Uruno; Michio

Patent Applications and Registrations

Patent applications and USPTO patent grants for Uruno; Michio.The latest application filed is for "adhesive film".

Company Profile

0.15.26

Uruno; Michio - Chikusei N/A JP
Uruno; Michio - Chikusei-shi JP
Uruno; Michio - Ichihara N/A JP
URUNO; Michio - Ichihara-shi JP
Uruno; Michio - Chiba-shi JP
Uruno; Michio - Chiba JP
Uruno; Michio - Ichihara-chi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Adhesive film Grant 9,327,418 - Horiuchi , et al. May 3, 2	2016-05-03
Adhesive Film App 20150239220 - HORIUCHI; KOUHEI ; et al.	2015-08-27
Adhesive film Grant 9,034,449 - Horiuchi , et al. May 19, 2	2015-05-19
Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device Grant 8,617,930 - Inada , et al. December 31, 2	2013-12-31
Adhesive Sheet And Method For Manufacturing The Same, Semiconductor Device Manufacturing Method And Semiconductor Device App 20130302570 - TANAKA; Maiko ; et al.	2013-11-14
Adhesive Sheet And Method For Manufacturing The Same, Semiconductor Device Manufacturing Method And Semiconductor Device App 20130295314 - TANAKA; Maiko ; et al.	2013-11-07
Adhesive Sheet, Dicing Tape Integrated Type Adhesive Sheet, And Method Of Producing Semiconductor Device App 20130224932 - INADA; Teiichi ; et al.	2013-08-29
Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device Grant 8,470,115 - Tanaka , et al. June 25, 2	2013-06-25
Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device Grant 8,465,615 - Tanaka , et al. June 18, 2	2013-06-18
Adhesive Film And Method For Producing The Same App 20130071596 - HORIUCHI; Kouhei ; et al.	2013-03-21
Conductive Material App 20130048921 - Tsuruoka; Yasuo ; et al.	2013-02-28
Adhesive Sheet, Dicing Tape Integrated Type Adhesive Sheet, And Method Of Producing Semiconductor Device App 20130045585 - INADA; Teiichi ; et al.	2013-02-21
Adhesive Film App 20130040093 - HORIUCHI; Kouhei ; et al.	2013-02-14
Adhesive Sheet And Method For Manufacturing The Same, Semiconductor Device Manufacturing Method And Semiconductor Device App 20120135176 - TANAKA; Maiko ; et al.	2012-05-31
Adhesive Sheet And Method For Manufacturing The Same, Semiconductor Device Manufacturing Method And Semiconductor Device App 20120073743 - TANAKA; Maiko ; et al.	2012-03-29
Adhesive Sheet And Method For Manufacturing The Same, Semiconductor Device Manufacturing Method And Semiconductor Device App 20120068312 - TANAKA; Maikoi ; et al.	2012-03-22
Adhesive Sheet, Semiconductor Device, And Process For Producing Semiconductor Device App 20110287250 - Inada; Teiichi ; et al.	2011-11-24
Adhesive sheet, semiconductor device, and process for producing semiconductor device Grant 8,017,444 - Inada , et al. September 13, 2	2011-09-13
Dicing tape laminated with adhesive sheet of polymer, epoxy resin and filler Grant 7,968,195 - Inada , et al. June 28, 2	2011-06-28
Dicing tape laminated with adhesive sheet of polymer, thermosetting resin and filler Grant 7,968,194 - Inada , et al. June 28, 2	2011-06-28
Bonding semiconductor wafer stuck on dicing tape laminated adhesive sheet onto mounting support Grant 7,875,500 - Inada , et al. January 25, 2	2011-01-25
Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device App 20090186216 - Inada; Teiichi ; et al.	2009-07-23
Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device App 20080305583 - Inada; Teichi ; et al.	2008-12-11
Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device App 20080286594 - Inada; Teiichi ; et al.	2008-11-20
Adhesive Sheet and Method for Manufacturing the Same, Semiconductor Device Manufacturing Method and Semiconductor Device App 20080261039 - Tanaka; Maiko ; et al.	2008-10-23
Adhesive Sheet, Dicing Tape Integrated Type Adhesive Sheet, And Method Of Producing Semiconductor Device App 20080171187 - INADA; Teiichi ; et al.	2008-07-17
Adhesive Sheet, Semiconductor Device, and Process for Producing Semiconductor Device App 20070241434 - Inada; Teiichi ; et al.	2007-10-18
Dicing/die bonding sheet App 20070026572 - Hatakeyama; Keiichi ; et al.	2007-02-01
Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device Grant 7,070,670 - Tomiyama , et al. July 4, 2	2006-07-04
Adhesive sheet, dicing tape intergrated type adhesive sheet, and semiconductor device producing method App 20060128065 - Inada; Teiichi ; et al.	2006-06-15
Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device App 20030159773 - Tomiyama, Takeo ; et al.	2003-08-28

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