loadpatents
name:-0.091242074966431
name:-0.01255202293396
name:-0.0036940574645996
HATAKEYAMA; Keiichi Patent Filings

HATAKEYAMA; Keiichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for HATAKEYAMA; Keiichi.The latest application filed is for "method for determining presence or absence of risk of developing cancer".

Company Profile
3.12.29
  • HATAKEYAMA; Keiichi - Shizuoka JP
  • Hatakeyama; Keiichi - Sunto-gun JP
  • Hatakeyama; Keiichi - Tsukuba-shi JP
  • Hatakeyama; Keiichi - Tsukuba JP
  • HATAKEYAMA; Keiichi - Tokyo JP
  • Hatakeyama; Keiichi - Ibaraki JP
  • Hatakeyama; Keiichi - Nagoya JP
  • Hatakeyama, Keiichi - Nagoya-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method For Determining Presence Or Absence Of Risk Of Developing Cancer
App 20200255901 - YAMAGUCHI; Ken ;   et al.
2020-08-13
Biomarker for diagnosis of extrahepatic bile duct carcinoma, intrahepatic bile duct carcinoma, or gallbladder carcinoma
Grant 10,641,773 - Mochizuki , et al.
2020-05-05
System and method for retrieval treatment of proteins in formalin-fixed paraffin-embedded tissue section
Grant 10,018,539 - Aoki , et al. July 10, 2
2018-07-10
Biomarker For Diagnosis Of Extrahepatic Bile Duct Carcinoma, Intrahepatic Bile Duct Carcinoma, Or Gallbladder Carcinoma
App 20180080935 - MOCHIZUKI; Tohru ;   et al.
2018-03-22
System And Method For Retrieval Treatment Of Proteins In Formalin-fixed Paraffin-embedded Tissue Section
App 20160153872 - AOKI; Yutaka ;   et al.
2016-06-02
Method For Producing Semiconductor Device
App 20150179494 - Kawamori; Takashi ;   et al.
2015-06-25
Adhesive Composition, Process For Producing The Same, Adhesive Film Using The Same, Substrate For Mounting Semiconductor And Semiconductor Device
App 20140332984 - INADA; Teiichi ;   et al.
2014-11-13
System And Method For Retrieval Treatment Of Proteins In Formalin-fixed Paraffin-embedded Tissue Section
App 20140220624 - Aoki; Yutaka ;   et al.
2014-08-07
Adhesive film for semiconductor, composite sheet, and method for producing semiconductor chip using them
Grant 8,404,564 - Nakamura , et al. March 26, 2
2013-03-26
Method For Producing Semiconductor Chip With Adhesive Film, Adhesive Film For Semiconductor Used In The Method, And Method For Producing Semiconductor Device
App 20120295400 - Hatakeyama; Keiichi ;   et al.
2012-11-22
Method For Manufacturing Semiconductor Chip, Adhesive Film For Semiconductor, And Composite Sheet Using The Film
App 20120244347 - Nakamura; Yuuki ;   et al.
2012-09-27
Method for manufacturing semiconductor chip, adhesive film for semiconductor, and composite sheet using the film
Grant 8,232,185 - Nakamura , et al. July 31, 2
2012-07-31
Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device
Grant 8,198,176 - Hatakeyama , et al. June 12, 2
2012-06-12
Adhesive Composition, Process For Producing The Same, Adhesive Film Using The Same, Substrate For Mounting Semiconductor And Semiconductor Device
App 20120080808 - Inada; Teiichi ;   et al.
2012-04-05
Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device
Grant 8,119,737 - Inada , et al. February 21, 2
2012-02-21
Method For Producing Semiconductor Chip With Adhesive Film, Adhesive Film For Semiconductor Used In The Method, And Method For Producing Semiconductor Device
App 20110318879 - HATAKEYAMA; Keiichi ;   et al.
2011-12-29
Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device
Grant 8,071,465 - Hatakeyama , et al. December 6, 2
2011-12-06
Production method of semiconductor device and bonding film
Grant 8,034,659 - Nagai , et al. October 11, 2
2011-10-11
Adhesive Film And Process For Preparing The Same As Well As Adhesive Sheet And Semiconductor Device
App 20110193244 - MASUKO; Takashi ;   et al.
2011-08-11
Adhesive Composition, Process For Producing The Same, Adhesive Film Using The Same, Substrate For Mounting Semiconductor And Semiconductor Device
App 20110187006 - INADA; Teiichi ;   et al.
2011-08-04
Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer
Grant 7,947,779 - Inada , et al. May 24, 2
2011-05-24
Dendrimer-coated Magnetic Fine Particles, And Method For Preparing Same And Utility Thereof
App 20110060136 - MATSUNAGA; Tadashi ;   et al.
2011-03-10
Method For Preparing Dendrimer-modified, Magnetic Fine Particles
App 20110057145 - Matsunaga; Tadashi ;   et al.
2011-03-10
Adhesive Composition, Process For Producing The Same, Adhesive Film Using The Same, Substrate For Mounting Semiconductor And Semiconductor Device
App 20110021005 - INADA; Teiichi ;   et al.
2011-01-27
Method For Producing Semiconductor Chip With Adhesive Film, Adhesive Film For Semiconductor Used In The Method, And Method For Producing Semiconductor Device
App 20100311227 - Hatakeyama; Keiichi ;   et al.
2010-12-09
Method For Producing Semiconductor Chip With Adhesive Film, Adhesive Film For Semiconductor Used In The Method, And Method For Producing Semiconductor Device
App 20100267199 - Hatakeyama; Keiichi ;   et al.
2010-10-21
Method For Manufacturing Semiconductor Chip, Adhesive Film For Semiconductor, And Composite Sheet Using The Film
App 20100120229 - Nakamura; Yuuki ;   et al.
2010-05-13
Adhesive Film For Semiconductor, Composite Sheet, And Method For Producing Semiconductor Chip Using Them
App 20100112783 - Nakamura; Yuuki ;   et al.
2010-05-06
Production Method Of Semiconductor Device And Bonding Film
App 20100003771 - Nagai; Akira ;   et al.
2010-01-07
Adhesive Composition, Process For Producing The Same, Adhesive Film Using The Same, Substrate For Mounting Semiconductor And Semiconductor Device
App 20090186955 - INADA; Teiichi ;   et al.
2009-07-23
Adhesive film and process for preparing the same as well as adhesive sheet and semiconductor device
App 20070098995 - Masuko; Takashi ;   et al.
2007-05-03
Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device
App 20070036971 - Inada; Teiichi ;   et al.
2007-02-15
Dicing/die bonding sheet
App 20070026572 - Hatakeyama; Keiichi ;   et al.
2007-02-01
Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device
Grant 7,070,670 - Tomiyama , et al. July 4, 2
2006-07-04
Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device
App 20060106166 - Inada; Teiichi ;   et al.
2006-05-18
Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device
App 20060100315 - Inada; Teiichi ;   et al.
2006-05-11
Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device
App 20030159773 - Tomiyama, Takeo ;   et al.
2003-08-28
Game system and computer-readable storage medium carrying program therefor
Grant 6,602,132 - Kozawa , et al. August 5, 2
2003-08-05
Adhesive composition , process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor device
App 20030069331 - Teiichi, Inada ;   et al.
2003-04-10
Game system and computer-readable storage medium carrying program therefor
App 20010027127 - Kozawa, Akira ;   et al.
2001-10-04

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