising: (a) an epoxy resin, (b) a
curing agent and (c) a polymer compound with a weight average
molecular weight of 100,000 or more, wherein a ratio of A/B exceeds
1 and is 10 or less, where A is the total weight of (a) the epoxy
resin and (b) the curing agent and B is a weight of (c) the polymer
compound.
2. The adhesive composition according to claim 1, wherein a
half-life (H, in hour) of a resin flow amount after heat-treatment
at 60.degree. C. and a weight fraction (.phi.) of a weight of (c)
the polymer based on the total weight of (a) the epoxy resin, (b)
the curing agent and (c) the polymer satisfies a relation
represented by H.gtoreq.140.times..phi..sup.- 2.
3. The adhesive composition according to claim 1 or 2, wherein (a)
the epoxy resin is a solid epoxy resin having a softening point of
50.degree. C. or more as measured by a ring and ball method.
4. The adhesive composition according to any one of claims 1 to 3,
wherein at least one of (a) the epoxy resin and (b) the curing
agent is a compound comprising a bromine atom.
5. The adhesive composition according to any one of claims 1 to 4,
wherein (b) the curing agent is a phenolic resin with a hydroxyl
group equivalent of 150 g/eq or more.
6. The adhesive composition according to claim 5, wherein (b) the
curing agent is a phenolic resin represented by the following
general formula (I): 2(wherein R.sup.1 may be the same or
different, each representing a hydrogen atom, a halogen atom, a
C.sub.1-C.sub.10 linear or branched alkyl group, a cyclic alkyl
group, an aralkyl group, an alkenyl group, a hydroxy group, or an
aryl group, n is an integer of 1 to 3, and m is an integer of 0 to
50).
7. The adhesive composition according to any one of claims 1 to 6,
wherein (c) the polymer compound is an epoxy group-containing
acrylic copolymer which is immiscible with an epoxy resin.
8. The adhesive composition according to claim 7, wherein the epoxy
group-containing acrylic copolymer contains glycidylacrylate or
glycidyl methacrylate repeating unit in an amount of 0.5 to 6.0% by
weight.
9. The adhesive composition according to claim 7 or 8, wherein the
epoxy group-containing acrylic copolymer has a glass transition
temperature of -50.degree. C. to 0.degree. C.
10. The adhesive composition according to any one of claims 1 to 9,
comprising 0.1 to 5 parts by weight of the curing accelerator,
based on 100 parts by weight of the total amount of (a) the epoxy
resin and (b) the curing agent.
11. The adhesive composition according to any one of claims 1 to
10, further comprising (d) a filler.
12. The adhesive composition according to claim 11, wherein (d) the
filler has an average particle diameter of 0.005 .mu.m to 0.1
.mu.m.
13. The adhesive composition according to claim 11 or 12, wherein
(d) the filler is an inorganic filler and the inorganic filler is
contained by 1 to 50 parts by volume based on 100 parts of a volume
of the resin.
14. The adhesive composition according to any one of claims 11 to
13, wherein (d) the inorganic filler is a filler whose surface is
coated with an organic material.
15. The adhesive composition according to any one of claims 11 to
14, wherein (d) the filler has a contact angle with water of 0 to
100 degrees.
16. The adhesive composition according to any one of claims 1 to
15, which has a tensile modulus at 240.degree. C. of 1 to 10
MPa.
17. An adhesive composition, wherein components of the adhesive
composition are separated into a sea phase and an island phase in a
section in a cured state, and a ratio X/Y is in a range of 0.1 to
1.0, where X is an area of the sea phase and Y is an area of the
island phase.
18. The adhesive composition according to claim 23, wherein an area
ratio of the sea phase in a section in a cured state is larger on a
surface than at a position 5 .mu.m from the surface.
19. A method for producing an adhesive film, which comprises; (i)
mixing and kneading the adhesive composition according to anyone of
claims 1 to 18 in the presence or the absence of a solvent to
prepare a varnish; (ii) coating the obtained varnish on a support
film; and (iii) drying the support film coated with the varnish to
obtain an adhesive film at B stage.
20. An adhesive film wherein the adhesive composition according to
any one of claims 1 to 18 is formed into a film form.
21. An adhesive film for bonding a semiconductor chip and a
substrate for mounting a semiconductor or for bonding semiconductor
chips themselves, wherein the adhesive film can perform bonding by
heat-pressing with a pressure of 0.01 to 0.5 MPa.
22. An adhesive film for bonding a semiconductor chip and a
substrate for mounting a semiconductor or for bonding semiconductor
chips themselves, wherein a melt viscosity thereof at a
press-bonding temperature is in a range of 5.times.10 to
1.times.10.sup.5 Pa.multidot.s.
23. An adhesive film for bonding a semiconductor chip and a
substrate for mounting a semiconductor or for bonding semiconductor
chips themselves, wherein the adhesive film can perform bonding by
heat-pressing under a condition such that a press-bonding pressure
(F), press-bonding time (t) and a melt viscosity at a press-bonding
temperature (.eta.) satisfies the following
formula;1.times.10.ltoreq.F(Pa).multidot.t(s)/.eta.(Pa.multidot-
.s).ltoreq.5.times.10.sup.3
24. An adhesive film for bonding a semiconductor chip and a
substrate for mounting a semiconductor chip or for bonding
semiconductor chips themselves, wherein a tack load measured
according to Probe tack test at 25.degree. C. is in a range of 2 to
20 gf.
25. An adhesive film, wherein components of the adhesive
composition are separated into two phases of a sea phase and an
island phase in a section in a cured state, and a ratio X/Y is in a
range of 0.1 to 1.0, wherein X is an area of the sea phase and Y is
an area of the island phase.
26. The adhesive film according to claim 20, which satisfies at
least one of the following (I) to (IV); (I) The adhesive film can
perform bonding between a semiconductor chip and a substrate for
mounting a semiconductor or between semiconductor chips themselves
by heat-pressing with a pressure of 0.01 to 0.5 MPa; (II) A melt
viscosity at press-bonding temperature is in a range of 5.times.10
to 1.times.10.sup.5 Pa.multidot.s; (III) A tack load measured
according to Probe tack test at 25.degree. C. is in a range of 2 to
20 gf; and (IV) Components of the adhesive composition are
separated into two phases of a sea phase and an island phase in a
section in a cured state, and a ratio X/Y is in a range of 0.1 to
1.0, wherein X is an area of the sea phase and Y is an area of the
island phase.
27. The adhesive film according to claim 25 or 26, wherein an area
ratio of the sea phase in a section in a cured state is larger on a
surface than at a position 5 .mu.m from the surface.
28. The adhesive film according to any one of claims 20 to 27,
wherein a melt viscosity thereof at 100.degree. C. or less is
1.times.10.sup.4 Pa.multidot.s or more.
29. The adhesive film according to claim 28, wherein a ratio of a
melt viscosity at 100.degree. C. or less and a melt viscosity at a
press-bonding temperature is in a range of 1.times.10 to
1.times.10.sup.3.
30. The adhesive film according to any one of claims 20 to 29,
which has a peeling strength at 240.degree. C. of 50 N/m or
more.
31. The adhesive film according to any one of claims 20 to 30,
wherein an average coefficient of thermal expansion thereof at -65
to 150.degree. C. is 50 to 150 ppm/.degree. C.
32. The adhesive film according to any one of claims 20 to 31,
wherein a storage elastic modulus thereof is 20 to 2000 MPa at
25.degree. C. and 3 to 50 MPa at 260.degree. C.
33. The adhesive film according to any one of claims 20 to 32,
wherein the residual volatile component is 3.0% or less.
34. The adhesive film according to any one of claims 20 to 33,
wherein the laminated and cured product thereof does not suffer
peeling with a diameter of 2 mm or more during a heat treatment at
260.degree. C. after moisture absorption treatment.
35. The adhesive film according to any one of claims 20 to 34,
wherein thickness of the adhesive film layer is 10 to 200
.mu.m.
36. An adhesive film which comprises two laminated layers of the
adhesive film according to any one of claims 20 to 35, wherein the
first adhesive film layer has a curing degree according to
differential scanning calorimeter analysis (DSC) in a range of 0 to
40%, and the second adhesive layer has a content of the polymer
compounds which is greater than that of the first film by 10 parts
by weight or more, or has a curing degree by DSC which is greater
than that of the first layer by 5% or more.
37. A wiring board for mounting a semiconductor with an adhesive
film, wherein the adhesive film according to claim 36 is provided
on a semiconductor mounting surface of the wiring board in a way
such that the second adhesive film layer is in contact with the
wiring board.
38. A semiconductor chip with an adhesive film, wherein the
adhesive film according to claim 36 is provided on a semiconductor
chip in a way such that the first adhesive film layer is in contact
with the semiconductor chip.
39. A semiconductor device, which comprises a structure in which a
semiconductor chip and a circuit board or a circuit film are bonded
by the adhesive film according to claim 36, wherein the first
adhesive film layer is in contact with the semiconductor chip and
the second adhesive film layer is in contact with the circuit board
or the circuit film.
40. An adhesive film with a support, wherein the adhesive films
according to any one of claims 20 to 36 are laminated, directly or
intermediated by another layer, on one surface or on both surfaces
of a support film.
41. The adhesive film with a support according to claim 40, which
further comprises a layer for protecting the adhesive film on one
surface or on both surfaces thereof.
42. The adhesive film with a support according to claim 40 or 41,
wherein the support film is a heat resistant film.
43. The adhesive film with a support according to any one of claims
40 to 42, wherein the support film has a glass transition
temperature of 200.degree. C. or more.
44. A wiring board for mounting a semiconductor chip with an
adhesive film, wherein the adhesive film of any one of claims 20 to
36 or the adhesive film with a support of any one of claims 40 to
43 is provided on a semiconductor chip mounting surface of a wiring
board.
45. A semiconductor chip with an adhesive film wherein the adhesive
film of any one of claims 20 to 36 or the adhesive film with a
support of any one of claims 40 to 43 are provided on a
semiconductor chip.
46. A method for producing a semiconductor device which comprises:
(1) a step of laminating the adhesive film of any one of claims 20
to 36 or the adhesive film with a support of any one of claims 40
to 43 on an opposite surface of a wafer on which a semiconductor
chip is formed; (2) a step of laminating a dicing tape on the
laminated adhesive film or adhesive film with a support; (3) a step
of cutting the laminated wafer and the adhesive film or the
adhesive film with a support as a whole; (4) a step of peeling the
dicing tape to give a semiconductor chip with an adhesive film; and
(5) a step of heat-pressing to bond the semiconductor chip with the
adhesive film onto an outer connection part with wiring or another
semiconductor chip.
47. A semiconductor device wherein a semiconductor chip is mounted
on a wiring board for mounting a semiconductor intermediated by the
adhesive film of any one of claims 20 to 36, or the adhesive film
with a support according to any one of claims 40 to 43.
48. A semiconductor device having a structure in which plurals of
semiconductor chips are laminated on one surface or both surfaces
of a wiring board for mounting a semiconductor, wherein the
adhesive film of any one of claims 20 to 36, or the adhesive film
with a support of any one of claims 40 to 43 is used for at least
one bonding between the wiring board for mounting a semiconductor
and the semiconductor chip, or bonding between the semiconductor
chips themselves.
49. The semiconductor device according to claim 48, wherein the
wiring board for mounting a semiconductor is an organic board.
50. The semiconductor device according to claim 47, which does not
suffer peeling with a diameter of 1 mm or more between an adhesive
layer and a semiconductor chip, during a process of passing through
a reflow furnace kept at 260.degree. C. after moisture absorption
treatment at a temperature of 85.degree. C., at a relative humidity
of 85% for 168 hours.
Description
TECHNICAL FIELD
[0001] This invention relates to an adhesive composition, a process
for producing the same, an adhesive film using the same, a
substrate for mounting a semiconductor and a semiconductor device.
More specifically, this invention relates to an adhesive
composition which has heat resistance and moisture resistance
required for mounting semiconductor chips on a substrate for
mounting a semiconductor with largely different coefficients of
thermal expansion, and further has an excellent oozing-resistance
and circuit-filling property, as well as good storing property; a
process for producing the same; an adhesive film using the same;
and further, an adhesive film that can sufficiently perform bonding
with a small enough pressure not to break a chip upon pressing; a
substrate for mounting a semiconductor and a semiconductor
device.
BACKGROUND ART
[0002] In recent years, a mounting density of electronic parts has
been increased in accordance with the progress of electronic
apparatuses, and new types of the mounting method are being
employed, such as a method of mounting a semiconductor package
having almost the same size as that of a semiconductor chip, called
chip scale package or chip size package (hereinafter, simply
referred to as "CSP"), or mounting a bare chip, etc.
[0003] One of the most important characteristics for a mounted
board having mounted thereon various electronic parts including a
semiconductor element is interconnection reliability. Among them,
interconnection reliability against thermal fatigue is directly
responsible for a reliability of an apparatus using a mounted board
and is therefore a very important issue.
[0004] One of the causes of lowering the interconnection
reliability is a thermal stress caused by using various materials
with different coefficients of thermal expansion. Since a
semiconductor element has a coefficient of thermal expansion as
small as about 4 ppm/.degree. C., whereas a wiring board on which
electronic parts are mounted has a coefficient of thermal expansion
as large as 15 ppm/.degree. C. or more, a thermal strain is caused
upon a thermal impact, which in turn generates a thermal
stress.
[0005] A substrate having mounted thereon a semiconductor package
having a lead frame such as QFP and SOP, etc. has maintained its
reliability by absorbing a thermal stress at a portion of the lead
frame.
[0006] However, in the bare chip mounting, there is employed a
method of connecting an electrode of a semiconductor chip to a
wiring board pad of a wiring board using a solder ball, or a method
of connecting by preparing a small projection called bump and using
a conductive paste. Therefore, a thermal stress is concentrated on
this connecting portion, thereby lowering the interconnection
reliability. It has been known that introducing an underfill resin
between the semiconductor element and the wiring board is effective
for dispersing the thermal stress. However, the number of steps for
mounting is increased, thereby elevating the cost. On the other
hand, there is a method of connecting an electrode of a
semiconductor element to a wiring pad of a wiring board using
conventional wire bonding, however, in this method, the board must
be coated with a resin for encapsulation for protecting the wire,
thus increasing the number of steps for mounting.
[0007] CSP can be mounted together with other electronic parts, and
various structures have been proposed as shown in Table 1 appearing
at page 5 of "Future of CSP (fine pitch BGA) put into practical
use", the article of Surface Mounting Technology, March, 1997,
published by Nikkan Kogyo Shimbun Ltd. Especially, a system in
which a tape and a carrier substrate are used with a wiring board
called interposer is being put into practical use. This includes
systems shown in the above table that Tessera, Inc. and Texas
Instruments Inc. are developing. In these systems, a semiconductor
device is mounted through a wiring board called interposer, and
hence excellent interconnection reliability is exhibited as
reported in Shingaku Technical Report CPM96-121, ICD96-160
(1996-12) "Development of Tape BGA size CSP", and Sharp Technical
Journal, No. 66 (1996-12) "Development of Chip Size Package".
[0008] Between the semiconductor chip of CSP and the wiring board
called interposer, an adhesive film is preferably used which lowers
the thermal stress caused by the difference in coefficients of
thermal expansion between the semiconductor device and the wiring
board. Accordingly, the adhesive film is required to have moisture
resistance and durability at high temperatures. Further, from the
viewpoint of facilitating control of the production process, the
adhesive film is desired to be of a film type.
[0009] For these adhesive film, in addition to an effect for
alleviating thermal stress, heat resistance and moisture
resistance, it is required that adhesive should not be oozed out to
an electrode portion equipped on a semiconductor chip to output an
electric signal, for manufacturing process. In addition, in case of
using a wiring board with through-hole, it is requisite that an
adhesive should not be oozed out from the through-holes. This is
because oozing of the adhesive causes failure in connection of the
electrodes, and oozing of the adhesive from the through-holes
spoils a metal mold, causing a failure in connection. In addition,
since a void between a circuit and an adhesive tends to lower heat
resistance and moisture resistance, there should not be a void left
between the circuit on a wiring board and the adhesive.
[0010] An adhesive of a film type is used in flexible printed
circuit boards, and those comprised mainly of an
acrylonitrile-butadiene rubber are frequently used.
[0011] As printed circuit board materials with an improved moisture
resistance, Japanese Provisional Patent Publication No. 243180/1985
discloses an adhesive comprising an acrylic resin, an epoxy resin,
polyisocyanate and an inorganic filler, and Japanese Provisional
Patent Publication No. 138680/1986 discloses an adhesive comprising
an acrylic resin, an epoxy resin, a compound having a urethane bond
in the molecule and having primary amine at both terminals thereof
and an inorganic filler.
[0012] However, these adhesives have disadvantages in that the
adhesive force is significantly lowered after being treated at a
high temperature for a long time and that a resistance to
electrolytic corrosion is insufficient. The adhesives suffer
significant deterioration especially in the moisture resistance
test under severe conditions in, e.g., a pressure cooker test (PCT)
treatment, which is used for the reliability evaluation of
semiconductor relating parts.
[0013] When the semiconductor chip is mounted on a wiring board,
using the adhesive as a printed circuit board relating material,
the adhesive film cannot be used since the difference in
coefficients of thermal expansion between the semiconductor chip
and the interposer is large, thereby easily generating a crack
during reflow. In addition, the adhesive film cannot be used, since
it suffers significant deterioration when it is subjected to
moisture resistance test under severe conditions, e.g., in the
temperature cycle test or PCT treatment.
[0014] On the other hand, as an adhesive whose adhesiveness is less
deteriorated even after being treated at a high temperature for a
long period of time, there has been disclosed an adhesive obtained
by mixing a reactive acrylic rubber or an acrylonitrile-butadine
rubber with an epoxy resin. As for the reactive rubber type
adhesive, there is disclosed an adhesive composition comprising an
acrylic elastomer containing carboxyl groups and hydroxyl groups or
epoxy groups, an alkyl phenol, an epoxy resin and imidazolium
trimellitate, as disclosed in Japanese Provisional Patent
Publication No. Hei 3-181580, and this is used in a field where a
copper film is bonded on a support film of a flexible printed
wiring board.
