Patent | Date |
---|
Method For Determining Presence Or Absence Of Risk Of Developing Cancer App 20200255901 - YAMAGUCHI; Ken ;   et al. | 2020-08-13 |
Biomarker for diagnosis of extrahepatic bile duct carcinoma, intrahepatic bile duct carcinoma, or gallbladder carcinoma Grant 10,641,773 - Mochizuki , et al. | 2020-05-05 |
System and method for retrieval treatment of proteins in formalin-fixed paraffin-embedded tissue section Grant 10,018,539 - Aoki , et al. July 10, 2 | 2018-07-10 |
Biomarker For Diagnosis Of Extrahepatic Bile Duct Carcinoma, Intrahepatic Bile Duct Carcinoma, Or Gallbladder Carcinoma App 20180080935 - MOCHIZUKI; Tohru ;   et al. | 2018-03-22 |
System And Method For Retrieval Treatment Of Proteins In Formalin-fixed Paraffin-embedded Tissue Section App 20160153872 - AOKI; Yutaka ;   et al. | 2016-06-02 |
Method For Producing Semiconductor Device App 20150179494 - Kawamori; Takashi ;   et al. | 2015-06-25 |
Adhesive Composition, Process For Producing The Same, Adhesive Film Using The Same, Substrate For Mounting Semiconductor And Semiconductor Device App 20140332984 - INADA; Teiichi ;   et al. | 2014-11-13 |
System And Method For Retrieval Treatment Of Proteins In Formalin-fixed Paraffin-embedded Tissue Section App 20140220624 - Aoki; Yutaka ;   et al. | 2014-08-07 |
Adhesive film for semiconductor, composite sheet, and method for producing semiconductor chip using them Grant 8,404,564 - Nakamura , et al. March 26, 2 | 2013-03-26 |
Method For Producing Semiconductor Chip With Adhesive Film, Adhesive Film For Semiconductor Used In The Method, And Method For Producing Semiconductor Device App 20120295400 - Hatakeyama; Keiichi ;   et al. | 2012-11-22 |
Method For Manufacturing Semiconductor Chip, Adhesive Film For Semiconductor, And Composite Sheet Using The Film App 20120244347 - Nakamura; Yuuki ;   et al. | 2012-09-27 |
Method for manufacturing semiconductor chip, adhesive film for semiconductor, and composite sheet using the film Grant 8,232,185 - Nakamura , et al. July 31, 2 | 2012-07-31 |
Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device Grant 8,198,176 - Hatakeyama , et al. June 12, 2 | 2012-06-12 |
Adhesive Composition, Process For Producing The Same, Adhesive Film Using The Same, Substrate For Mounting Semiconductor And Semiconductor Device App 20120080808 - Inada; Teiichi ;   et al. | 2012-04-05 |
Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device Grant 8,119,737 - Inada , et al. February 21, 2 | 2012-02-21 |
Method For Producing Semiconductor Chip With Adhesive Film, Adhesive Film For Semiconductor Used In The Method, And Method For Producing Semiconductor Device App 20110318879 - HATAKEYAMA; Keiichi ;   et al. | 2011-12-29 |
Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device Grant 8,071,465 - Hatakeyama , et al. December 6, 2 | 2011-12-06 |
Production method of semiconductor device and bonding film Grant 8,034,659 - Nagai , et al. October 11, 2 | 2011-10-11 |
Adhesive Film And Process For Preparing The Same As Well As Adhesive Sheet And Semiconductor Device App 20110193244 - MASUKO; Takashi ;   et al. | 2011-08-11 |
Adhesive Composition, Process For Producing The Same, Adhesive Film Using The Same, Substrate For Mounting Semiconductor And Semiconductor Device App 20110187006 - INADA; Teiichi ;   et al. | 2011-08-04 |
Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer Grant 7,947,779 - Inada , et al. May 24, 2 | 2011-05-24 |
Dendrimer-coated Magnetic Fine Particles, And Method For Preparing Same And Utility Thereof App 20110060136 - MATSUNAGA; Tadashi ;   et al. | 2011-03-10 |
Method For Preparing Dendrimer-modified, Magnetic Fine Particles App 20110057145 - Matsunaga; Tadashi ;   et al. | 2011-03-10 |
Adhesive Composition, Process For Producing The Same, Adhesive Film Using The Same, Substrate For Mounting Semiconductor And Semiconductor Device App 20110021005 - INADA; Teiichi ;   et al. | 2011-01-27 |
Method For Producing Semiconductor Chip With Adhesive Film, Adhesive Film For Semiconductor Used In The Method, And Method For Producing Semiconductor Device App 20100311227 - Hatakeyama; Keiichi ;   et al. | 2010-12-09 |
Method For Producing Semiconductor Chip With Adhesive Film, Adhesive Film For Semiconductor Used In The Method, And Method For Producing Semiconductor Device App 20100267199 - Hatakeyama; Keiichi ;   et al. | 2010-10-21 |
Method For Manufacturing Semiconductor Chip, Adhesive Film For Semiconductor, And Composite Sheet Using The Film App 20100120229 - Nakamura; Yuuki ;   et al. | 2010-05-13 |
Adhesive Film For Semiconductor, Composite Sheet, And Method For Producing Semiconductor Chip Using Them App 20100112783 - Nakamura; Yuuki ;   et al. | 2010-05-06 |
Production Method Of Semiconductor Device And Bonding Film App 20100003771 - Nagai; Akira ;   et al. | 2010-01-07 |
Adhesive Composition, Process For Producing The Same, Adhesive Film Using The Same, Substrate For Mounting Semiconductor And Semiconductor Device App 20090186955 - INADA; Teiichi ;   et al. | 2009-07-23 |
Adhesive film and process for preparing the same as well as adhesive sheet and semiconductor device App 20070098995 - Masuko; Takashi ;   et al. | 2007-05-03 |
Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device App 20070036971 - Inada; Teiichi ;   et al. | 2007-02-15 |
Dicing/die bonding sheet App 20070026572 - Hatakeyama; Keiichi ;   et al. | 2007-02-01 |
Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device Grant 7,070,670 - Tomiyama , et al. July 4, 2 | 2006-07-04 |
Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device App 20060106166 - Inada; Teiichi ;   et al. | 2006-05-18 |
Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device App 20060100315 - Inada; Teiichi ;   et al. | 2006-05-11 |
Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device App 20030159773 - Tomiyama, Takeo ;   et al. | 2003-08-28 |
Game system and computer-readable storage medium carrying program therefor Grant 6,602,132 - Kozawa , et al. August 5, 2 | 2003-08-05 |
Adhesive composition , process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor device App 20030069331 - Teiichi, Inada ;   et al. | 2003-04-10 |
Game system and computer-readable storage medium carrying program therefor App 20010027127 - Kozawa, Akira ;   et al. | 2001-10-04 |