Yasuda; Masaaki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yasuda; Masaaki.The latest application filed is for "concentration measurement device".

Company Profile

1.24.16

Yasuda; Masaaki - Nagaokakyo JP
YASUDA; Masaaki - Nagaokakyo-shi JP
Yasuda; Masaaki - Ibaraki N/A JP
Yasuda; Masaaki - Tsukuba JP
Yasuda; Masaaki - Tochigi JP
Yasuda; Masaaki - Tsukuba-shi JP
Yasuda; Masaaki - Kanagawa JP
Yasuda, Masaaki - Ibaraki-ken JP
Yasuda; Masaaki - Iwakuni JP
Yasuda; Masaaki - Yamaguchi JP
Yasuda; Masaaki - Yokohama JP
Yasuda; Masaaki - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Gas concentration measurement device Grant 10,254,222 - Yasuda , et al.	2019-04-09
Concentration measurement device Grant 9,939,375 - Yasuda , et al. April 10, 2	2018-04-10
Gas concentration measurement device Grant 9,915,604 - Yasuda March 13, 2	2018-03-13
Gas Concentration Measurement Device App 20170102328 - YASUDA; Masaaki ; et al.	2017-04-13
Concentration Measurement Device App 20170102325 - YASUDA; Masaaki ; et al.	2017-04-13
Gas Concentration Measurement Device App 20170102324 - YASUDA; Masaaki	2017-04-13
Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part Grant 8,673,539 - Kawamori , et al. March 18, 2	2014-03-18
Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part Grant 8,445,177 - Kawamori , et al. May 21, 2	2013-05-21
Photosensitive Adhesive Composition, And Obtained Using The Same, Adhesive Film, Adhesive Sheet, Semiconductor Wafer With Adhesive Layer, Semiconductor Device And Electronic Part App 20130062787 - Kawamori; Takashi ; et al.	2013-03-14
Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part Grant 8,323,873 - Kawamori , et al. December 4, 2	2012-12-04
Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part Grant 8,293,453 - Kawamori , et al. October 23, 2	2012-10-23
Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part Grant 8,278,024 - Kawamori , et al. October 2, 2	2012-10-02
Production method of semiconductor device and bonding film Grant 8,034,659 - Nagai , et al. October 11, 2	2011-10-11
Seat provided with electric or electronic equipment Grant 7,942,477 - Toba , et al. May 17, 2	2011-05-17
Photosensitive Adhesive Composition, And Obtained Using The Same, Adhesive Film, Adhesive Sheet, Semiconductor Wafer With Adhesive Layer, Semiconductor Device And Electronic Part App 20110079927 - Kawamori; Takashi ; et al.	2011-04-07
Photosensitive Adhesive Composition, And Obtained Using The Same, Adhesive Film, Adhesive Sheet, Semiconductor Wafer With Adhesive Layer, Semiconductor Device And Electronic Part App 20110065260 - KAWAMORI; Takashi ; et al.	2011-03-17
Photosensitive Adhesive Composition, And Obtained Using The Same, Adhesive Film, Adhesive Sheet, Semiconductor Wafer With Adhesive Layer, Semiconductor Device And Electronic Part App 20100314783 - Kawamori; Takashi ; et al.	2010-12-16
Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part Grant 7,851,131 - Kawamori , et al. December 14, 2	2010-12-14
Semiconductor device and multilayer substrate therefor Grant 7,692,296 - Tanaka , et al. April 6, 2	2010-04-06
Production Method Of Semiconductor Device And Bonding Film App 20100003771 - Nagai; Akira ; et al.	2010-01-07
Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same Grant 7,560,307 - Yano , et al. July 14, 2	2009-07-14
Photosensitive Adhesive Composition, And Obtained Using The Same, Adhesive Film, Adhesive Sheet, Semiconductor Wafer With Adhesive Layer, Semiconductor Device And Electronic Part App 20080176167 - Kawamori; Takashi ; et al.	2008-07-24
Method for evaluating hair damage using an oxidized protein in hair as an indicator App 20070110670 - Fujita; Hiroshi ; et al.	2007-05-17
Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same App 20060180908 - Yano; Yasuhiro ; et al.	2006-08-17
Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device Grant 7,070,670 - Tomiyama , et al. July 4, 2	2006-07-04
Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof Grant 7,061,081 - Yano , et al. June 13, 2	2006-06-13
Semiconductor device and multilayer substrate therefor App 20050230826 - Tanaka, Naotaka ; et al.	2005-10-20
Resin-sealed semiconductor device, and die bonding material and sealing material for use therein Grant 6,774,501 - Kurafuchi , et al. August 10, 2	2004-08-10
Resin-sealed semiconductor device, and die bonding material and sealing material for use therein App 20040000728 - Kurafuchi, Kazuhiko ; et al.	2004-01-01
Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device App 20030159773 - Tomiyama, Takeo ; et al.	2003-08-28
Semiconductor device and method for manufacturing the same Grant 6,611,064 - Kousaka , et al. August 26, 2	2003-08-26
Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof App 20030082925 - Yano, Yasuhiro ; et al.	2003-05-01
Linear triene compound and copolymer Grant 6,303,727 - Maeda , et al. October 16, 2	2001-10-16
Method of production of semiconductor device Grant 6,223,429 - Kaneda , et al. May 1, 2	2001-05-01
Chain polyene group-containing norbornene compound and unsaturated ethylene copolymer using the same Grant 6,040,407 - Ishida , et al. March 21, 2	2000-03-21
Emulsion for hair treatment Grant 5,817,155 - Yasuda , et al. October 6, 1	1998-10-06
Joystick Grant D297,953 - Yasuda , et al. October 4, 1	1988-10-04

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