[0015] The present inventors have found that, as described in
Japanese Provisional Patent Publication No. 2000-154361, by
reducing the elastic modulus of the adhesive film at around room
temperature, the thermal stress caused in the heating-cooling cycle
due to the difference in coeffficient of thermal expansion between
the semiconductor chip and the wiring board can be lowered, so that
no crack is caused during reflow and no damage is observed after
temperature cycle test, thus giving the adhesive film excellent in
heat resistance.
[0016] However, when the reactive rubber is used, an adhesive of
the film type or an adhesive parts using the same tends to change
its property on storage in a time dependent-manner, due to a
reactivity of the rubber, leading to a loss of fluidity and
adhesiveness. Therefore, these films and adhesive parts are
required to be stored in a refrigerated or frozen state, or to be
used in a short time after it is purchased, leaving a problem as to
handling unsolved.
[0017] In order to repress a reactivity of a rubber in a reactive
rubber type adhesive and to improve a storing property thereof, a
capsule type latent curing agent is used in some cases. However, an
adhesive film to be used for CSP to which the present invention is
objected has a problem such that the above-mentioned capsule type
latent curing agent can not be used since the capsule is melt when
it goes through several times of heat-treatments when it is
laminated on a substrate such as polyimide and a semiconductor
chip, prior to carrying out the final connection and
adhesion-curing between the semiconductor chip and the substrate
for mounting.
[0018] However, in the future, when requirements for heat
resistance and reflow-resistance are set more strictly, it is
necessary to give the adhesive higher levels of heat resistance and
moisture resistance by elevating a peeling strength and an
elasticity at a higher temperature. In addition, if oozing of the
adhesive is considerable, it causes a failure in connectivity, such
as failure in connection of electrodes, spoiling of a metal mold,
etc., and this problem has to be solved. Further, if storing
property is not sufficient, there arises a problem relating to a
handling or a problem that flexibility in production is hindered,
for example, an adhesive film has to be stored in a refrigerated or
frozen state, or it has to be used in a short time after its
purchase.
[0019] On the other hand, for a method for using an adhesive film
for bonding a semiconductor chip and an outer connection part, or
bonding semiconductor chips themselves, there are a punch and
pressing method and a wafer back surface attaching and
press-bonding method.
[0020] In the punch and pressing method, a film-press-bonding
machine having both a film die-cutting function and a heat-pressing
function is used. First, an adhesive film in a sheet form or a reel
form is cut by a metal mold in a fixed size, and this is
tentatively press-bonded onto a fixed position of an outer
connection part. Subsequently, the adhesive film is heat-pressed
and bonded using a pressing means. Further, a semiconductor chip is
positioned on the adhesive film, and heat-pressed for bonding the
outer connection part and the semiconductor chip.
[0021] In the wafer back surface attaching and press-bonding
method, an adhesive film is attached on a back surface of a wafer
onto which semiconductor chips are formed, by means of e.g., heat
and pressure laminating method, and then, a dicing tape is
laminated thereon. The wafer and the adhesive film are cut as a
whole. Subsequently, the dicing tape is peeled off to give a
semiconductor with an adhesive film, and this is heat-pressed for
bonding to an outer connection part with wiring or another
semiconductor chip.
[0022] In any method for press-bonding, in case of a face-up
structure where a back surface of a chip is faced to the outer
connection part, pressuring for bonding is carried out from a chip
surface by using a pressing means, it is required that the chips
should be pressed by a small pressure to prevent the chip from
being broken. Especially in a recent year, in accordance with a
trend for thinner and more laminated chips, it is required to carry
out press-bonding by a smaller pressure and a lower temperature
than ever.
[0023] Incidentally, the outer connection part has a structure in
which a wiring layer is formed on a base comprising a film
substrate such as polyimide, etc. and a rigid substrate such as BT
resin, etc. It is categorized in a structure where a wiring layer
is faced to a semiconductor chip or to outer connecting terminals,
or a structure where wiring layers are provided on both surfaces of
the substrate. In a circuit-in structure where the wiring layer is
provided on the surface facing the semiconductor, there exists
unevenness of about 5 to 20 .mu.m due to a patterning of the wiring
layer on a surface of the outer connection part to which the
adhesive film is presse-bonded.
[0024] However, as to a conventional adhesive film, e.g., the
adhesive film disclosed in Japanese Provisional Patent Publication
No.2000-256628, filling property toward the unevenness is good
under a pressure of 0.5 to 3.0 Mpa, however, when the pressure
fells below 0.5 Mpa, filling of the adhesive film can not be fully
performed, leaving voids on an adhesive interface. Such voids on
the interface lowers a reliability including heat resistance and
moisture resistance, therefore, the pressure below 0.5 Mpa has not
been employed for bonding conventionally.
[0025] Generation of the voids depends on fluidity of the adhesive
film, so it is possible to prevent a generation of voids by making
melt viscosity small at a pressing temperature, however, when the
melt viscosity is too small, excessive adhesive composition is
oozed out from the peripheral of the adhesive film when the chip is
pressed, causing a bonding failure at a lead terminal part. In
addition, in case of using the wafer back surface attaching and
press-bonding method, excessive oozing is caused, and a surface of
a wafer or a laminated device is spoiled. Moreover, as to
workability in a pressing process, there is a problem that the
adhesive film adheres to a metal mold and a conveyer in the punch
and pressing method, and in the wafer back surface attaching and
press-bonding method, there is a problem that peeling a dicing tape
is difficult. Therefore, the conventional adhesive films cannot
achieve both press-bonding property and workability when it is
pressed with a small pressure.
[0026] An object of the present invention is to provide an adhesive
composition that has heat resistance and moisture resistance
required for mounting a semiconductor chip whose coefficient of
thermal expansion is largely different on a substrate for mounting
a semiconductor, and further has an excellent oozing-resistance and
circuit-filling property, as well as good storing property, a
process for producing the same, an adhesive film using the same, a
substrate for mounting a semiconductor and a semiconductor
device.
[0027] Another object of the present invention is to provide an
adhesive film for connecting semiconductor chips and an outer
connection part with wiring which supports the chips, being able to
perform bonding by heat-pressing with a pressure of 0.01 to 0.5
MPa, and being excellent in adhesiveness and workability upon
press-bonding.
DISCLOSURE OF THE INVENTION
[0028] The adhesive composition of the present invention comprises
(a) an epoxy resin, (b) a curing agent and (c) a polymer compound
with a weight average molecular weight of 100,000 or more, wherein
a ratio of A/B exceeds 1 and is 10 or less, when A represents the
total weight of (a) the epoxy resin and (b) the curing agent, and B
represents a weight of (c) the polymer. The adhesive composition of
the present invention may comprises, as needs arises, (d) a filler
and/or a curing accelerator.
[0029] The adhesive composition of the present invention also
satisfies a relation of H.gtoreq.140.times..phi..sup.2, wherein H
(in hour) represents a half-life of a flow amount of a resin after
heat-treatment at 60.degree. C. and (.phi.) represents a weight
fraction of the weight of (c) the polymer compound (B) based on a
total weight of (a) the epoxy resin, (b) the curing agent, and (c)
the polymer compound (A+B).
[0030] In the adhesive composition of the present invention,
preferably used as (c) the polymer is an acrylic copolymer
containing 0.5 to 6.0% by weight of an epoxy group containing
repeating unit, such as glycidylacrylate or glycidyl methacrylate,
that is immiscible with an epoxy resin.
[0031] The adhesive composition of the present invention is
characterized in that components of the adhesive composition are
separated into twophases of a sea phase and an island phase, when
viewed at a section in a cured state, and that a ratio X/Y is in a
range of 0.1 to 1.0, wherein X represents an area of the sea phase
and Y represents an area of the island phase, and especially, an
area ratio of the sea phase on a surface is larger than that of the
sea phase located 5 .mu.m from the surface.
[0032] The adhesive film of the present invention is an adhesive
film that connects a semiconductor chip and a substrate for
mounting a semiconductor or connects semiconductor chips
themselves, wherein it can perform bonding by heat-pressing with a
pressure of 0.01 to 0.5 MPa. This adhesive film is characterized in
that a melt viscosity thereof at a press-bonding temperature is in
a range of 5.times.10 to 1.times.10.sup.5 Pa.multidot.s; it can
perform bonding by heat-pressing under a condition where a pressure
for press-bonding (F), time for press-bonding (t) and a melt
viscosity at a temperature for press-bonding (.eta.) satisfies the
following formula;
1.times.10.ltoreq.F(Pa).multidot.t(s)/.eta.(Pa.multidot.s).ltoreq.5.times.-
10.sup.3
[0033] or a tack load measured according to Probe tack test at
25.degree. C. is in a range of 2 to 20 gf.
[0034] The adhesive film of the present invention is characterized
in that components of the adhesive composition are separated into
two phases of a sea phase and an island phase, when viewed at a
section in a cured state, and that a ratio X/Y is in a range of 0.1
to 1.0, wherein X represents an area of the sea phase and Y
represents an area of the island phase, and an area ratio of the
sea phase on a surface is larger than that of the sea phase located
5 .mu.m from the surface.
[0035] The adhesive film of the present invention has a peeling
strength at 240.degree. C. of 50 N/m or more, an average
coefficient of thermal expansion is 50 to 150 ppm/.degree. C. at
-65.degree. C. to 150.degree. C., and a storage elastic modulus of
20 to 2000 MPa at 25.degree. C. and 3 to 50 MPa at 260.degree.
C.
[0036] The adhesive film with a support of the present invention
comprises the afore-mentioned adhesive film laminated on one
surface or both surfaces of a supporting film, either directly or
intermediated by another layer.
[0037] The wiring board for mounting a semiconductor with the
adhesive film of the present invention comprises the
afore-mentioned adhesive film or an adhesive film with a support
provided on a surface for mounting a semiconductor of a wiring
board.
[0038] The semiconductor chip with the adhesive film of the present
invention comprises the afore-mentioned adhesive film or the
adhesive film with a support provided on a semiconductor chip.
[0039] The semiconductor device of the present invention comprises
a structure in which plurals of semiconductor chips are laminated
on one surface or both surfaces of a wiring board for mounting a
semiconductor, wherein the adhesive film are used for bonding the
wiring board for mounting a semiconductor and the semiconductor
chip, or bonding the semiconductor chips themselves, when
semiconductor chips are mounted.
BRIEF DESCRIPTION OF THE DRAWINGS
[0040] FIG. 1 shows an adhesive film of the present invention
wherein (a) shows an adhesive film itself and (b) shows a case
where adhesive films are adhered on both surfaces of a core
material, in which 1 represents an adhesive film, and 2 represents
a core material.
[0041] FIG. 2 shows an outer connection part for mounting a
semiconductor chip using an adhesive film of the present invention
wherein 1 represents an adhesive film, 3 represents a wiring and 4
represents an outer connection part.
[0042] FIG. 3 shows a semiconductor device in which a semiconductor
chip is bonded on an outer connection part for mounting a
semiconductor chip with the adhesive film of the present invention,
wherein 1 represents an adhesive film, 5 represents a semiconductor
chip, 6 represents a bonding wire, 7 represents a encapsulating
resin, and 8 represents an outer connection terminal (solder ball),
respectively.
[0043] FIG. 4 shows a relation between a pressure of press-bondingS
(F) and a melt viscosity (.eta.) at a pressing temperature, which
influence an press bonding property of the adhesive film of the
present invention.
[0044] FIG. 5 shows a relation among pressure of press-bonding (F),
a pressing time (t) and melt viscosity (.eta.) at a pressing
temperature, which influence press bonding property and oozing
property of the adhesive film of the present invention.
[0045] FIG. 6 shows a construction of two-phase structure in which
sea phase prevails on a surface and island phase prevails in inside
of the film, wherein 1 represents a sea phase and 2 represents an
island phase.
BEST MODE FOR CARRYING OUT THE INVENTION
[0046] The present invention will be explained in more detail
hereinafter.
[0047] With respect to (a) the epoxy resin used in the present
invention, there is no particular limitation as long as it is cured
to exhibit an adhesive action. An epoxy resin having two or more
functional groups and preferably having a molecular weight of less
than 5,000, more preferably less than 3,000 can be used. For
example, bifunctional epoxy resins, such as a bisphenol A epoxy
resin and a bisphenol F epoxy resin, and novolak epoxy resins, such
as a phenolic novolak epoxy resin and a cresol novolak epoxy resin,
can be used. In addition, generally known polyfunctional epoxy
resins and heterocycle-containing epoxy resins can be used.
[0048] As these epoxy resins (a) which are commercially available,
for example, bisphenol A epoxy resins such as EPIKOTE 807, EPIKOTE
815) , EPIKOTE 825, EPIKOTE 827, EPIKOTE 828, EPIKOTE 834, EPIKOTE
1001, EPIKOTE 1002, EPIKOTE 1003, EPIKOTE 1055, EPIKOTE 1004,
EPIKOTE 1004AF, EPIKOTE 1007, EPIKOTE 1009, EPIKOTE 1003F and
EPIKOTE 1004F (manufactured by Japan Epoxy Resins Co., Ltd., trade
name), DER-330, DER-301, DER-361, DER-661, DER-662, DER-663U,
DER-664, DER-664U, DER-667, DER-642U, DER-672U, DER-673MF, DER-668
and DER-669 (they are manufactured by Dow Chemical Company, trade
name), YD8125 and YDF8170 (manufactured by Tohto Kasei Co., Ltd.,
trade name); bisphenol F epoxy resins such as YDF-2004
(manufactured by Tohto Kasei Co., Ltd., trade name); phenolic
novolak epoxy resins such as EPIKOTE 152 and EPIKOTE 154
(manufactured by Japan Epoxy Resins Co., Ltd., trade name),
EPPN-201 (manufactured by Nippon Kayaku Co., Ltd., trade name) and
DEN-438 (manufactured by Dow Chemical Company, trade name); cresol
novolak epoxy resins such as EPIKOTE 180S65 (manufactured by Japan
Epoxy Resins Co., Ltd., trade name), Araldite ECN1273, Araldite
ECN1280 and Araldite ECN1299 (manufactured by Ciba Specialty
Chemicals Inc., trade name), YDCN-701, YDCN-702, YDCN-703 and
YDCN-704 (manufactured by Tohto Kasei Co., Ltd., trade name),
EOCN-102S, EOCN-103S, EOCN-104S, EOCN-1012, EOCN-1020, EOCN-1025
and EOCN-1027 (manufactured by Nippon Kayaku Co., Ltd., trade
name), ESCN-195X, ESCN-200L and ESCN-220 (manufactured by Sumitomo
Chemical CO., Ltd., trade name); polyfunctional epoxy resins such
as EPON 1031S, EPIKOTE 1032H60 and EPIKOTE 157S70 (manufactured by
Japan Epoxy Resins Co., Ltd., trade name), Araldite 0163
(manufactured by Ciba Specialty Chemicals Inc., trade name),
Denacol EX-611, Denacol EX-614, Denacol EX-614B, Denacol EX-622,
Denacol EX-512, Denacol EX-521, Denacol EX-421, Denacol EX-411 and
Denacol EX-321 (manufactured by Nagase Chemicals Ltd., trade name),
EPPN501H and EPPN502H (manufactured by Nippon Kayaku Co., Ltd.,
trade name); amine epoxy resins such as EPIKOTE 604 (manufactured
by Japan Epoxy Resins Co., Ltd., trade name), YH-434 (manufactured
by Tohto Kasei Co., Ltd., trade name), TETRAD-X and TETRAD-C
(manufactured by Mitsubishi Gas Chemical Company, Inc., trade name)
and ELM-120 (manufactured by Sumitomo Chemical Co., Ltd., trade
name); heterocycle-containing epoxy resins such as Araldite PT810
(manufactured by Ciba Specialty Chemicals Inc., trade name); and
alicyclic epoxy resins such as ERL4234, ERL4299, ERL4221 and
ERL4206 (manufactured by Union Carbide Corporation, trade name) can
be used, and one kind or two or more kinds of them can also be used
in combination.
[0049] In the present invention, in terms of heat resistance, an
epoxy resin being in a solid state at room temperature and having a
softening point of 50.degree. C. or more as measured by a ring and
ball method is preferably used in an amount of 20% by weight or
more, more preferably 40% by weight or more, further preferably 60%
by weight or more, based on the total weight of the epoxy resins
used. Examples of such epoxy resins include a bisphenol A epoxy
resin, a bisphenol F epoxy resin, a bisphenol S epoxy resin, an
alicyclic epoxy resin, an aliphatic linear epoxy resin, a phenolic
novolak epoxy resin, a cresol novolak epoxy resin, a bisphenol A
novolak epoxy resin, diglycidyl ether compounds of a biphenol,
diglycidyl ether compounds of a naphthalenediol, diglycidyl ether
compounds of a phenol, diglycidyl ether compounds of an alcohol,
and alkyl-substituted compounds, halides, and hydrogenation
products thereof. These may be used in combination, and may contain
an ingredient other than the epoxy resins as an impurity.
[0050] It is preferred to use an epoxy resin having a large
molecular weight and having a softening point of 50.degree. C. or
more and a rubber in combination wherein the difference in polarity
between the epoxy resin and the rubber is large since these are
difficultly compatible to each other.
[0051] It is necessary that the epoxy resin be incompatible with
the polymer compound, however, when two or more epoxy resins are
used in combination as the epoxy resin, if the mixture of the epoxy
resins is incompatible with the polymer compound, each of the epoxy
resins is not necessarily incompatible with the polymer compound.
For example, when epoxy resin YDCN703, which is solely incompatible
with the polymer compound and which has a softening point of
50.degree. C. or more, and epoxy resin EPIKOTE 828, which is
compatible by itself with the polymer compound and which has a
softening point of less than 50.degree. C., are used in
combination, a mixture of these epoxy resins in a weight ratio of
1:0 to 1:10 is incompatible with the polymer compound.
[0052] In addition, it is preferable to use a brominated epoxy
resin as (a) the epoxy resin, since it will give a frame-retardant
effect. As the brominated epoxy resin, a bifunctional epoxy resin
containing bromine atoms and a novolak-type brominated epoxy resin
may be used. As the bifunctional epoxy resin containing bromine
atoms, there are listed, for example, YDB-360, YDB-400
(manufactured by Tohto Kasei Co., trade name), and as the
novolak-type brominated epoxy resin, there are mentioned BREN-S,
BREN-104 and BREN-301 (manufactured by Nihon Kayaku Co., trade
name).
