Inada; Teiichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Inada; Teiichi.The latest application filed is for "resin member and sheet using same, and heat storage material and heat control sheet using same".

Company Profile

4.27.38

Inada; Teiichi - Tokyo JP
INADA; Teiichi - Chiyoda-ku Tokyo
INADA; Teiichi - Tsukuba-shi JP
Inada; Teiichi - Tsukuba N/A JP
- Tsukuba JP
Inada; Teiichi - Ibaraki JP
Inada; Teiichi - Shimodate JP
Inada, Teiichi - Shimodate-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Resin member and sheet using same, method for producing resin member, and heat storage material and heat control sheet using same Grant 11,441,022 - Nagai , et al. September 13, 2	2022-09-13
Resin Member And Sheet Using Same, And Heat Storage Material And Heat Control Sheet Using Same App 20200048521 - NAGAI; Akira ; et al.	2020-02-13
Resin Member And Sheet Using Same, Method For Producing Resin Member, And Heat Storage Material And Heat Control Sheet Using Sam App 20200048442 - NAGAI; Akira ; et al.	2020-02-13
Adhesive Composition, Process For Producing The Same, Adhesive Film Using The Same, Substrate For Mounting Semiconductor And Semiconductor Device App 20140332984 - INADA; Teiichi ; et al.	2014-11-13
Thermally Conductive Sheet, Process For Producing The Same, And Radiator Utilizing Thermally Conductive Sheet App 20140293626 - Yoshikawa; Tooru ; et al.	2014-10-02
Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same Grant 8,840,811 - Yasuda , et al. September 23, 2	2014-09-23
Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device Grant 8,617,930 - Inada , et al. December 31, 2	2013-12-31
Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device Grant 08617930 -	2013-12-31
Adhesive Sheet And Method For Manufacturing The Same, Semiconductor Device Manufacturing Method And Semiconductor Device App 20130302570 - TANAKA; Maiko ; et al.	2013-11-14
Adhesive Sheet And Method For Manufacturing The Same, Semiconductor Device Manufacturing Method And Semiconductor Device App 20130295314 - TANAKA; Maiko ; et al.	2013-11-07
Adhesive Sheet, Dicing Tape Integrated Type Adhesive Sheet, And Method Of Producing Semiconductor Device App 20130224932 - INADA; Teiichi ; et al.	2013-08-29
Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device Grant 8,470,115 - Tanaka , et al. June 25, 2	2013-06-25
Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device Grant 8,465,615 - Tanaka , et al. June 18, 2	2013-06-18
Adhesive Sheet, Dicing Tape Integrated Type Adhesive Sheet, And Method Of Producing Semiconductor Device App 20130045585 - INADA; Teiichi ; et al.	2013-02-21
Adhesive Sheet And Method For Manufacturing The Same, Semiconductor Device Manufacturing Method And Semiconductor Device App 20120135176 - TANAKA; Maiko ; et al.	2012-05-31
Adhesive Composition, Process For Producing The Same, Adhesive Film Using The Same, Substrate For Mounting Semiconductor And Semiconductor Device App 20120080808 - Inada; Teiichi ; et al.	2012-04-05
Adhesive Sheet And Method For Manufacturing The Same, Semiconductor Device Manufacturing Method And Semiconductor Device App 20120073743 - TANAKA; Maiko ; et al.	2012-03-29
Adhesive Sheet And Method For Manufacturing The Same, Semiconductor Device Manufacturing Method And Semiconductor Device App 20120068312 - TANAKA; Maikoi ; et al.	2012-03-22
Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device Grant 8,119,737 - Inada , et al. February 21, 2	2012-02-21
Adhesive Sheet, Semiconductor Device, And Process For Producing Semiconductor Device App 20110287250 - Inada; Teiichi ; et al.	2011-11-24
Adhesive Bonding Sheet, Semiconductor Device Using Same, And Method For Manufacturing Such Semiconductor Device App 20110281399 - OOKUBO; Keisuke ; et al.	2011-11-17
Semiconductor Chip Used For Evaluation, Evaluation System, And Repairing Method Thereof App 20110237001 - HASEBE; Takehiko ; et al.	2011-09-29
Adhesive sheet, semiconductor device, and process for producing semiconductor device Grant 8,017,444 - Inada , et al. September 13, 2	2011-09-13
Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device Grant 8,012,580 - Ookubo , et al. September 6, 2	2011-09-06
Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor device Grant 8,003,207 - Ookubo , et al. August 23, 2	2011-08-23
Adhesive Composition, Process For Producing The Same, Adhesive Film Using The Same, Substrate For Mounting Semiconductor And Semiconductor Device App 20110187006 - INADA; Teiichi ; et al.	2011-08-04