[0053] With respect to the curing agent (b) used in the present
invention, there is no particular limitation as long as it can cure
an epoxy resin. Examples of such curing agents include
polyfunctional phenols, amines, imidazole compounds, acid
anhydrides, organophosphorus compounds and halides thereof,
polyamide, polysulfide and boron trifluoride.
[0054] Examples of the polyfunctional phenols include monocyclic
bifunctional phenols, such as hydroquinone, resorcinol, and
catechol; polycyclic bifunctional phenols, such as bisphenol A,
bisphenol F, bisphenol S, a naphthalenediol, and a biphenol; and
halides and alkyl-substituted compounds thereof. Further, examples
include phenolic resins which are polycondensation products of the
above phenols and aldehydes, such as a phenolic novolak resin, a
resol resin, a bisphenol A novolak resin, and a cresol novolak
resin.
[0055] Especially, it is preferable to use phenol resin as it is
excellent in electrolytic corrosion resistance. There may be
mentioned Varcum TD-2090 and Varcum TD-2131 (manufactured by
Daihihon Ink Kagaku Kogyo Co., trade name) as the phenol-novolak
resin, Plyophen VH4150 and Plyophen VH4170 (manufactured by
Daihihon Ink Kagaku Kogyo Co., trade name) as a modified
phenol-novolak resin, and Phenolite LF2882 and Phenolite LF2822
(manufactured by Daihihon Ink Kagaku Kogyo Co., trade name) as a
bisphenol-novolak resin.
[0056] Further, in order to improve a frame retardancy of the
resin, it is preferred to use brominated phenol compound as a
curing agent, together with the brominated epoxy resin. As the
brominated phenol compound, for example, tetrabromobisphenol A may
be used and there may be mentioned Fireguard FG 2000 (manufactured
by Teijin Kasei Kogyo Co., trade name).
[0057] In the present invention, it is preferred to use a phenolic
resin having a hydroxyl group equivalent of 150 g/eq or more. With
respect to the above phenolic resin, there is no particular
limitation as long as it has the above-mentioned hydroxyl group
equivalent value, and novolak type or resol type resins are
preferably used because they have excellent electrolytic corrosion
resistance when absorbing moisture.
[0058] As specific examples of the phenolic resins mentioned above,
there can be mentioned phenolic resins represented by the following
general formula (I): 1
[0059] (wherein R.sup.1 each independently represents a hydrogen
atom, a halogen atom, a C.sub.1-C.sub.10 linear or branched alkyl
group, a cyclic alkyl group, an aralkyl group, an alkenyl group, a
hydroxyl group or an aryl group, n represents an integer of 1 to 3,
and m represents an integer of 0 to 50).
[0060] With respect to such phenolic resin, there is no particular
limitation as long as it is a compound represented by the formula
(I), and from the viewpoint of moisture resistance, it is preferred
that the phenolic resin exhibits a moisture absorption of 2% by
weight or less after being placed in a thermo-humidistatic chamber
at 85.degree. C. at a relative humidity (RH) of 85% for 48 hours.
Further, it is preferred to use a phenolic resin which exhibits a
weight loss by heating at 350.degree. C. (temperature elevation
rate: 5.degree. C./min; atmosphere: nitrogen gas) of less than 5%
by weight as measured by a thermogravimetric analyzer (TGA) because
volatilization of the volatile components is suppressed during
heating and processing, thereby improving the reliability of
various properties, such as a heat resistance and a moisture
resistance, and contamination of the apparatuses due to the
volatile components during operations can be reduced.
[0061] The phenolic resin represented by the formula (I) in the
present invention can be obtained by, for example, reacting a
phenolic compound with a xylylene compound comprised of divalent
linking groups in the absence or presence of an acid catalyst.
[0062] Examples of the above mentioned phenolic resins include
Milex XLC series and Milex XL series (manufactured by Mitsui
Chemicals, Inc., trade names).
[0063] When the phenolic resin and the epoxy resin are used in
combination, the ratio of the epoxy equivalent in the epoxy resin
to the hydroxyl group equivalent in the phenolic resin is
preferably 0.70/0.30 to 0.30/0.70, more preferably 0.65/0.35 to
0.35/0.65, further preferably 0.60/0.40 to 0.40/0.60, especially
preferably 0.55/0.45 to 0.45/0.55. When the ratio falls outside of
the above range, the resultant adhesive possibly has poor curing
properties.
[0064] The phenolic compounds used for production of the phenolic
resin of the formula (I) can be exemplified by phenol, o-cresol,
m-cresol, p-cresol, o-ethylphenol, p-ethylphenol, o-n-propylphenol,
m-n-propylphenol, p-n-propylphenol, o-isopropylphenol,
m-isopropylphenol, p-isopropylphenol, o-n-butylphenol,
m-n-butylphenol, p-n-butylphenol, o-isobutylphenol,
m-isobutylphenol, p-isobutylphenol, octylphenol, nonylphenol,
2,4-xylenol, 2,6-xylenol, 3,5-xylenol, 2,4,6-trimethylphenol,
resorcin, catechol, hydroquinone, 4-methoxyphenol, o-phenylphenol,
m-phenylphenol, p-phenylphenol, p-cyclohexylphenol, o-allylphenol,
p-allylphenol, o-benzylphenol, p-benzylphenol, o-chlorophenol,
p-chlorophenol, o-bromophenol, p-bromophenol, o-iodophenol,
p-iodophenol, o-fluorophenol, m-fluorophenol, p-fluorophenol, etc.
These phenolic compounds may be used singly or by mixing two or
more kinds thereof. Phenol, o-cresol, m-cresol, p-cresol, etc. are
particularly preferred.
[0065] As the xylylene compound which is a divalent linking group
to be used for production of the phenolic resin of formula (I), the
following xylylene dihalides, xylylene diglycols and their
derivatives can be used. Specifically, they include
1,1'-dichloro-p-xylene, 1,1'-dichloro-m-xylene,
1,1'-dichloro-o-xylene, 1,1'-dibromo-p-xylene,
1,1'-dibromo-m-xylene, 1,1'-dibromo-o-xylene, 1,1'-diiodo-p-xylene,
1,1'-diiodo-m-xylene, 1,1'-diiodo-o-xylene,
1,1'-dihydroxy-p-xylene, 1,1'-dihydroxy-m-xylene,
1,1'-dihydroxy-o-xylene, 1,1'-dimethoxy-p-xylene- ,
1,1'-dimethoxy-m-xylene, 1,1'-dimethoxy-o-xylene,
1,1'-diethoxy-p-xylene, 1,1'-diethoxy-m-xylene,
1,1'-diethoxy-o-xylene, 1,1'-di-n-propoxy-p-xylene,
1,1'-n-propoxy-m-xylene, 1,1'-di-n-propoxy-o-xylene,
1,1'-di-isopropoxy-p-xylene, 1,1'-diisopropoxy-m-xylene,
1,1'-diisopropoxy-o-xylene, 1,1'-di-n-butoxy-p-xylene,
1,1'-di-n-butoxy-m-xylene, 1,1'-di-n-butoxy-o-xylene,
1,1'-diisobutoxy-p-xylene, 1,1'-diisobutoxy-m-xylene,
1,1'-diisobutoxy-o-xylene, 1,1'-di-tert-butoxy-p-xylene,
1,1'-di-tert-butoxy-m-xylene and 1,1'-di-tert-butoxy-o-xylene.
These compounds can be used singly or two or more kinds thereof can
be used as a mixture. Of these, particularly preferred are
1,1'-dichloro-p-xylene, 1,1'-dichloro-m-xylene,
1,1'-dichloro-o-xylene, 1,1'-dihydroxy-p-xylene,
1,1'-dihydroxy-m-xylene, 1,1'-dihydroxy-o-xylene,
1,1'-dimethoxy-p-xylene, 1,1'-dimethoxy-m-xylene and
1,1'-dimethoxy-o-xylene.
[0066] In the reaction of the above-mentioned phenolic compound
with the xylylene compound, using an acid catalyst, e.g., a mineral
acid, such as hydrochloric acid, sulfuric acid, phosphoric acid,
polyphosphoric acid, etc.; an organic carboxylic acid, such as
dimethyl sulfate, diethyl sulfate, p-toluenesulfonic acid,
methanesulfonic acid, ethanesulfonic acid, etc.; a superstrong
acid, such as trifluoromethanesulfonic acid, etc.; a strong acid
ion-exchange resin, such as an alkanesulfonic acid ion-exchange
resin; a superstrong acid ion-exchange resins, such as a
perfluoroalkanesulfonic acid ion-exchange resin (trade name:
Nafion; manufactured by Du Pont Company); natural or synthetic
zeolite; or activated clay (acid clay), etc., a reaction is carried
out until the xylylene compound as a raw material substantially
disappears at 50 to 250.degree. C. and the composition of the
reaction product becomes constant. The reaction time varies
depending on the raw material and the reaction temperature, and it
is generally about 1 hour to 15 hours, and may be actually
determined while tracing the composition of the reaction product by
gel permeation chromatography (GPC), etc. When a halogenoxylene
derivative, such as 1,1'-dichloro-p-xylene, is exceptionally used,
the reaction proceeds in the absence of a catalyst while generating
the corresponding hydrogen halide gas. Therefore, in such a case,
no acid catalyst is needed. In other cases, the reaction proceeds
in the presence of an acid catalyst to generate water or alcohol,
correspondingly. With respect to the molar ratio of the phenolic
compound and the xylylene compound in the reaction, generally, the
phenolic compound is used in an excess amount, and, after
completion of the reaction, the unreacted phenolic compound is
recovered. In this case, the average molecular weight of the
phenolic resin depends on the amount of the phenolic compound used,
and the larger the amount of the phenolic compound, the lower the
average molecular weight of the phenolic resin obtained. A phenolic
resin with the phenolic compound portion being an allylphenol can
be obtained by, for example, a method in which a phenolic resin
which is not allylated is prepared, and then, allylation is carried
out by reaction with an allyl halide to form an allyl ether,
followed by Claisen conversion.
[0067] Examples of the amines include aliphatic or aromatic primary
amines, secondary amines, tertiary amines, quaternary ammonium
salts, alicyclic amines, guanidines, urea derivatives, etc.
[0068] These compounds can be exemplified by
N,N-benzyldimethylamine, 2-(dimethylaminomethyl)phenol,
2,4,6-tris(dimethylaminomethyl)phenol, tetramethylguanidine,
triethanolamine, N,N'-dimethylpiperadine,
1,4-diazabicyclo-[2.2.2]octane, 1,8-diazabicyclo[5.4.0]-7-undecene,
1,5-diazabicyclo[4.4.0]-5-nonene, hexamethylenetetramine, pyridine,
picoline, piperidine, pyrrolidine, dimethylcyclohexylamine,
dimethylhexylamine, cyclohexylamine, diisobutylamine,
di-n-butylamine, diphenylamine, N-methylaniline, tri-n-propylamine,
tri-n-octylamine, tri-n-butylamine, triphenylamine,
tetramethylammonium chloride, tetramethylammonium bromide,
tetramethylammonium iodide, triethylenetetramine,
diaminodiphenylmethane, diaminodiphenyl ether, dicyanediamide,
tolylbiguanide, guanylurea, dimethylurea, etc.
[0069] Examples of the imidazole compound include imidazole,
2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-methyl-imidazole,
2-phenylimidazole, 2-undecylimidazole, 1-benzyl-2-methylimidazole,
2-heptadecylimidazole, 4,5-diphenyl-imidazole, 2-methylimidazoline,
2-phenylimidazoline, 2-undecylimidazoline, 2-heptadecylimidazoline,
2-isopropyl-imidazole, 2,4-dimethylimidazole,
2-phenyl-4-methylimidazole, 2-ethylimidazoline,
2-phenyl-4-methylimidazoline, benzimidazole, 1-cyanoethylimidazole,
etc.
[0070] Examples of the anhydrides include phthalic anhydride,
hexahydrophthalic anhydride, pyromellitic dianhydride,
benzophenonetetracarboxylic dianhydride, etc.
[0071] With respect to the organophosphorus compound, there is no
particular limitation as long as it is a phosphorus compound having
an organic group, and examples include hexamethylphosphoric
triamide, tri(dichloropropyl) phosphate, tri(chloropropyl)
phosphate, triphenyl phosphite, trimethyl phosphate,
phenylphosphonic acid, triphenylphosphine, tri-n-butylphosphine,
and diphenylphosphine.
[0072] These curing agents can be used independently or in
combination.
[0073] With respect to the blending amount of the curing agent,
there is no particular limitation as long as the curing reaction of
the epoxy group can proceed, but the curing agent is preferably
used in an amount of 0.01 to 5.0 equivalents, especially preferably
0.8 to 1.2 equivalent, based on 1 mol of the epoxy group.
[0074] As the epoxy resin and the curing agent, it is preferred to
use a compound having no mutagen, for example, a compound using no
bisphenol A, since it has less influence on the environment and
human bodies.
[0075] The polymer compound (c) having a functional group
(reactivity) to be used in the present invention has a weight
average molecular weight of 100,000 or more, and a glass transition
temperature (Tg) of -50 to 0.degree. C. There is no particular
limitation on this polymer compound as long as it is incompatible
with the epoxy resin. For examples, rubbers such as an acrylic
copolymer, an acrylic rubber, etc., silicone resins, silicone
modified resins such as silicone modified polyamideimide, etc. can
be mentioned. To be incompatible with the epoxy resin means a
property of being separated from the epoxy resin into two or more
phases. The compatibility of the resins is defined as a visible
light (600 nm) transmittance of a film (50 .mu.m) prepared from a
varnish containing the epoxy resin and the polymer compound
(composition ratio=1:1). When the transmittance of the film is 50%
or more, the polymer compound is "compatible" with the epoxy resin,
whereas, when the transmittance is less than 50%, the polymer
compound is "incompatible (is not compatible)" with the epoxy
resin. In the present invention, it is preferred that the polymer
compound is selected so that the transmittance is less than
30%.
[0076] As the functional group used in the present invention,
glycidyl acrylate or glycidyl methacrylate being incompatible with
an epoxy resin is preferred, and an epoxy group-containing acrylic
copolymer having a weight average molecular weight of 100,000 or
more is more preferred. The component (c) of the present invention
can be obtained by carrying out a polymerization reaction so that
unreacted monomers remain in a polymer compound, or by initially
preparing a polymer compound, and then, adding reactive
group-containing monomers thereto.
[0077] Incidentally, the weight average molecular weight is a
polystyrene conversion value obtained by a gel permeation
chromatography (GPC) method using a calibration curve obtained by
standard polystyrene.
[0078] Examples of the acrylic copolymers include acrylic rubbers
which are copolymers of an acrylate or a methacrylate and
acrylonitrile. Further, from the viewpoint of excellent
adhesiveness and heat resistance, an acrylic copolymer containing
glycidyl acrylate or glycidyl methacrylate as a functional group is
especially preferred. Especially preferred is an acrylic copolymer
containing 0.5 to 6% by weight of this epoxy group containing
repeating unit, based on the amount of the acrylic copolymer, and
having a weight average molecular weight of 100,000 or more. As an
acrylic copolymer containing 0.5 to 6% by weight of glycidyl
acrylate or glycidyl methacrylate and having Tg of -50.degree. C.
or more and having a weight average molecular weight of 100,000 or
more, for example, there can be mentioned HTR-860P-3 (manufactured
by Teikoku Chemical Industries Co., Ltd., trade name).
[0079] Further, when the repeating units containing an epoxy group
are contained in a range of 0.5 to 2.7% by weight based on an
acrylic copolymer, it is possible to improve a storing stability of
the adhesive film, while maintaining adhesiveness and preventing
gelation, which is more preferred. Such an acrylic copolymer
containing 0.5 to 2.7% by weight of the repeating units containing
epoxy groups can be prepared using the above-mentioned
HTR-860P-3.
[0080] As the remaining portion excluding the glycidyl acrylate or
glycidyl methacrylate in the acrylic copolymer, an alkyl acrylate
or an alkyl methacrylate having a C.sub.1-C.sub.8 alkyl group, such
as methyl acrylate or methyl methacrylate, and a mixture of styrene
and acrylonitrile, etc. can be used. Of these, ethyl (meth)acrylate
and/or butyl (meth)acrylate is especially preferred. It is
preferred that the mixing ratio is adjusted so that the Tg of the
copolymer becomes -50.degree. C. When Tg is lower than -50.degree.
C., the tack property of the adhesive layer or adhesive film in a
B-stage tends to increase, whereby the handling properties becomes
poor.
[0081] With respect to the polymerization method, there is no
particular limitation, and examples include a pearl polymerization
and a solution polymerization, and a copolymer is obtained by these
methods.
[0082] The weight average molecular weight of the polymer compound
of the present invention should be 100,000 or more, and preferably
300,000 to 3,000,000, more preferably 500,000 to 2,000,000. When
the weight average molecular weight is in this range, it is
possible to suitably control strength, flexibility and the tack
property in a sheet form or in a film form, and at the same time,
to give an excellent flowability to keep the circuit filling
property for wiring good.
[0083] With respect to the addition amount of the above-mentioned
(c) polymer compound incompatible with the epoxy resin, for
reducing the elastic modulus and suppressing the flowability during
shaping, the A/B ratio should exceed 1.0 and is 10 or less, where A
represents the total weight of (a) the epoxy resin and (b) the
curing agent, and B represents the weight of (c) the polymer
compound incompatible with the epoxy resin. When the A/B ratio for
the polymer compound is in this range, the handling properties at
high temperatures is sufficiently attained. At the same time, the
effects of reducing the elastic modulus and suppressing the
flowability during shaping can be attained.
[0084] To the adhesive composition of the present invention, if
desired, (d) a filler and/or (e) a curing accelerator can be
further added.
[0085] Examples of (d) the filler used in the present invention
include an inorganic filler and an organic filler. From the
viewpoint of improving handling properties, improving thermal
conductivity, adjusting melt viscosity and imparting thixotropic
properties, etc., it is preferred to add an inorganic filler.
[0086] With respect to the inorganic filler, there is no particular
limitation, and examples include aluminum hydroxide, magnesium
hydroxide, calcium carbonate, magnesium carbonate, calcium
silicate, magnesium silicate, calcium oxide, magnesium oxide,
aluminum oxide, aluminum nitride, aluminum borate whisker, boron
nitride, crystalline silica, amorphous silica, etc. These can be
used independently or in combination. From the viewpoint of
improving the thermal conductivity, aluminum oxide, aluminum
nitride, boron nitride, crystalline silica, amorphous silica, etc.
are preferred. From the viewpoint of adjusting the melt viscosity
or imparting thixotropic properties, aluminum hydroxide, magnesium
hydroxide, calcium carbonate, magnesium carbonate, calcium
silicate, magnesium silicate, calcium oxide, magnesium oxide,
aluminum oxide, crystalline silica, amorphous silica, etc. are
preferred.
[0087] Examples of the organic filler include various rubber
fillers, such as acrylonitrile-butadiene rubber fillers and
silicone rubber fillers, etc. These have effects of improving the
flexibility at low temperatures and reducing the elastic
modulus.
[0088] It is more preferred that the filler used in the present
invention has a contact angle with water of 0 to 100.degree.. When
the contact angle with water exceeds 100.degree., the effect
attained by addition of the filler is likely to be lowered. The
contact angle with water is preferably 0 to 60.degree., since the
effect of improving a reflow resistance is especially high. Since
contact angle of the filler and water changes depending on particle
diameter of the filler which is mediated by composition of the
filler, surface treatment thereof, and preparation process thereof,
it can be controlled by, for example, using fumed silica or using
finer fillers.
[0089] The contact angle of the filler with water is measured by
the following method. A filler is subjected to compression molding
to prepare a plane plate, and a water drop is placed on the plate
and the angle of the water drop with the plate is measured by means
of a contact angle meter. This measurement is repeated 10 times to
obtain an average value, and this average value is used as a value
of the contact angle.
[0090] It is preferred that the filler has an average particle
diameter of 0.005 .mu.m to 0.1 .mu.m. When the average particle
diameter of the filler is less than 0.005 .mu.m, the dispersion
property and the flowability tend to be lowered, and, on the other
hand, when the average particle diameter exceeds 0.1 .mu.m, the
effect of improving the adhesiveness tends to be decreased.
[0091] Examples of the filler include silica, alumina, and antimony
oxide. As the silica, NanoTek SiO.sub.2 with a contact angle: 43
degrees; an average particle diameter: 0.012 .mu.m (manufactured by
C. I. KASEI CO., LTD., trade name) or Aerosil R972 with an average
particle diameter: 0.016 .mu.m (manufactured by Nippon Aerosil Co.,
Ltd., trade name) are listed. As the alumina, NanoTek
Al.sub.2O.sub.3 with a contact angle: 55 degrees; an average
particle diameter: 0.033 .mu.m (manufactured by C. I. KASEI CO.,
LTD., trade name) is exemplified and as the diantimony trioxide,
PATOX-U with a contact angle: 43 degrees; an average particle
diameter: 0.02 .mu.m (manufactured by Nihon Mining &
Concentrating Co., Ltd., trade name) is exemplified.
[0092] It is preferred that the amount of the filler added is 0 to
50 parts by weight, based on 100 parts by weight of the total
weight of the epoxy resin and the curing agent. When the amount of
the filler used exceeds 50 parts by weight, problems may arise such
that the storage elastic modulus increases and the adhesiveness
becomes poor. The amount of the filler used is further preferably 5
to 40 parts by weight, especially preferably 10 to 30 parts by
weight.
[0093] Further, in case of using the inorganic filler, those whose
surface is treated with a surface-treating agent are preferred. As
the surface-treating agent, there may be mentioned a silylating
agent, an organofluorine compound, etc. As the silylating agent,
there may be exemplified hexamethyl disilazane, dimethyldichloro
silane, trimethylsilyl dimethyl amine,
N,O-bis(trimethylsilyl)acetoamide, etc.
[0094] With respect to (e) the curing accelerator used in the
adhesive composition of the present invention, there is no
particular limitation. For example, tertiary amines, imidazoles,
quaternary ammonium salts, etc. can be used. Examples of the
imidazoles include 2-methylimidazole, 2-ethyl-4-methylimidazole,
1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-phenylimidazolium
trimellitate, etc., and these can be used independently or in
combination. Imidazoles are commercially available from, for
example, Shikoku Kasei Kogyo Co. in the trade names of 2E4MZ,
2PZ-CN, and 2PZ-CNS.
[0095] For prolonging the shelf life (usable period) of the film,
the curing accelerator is preferred to have latency. Representative
examples include dihydrazide compounds, such as dicyandiamide,
adipic dihydrazide, etc., guanamine acid, melamine acid, addition
products of an epoxy compound and an imidazole compound, addition
products of an epoxy compound and a dialkylamine, addition products
of an amine and thiourea, addition products of an amine and
isocyanate, etc. From the viewpoint of reducing the activity at
room temperature, it is preferred that the curing accelerator has
an adduct structure.
[0096] As the adduct-type curing accelerator, there may be listed,
for example, Amicure PN-23, Amicure MY-24, Amicure MY-D, Amicure
MY-H, etc. (manufactured by Ajinomoto Co., trade mane), Hardener
X-3615S, Hardener X-3293S, etc. (manufactured by A. C. R. Co.,
trade name), Novacure HX-3748, Novacure HX-3088, etc. (manufactured
by Asahi Kasei Co., trade namef), Ancamine 2014AS, Ancamine 2014FG,
etc. (manufactured by Pacific Anchor chemical Co., trade name) as
an amine-epoxy adduct type. And as an amine-urea type adduct, there
may be mentioned Fujicure FXE-1000, Fujicure FXR-1030 (manufactured
by Fuji Kasei Co., trade name).
[0097] The blending amount of (e) the curing accelerator is
preferably 0 to 5.0 parts by weight, more preferably 0.05 to 3.0
parts by weight, and further preferably 0.2 to 3.0 parts by weight,
based on the total weight (100 parts by weight) of the epoxy resin
and the curing agent. When the blending amount of the curing
accelerator exceeds 5.0 parts by weight, the storage stability of
the resultant composition becomes poor, so that the pot life is
likely to be insufficiently short.
[0098] In the adhesive composition of the present invention, for
improving the flexibility and the resistance to reflow crack, a
high molecular-weight resin which is compatible with the epoxy
resin can be added. With respect to the high molecular-weight resin
compatible with the epoxy resin, there is no particular limitation,
and, for example, phenoxy resins, high molecular-weight epoxy
resins, extra-high molecular-weight epoxy resins, a large polarity
functional group-containing rubbers, a large polarity functional
group-containing reactive rubbers, etc. can be used.
[0099] As the phenoxy resins, Phenotot YP-40 and Phenotot YP-50
(manufactured by Tohto Kasei Co., Ltd., trade names), PKHC, PKHH,
and PKHJ (manufactured by Phenoxy Associates CO., trade names) are
exemplified.
[0100] Examples of the high molecular-weight epoxy resins include
high molecular-weight epoxy resins having a molecular weight of
30,000 to 80,000 and extra-high molecular-weight epoxy resins
having a molecular weight exceeding 80,000 (see Japanese Patent
Publication Nos. 59617/1995, 59618/1995, 59619/1995, 59620/1995,
64911/1995, 68327/1995, etc.). As the large polarity functional
group-containing reactive rubber, a carboxyl group-containing
acrylonitrile-butadiene rubber is commercially available from JSR
Co. in the trade name of PNR-1.
[0101] It is preferred that the amount to be used of the high
molecular-weight resin compatible with the epoxy resin is 40 parts
by weight or less, based on 100 parts by weight of the epoxy resin.
When the amount exceeds 40 parts by weight, the Tg of the epoxy
resin layer is possibly lowered.
[0102] To the adhesive composition of the present invention,
various coupling agents can be further added for improving bonding
at the interface between different materials. Examples of coupling
agents include silane coupling agents, titanium coupling agents,
and aluminum coupling agents, and silane coupling agents are most
preferred.
[0103] The silane coupling agent is not particularly restricted.
For example, there can be used vinyl group-containing silanes, such
as vinyltriethoxysilane, vinyltris-(2-methoxyethoxy)-silane, etc.;
methacryloyl group-containing silanes, such as
.gamma.-methacryloxypropyl- trimethoxysilane, etc.; epoxy
group-containing silanes, such as
2-(3,4-epoxycyclohexyl)ethyl-trimethoxysilane,
3-glycidoxypropyltrimethox- ysilane,
3-glycidoxypropylmethyldimethoxysilane, etc.; amino
group-containing silanes, such as
N-2-(aminoethyl)-3-aminopropyltrimethox- ysilane,
N-2-(aminoethyl)-3-aminopropyl(methyl)dimethoxysilane,
3-aminopropyltriethoxysilane,
N-phenyl-3-aminopropyltri-methoxysilane,
3-aminopropyl(methyl)diethoxysilane,
3-aminopropyl-tris(2-methoxyethoxy)s- ilane,
N-methyl-3-amiopropyltrimethoxysilane,
triaminopropyltrimwthoxysila- ne,
3-(4,5-dihydroimidazol-1-yl)propyltrimethoxysilane,
N-2-(N-vinylbenzylaminoethyl)-3-aminopropyltrimethoxysilane, etc.;
mercapto group-containing silanes, such as
3-mercaptopropyltrimethoxysila- ne,
3-mercaptopropyltriethoxysilane, 3-mercaptopropyl
(methyl)dimethoxysilane, etc.; ureido group-containing silanes,
such as 3-ureidopropyltriethoxysilane,
3-ureidopropyltrimethoxysilane, etc.; isocyanate group-containing
silanes, such as trimethylsilyl isocyanate, methyltriisocyanate
silane, vinyltriisocyanate silane, phenyltriisocyanate silane,
tetraisocyanate sline, etc.; carbon functional chloro-containing
silanes such as 3-chloropropyl(methyl)dimeth- oxysilane,
3-chloropropyltrimethoxysilane, 3-chloropropyl(methyl)diethoxys-
ilane, etc.; cyano group-containing silanes, such as
3-cyanopropyltriethoxysilane, etc.; quaternary ammonium
group-containing silanes, such as
octadecyldimethyl[3-(trimethoxysylil)propyl]ammonium chloride,
etc., and a combination of one or two kinds or more of the
above.
[0104] As the titanium coupling agent, there can be mentioned
isopropyltrioctanoyl titanate, isopropyldimethacrylisostearoyl
titanate, isopropyltridodecylbenzenesulfonyl titanate,
isopropylisostearoyldiacryl titanate,
isopropyltri(dioctylphosphate) titanate, isopropyltricumylphenyl
titanate, isopropyltris(dioctylpyrophosphate) titanate,
isopropyltris(n-aminoethyl) titanate, tetraisopropylbis(dioctyl-
phosphite) titanate, tetraoctylbis(ditridecylphosphite) titanate,
tetra(2,2-diallyloxymethyl-1-butyl)bis(ditridecyl)phosphite
titanate, dicumylphenyloxyacetate titanate,
bis(dioctylpyrophosphate)oxyacetate titanate, tetraisopropyl
titanate, tetranormalbutyl titanate, butyl titanate dimer,
tetra(2-ethylhexyl) titanate, titanium acetylacetonate,
polytitanium acetylacetonate, titanium octylene glycolate, titanium
lactate ammonium salt, titanium lactate, titanium lactate ethyl
ester, titanium triethanol aminate, polyhydroxytitanium stearate,
tetramethyl orthotitanate, tetraethyl orthotitanate, tetrapropyl
orthotitanate, tetraisobutyl orthotitanate, stearyl titanate,
cresyl titanate monomer, cresyl titanate polymer,
diisopropoxy-bis(2,4-pentadionate) titanium (IV),
diisopropyl-bis-triethanolamino titanate, octyleneglycol titanate,
tetra-n-butoxy titanium polymer, tri-n-butoxytitanium monostearate
polymer, tri-n-butoxytitanium monostearate, etc. These compounds
can be used singly or in combination of two or more kinds
thereof.
[0105] As the aluminum coupling agent, there can be mentioned, for
example, aluminum chelate compounds such as ethylacetoacetate
aluminum diisopropylate, aluminum tris(ethylacetoacetate),
alkylacetoacetate aluminum diisopropylate, aluminum
monoacetylacetatobis(ethylacetoacetate)- , aluminum
tris(acetylacetonate), aluminum-monoisopropoxymono-oleoxyethyl
acetoacetate, aluminum-di-n-butoxide-mono-ethylacetoacetate,
aluminum-di-iso-propoxide-mono-ethylacetoacetate, etc., and
aluminum alcholates such as aluminum isopropylate,
mono-sec-butoxyaluminum diisopropylate, aluminum sec-butyrate,
aluminum ethylate, etc. These compounds can be used singly or in
combination of two or more kinds thereof.
[0106] In view of obtaining effects and heat resistance thereof as
well as reducing the cost, it is preferred that the amount of the
coupling agent added is 0 to 10 parts by weight, based on 100 parts
by weight of the total weight of the resins.
[0107] Further, to the adhesive composition of the present
invention, for adsorbing an ionic impurity to improve the
insulation reliability when absorbing moisture, an ion-capturing
agent can be added. With respect to the ion capturing agent, there
is no particular limitation, and a compound known as an anti-copper
damage agent for preventing copper from ionizing and dissolving
out, for example, a triazinethiol compound and a bisphenol reducing
agent can be used. As the copper damage preventing agent containing
triazinethiol compound, Gisnet DB (available from Sankyo Seiyaku
Co., trade name) can be mentioned, and as the copper damage
preventing agent containing bisphenol reducing agent, Yoshinox BB
(available from Yoshitomi Seiyaku Co., trade name) can be
mentioned. In addition, inorganic ion adsorbents, such as zirconium
type, antimony type, bismuth type, magnesium type, and aluminum
type compounds can be used, and various kinds of the compounds are
commercially available from Toa Gosei Kagaku Kogyo Co. under a
trade name of IXE.
[0108] In view of obtaining an effect aimed at by the addition and
excellent heat resistance and reducing the cost, it is preferred
that the amount of the ion capturing agent added is 0 to 10 parts
by weight, based on 100 parts by weight of the adhesive
composition.
[0109] The above-mentioned adhesive composition of the present
invention maybe coated on a support as a single layer, followed by
heating and curing to give an adhesive film, and also, more than
two kinds of adhesive compositions may be layered to give an
adhesive film.
[0110] In this case, it is preferred that the first adhesive layer
comprises the above-mentioned adhesive composition and has a curing
degree according to differential scanning calorimeter analysis
(DSC) in a range of 0 to 40%, and the second adhesive layer has a
curing degree by DSC after heating and drying in a range of 0 to
40%, and its content of the polymer compounds is greater than that
of the first film by 10 parts by weight or more, or a curing degree
by DSC of the second layer after heating and drying is greater than
that of the first layer by 5% or more. By changing the content of
the polymer compound or the curing degree by DSC as such, as
compared to the first layer, sufficient circuit filing property and
oozing resistance from through-holes can be achieved at the same
time. Further, it is more preferred that the contents of the
polymer compound in the second layer is greater than that of the
first layer by 10 to 40 parts by weight, or the curing degree by
DSC is greater than that of the first layer by 5 to 20%
[0111] Incidentally, the curing degree of an adhesive layer after
drying is measured by total calorific value for curing at a state
where heat generation ceased, and it was measured using DSC (912
type DSC manufactured by Du Pont Co.), with a raising temperature
rate of 10.degree. C./minute.
[0112] As mentioned above, each of the adhesive composition and the
adhesive film of the present invention comprises a composition
comprising (a) an epoxy resin, (b) a curing agent, (c) a polymer
compound incompatible with the epoxy resin, and optionally (d) a
filler and/or (e) a curing accelerator, wherein the components are
separated into two phases after being cured as viewed in the
cross-section thereof.
[0113] The term "two phases" used here indicates that the cured
product has an islands-in-sea structure. The "islands-in-sea
structure" in the present invention means a ununiform structure
comprising a continuous phase (referred to as "sea") and a
dispersed phase (referred to as "islands") described in, for
example, page 16 of "Polymer New Material one point Polymer Alloy",
published by KYORITSU SHUPPAN CO., LTD., as viewed in the
cross-section of the adhesive composition in a cured state, which
is polished and examined under, e.g., a scanning electron
microscope. In the adhesive composition of the present invention,
(c) the polymer compound comprises a sea phase, and (a) the epoxy
resin and (b) the curing agent thereof comprise an island
phase.
[0114] Further, in a section of the adhesive film of the present
invention after heating and curing, when X represents an area of
the sea phase and Y represents an area of the island phase in the
section, a ratio X/Y falls in a range of 0.1 to 1.
[0115] Further, adhesive film of the present invention, as shown in
FIG. 6, is characterized in that the sea phase comprising the
polymer compounds appears more frequently in a proximate of a
surface of the adhesive film, and the epoxy resin and the curing
agent appearing as the island phase are less precipitated. As shown
above, the island phase appears less frequently and the sea phase
appears more frequently on a surface of the adhesive film, it
elevated adhesiveness at an interface. On the other hand, in the
inside of the adhesive film, for example, at a position 5 .mu.m
from the surface, the island phases are precipitate frequently,
therefore, even when a crack is generated, it serves to prevent the
crack from spreading. Further, the adhesive composition of the
present invention can give an adhesive film with a bi-phase
structure in which the sea phase prevails on the film surface and
the island phase prevails in inside of the film, only by coating a
varnish on a support.
[0116] The ratio X/Y of the island phase and the sea phase in the
sectional area is measured as follows.
[0117] (1) In a photo of a section of the adhesive film by a
scanning electronic microscope (SEM), a square with a side of 10
.mu.m long is set randomly.
[0118] (2) A transparent film with a uniform density (.rho.) and a
film thickness (t) is mounted on this SEM photo, and all the
islands are traced by a pen along their shapes, detaching the
island parts, and measuring the weight (Wx) of the detached film.
Wx corresponds to Sx (surface area of the island parts) X .rho. X
t.
[0119] (3) As to an area for the sea phase, from the square with a
side of 10 .mu.m long, an area which is left behind after removing
the island parts (the sea parts) are detached in the same manner as
the above, and a weight of the detached film (Wy) is measured.
Similarly, Wy corresponds to Sy X .rho. X t.
[0120] (4) A ratio of Wx/Wy is Sx X .rho.X t/Sy X .rho.X t=Sx/Sy,
which corresponds to a ratio of surface areas.
[0121] (5) Procedures (1) to (4) are repeated for 5 times, and an
obtained average value of Wx/Wy is taken as X/Y.