Dicing tape laminated with adhesive sheet of polymer, epoxy resin and filler Grant 7,968,195 - Inada , et al. June 28, 2	2011-06-28
Dicing tape laminated with adhesive sheet of polymer, thermosetting resin and filler Grant 7,968,194 - Inada , et al. June 28, 2	2011-06-28
Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer Grant 7,947,779 - Inada , et al. May 24, 2	2011-05-24
Adhesive Composition, Process For Producing The Same, Adhesive Film Using The Same, Substrate For Mounting Semiconductor And Semiconductor Device App 20110021005 - INADA; Teiichi ; et al.	2011-01-27
Bonding semiconductor wafer stuck on dicing tape laminated adhesive sheet onto mounting support Grant 7,875,500 - Inada , et al. January 25, 2	2011-01-25
Electrically Conductive Bonding Material, Method Of Bonding With The Same, And Semiconductor Device Bonded With The Same App 20100270515 - YASUDA; Yuusuke ; et al.	2010-10-28
Resin molding material Grant 7,772,317 - Kaya , et al. August 10, 2	2010-08-10
Thermally Conductive Sheet, Process For Producing The Same, And Radiator Utilizing Thermally Conductive Sheet App 20100073882 - Yoshikawa; Tooru ; et al.	2010-03-25
Adhesive Bonding Sheet, Semiconductor Device Using The Same, And Method For Manufacturing Such Semiconductor Device App 20100003513 - OOKUBO; Keisuke ; et al.	2010-01-07
Adhesive Bonding Sheet, Semiconductor Device Using Same, And Method For Manufacturing Such Semiconductor Device App 20100003512 - Ookubo; Keisuke ; et al.	2010-01-07
Resin Molding Material App 20090227723 - Kaya; Michiko ; et al.	2009-09-10
Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device Grant 7,578,891 - Ookubo , et al. August 25, 2	2009-08-25
Adhesive Composition, Process For Producing The Same, Adhesive Film Using The Same, Substrate For Mounting Semiconductor And Semiconductor Device App 20090186955 - INADA; Teiichi ; et al.	2009-07-23
Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device App 20090186216 - Inada; Teiichi ; et al.	2009-07-23
Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device App 20080286594 - Inada; Teiichi ; et al.	2008-11-20
Adhesive Sheet and Method for Manufacturing the Same, Semiconductor Device Manufacturing Method and Semiconductor Device App 20080261039 - Tanaka; Maiko ; et al.	2008-10-23
Adhesive Sheet, Dicing Tape Integrated Type Adhesive Sheet, And Method Of Producing Semiconductor Device App 20080171187 - INADA; Teiichi ; et al.	2008-07-17
Adhesive Sheet, Semiconductor Device, and Process for Producing Semiconductor Device App 20070241434 - Inada; Teiichi ; et al.	2007-10-18
Adhesive Bonding Sheet, Semiconductor Device using the Same, and Method for Manufacturing such Semiconductor Device App 20070241436 - Ookubo; Keisuke ; et al.	2007-10-18
Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device App 20070036971 - Inada; Teiichi ; et al.	2007-02-15
Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device Grant 7,070,670 - Tomiyama , et al. July 4, 2	2006-07-04
Adhesive sheet, dicing tape intergrated type adhesive sheet, and semiconductor device producing method App 20060128065 - Inada; Teiichi ; et al.	2006-06-15
Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device App 20060106166 - Inada; Teiichi ; et al.	2006-05-18
Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device App 20060100315 - Inada; Teiichi ; et al.	2006-05-11
Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same Grant 6,838,170 - Tanaka , et al. January 4, 2	2005-01-04
Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same Grant 6,673,441 - Tanaka , et al. January 6, 2	2004-01-06
Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film Grant 6,621,170 - Yamamoto , et al. September 16, 2	2003-09-16
Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device App 20030159773 - Tomiyama, Takeo ; et al.	2003-08-28
Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same App 20030145949 - Tanaka, Yuko ; et al.	2003-08-07
Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film App 20010022404 - Yamamoto, Kazunori ; et al.	2001-09-20
Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film Grant 6,265,782 - Yamamoto , et al. July 24, 2	2001-07-24
Electronic component parts device Grant 6,184,577 - Takemura , et al. February 6, 2	2001-02-06
Multilayer wiring board for mounting semiconductor device and method of producing the same Grant 6,090,468 - Shimada , et al. July 18, 2	2000-07-18
Process for producing multilayer printed circuit board Grant 5,690,837 - Nakaso , et al. November 25, 1	1997-11-25

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