[0122] In the present invention, each of the adhesive composition
and the adhesive film of the present invention wherein the
components thereof are separated into two phases after being cured
in the section thereof, is attained by an adhesive composition
which comprises an epoxy resin, a cyanate resin, a phenolic resin
and a curing agent thereof, a polymer compound incompatible with
these resins, for example, an acryl rubber, an
acrylonitrile-butadiene rubber, a silicone rubber, polyurethane,
polyimide, polyamideimide, and a copolymer or a mixture thereof,
and optionally a filler and/or a curing accelerator, or by an
adhesive film obtained by heating and curing the adhesive film.
[0123] In the present invention, from the viewpoint of obtaining
excellent adhesion between the sea phase and the island phase and
excellent adhesiveness, it is preferred that the two phases
comprise a sea phase and an island phase and satisfy a relationship
represented by the following formula (1):
S/{square root}V>3.6 (1)
[0124] wherein a length of an outer periphery of the island phase
represented by S and an area of a section represented by V.
Further, from the viewpoint of obtaining still higher adhesion
between the sea phase and the island phase, it is preferred that,
in the above formula (1), the relationship: S/(V.sup.1/2)>4.0 is
satisfied.
[0125] In the present invention, there is provided an adhesive film
which can attain a long half-life of a resin flaw rate after a
heat-treatment at 60.degree. C., relative to a ratio of the polymer
contained in the adhesive composition.
[0126] That is, the adhesive composition of the present invention
also satisfies a relation of H.gtoreq.140.times..phi..sup.2,
wherein (H, in hour) represents a half-life of a flow amount of
resin after heat-treatment at 60.degree. C. and (.phi.) represents
a weight fraction of a weight of the polymer (B) based on the total
amount of the epoxy resin, the curing agent, and the polymer (A+B).
This results in an adhesive film that has connection reliability
and heat resistance at the same time, has a longer storage life at
room temperature, thereby enabling a prolonged storage and ensuring
a storing stability.
[0127] Incidentally, a decreased amount of the flaw rate is
measured as follows. Adhesive films are left in a thermostatic bath
kept at 60.degree. C., for 12 h, 24 h, 48 h, 72 h, 96 h, 120 h, 180
h and 240 h, and then, the adhesive films for testing are taken out
and each sample is cut out in a rectangular shape of 2 cm.times.1
cm. Using a heat press machine (manufactured by Tester Sangyo Co.),
a pressure of 2 MPa is applied on the sample for 18 seconds on a
stage heated at 160.degree. C. After heating, using 4 samples, a
maximum flaw width of the adhesive oozed out from the long side of
the rectangular is measured at 2 points for each sample, and an
average thereof is taken as a flow amount. A flow amount of an
untreated sample without being kept at 60.degree. C. is taken as an
initial value. The initial value is compared to flaw amounts of the
samples taken out after heating for respective period of time, and
a treating time when the flow amount is decreased by 50% is defined
as a half-life. The relation between the flow amounts and the
treating time is plotted to give a curve and the half-life is
obtained from the curve.
[0128] The adhesive composition of the present invention has a
small weight-loss rate of 2% by weight or less when it is heated at
270.degree. C. This prevents it from spoiling the peripheral device
when it is used.
[0129] The adhesive film obtained by heating and drying the
adhesive composition of the present invention is press-bonded onto
an outer connection part in a semi-cured state (B stage), and
cured. At this point, when residual volatile composition remains in
a large amount, the film itself produces foams at the time of
curing, producing a void inside the film and lowering reliability.
When relation between foaming at curing and an amount of residual
volatile component is studied, it has been found that by keeping
the amount of residual volatile component 3% or less, foaming is
decreased at a time of curing. Further, the amount of the residual
volatile component of the adhesive film is calculated from the
formula (2), from the weights of the adhesive film before and after
curing at 170.degree. C./1 h.
The residual volatile component fraction (%)=
[(weight of the film before curing-weight of the film after
curing)/weight of the film before curing].times.100 (2)
[0130] In the present invention, there is provided an adhesive film
having a tensile modulus of elasticity of 1 to 10 MPa at
240.degree. C. This ensures thermal stress moderating property and
at the same time, prevents generation of a bend of the film and
generation of a reflow crack.
[0131] Incidentally, the measurement of the tensile modulus of
elasticity is carried out as follows. First, an adhesive
composition with an initial length of 20 mm (L) and a thickness of
50 .mu.m is cured at 170.degree. C. for 1 hour, to prepare a cured
film. The cured film is bathed in a thermostatic bath kept at
240.degree. C., while applying a constant load of 1 to 10 kg to the
cured film. After the film is put in the bath and its temperature
reaches 240.degree. C., elongated length (.DELTA.L) and sectional
area (S) of the cured film are measured, from which tensile modulus
of elasticity (E') is calculated according to the formula (3)
below:
E'=L.multidot.W/(.DELTA.L.multidot.S) (3)
[0132] In the present invention, there is provided an adhesive film
comprising a laminated cured product of the adhesive composition of
the present invention and a polyimide film, which exhibits a
peeling strength measured at 240.degree. C. of 50 N/m or more.
[0133] Measurement of the peeling strength is carried out as
follows. Using a hot roll laminator, polyimide films with a
thickness of 50 .mu.m are attached on both surface of the adhesive
film and cured under conditions of temperature: 80.degree. C.,
press-bonding rate: 0.3 m/minute, and pressure: 0.3 MPa. The
laminated and cured product is cut with a width of 10 mm to give an
evaluation sample, and a value is obtained when the film is peeled
at an angle of 180.degree. at a peeling rate of 50 mm/minute, using
Tensilon: tensile testing machine (manufactured by TOYO BALDWIN
Co., trade name:UTM-4-100). Three samples are measured, and an
average value is taken as peeling strength.
[0134] In the present invention, there is provided an adhesive film
which does not suffer peeling with a diameter of 2 mm or more in
the laminated and cured product, in a heat treatment at 260.degree.
C. for 120 seconds after moisture absorption.
[0135] The peeling property of the polyimide laminated product
after moisture absorption is evaluated as follows. In the same
manner as used for a measurement of peeling strength, polyimide
films with a thickness of 50 .mu.m are attached on both surface of
the adhesive film and cured, and the laminated and cured product is
cut into a size of 25 mm.times.25 mm to give an evaluation sample.
In a thermostatic bath, the samples are subjected to moisture
absorption for 48 hours under condition of temperature: 85.degree.
C. and relative humidity (RH): 85%. The samples are taken out and
placed in a solder bath kept at 240, 260 and 280.degree. C.,
respectively. They are observed with respect to existence of
peeling.
[0136] In the present invention, there is provided an adhesive film
with a low elasticity modulus, whose storage elastic module is 10
to 2000 MPa at 25.degree. C. and 3 to 50 MPa at 260.degree. C. This
leads to an effect for moderating thermal stress generated due to a
difference in coefficient of thermal expansion between a
semiconductor chip and a supporting material, thereby preventing
peelings and cracks. Further, it is excellent in handling property
of the adhesive and in accuracy of a thickness of the adhesive
layer, thereby preventing generation of reflow crack.
[0137] Measurement of storage elastic module is carried out using a
dynamic modulus of viscoelasticity measuring device (manufactured
by Reology Co., DVE-V4), applying a tensile load to the adhesive
cured product, under condition of frequency of 10 Hz and
temperature elevating rate of 5 to 10.degree. C./minute, according
to a temperature-dependent measurement mode in which measurement is
carried out from -50.degree. C. to 300.degree. C.
[0138] In the present invention, there is provided a semiconductor
device which does not suffer peeling with a diameter of 1 mm or
more between the adhesive layer and a semiconductor chip, when it
passes through are flow furnace kept at 260.degree. C. for 120
seconds, after 168 hours of moisture absorption treatment at
85.degree. C. and relative humidity of 85%.
[0139] Measurement of the reflow resistance is carried out as
follows. To an adhesive film, a semiconductor chip and a wiring
board using a polyimide film with a thickness of 25 .mu.m as a
support are attached and cured, to prepare a semiconductor device
sample having solder balls formed on single piece thereof.
According to JEDEC standard J-STD-020A, this semiconductor device
sample is passed through an IR reflow furnace whose temperature is
set so that the maximum temperature on a surface of the sample is
kept at 245.degree. C. or 265.degree. C. for 20 seconds, and cooled
down by leaving it at room temperature. This cycle is repeated for
3 times, and the sample is observed by direct observation or by an
ultrasonic microscope whether or not peelings and cracks are
generated in the sample.
[0140] In the present invention, there is further provided an
adhesive film for connecting semiconductor chips, that is excellent
in adhesiveness and workability upon pressing, which can be
thermally press-bonded with a small pressure of 0.01 to 0.5 MPa in
connecting a semiconductor chip and an outer connection. part with
a wiring which supports the chip or connecting semiconductor chips
themselves. In order to obtain an excellent press-bonding property
with such a small pressure as in the present invention, it is
important to control a melt viscosity at a press-bonding
temperature of the adhesive film in a specific range.
[0141] Characteristic values of the adhesive film have a large
influence on press-bonding property and laminating property of the
adhesive film. That is, as controlling factors of press-bonding
property and laminating property evaluated by an existence of voids
and amount of oozing, there are mentioned melt viscosity,
press-bonding temperature, press-bonding pressure, press-bonding
time and a thickness of the adhesive film. However, the
press-bonding time and a thickness of the adhesive film is
determined by production efficiency and values required for the
film, whereby it has less freedom since it is practiced in a
limited range. Therefore, main controlling factors are melt
viscosity of the film and a press-bonding pressure at a
press-bonding temperature and a laminating temperature.
[0142] Using adhesive films different in melting viscosities,
influence that the melt viscosity has on press-bonding property and
laminating property is studied quantitatively, and it is found that
an excellent press-bonding property and laminating property are
obtained when the adhesive film has a melt viscosity of
1.times.10.sup.4 Pa.multidot.s or more at 100.degree. C. or less,
and has a melt viscosity in a range of 5.times.10 to
1.times.10.sup.5 Pa.multidot.s at press-bonding temperature.
[0143] In this case, the melt viscosity of the adhesive film is
measured by parallel plate plastmeter method, and evaluated by a
calculated value. That is, melt viscosity (.eta.) of the adhesive
film is obtained by measuring change in thickness of the adhesive
film by applying a load to an adhesive film with a radius of r for
a predetermined time, and by solving the following equation (4)
with respect to .eta.: 1 t = 3 V 2 8 F ( 1 z 4 - 1 zo 4 ) ( 4 )
[0144] (wherein z.sub.0 represents a thickness of an adhesive film
before applying load, z represents a thickness of the adhesive film
after applying load, V represents a volume of the adhesive film, F
represents load applied, and t represents a time for applying
load).
[0145] Adhesive films different in composition of a several kinds
of resins are prepared, and the adhesive films are press-bonded
onto an outer connection part having a surface unevenness, varying
a press-bonding temperature and a press-bonding time in some cases.
It is studied how the melt viscosity and the press-bonding pressure
have an effect on the press-bonding property and the laminating
property of the adhesive film, that is, on void and oozing. In
order to carry out bonding by press-bonding with a small pressure
of 0.5 MPa or less, without leaving voids, the melt viscosity of
the adhesive film at a press-bonding temperature should be
1.times.10.sup.5 Pa.multidot.s or less. Also as to an amount of
oozing, in order to keep the oozing amount 50 .mu.m or less, the
melt viscosity of the adhesive film at a press-bonding temperature
should be 5.times.10 Pa.multidot.s or more.
[0146] Incidentally, a pressure range is set at 0.5 MPa or less,
because, in case of applying a pressure from a chip surface by
using a tool, if the pressure exceeds this range, the chip might be
destroyed. And the amount of oozing is set at 50 .mu.m or less,
because, in accordance with a recent trend of high density,
distance between the chip terminals and the lead-bonding terminals
of the outer connection part has become smaller, and it is
impossible to carry out lead-bonding if oozing of the adhesive film
exceeds 50 .mu.m or more, since it reaches the terminals.
Therefore, by controlling the melt viscosity of the adhesive film
at a press-bonding temperature in a range of 5.times.10 to
1.times.10.sup.5 Pa.multidot.s, preferably, in a range of
1.times.10.sup.2 to 1.times.10.sup.4 Pa.multidot.s at a temperature
range of 140 to 180.degree. C., it is possible to carry out
press-bonding even with a small pressure, without causing voids and
excessive oozing.
[0147] When the data from Examples and Comparative Examples are
analyzed, when the melt viscosity of the adhesive film falls within
the above-mentioned range, as shown in FIG. 4, the smaller the melt
viscosity is, it is possible to carry out thermal press-bonding
with a smaller pressure.
[0148] Moreover, when relation between parameters
F(Pa).multidot.t(s)/.eta- .(Pa.multidot.s), using a melt viscosity
at a press-bonding temperature (.eta.), a press-bonding
pressure(F), press-bonding time (t), and press-bonding property are
analyzed, as shown in FIG. 5, the adhesive film satisfying the
following equation (5);
1.times.10.ltoreq.F(Pa).multidot.t(s)/.eta.(Pa.multidot.s).ltoreq.5.times.-
10.sup.3
[0149] can be press-bonded without causing voids and excessive
oozing.
[0150] Further, in a wafer back surface attaching and press-bonding
method, since a back surface of a wafer has no unevenness on the
surface different from the outer connection part, laminating an
adhesive film thereon is carried out under condition of a
temperature at around 100.degree. C. which is lower than a
press-bonding temperature, and with a line pressure of 0.1 to 10
MPa. Also in this case, relation between the melt viscosity of the
adhesive film and oozing of the adhesive film from the wafer
terminal after laminating is studied, the melt viscosity of the
adhesive film at a laminating temperature has to be about
1.times.10.sup.4 Pa.multidot.s or more, in order to laminate
without causing an ooze of the adhesive film resin onto a surface
of the wafer.
[0151] Therefore, it is preferred to set a ratio of the melt
viscosties of the adhesive film at 100.degree. C. and 180.degree.
C. in a range of 1.times.10 to 1.times.10.sup.3. When the ratio of
the melt viscosities is in this range, temperature dependency of
the melt viscosity is proper, and it is possible to have a wide
temperature range for carrying out press-bonding, and it is
possible to achieve the above-mentioned suitable range for the melt
viscosity, at the above-mentioned temperature of 100.degree. C. and
at a press-bonding temperature of 140.degree. C. to 180.degree.
C.
[0152] Further, also as to adhesion of the adhesive film onto a
metal dicing mold or onto a conveyer, and as to peeling from a
dicing tape, correlations with the properties of the adhesive film
are studied, and it was found that they have a correlation with an
adhesiveness at room temperature. As an index of adhesiveness, that
is tack property, Probe tack test method as described in JISZ0237
is used. Probe tack test method is a method in which a prove is
contacted with an adhesive film while applying a predetermined load
for a predetermined time, and then, a force is measured required
for peeling a probe from the adhesive film in a vertical direction.
As to adhesion to a metal mold and peeling from a dicing tape, when
a tack load measured at 25.degree. C. by the Probe tack method is
in a range of 2 to 20 gf, there is observed no adhesion to the
metal mold, and peeling from the dicing tape is possible, thereby
being excellent in workability, since adhesiveness between the
adhesive film and the protective film is good.
[0153] The melt viscosity (.eta.) of the adhesive film at a
press-bonding temperature can be adjusted in the above-mentioned
range by a blending amount of the adhesive composition and by
coating conditions to prepare an adhesive film based on the
blending ratio of the resin composition, that is, by degree of B
stage.
[0154] As to the blending amount of the adhesive composition, in
order to adjust the melt viscosity (.eta.) of the adhesive film at
a press-bonding temperature in a range of 5.times.10 to
1.times.10.sup.5 Pa.multidot.s, a ratio A/B is preferably in a
range exceeding 1 and 3.3 or less, where A is the total weight of
the epoxy resin and the curing agent, and B is a weight of the
polymer compound. In addition, in order to control the melt
viscosity of the adhesive film at 140 to 180.degree. C. in a range
of 1.times.10.sup.2 to 1.times.10.sup.4 Pa.multidot.s, A/B is
particularly preferably in a range of 1.25 to 3.3. Further, the
weight average molecular weight of the polymer is preferred to be
from 300,000 to 800,000.
[0155] On the other hand, it is possible to control a melt
viscosity of the adhesive film by adjusting a semi-cured state of
the film by a coating condition for filming a resin varnish, such
as coating temperature and coating time. Especially, the melt
viscosity of the adhesive film can be adjusted in the range of the
present invention by heating and drying at a moderately low
temperature of 80 to 100.degree. C. after coating the resin
varnish, followed by selecting an appropriate heating temperature
and a heating time within a range of 110 to 150.degree. C. based on
the resin composition.
[0156] In order to adjust the tack load of the adhesive film
measured at 25.degree. C. within a range of 2 to 20 gf, the ratio
A/B is more preferably in a range exceeding 1 and 3.3 or less,
where A is the total amount of the epoxy resin and the curing agent
thereof and B is the amount of the polymer compound, and is
especially preferably in a range of 1.25 to 3.3. Further, a weight
average molecular weight of the polymer compound is preferably in a
range of 300,000 to 800,000. In addition, the tack load can be
adjusted in a range of 2 to 20 gf by controlling a coating
condition at the time of production of the film.
[0157] Further, the adhesive film using the adhesive composition of
the present invention in a B stage, which has a bi-phase structure
in which the island phase appears less frequently on the surface is
preferred since it shows a smaller tack load and high fluidity.
[0158] The above-mentioned residual volatile component fraction in
the adhesive composition is also a factor affecting the tack load.
When more of the residual volatile component remains in the
adhesive film, the film itself produces foams at curing process,
producing the voids inside the film, causing a decreased
reliability. By reducing the amount of the residual volatile
component to 3.0% or less, the foaming at the curing process can be
reduced.
[0159] The adhesive film of the present invention can be prepared
in a film form, by dissolving or suspending the adhesive
composition of the present invention in the solvent to give a
varnish, coating the same onto a support and by heating to
evaporate the solvent. The heating conditions in this process are
preferably, for example, from 80 to 250.degree. C. and from 10
minutes to 20 hours.
[0160] As the support, s plastic film such as
polytetrafluoroethylene, polyethylenetelephthalate, polyethylene,
polypropylene, polymethylpentene, polyimide, etc. can be used, and
these supports can be used after release-treating their surfaces.
The support can be peeled off upon use so that the adhesive layer
is used alone, or it can be removed later, so that the support can
be used together with an adhesive film.
[0161] As to the above-mentioned solvent for varnish, it is not
specifically limited, but when the volatile property is considered,
a solvent with a relatively low boiling point can be preferably
used, for example, methanol, ethanol, 2-methoxyethanol,
2-butoxyethanol, methyl ethyl ketone, acetone, methyl isobutyl
ketone, 2-ethoxyethanol, toluene, xylene, etc. Further, for the
purpose of improving the coating properties, a solvent with a
relatively high boiling point such as dimethylacetamide,
dimethylformamide, N-methylpyrrolidone, cyclohexanone, etc. may be
added.
[0162] In preparation of the varnish in which the inorganic fillers
are added to the adhesive composition of the present invention, in
view of dispersibility of the inorganic filler, it is preferred to
use a mixer, a three-roll mill, a ball mill, a beads mill, etc., or
these can be used in combination. In the present invention, when
the filler is added to the adhesive composition, it is preferred to
employ a method in which an epoxy resin, a curing agent and a
filler are mixed with one another, and then, a polymer compound
incompatible with the epoxy resin is mixed into the resultant
mixture to produce an adhesive composition. By employing the above
production method, a film of the epoxy resin is formed at the
interface of the filler. Therefore, after the rubber and the epoxy
resin undergo phase separation and curing, a larger amount of the
filler remains in the epoxy resin phase, so that the effect of
reinforcing adhesion of the interface between the epoxy resin and
the filler is increased, thus improving the heat resistance of the
resultant cured product. After a varnish is prepared, the varnish
may be deaerated by vacuum deaeration, etc. to remove foams in the
varmish.
[0163] As a method for coating a varnish to a support film, a known
method can be used, and examples include a knife coating method, a
roll coating method, a spray coating method, a gravure coating
method, a bar coating method, a curtain coating method, etc.
[0164] With respect to the thickness of the adhesive layer, there
is no particular limitation, but the thickness is preferably 3 to
300 .mu.m, more preferably 10 to 250 .mu.m, further preferably 25
to 200 .mu.m. When the thickness is in this range, the adhesive
film can fully exhibit the stress relaxation effect, and at the
same time, it is advantageous from an economical point of view.
[0165] Further, for obtaining a desired thickness of the adhesive
layer in the adhesive film of the present invention, two or more
films can be attached to one another. In this case, it is required
to set conditions for attaching films so that no peeling occurs
between the adhesive layers.
[0166] The adhesive film in which the adhesive composition of the
present invention are laminated, being separated as the first
adhesive layer and the second adhesive layer can be prepared by
forming the first and the second adhesive layer on a support
respectively, and by press-bonding and heating these adhesive
layers of a film form. For example, it can be prepared by
laminating the first and the second adhesive layers, followed by
attaching themselves by a hot roll laminator. In this case, a
film-shaped adhesive layer can be used alone after peeling off a
film-shaped support, or it may be used without peeling off the
film-shaped support. In the latter case, the film-shaped support
may be used as a cover film.
[0167] Further, an adhesive film in which a curing degree is higher
in the second adhesive layer than the first adhesive layer can also
be prepared by coating a varnish comprising a composition of the
second adhesive layer on a film-shaped support, heating to remove a
solvent, coating a varnish comprising a composition of the first
adhesive layer onto the second adhesive layer, and heating
again.
[0168] The thickness of the first and the second adhesive layers
are preferably 10 to 250 .mu.m, respectively, but it is not limited
to this. In addition, the thickness of the adhesive film comprising
the laminated first adhesive layer and the second adhesive layer is
thinner than that of a circuit board, filling property tends to be
lowered.
[0169] The adhesive film of the present invention can be used as a
core material with adhesive film, by bonding the adhesive films of
the present invention on both surfaces of a core material. In this
case, the first adhesive layer may be laminated on one surface of
the core material, and the second adhesive layer may be laminated
on the other surface. The thickness of the core material is
preferably in the range of from 5 to 200 .mu.m, but it is not
limited to this range.
[0170] With respect to the material used as a core material, there
is no particular limitation, but it is preferably a heat-resistant
thermoplastic resin, further preferably a heat-resistant
thermoplastic resin having a glass transition temperature of
260.degree. C. or higher. When such a heat-resistant thermoplastic
resin is used as a core material, a possible peeling of the
adhesive film at high temperatures can be avoided, i.e., during
soldering reflow. Further, heat-resistant thermoplastic resins
using liquid crystalline polymers, polyamideimide, polyimide,
polyetherimide, polyethersulfone, peraromatic polyester,
polytetrafluoroethylene, ethylene-tetrafluoroethylene copolymers,
tetrafluoroethylene-hexafluoropropylene copolymers,
tetrafluoroethylene-perfluoroalkyl vinyl ether copolymers, etc. are
preferably used. Further, as the heat-resistant thermoplastic
resin, a porous material in a film form can be used for reducing
the elastic modulus of the adhesive layer.
[0171] The adhesive layers formed on both surfaces of the core
material can be firstly prepared as a varnish by dissolving or
dispersing an adhesive composition in a solvent. The varnish is
coated onto a heat-resistant thermoplastic film which becomes a
core material, and heated to remove the solvent to form an adhesive
film on the heat-resistant thermoplastic film. As the method for
coating, the above-mentioned methods can be used. This step is
conducted with respect to both surfaces of the heat-resistant
thermoplastic film to prepare an adhesive film having adhesive
layers on both surfaces of the core material. In this case, it is
preferred that the surfaces of the adhesive film are protected by
cover films so that the adhesive layers on both surfaces do not
suffer blocking. However, when no blocking occurs, it is preferred
not to use a cover film from an economical point of view.
[0172] Alternatively, a varnish prepared by dissolving or
dispersing an adhesive composition in a solvent is coated onto the
above-mentioned support film, and heated to remove the solvent to
form an adhesive layer on the support material. The adhesive layers
are laminated to both surfaces of a core material to prepare an
adhesive film having adhesive layers formed on both surfaces of the
core material. In this case, the support film can be used as a
cover film.
[0173] The substrate for mounting semiconductor of the present
invention is not limited and a lead frame having a die pad, ceramic
substrates, and organic substrates may be used. As the ceramic
substrates, alumina substrates and aluminum nitride substrates can
be used. As the organic substrates, FR-4 substrates obtained by
impregnating an epoxy resin into glass cloth, BT substrates
obtained by impregnating a bismaleimide-triazine resin into glass
cloth, and polyimide film substrates using a polyimide film as a
base material can be used.
[0174] As the shape of wiring, any structure of single side wiring,
both sides wiring, and multilayer wiring may be used, and, if
desired, an electrically connected through hole or non-through hole
may be formed. Further, when the wiring appears on the outer
surface of the semiconductor device, it is preferred to form a
protecting resin layer.
[0175] As a method for laminating an adhesive film to a supporting
member, a method in which the adhesive film is cut into a desired
shape, and the cut adhesive film is heat-pressed to the supporting
member at a desired position is general, but the method is not
limited to this.
[0176] As examples of structures of the semiconductor device of the
present invention, there can be mentioned a structure such that an
electrode of an semiconductor chip and a supporting member for
mounting the semiconductor are connected to each other through wire
bonding, and a structure such that an electrode of a semiconductor
chip and a supporting member are connected to each other through
inner lead bonding of tape automated bonding (TAB), etc., but the
structure is not limited to these, and an effect can be obtained by
any of these structures.
[0177] As the semiconductor element, general semiconductor elements
such as IC, LSI, VLSI, etc. can be used.
[0178] The characteristic feature of the adhesive film of the
present invention resides in that an amount of the volatile
components from the adhesive layer can be reduced in heating steps
such as the step of heat-pressing the adhesive film to the
supporting member at a desired position and the step of connecting
through wire bonding. Therefore, peeling can be reduced to an area
with a diameter of less than 1 mm.
[0179] The wiring board for mounting a semiconductor of the present
invention is not limited by substrate materials, such as ceramic
substrates and organic substrates. The ceramic substrates and the
organic substrates to be used is the same as those used for a
supporting member for mounting a semiconductor, as mentioned
above.
[0180] As the shape of wiring, any structures of single side
wiring, both sides wiring, and multilayer wiring may be used, and,
if desired, an electrically connected through hole or non-through
hole may be formed.
[0181] Further, when the wiring appears on the outer surface of the
semiconductor device, it is preferred to form a protecting resin
layer.
[0182] For a method for connecting a semiconductor chip and outer
connection part with wiring, there are a punch and pressing method
and a wafer back surface attaching and press-bonding method. In the
punch and pressing method, an adhesive film-pressing machine having
both a film dicing function and a heat-pressing function is used.
First, an adhesive film in a sheet form or a reel form is punched
by a metal mold with a pre-determined size, and this is temporarily
pressed onto a predetermined position of an outer connection part.
Subsequently, the adhesive film is heat-pressed using a pressing
means. Further, a semiconductor chip is positioned on an adhesive
film, and heat-pressed to bond the outer connection part and the
semiconductor chip. On the other hand, in the wafer back surface
attaching and press-bonding method, an adhesive film is attached by
heat-pressing laminate method, etc. on a back surface of a wafer on
which a semiconductor chip is formed, followed by laminating a
dicing tape thereon, and the wafer and the adhesive film were cut
as a whole. Subsequently, the dicing tape was peeled off to give a
semiconductor with an adhesive film, and this is heat-pressed onto
an outer connection part with wiring or another semiconductor
chip.
[0183] In any method for press-bonding, it is required to use a
pressure of 0.5 MPa or less, to prevent the chip from being broken.
Laminating temperature and press-bonding temperature and time are
selected under a condition that the bonding can be carried out
without forming voids and excessive oozing at a bonding interface.
The laminating temperature is preferably around at 100.degree. C.,
the press-bonding temperature is preferably from 100 to 200.degree.
C., and especially preferably from 140 to 180.degree. C.,
considering heat resistance of the outer connection part. Further,
the press-bonding time is preferably from 0.5 to 5 seconds
considering productivity.
[0184] The adhesive film of the present invention may be an
independent adhesive film 1 as shown in FIG. 1(a), or may be an
adhesive film with a core material in which the adhesive films 1
are provided on the both surfaces of the core material 2, as shown
in FIG. 1(b). In addition, the outer connection part for mounting a
semiconductor of the present invention has a structure as shown in
FIG. 2, in which the above adhesive film 1 is bonded onto an outer
connection part 4 with a wiring 3 formed thereon. Further, the
semiconductor device has a structure exemplified in FIG. 3, in
which an outer connection part for mounting a semiconductor shown
in FIG. 2 and a semiconductor chip 5, and on top of them, another
semiconductor chip 5 are bonded with the adhesive films 1, pads of
the semiconductor chip and the outer connection part are connected
with a bonding wire 6, the semiconductor chip 5 and the outer
connection part are encapsulated by an encapsulating material 7,
and solder balls are provided on the outer connection termini
8.
EXAMPLES
[0185] Hereinbelow, the present invention will be described in more
detail with reference to the following Examples, which should not
be construed as limiting the scope of the present invention.
Example 1
[0186] (Sample 1)
[0187] Methyl ethyl ketone was added to an adhesive composition
comprising 45 parts by weight of bisphenol A type epoxy resin
(epoxy equivalent 175, manufactured by Tohto Kasei Co., Ltd., trade
name: YD-8125) and 15 parts by weight of a cresol novolak type
epoxy resin: (epoxy equivalent 210, manufactured by Tohto Kasei
Co., Ltd., trade name: YDCN-703) as an epoxy resin, 40 parts by
weight of a phenol novolak resin (manufactured by Dainippon Ink
& Chemicals, Inc., trade name: Plyofen LF2882) as an epoxy
resin curing agent, 66 parts by weight of an epoxy group-containing
acrylic rubber as an epoxy group-containing acrylic type copolymer
(molecular weight: 1,000,000, grycidyl group-containing repeating
unit 3% by weight, Tg: -7.degree. C., manufactured by Teikoku
Chemical Industries Co., Ltd.; trade name: HTR-860P-3DR(C)) as a
polymer, and, as a curing accelerator, 0.5 part by weight of an
imidazole type curing accelerator (manufactured by Shikoku Kasei
Kogyo Co., trade name: Curezol 2PZ-CN), and they were mixed by
stirring, and then vacuum-deaerated. The resultant adhesive varnish
was coated on a release-treated polyethylene-terephthala- te film
having a thickness of 75 .mu.m, and heated for drying at 90.degree.
C. for 20 minutes, and subsequently at 120.degree. C. for 5 minutes
to form a coating film having a thickness of 60 .mu.m, thus
preparing an adhesive film E1.
[0188] A cured product obtained by heat-curing this adhesive film
at 170.degree. C. for 1 hour has a storage elastic modulus of 600
MPa at 25.degree. C., and 5 MPa at 260.degree. C. An amount of the
residual solvent was 1.4% by weight, and the ratio A/B was 1.52 in
which A represents the total weight of the epoxy resin and its
curing agent and B represents an amount of the polymer
compound.
[0189] (Sample 2)
[0190] An adhesive film E2 was prepared in the same manner as in
Sample 1, except for using 42 parts by weight of the epoxy
group-containing acrylic rubber used in Sample 1. The ratio A/B was
2.38.
[0191] (Sample 3)
[0192] An adhesive film E3 was prepared in the same manner as in
Sample 1, except for using 24 parts by weight of the epoxy
group-containing acrylic rubber used in Sample 1. The ratio A/B was
4.17.
[0193] (Sample 4)
[0194] Methyl ethyl ketone was added to an adhesive composition
comprising 55 parts by weight of polygrycidyl ether of brominated
phenol novolak resin (epoxy equivalent 285, manufactured by Nihon
Kayaku Co., Ltd., trade name: BREN-S) as an epoxy resin, 40.8 parts
by weight of a brominated phenol resin (manufactured by Teijin
Kasei Co., Ltd., trade name: Fireguard FG200) and 5.9 parts by
weight of a phenol novolak resin (manufactured by Dainippon Ink
& Chemicals, Inc., trade name: Plyofen LF2882) as an epoxy
resin curing agent, 68 parts by weight of an epoxy group-containing
acrylic rubber, as an epoxy group-containing acrylic type polymer
(molecular weight: 1,000,000, grycidyl group-containing repeating
unit 3% by weight, Tg: -7.degree. C., manufactured by Teikoku
Chemical Industries Co., Ltd.; trade name: HTR-860P-3DR(C)) as a
polymer, 0.5 part by weight of an imidazole type curing accelerator
(manufactured by Shikoku Kasei Kogyo Co., trade name: Curezol
2PZ-CN) as a curing accelerator, and 21 parts by weight of
diantimony trioxide (manufactured by Nihon Seiko Co., trade name:
PATOX-U) as a filler, and they were mixed by stirring, and then
vacuum-deaerated. The resultant adhesive varnish was coated on a
release-treated polyethylene terephthalate film having a thickness
of 75 .mu.m, and heated for drying at 90.degree. C. for 20 minutes,
and subsequently at 120.degree. C. for 5 minutes to form a coating
film having a thickness of 60 .mu.m, thus preparing an adhesive
film E4.
[0195] A cured product obtained by heat-curing this adhesive film
at 170.degree. C. for 1 hour has a storage elastic modulus of 1000
MPa at 25.degree. C., and 5 MPa at 260.degree. C. An amount of the
residual solvent was 1.2% by weight, and the ratio A/B was
1.50.
[0196] (Sample 5)
[0197] An adhesive film E5 was prepared in the same manner as in
Sample 4, except for using 44 parts by weight of the epoxy
group-containing acrylic rubber used in Sample 4. The ratio A/B was
2.31.
[0198] (Sample 6)
[0199] An adhesive film E6 was prepared in the same manner as in
Sample 4, except for using 26 parts by weight of the epoxy
group-containing acrylic rubber used in Sample 4. The ratio A/B was
3.91.
[0200] (Comparative Sample 1)
[0201] An adhesive film C1 was prepared in the same manner as in
Sample 1, except for using 110 parts by weight of the epoxy
group-containing acrylic rubber used in Sample 1. The ratio A/B was
0.91.
[0202] (Comparative Sample 2)
[0203] An adhesive film C2 was prepared in the same manner as in
Sample 1, except for using 5 parts by weight of the epoxy
group-containing acrylic rubber used in Sample 1. The ratio A/B was
20.00.
[0204] Using the obtained adhesive films E1 to E6 and C1 to C2, a
semiconductor chip and a wiring board using a polyimide film with
25 .mu.m thickness as a substrate were heat-pressed for 5 seconds
under the conditions for temperature and pressure shown in Table 1,
and subsequently, it was heated at 170.degree. C. for 1 hour for
curing to prepare a semiconductor device sample with an adhesive
film (solder balls are formed on single piece). And the sample was
tested with respect to filling property, oozing property at
via-holes and terminals, heat resistance, moisture resistance,
foaming, and a shelf life for evaluating storing property.
[0205] The filling property was evaluated by observing a filling of
the adhesive into a circuit by an optical microscope. Those without
a void between the adhesive and the circuit provided on the wiring
board were evaluated as "O", and those with voids were evaluated as
"X". Oozing of the resin from the through-holes or terminals are
observed by an optical microscope and those without oozing were
evaluated as "O", and those with oozing were evaluated as "X".
[0206] The heat resistance was evaluated by using reflow resistance
test and a temperature cycle test. The evaluation of the reflow
resistance was made as follows. A sample was placed in an IR reflow
furnace in which the temperature was adjusted so that the maximum
temperature of the sample surface became 240.degree. C. and this
temperature was kept for 20 seconds, and then cooled by allowing
the sample to stand at room temperature. The sequence of the above
treatments was repeated two times, and then, the resultant sample
was observed by direct observation and through an ultrasonic
microscope with respect to generation of cracks. A sample in which
no crack was observed was evaluated as "O", and a sample in which a
crack was observed was evaluated as "X". The evaluation of the
temperature cycle resistance was made as follows. A sample was
allowed to stand in an atmosphere at -55.degree. C. for 30 minutes
and then stand in an atmosphere at 125.degree. C. for 30 minutes.
The sequence of the above treatments was repeated 1,000 cycles, and
then, the resultant sample was observed by an ultrasonic microscope
whether or not peeling or crack is generated. A sample in which no
crack, etc. was observed was evaluated as "O", and a sample in
which a crack, etc. was observed was evaluated as "X".
[0207] Evaluation for moisture resistance was done by treating a
sample at a temperature of 121.degree. C., under a humidity of
100%, and in an atmosphere of 2.03.times.10.sup.5 Pa (pressure
cooker test, PCT treatment) for 72 hours, and by observing the
sample whether a peeling exists. A sample in which no peeling was
observed in the adhesive member evaluated as "O", and a sample in
which peeling was observed in the adhesive member was evaluated as
"X".
[0208] Existence of foaming was confirmed by observing the sample
using an ultrasonic microscope, with respect to generation of foams
in the semiconductor device sample. A sample in which no foam was
observed in the adhesive film was evaluated as "O", and a sample in
which foam was observed in the adhesive film was evaluated as "X".
Evaluation of the shelf life was done as follows. The above
mentioned semiconductor device sample was prepared using the
adhesive film after having been stored at 25.degree. C. for 3
months. And then, a filling property was confirmed and a sample in
which no void was observed between the adhesive film and the
circuit provided on the wiring board was evaluated as "O", and a
sample in which voids were observed was evaluuated as "X".
[0209] The results are shown in Table 1.
1 TABLE 1 Comparative Samples samples Evaluations 1 2 3 4 5 6 1 2
Load for bonding kPa 65 65 65 98 65 65 65 65 Temperature for
bonding .degree. C. 160 160 160 180 180 160 160 160 Filling
property .largecircle. .largecircle. .largecircle. .largecircle.
.largecircle. .largecircle. X .largecircle. Oozing at via-hole,
terminal .largecircle. .largecircle. .largecircle. .largecircle.
.largecircle. .largecircle. .largecircle. X Heat resistance Reflow
resistance .largecircle. .largecircle. .largecircle. .largecircle.
.largecircle. .largecircle. X X Temperature cycle resistance
.largecircle. .largecircle. .largecircle. .largecircle.
.largecircle. .largecircle. X X Moisture resistance .largecircle.
.largecircle. .largecircle. .largecircle. .largecircle.
.largecircle. X X Foaming .largecircle. .largecircle. .largecircle.
.largecircle. .largecircle. .largecircle. .largecircle. X Shelf
life .largecircle. .largecircle. .largecircle. .largecircle.
.largecircle. .largecircle. X .largecircle.
[0210] From Table 1, it was shown that the adhesive films E1 to E6
of the present invention in which a ratio of A/B exceeds 1 and is
10 or less, where A is the total weight of the epoxy resin and the
curing agent and B is a weight of the polymer compound are
excellent in every characteristic including filling property,
oozing property at via-holes and terminals, heat resistance,
moisture resistance foaming property and shelf life. On the other
hand, the adhesive film C1 whose A/B ratio is 1 or less showed
insufficient results in filling property, heat resistance, moisture
resistance and shelf life. Also, the adhesive film C2 whose A/B
ratio largely exceeds 10 also showed insufficient results in oozing
property at via-holes and terminals, heat resistance, moisture
resistance and foaming property.
Example 2
[0211] (Sample 7)
[0212] (1) Preparation of the First Adhesive Layer
[0213] Methyl ethyl ketone was added to an adhesive composition
comprising 45 parts by weight of bisphenol A type epoxy resin
(epoxy equivalent 175, manufactured by Tohto Kasei Co., Ltd., trade
name: YD-8125) and 15 parts by weight of a cresol novolak epoxy
resin (epoxy equivalent 210, manufactured by Tohto Kasei Co., Ltd.,
trade name: YDCN-703) as an epoxy resin, 40 parts by weight of a
phenol novolak resin (manufactured by Dainippon Ink &
Chemicals, Inc., trade name: Plyofen LF2882) as an epoxy resin
curing agent, 66 parts by weight of an epoxy group-containing
acrylic rubber as an epoxy group-containing acrylic type polymer
(molecular weight: 1,000,000, grycidyl group-containing repeating
unit 3% by weight, Tg: -7.degree. C., manufactured by Teikoku
Chemical Industries Co., Ltd.; trade name: HTR-860P-3DR(C)) as a
polymer, and, as a curing accelerator, 0.5 part by weight of an
imidazole type curing accelerator (manufactured by Shikoku Kasei
Kogyo Co., trade name: Curezol 2PZ-CN), and they were mixed by
stirring, and then vacuum-deaerated. The resultant adhesive varnish
was coated on a release-treated polyethylene terephthalate film
having a thickness of 75 .mu.m, and heated for drying at 90.degree.
C. for 20 minutes, and subsequently at 120.degree. C. for 5 minutes
to form a coating film having a thickness of 30 .mu.m, thus
preparing the first adhesive film. Degree of curing measured by
using DSC was 5%. Storage elastic modulus of the adhesive film
obtained by heat-curing this adhesive film at 170.degree. C. for 1
hour was 600 aMPa at 25.degree. C. and 5 MPA at 260.degree. C.
[0214] (2) Preparation of the Second Adhesive Layer
[0215] The second adhesive layer was prepared in the same manner as
in the first adhesive layer, except for heating for drying at
90.degree. C. for 20 minutes, and subsequently at 140.degree. C.
for 5 minutes after being coated on a polywthylene terephthalate
film. Degree of curing measured by using DSC was 15%.
[0216] (3) Lamination of the First and the Second Adhesive
Layers
[0217] An adhesive film E7 was prepared by laminating the first and
the second adhesive layers, bonding them using a hot-roll laminator
under conditions of temperature of 100.degree. C., pressure of 0.3
MPa, and velocity of 0.2 m/min. The A/B ratio was 1.52 in which A
is the total weight of the epoxy resin and the curing agent, and B
is a weight of the polymer compound.
[0218] (Sample 8)
[0219] (1) Preparation of the First Adhesive Layer
[0220] Methyl ethyl ketone was added to an adhesive composition
comprising 55 parts by weight of polygrycidyl ether of brominated
phenol novolak resin (epoxy equivalent 285, manufactured by Nihon
Kayaku Co., Ltd., trade name: BREN-S) as an epoxy resin, 40.8 parts
by weight of a brominated phenol resin (manufactured by Teijin
Kasei Co., Ltd., trade name: Fireguard FG200) and 5.9 parts by
weight of a phenol novolak resin (manufactured by Dainippon Ink
& Chemicals, Inc., trade name: Plyofen LF2882) as an epoxy
resin curing agent, 68 parts by weight of an epoxy group-containing
acrylic rubber, as an epoxy group-containing acrylic type polymer
(molecular weight: 1,000,000, grycidyl group-containing repeating
unit 3% by weight, Tg: -7.degree. C., manufactured by Teikoku
Chemical Industries Co., Ltd.; trade name: HTR-860P-3DR(C)) as a
polymer, 0.5 part by weight of an imidazole type curing accelerator
(manufactured by Shikoku Kasei Kogyo Co., trade name: Curezol
2PZ-CN) as a curing accelerator, and 21 parts by weight of
diantimony trioxide (manufactured by Nihon Seiko Co., trade name:
PATOX-U) as a filler, and they were mixed by; stirring, and then
vacuum-deaerated. The resultant adhesive varnish was coated on a
release-treated polyethylene terephthalate film having a thickness
of 75 .mu.m, and heated for drying at 90.degree. C. for 20 minutes,
and subsequently at 120.degree. C. for 5 minutes to form a coating
film having a thickness of 30 .mu.m, thus preparing an adhesive
film. A residual amount of the solvent was 1.2% by weight and
storage elastic modulus of the adhesive film obtained by
heat-curing this adhesive film at 170.degree. C. for 1 hour was
1000 MPa at 25.degree. C. and 5 MPa at 260.degree. C.
[0221] (2) Preparation of the Second Adhesive Layer
[0222] The second adhesive layer was prepared in the same manner as
in the above-mentioned first adhesive layer, except for using 68
parts by weight of the polymer compound.
[0223] (3) Lamination of the First and the Second Adhesive
Layers
[0224] An adhesive film E8 was prepared by laminating the first and
the second adhesive layers, bonding them using a hot-roll laminator
under conditions of temperature of 100.degree. C., pressure of 0.3
MPa, and velocity of 0.2 m/min. The A/B ratios were 2.31 in the
first adhesive layer and 1.50 in the second adhesive layer.
[0225] Using the obtained adhesive films, a semiconductor chip and
a wiring board using a polyimide film with 25 .mu.m thickness as a
substrate were heat-pressed for 5 seconds under the conditions for
temperature and pressure shown in Table 2, and subsequently, it was
heated at 170.degree. C. for 1 hour for curing to prepare a
semiconductor device sample with an adhesive film (solder balls are
formed on single piece). In this preparation, the first adhesive
layer was made facing to the semiconductor chip side, and the
second adhesive layer was made facing to the wiring board.
[0226] The samples were tested with respect to filling property,
oozing property at via-holes and terminals, heat resistance,
moisture resistance, foaming, and shelf life for evaluating storing
property. Tests and evaluation were carried out in the same manner
as in Example 1. Results are shown in Table 2.
2 TABLE 2 Samples Evaluations 7 8 Load for bonding kPa 65 65
Temperature for bonding .degree. C. 160 160 Filling property
.largecircle. .largecircle. Oozing at via-hole, terminal
.largecircle. .largecircle. Heat resistance Reflow resistance
.largecircle. .largecircle. Temperature cycle resistance
.largecircle. .largecircle. Moisture resistance .largecircle.
.largecircle. Foaming .largecircle. .largecircle. Usable period
.largecircle. .largecircle.
[0227] From Table 2, it was shown that the samples 7 and 8 in which
the adhesive films of the present invention were laminated have an
excellent property.
Example 3
[0228] (Sample 9)
[0229] Cyclohexanone was added to an adhesive composition
comprising 55 parts by weight of a cresol novolak type epoxy resin
with an epoxy equivalent of 210 (manufactured by Tohto Kasei Co.,
Ltd., trade name: YDCN-703) as an epoxy resin, 45 parts by weight
of a phenol resin with a hydroxy group equivalent of 175, moisture
absorption of 1.8%, and weight loss by heating at 350.degree. C. of
4% (manufactured by Mitsui Kagaku Kogyo Co., trade name: MILEX
XLC-LL) as an epoxy resin curing agent, 1.7 parts by weight of
3-mercaptopropyltrimethoxy silane (manufactured by Nihon Yunicar
Co., tradename: NUCA-189) and 3.2 parts by weight of
3-ureidopropyltriethoxy silane (manufactured by Nihon Yunicar Co.
Ltd., tradename: NUCA-1160) as a silane coupling agent, and 10
parts by weight of fumed silica with an average particle diameter
of 0.016 .mu.m (manufactured by Nippon Aerosil Co., Ltd., trade
name: Aerosil R972). The mixture was stirred and then, it was
further kneaded using a beads mill for 90 minutes.
[0230] To the above, 70 parts by weight of acrylic rubber
containing 1% by weight of grycidyl group containing repeating unit
and having a weight average molecular weight of 800,000 and, as a
curing accelerator, 0.5 parts by weight of
1-cyanoethyl-2-phenylimidazole (manufactured by Shikoku Kasei Kogyo
Co. Ltd., trade name: Curezole 2PZ-CN) were mixed and the mixture
was vacuum-deaerated. Thus prepared varnish was coated on a
release-treated polyethylene terephthalate film with a thickness of
75 .mu.m, and it was heated for drying at 140.degree. C. for 5
minutes to give a coating film in B stage with a film thickness of
75 .mu.m, to prepare an adhesive film E9 equipped with a support
film.
[0231] Incidentally, a ratio A/B of the prepared adhesive film E9
was 1.43, where A is the total weight of the epoxy resin and the
curing agent, and B is a weight of the acrylic copolymer. In
addition, a weight fraction (.phi.) of a weight of the polymer (B)
based on the total amount of the epoxy resin, the epoxy
resin-curing agent, and the polymer (A+B) was 0.41.
[0232] Further, an area of a sea phase X at a section of the
adhesive film was 0.34, while an area of an island phase Y was
0.66, and a ratio X/Y was 0.52. An area ratio of the sea phase was
0.60 when it was measured on a surface of the adhesive film, while
it was 0.40 when measured at a position 5 .mu.m inside from the
surface. The area ratio in the center of the film (37 .mu.m inside
from the surface) was almost the same, which was 0.34.
[0233] (Sample 10)
[0234] An adhesive film E10 was prepared in the same manner as in
Sample 9, except for using an acrylic rubber containing 2% by
weight of grycidyl group-containing repeating units in place of an
acrylic rubber containing 1% by weight of grycidyl group-containing
repeating units. A/B was 1.43, and .phi. was 0.41.
[0235] (Sample 11)
[0236] An adhesive film E11 was prepared in the same manner as in
Sample 9, except for using 64 parts by weight of a cresol novolak
type epoxy resin with an epoxy equivalent of 210 (manufactured by
Tohto Kasei Co., Ltd., trade name: YDCN-703) as an epoxy resin, 36
parts by weight of a phenol resin with a hydroxy group equivalent
of 118, moisture absorption of 4.4%, and weight loss by heating at
350.degree. C. of 18% (manufactured by Dainippon Ink &
Chemicals, Inc., trade name; Plyofen LF2882) as an epoxy resin
curing agent, and 70 parts by weight of an acrylic rubber
containing 2% by weight of grycidyl group-containing repeating
units. A/B ratio was 1.43, and .phi. was 0.41.
[0237] (Sample 12)
[0238] An adhesive film E12 was prepared in the same manner as in
Sample 9, except for using 40 parts by weight of the acrylic rubber
containing 1% by weight of grycidyl-group containing repeating
unit, instead of using 70 parts by weight thereof. A/B ratio was
2.5, and .phi. was 0.30.
[0239] In addition, an area of a sea phase X at a section of the
adhesive film was 0.35, while an area of an island phase Y was
0.65, and the ratio X/Y was 0.54. An area ratio of the sea phase
was 0.60 when it was measured on a surface of the adhesive film,
and it was 0.32 when measured at a position 5 .mu.m inside from the
surface. The ratio in the center of the film (37 .mu.m inside from
the surface) was almost the same, which was 0.35.
[0240] (Sample 13)
[0241] An adhesive film E13 was prepared in the same manner as in
Sample 11, except that filler R972 used in Sample 11 was not used
and kneading by a beads mill was not carried out. A/B ratio was
1.43, and .phi. was 0.41.
[0242] (Sample 14)
[0243] An adhesive film E14 was prepared in the same manner as in
Sample 11, except for using silica with an average particle
diameter of 0.9 .mu.m (manufactured by Admatex Co. Ltd., trade
name: SO25) in place of the fumed silica filler R972. A/B ratio was
1.43, and .phi. was 0.41.
[0244] (Sample 15)
[0245] An adhesive film E15 was prepared in the same manner as in
Sample 12, except for using 28 parts by weight of a cresol novolak
type epoxy resin with an epoxy equivalent of 210 (manufactured by
Tohto Kasei Co., Ltd., trade name: YDCN-703) and a bisphenol A type
epoxy resin with an epoxy equivalent of 173 (manufactured by Tohto
Kasei Co., Ltd., trade name: YD-81257) asan epoxy resin, 26 parts
by weight of a phenol resin with a hydroxy group equivalent of 175,
moisture absorption of 1.8%, and weight loss by heating at
350.degree. C. of 4% (manufactured by Mitsui Kagaku Kogyo Co.,
trade name: Mylex XLC-LL) and 18 parts by weight of a phenol resin
with a hydroxy group equivalent of 118, moisture absorption of
4.4%, and weight loss by heating at 350.degree. C. of 18%
(manufactured by Dainippon Ink & Chemicals, Inc., trade name;
Plyofen LF2882) as an epoxy resin curing agent. A/B ratio was 2.5,
and .phi. was 0.30.
[0246] The thus prepared adhesive films E9 to E15 were measured
with respect to an area of a sea phase and an island phase in a
bi-phase structure and its ratio, and at the same time, evaluations
were made with respect to half life in flow amount, peeling
strength, tensile modulus, soldering heat resistance, PCT
resistance, reflow resistance, and releasing property of the
polyimide-laminated product after moisture absorption.
[0247] Measurement of the half life in flow amount was carried out
by a film in B stage, and other evaluations were made with respect
to a film in C stage. An adhesive film and an adhesive material
comprising an adhesive film and polyimide film were heated for
drying at 170.degree. C. for 1 hour, and subsequently at
150.degree. C. for 4 hours, to let the resin completely cured to
reach C stage.
[0248] Measurements and evaluations of half life in flow amount,
peeling strength, tensile modulus, reflow resistance, and releasing
property of the polyimide-laminated product after moisture
absorption were carried out as in the afore-mentioned manner.
[0249] Soldering heat resistance was tested by floating the samples
in a solder bath kept at 240.degree. C. or at 260.degree. C., and a
sample generating blisters in less than 40 seconds was evaluated as
"X", a sample generating blisters between 40 seconds and 120
seconds was evaluated as "O", and a sample which did not generate
any blisters after 120 seconds was evaluated as "{circumflex over
(.smallcircle.)}". Evaluations for PCT resistance were done by
observing adhesive materials with respect to peeling with intervals
of 100 hours, at a temperature of 121.degree. C., humidity of 100%,
and under an atmosphere of 2 atm. (pressure cocker test: PCT
treatment) A sample in which no peeling was observed was evaluated
as "O", and a sample in which peeling was observed was evaluated as
"X".
[0250] Results for the bi-phase structure and evaluations are shown
in Table 3.
3 TABLE 3 Condition for Samples Evaluations Evaluation .degree. C.
9 10 11 12 13 14 15 Bi-phase structure Area of sea phase X 0.34
0.35 0.27 0.35 0.33 0.35 0.28 Area of island phase Y 0.66 0.65 0.73
0.65 0.67 0.65 0.72 X/Y 0.52 0.54 0.37 0.54 0.49 0.54 0.39 Initial
value for flow 160 1200 1100 1200 1300 1200 1200 900 amount .mu.m
Half-life in flow amount h 60 35 35 35 30 40 40 30 Peeling strength
N/m 240 50 50 55 55 55 55 55 Tensile modulus MPa 240 30 30 30 30 44
20 44 Soldering heat resistance 240 .circleincircle.
.circleincircle. .circleincircle. .circleincircle. .circleincircle.
.circleincircle. .circleincircle. 260 .largecircle. .largecircle.
.largecircle. .largecircle. .largecircle. .largecircle.
.largecircle. PCT resistance .largecircle. .largecircle.
.largecircle. .largecircle. .largecircle. .largecircle.
.largecircle. Reflow resistance 245 .largecircle. .largecircle.
.largecircle. .largecircle. .largecircle. .largecircle.
.largecircle. Peeling of 260 .largecircle. .largecircle.
.largecircle. .largecircle. .largecircle. .largecircle.
.largecircle. polyimide-laminate after moisture absorpotion
Moisture absorption of 1.8 1.8 4.4 1.8 1.8 1.8 1.8 phenol resin
%
[0251] Further, the prepared adhesive films were left at room
temperature (25.degree. C.) for 2 months, and evaluated with
respect to peeling strength, elastic modulus, reflow resistance,
PCT resistance and peeling property of the polyimide-laminate after
moisture absorptioin according to the above-described methods.
Results are shown in Table 4.
4 TABLE 4 Condition for Samples Evaluation evaluation .degree. C. 9
10 11 12 13 14 15 Peeling strength N/m 240 35 35 35 35 35 35 35
Tensile modulus MPa 240 30 30 30 30 40 20 44 Soldering heat 240
.circleincircle. .circleincircle. .circleincircle. .circleincircle.
.circleincircle. .circleincircle. .circleincircle. resistance 260
.largecircle. X .largecircle. X X X X PCT resistance .largecircle.
.largecircle. .largecircle. .largecircle. .largecircle.
.largecircle. .largecircle. Reflow resistance 245 .largecircle.
.largecircle. .largecircle. .largecircle. .largecircle.
.largecircle. .largecircle. Peeling of 260 .largecircle.
.largecircle. .largecircle. .largecircle. .largecircle.
.largecircle. .largecircle. polyimide-laminate after moisture
absorpotion
[0252] The samples E9 to E15 were the adhesive films prepared by
using an acrylic copolymer containing 0.5 to 2.7% by weight of the
epoxy group-containing repeating units and having an average
molecular weight of 100,000 or more. Here, the samples 9, 10, 13
and 14 whose A/B ratio is 1.4 and the samples 12 and 15 whose A/B
ratio is 2.5 wherein A is the total weight of the epoxy resin and
the curing agent, and B is a weight of the acrylic copolymer,
satisfied the relationship represented by the formula
H.gtoreq.140.times..phi..sup.2, which is a relationship between a
half-life (H, in hour) and .phi. being a weight fraction of a
weight of the acrylic copolymer (B) based on a total amount of the
epoxy resin, the curing agent, and the acrylic copolymer (A+B), and
they showed excellent storing stabilities. Additionally, they
showed excellent soldering heat resistance after absorption and PCT
resistance. Moreover, even after being stored at room temperature
for 2 months, these adhesive films still showed excellent soldering
heat resistance at 240.degree. C., although there were decreases in
soldering heat resistance at 260.degree. C. solely. Additionally,
there were no big changes in other characteristic values showing
that they have significantly high storing property.
Example 4
[0253] (Sample 16)
[0254] To an adhesive composition comprising 42 parts by weight of
a cresol novolak type epoxy resin (manufactured by Tohto Kasei Co.,
Ltd., trade name: YDCN-703) as an epoxy resin, 12 parts by weight
of a phenol Novolak resin (manufactured by Dainippon Ink &
Chemicals, Inc., trade name; Plyofen LF2882) and 18 parts by weight
of a phenol resin (manufactured by Mitsui Kagaku Kogyo Co., trade
name: XLC-LL) as an epoxy resin curing agent, 44 parts by weight of
epoxy group-containing acrylic polymer (manufactured by Teikoku
Kagaku Sangyo Co. Ltd., trade name: HTR-860P-3) as a polymer, 0.025
parts by weight of 1-cyanoethyl-2-phenylimidazole (manufactured by
Shikoku Kasei Kogyo Co. Ltd., trade name: Curezole 2PZ-CN) as a
curing accelerator, 1 parts by weight of 3-mercaptopropyltrimethoxy
silane and 2 parts by weight of 3-ureidopropyltrimethoxy silane as
a coupling agent, and 5.3 parts by weight of fumed silica with an
average particle diameter of 0.016 .mu.m (manufactured by Nippon
Aerosil Co., Ltd., trade name: Aerosil R972) as filler, was added
methyl ethyl ketone as a solvent and dissolved by stirring to give
a resin varnish. This varnish was coated on a polyethylene
terephthalate film and heated for drying at 90.degree. C. for 20
minutes, and subsequently at 120.degree. C. for 5 minutes to
prepare an adhesive film E16 in B stage with a thickness of about
50 .mu.m. The A/B ratio was 1.64.
[0255] (Sample 17)
[0256] A resin varnish was prepared in the same manner as in Sample
16, except for changing a blending amount of the epoxy
group-containing acrylic rubber (HTR-860P-3) from 44 parts by
weight to 31 parts by weight. This varnish was coated on a
polyethylene terephthalate film and heated for drying at 90.degree.
C. for 5 minutes and subsequently, at 140.degree. C. for 5 minutes
to give an adhesive film E17 with a thickness of about 50 .mu.m.
The A/B ratio was 2.32.
[0257] (Comparative Sample 3)
[0258] To an adhesive composition comprising 30 parts by weight of
bisphenol A type epoxy resin (manufactured by Yuka Shell Epoxy Co.,
Ltd., trade name: Epicote 828) as an epoxy resin, 10 parts by
weight of a cresol Novolak type epoxy resin (manufactured by
Sumitomo Kagaku Kogyo Co. Ltd., trade name: ESCN 195), and 25 parts
by weight of a phenol Novolak resin (manufactured by Dainippon Ink
& Chemicals, Inc., trade name; Plyofen LF2882) as a curing
agent, and 150 parts by weight of an epoxy group-containing acrylic
rubber (manufactured by Teikoku Kagaku Sangyo CO., trade name:
HTR-860P-3) as a polymer, 0.5 parts by weight of
1-cyanoethyl-2-phenylimidazole (manufactured by Shikoku Kasei Kogyo
Co. Ltd., trade name: Curezole 2PZ-CN) as a curing accelerator, 2
parts by weight of each of 3-mercaptopropyltrimethoxy silane and
3-ureidopropyltrimethoxy silane as a coupling agent, was added
methyl ethyl ketone as a solvent and dissolved by stirring to give
a resin varnish. This varnish was coated on a polyethylene
terephthalate film and heated for drying at 90.degree. C. for 20
minutes, and subsequently at 140.degree. C. for 5 minutes to
prepare an adhesive film C3 with a thickness of about 50 .mu.m. The
A/B ratio was 0.43.
[0259] (Comparative Sample 4)
[0260] The resin varnish prepared in Sample 16 was coated on a
polyethylene terephthalate film and heated for drying at 90.degree.
C. for 20 minutes and subsequently at 160.degree. C. for 5 minutes
to prepare an adhesive film C4 with a thickness of about 50
.mu.m.
[0261] (Comparative Sample 5)
[0262] The resin varnish prepared in Sample 16 was coated on a
polyethylene terephthalate film and heated for drying at 90.degree.
C. for 20 minutes and subsequently at 100.degree. C. for 5 minutes
to prepare an adhesive film C5 with a thickness of about 50
.mu.m.
[0263] (Comparative Sample 6)
[0264] The resin varnish prepared in Sample 17 was coated on a
polyethylene terephthalate film and heated for drying at 90.degree.
C. for 20 minutes and subsequently at100.degree. C. for 5 minutes
to prepare an adhesive film C6 with a thickness of about 50
.mu.m.
[0265] (Comparative Sample 7)
[0266] The resin varnish prepared in Sample 17 was coated on a
polyethylene terephthalate film and heated for drying at 90.degree.
C. for 25 minutes to prepare an adhesive film C7 with a thickness
of about 50 .mu.m.
[0267] The thus prepared adhesive films were evaluated with respect
to physical properties at B stage, physical properties of cured
product, press-bonding property, workability, and reliability. The
results are shown in Tables 5 to 8. Measurements for physical
properties of the film and heat-cured products and evaluations for
press-bonding property, workability and reliability were carried
out as follows.
[0268] Melting viscosity of adhesive films at B stage was measured
as follows.
[0269] Eight adhesive films were laminated to prepare an adhesive
film with a thickness of about 400 .mu.m. This adhesive film was
die-cut in a circle with a diameter of 11.3 mm, pressed at a
predetermined temperature with a load of 2.5 kgf for 5 seconds.
From the thickness before and after loading, melt viscosity was
calculated by using the above-described formula (4). Tack load of
the adhesive film was measured by using a tacking testing device
manufactured by RHESCA Co., according to a method described in a
reference column of JIS z0237-1991, at 25.degree. C. Conditions for
measurement were, 5.1 .phi.mm for probe radius, 10 mm/sec for
peeling rate, 100 gf/cm.sup.2 for contact load, 1.0 second for
contact time. Residual volatile volume of the adhesive film was
calculated using the following formula (2) from the weights of the
adhesive film before and after curing at 170.degree. C./1 h.
The residual volatile component fraction (%)=
[(weight of the film before curing-weight of the film after
curing)/weight of the film before curing].times.100 (2)
[0270] Measurements for physical properties of a cured product of
the adhesive film was done using a sample obtained by curing an
adhesive film at B stage at 170.degree. C. for 1 hour. A storage
elastic modulus was measured using a dynamic viscoelasticity
measuring machine (manufactured by Reology, DVE-V4), under
conditions of sample size: length of 20 mm, width of 4 mm,
thickness of 60 .mu.m, temperature elevation rate of 5.degree.
C./min, tensile mode of 10 Hz, and automatic static loading. The
coefficient for thermal expansion was measured using a thermal
expansion measuring device (manufactured by Shinku Riko Co. Ltd.,
TM-7000), and an average coefficient for thermal expansion from -65
to 150.degree. C. were obtained.
[0271] Laminating property and press-bonding property were measured
as follows.
[0272] An adhesive film was laminated onto a back surface of a
wafer with 280 .mu.m thickness, at a temperature of 100.degree. C.,
line pressure of 1 MPa, and at a rate of 0.2 m/min. In this
testing, when the adhesive film was oozed from a terminal of the
wafer and reached to a front surface, it was evaluated as poor in
laminating property. Further, a dicing tape (manufactured by
Furukawa Denko Co. Ltd., trade name: UC-334EP) was laminated at
room temperature, and then, the wafer with an adhesive film was cut
ina size of 7.0.times.9.0 mm. The dicing tape was irradiated with
UV light (high pressure mercury light) at 500 mj/cm.sup.2 and the
dicing tape was peeled off to give a semiconductor chip with an
adhesive film. This was heat-pressed onto an outer connection part
with wiring under conditions as shown in Table 6, and when voids
are within 10% based on the total area of the adhesive film, or
when ooze from a chip terminal was within 50 .mu.m, press-bonding
property was evaluated as good.
[0273] Foaming at curing was evaluated by press-bonding an adhesive
film onto an outer connection part, curing it at 170.degree. C. in
an oven for 1 hour, and by observing a section of the film with a
microscope. When the fine voids were observed, it was judged as
foaming exists. For the outer connection part, TAB tape with
via-holes comprising a wiring layer with a wiring width of 30
.mu.m, the narrowest line intervals of 40 .mu.m, thickness of 20
.mu.m, and a polyimide type film with a thickness of 50 .mu.m was
used. Conditions for press-bonding was pressing time of 1 second to
3 seconds, temperature of 140 to 180.degree. C., pressure of 0.05
to 0.2 MPa. Peeling property from the dicing tape was evaluated by
measuring a peeling strength between the adhesive film and the
dicing tape after exposure at room temperature. When the peeling
strength was 40 gf/cm.sup.2 or more, it was judged as difficult for
peeling.
[0274] Reliability was evaluated by using a semiconductor package
prepared by encapsulating the above outer connection part equipped
with a semiconductor chip with a resin for encapsulation
(manufactured by Hitachi Kasei Kogyo Co., Ltd, trade name:
CEL-9120). As factors for evaluating reliability, reflow
resistance, PCT resistance, and heat cycle resistance were used.
Reflow resistance was judged as follows. After subjecting a
prepared semiconductor package to moisture absorption in an
atmosphere of at 85.degree. C. and 85% of humidity, a treatment was
repeated for 3 times under a condition such that the highest
reached temperature of the surface of the semiconductor package
became 265.degree. C. for 10 seconds, in an infrared reflow device.
Subsequently, using an ultrasonic scanning damage-searching device,
inside of the semiconductor package was examined, and it was
evaluated with respect to peeling at a bonding interface, cracks,
etc. PCT resistance was judged by treating the semiconductor
package after the reflow treatment in an atmosphere at 121.degree.
C. and 100% of humidity for 200 hours, and evaluating the peeling
at a bonding interface and existence of oozing of an adhesive film
resin through via-holes of the outer connection part. Heat cycle
resistance was judged by treating a semiconductor package in an
atmosphere from -55.degree. C. to 125.degree. C. for 15 minutes,
examining the inside of the semiconductor package with an
ultrasonic scanning damage-searching device, and by evaluating
peeling of a bonding interface, cracks, etc.
5 TABLE 5 Viscosity Residual ratio Tack volatile Melting Viscosity
(Pa .multidot. s) 100.degree. C./ load component Samples
100.degree. C. 140.degree. C. 160.degree. C. 180.degree. C.
180.degree. C. (g/f) (%) Sample 16 360000 11000 4200 1000 350 6 2.2
Sample 17 33000 2200 740 320 100 4 1.8 Comp. Sample 3 11000000
2800000 1400000 790000 14 10 0.5 Comp. Sample 4 990000 360000
200000 110000 9 4 1.4 Comp. Sample 5 350000 6600 2500 620 570 18
3.5 Comp. Sample 6 5900 470 230 67 88 22 8.6 Comp. Sample 7 4000
320 160 50 80 -- --
[0275]
6TABLE 6 Physical properties of the adhesive film-cured product
Elastic Modulus Average thermal (MPa) coefficient of expansion
samples 25.degree. C. 250.degree. C. -65 to 150.degree. C. Sample
16 800 12 125 Sample 17 1300 3 102 Comparative Sample 3 190 3 112
Comparative Sample 4 800 12 125 Comparative Sample 5 900 15 105
Comparative Sample 6 1000 2 110 Comparative Sample 7 800 3 108
[0276]
7TABLE 7 Workability and press-bonding property of adhesive film
Press-bonding property: Peeling pressure/time property (lower
columns: temperature) from Foaming Laminating 0.05 MPa/1s 0.2
MPa/1s 0.2 MPa/3s dicing at samples property 140.degree. C.
180.degree. C. 140.degree. C. 180.degree. C. 140.degree. C.
180.degree. C. tape curing Sample 16 Good X X X .largecircle.
.largecircle. .largecircle. Good None Sample 17 Good X
.largecircle. .largecircle. .largecircle. .largecircle.
.largecircle. Good None Comparative Good X X X X X X Good None
Sample 3 Comparative Void X X X X X X Good None Sample 4
Comparative Good X .largecircle. X .largecircle. -- -- Good Foam
Sample 5 Comparative Oozing X .largecircle. .largecircle.
.largecircle. -- -- Peeling Foam Sample 6 impossible Comparative
Oozing X .largecircle. .largecircle. .DELTA. -- -- -- Sample 7
.largecircle.: good press-bonding property, .DELTA.: excessive
oozing, X: poor press-bonding property (with voids)
[0277]
8TABLE 8 Reliability of semiconductor package prepared by adhesive
film Reflow resistance.sup.1) PcT Heat cycle 245.degree. C.
260.degree. C. resistance.sup.2) resistance.sup.1) Sample 16 Good
Good Good Good Sample 17 Good Good Good Good Comparative Good Good
Good Good Sample 3 Comparative Good Good Good Good Sample 4
Comparative Adhesive Adhesive -- -- Sample 5 film film Cohesive
Cohesive failure failure Comparative Adhesive Adhesive -- -- Sample
6 film film Cohesive Cohesive failure failure .sup.1)Good: No
peeling at interface, no cracks, etc. .sup.2)Good: No oozing of the
adhesive film resin from via-holes of outer connection part
[0278] From Tables 5 to 8, it was shown that the adhesive film of
the present invention has a melting viscosity at 100.degree. C. or
less of 5.times.10 to 1.times.10.sup.5 Pa.multidot.s, tack load of
2 to 20 gf, residual volatile component of 3% or less, and it can
connect a semiconductor chip and an outer connection part for
mounting the same with a pressure of as small as 0.01 to 0.5 MPa,
without leaving voids at a bonding interface, and without causing
an ooze at the terminals. Therefore, the present invention can
provide an adhesive film excellent in press-bonding property,
workability and reliability.
[0279] Industrial Applicability
[0280] The adhesive composition of the present invention whose A/B
ratio exceeds 1 and is 10 or less, wherein A is the total amount of
an epoxy resin and a curing agent and B is a weight of a polymer
compound, has an excellent moisture resistance, reflow resistance
and heat resistance, as mentioned above. Further, by using a phenol
resin with a low moisture absorbing property represented by the
general formula (I) as a curing agent, it is possible to improve
moisture absorption resistance. And by using an acrylic copolymer
as a polymer compound, an adhesive agent excellent in reflow
resistance can be obtained by forming cross-linking structures.
Further, since this acrylic copolymer is immiscible with the epoxy
resin, the resin is separated into two phases after curing, to give
an excellent adhesive which can effectively exhibit a reflow
resistance of the acrylic resin and the heat resistance of the
epoxy resin. Still further, by optionally adding inorganic fillers,
an adhesive can be obtained with a high elastic modulus at high
temperature, high peeling strength at a high temperature, with a
reflow crack preventing effect and excellent reflow resistance.
[0281] Further, by using the adhesive composition of the present
invention, an adhesive film can be prepared, which is excellent in
storing property in addition to the above-mentioned properties.
Especially, the adhesive of reactive rubber type with a short life
is improved, whereby the adhesive film can be kept at room
temperature for 2 months and more, which conventionally has to be
used within a short time after purchase. This effect of largely
moderating the limitation for productivity of the adhesive film is
significant.
[0282] In addition, the adhesive film prepared from the adhesive
composition of the present invention can connect a semiconductor
chip and an outer connection part with wiring for mounting the same
with a small press-bonding pressure, thereby it is excellent in
press-bonding property, workability and reliability,
[0283] Further, the wiring board for mounting a semiconductor and
the semiconductor device using the adhesive film of the present
invention has heat resistance and moisture resistance required for
mounting a semiconductor chip on a board for mounting a
semiconductor with largely different thermal coefficients of
expansion.
* * * * *