Temporary protective film for manufacturing semiconductor devices
Tomori March 22, 2
U.S. patent number D946,540 [Application Number 35/512,768] was granted by the patent office on 2022-03-22 for temporary protective film for manufacturing semiconductor devices. This patent grant is currently assigned to SHOWA DENKO MATERIALS CO., LTD.. The grantee listed for this patent is Showa Denko Materials Co., Ltd.. Invention is credited to Naoki Tomori.
| United States Patent | D946,540 |
| Tomori | March 22, 2022 |
Temporary protective film for manufacturing semiconductor devices
Claims
CLAIM The ornamental design for a temporary protective film for manufacturing semiconductor devices, as shown and described.
| Inventors: | Tomori; Naoki (Tokyo, JP) | ||||||||||
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| Applicant: |
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| Assignee: | SHOWA DENKO MATERIALS CO., LTD.
(Tokyo, JP) |
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| Appl. No.: | 35/512,768 | ||||||||||
| Filed: | April 22, 2021 |
International Registration
| Int'l Reg. No. | Int'l Reg. Date | Int'l Reg. Publication Date |
Hague Int'l Filing Date |
|---|---|---|---|
| DM/214171 | Apr 22, 2021 | Oct 22, 2021 | Apr 22, 2021 |
Foreign Application Priority Data
| Nov 2, 2020 [JP] | 2020-023696 D | |||
| Current U.S. Class: | D13/182; D13/199 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/182,180 ;D19/69,67 ;D24/189 |
References Cited [Referenced By]
U.S. Patent Documents
| 2080052 | May 1937 | Lemaster |
| 2082546 | June 1937 | Machate |
| 2229961 | January 1941 | Deane |
| 2414333 | January 1947 | Schieman |
| 2626666 | January 1953 | Coldiron |
| 2694533 | November 1954 | Zucker |
| 2699251 | January 1955 | Rizza |
| 3001306 | September 1961 | Wilkinson |
| 3187968 | June 1965 | Favre |
| 3216634 | November 1965 | Lausa |
| 3237174 | February 1966 | Di Matteo |
| 4983932 | January 1991 | Kitagawa |
| 5258888 | November 1993 | Korinsky |
| D433061 | October 2000 | Shen |
| D571859 | June 2008 | Harmston |
| 7669631 | March 2010 | Bailey |
| D621051 | August 2010 | Kase |
| D621803 | August 2010 | Maruyama |
| D656909 | April 2012 | Taniguchi |
| D656910 | April 2012 | Taniguchi |
| D664511 | July 2012 | Taniguchi |
| D664512 | July 2012 | Taniguchi |
| D680505 | April 2013 | Taniguchi |
| D689831 | September 2013 | Taniguchi |
| D690278 | September 2013 | Taniguchi |
| D741406 | October 2015 | Doucette |
| D804435 | December 2017 | Taniguchi |
| D847258 | April 2019 | Kang |
| 2007/0241436 | October 2007 | Ookubo |
| 2010/0080989 | April 2010 | Asai |
Other References
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"Establishing . . . " reference dated Sep. 13, 2018 found by RMS on the internet at: https://www.mc.showadenko.com/english/information/2018/n_180913uo3.html. cited by examiner . "RD Series . . . " reference dated Nov. 6, 2021 found by RMS on the internet at: https://www.mc.showadenko.com/english/products/pm/015.html. cited by examiner . "Disposal . . . " reference dated Nov. 6, 2021 found by RMS on the internet at: https://www.pvawatersolublefilm.com/sale-11363692-disposable-high-tempera- ture-water-soluble-plastic-film-for-mold-release.html. cited by examiner . "Back-grinding tape with heat resistance is for special heating process after wafer grinding", Nov. 6, 2021 (cited in an office action dated Nov. 9, 2021 in Design U.S. Appl. No. 35/512,766). cited by applicant. |
Primary Examiner: Shields; Rhea
Attorney, Agent or Firm: Fitch, Even, Tabin & Flannery, LLP
Description
1. Temporary protective film for manufacturing semiconductor devices
1.1 : Perspective
1.2 : Perspective
1.3 : Front
1.4 : Back
1.5 : Top
1.6 : Bottom
1.7 : Left
1.8 : Right
1.9 : A-A Sectional view
The article includes a core part and a film part, and is shown with the width of the core part as smaller than the width of the film part, and the film part is wound while partially protruding from the core part; this article is temporarily attached to a back of a lead frame when manufacturing a semiconductor device with only one side encapsulated and the lead frame on the back side exposed; the film part of this article has an adhesive layer on one side; since the core part does not protrude from the film part, this article can be easily positioned when set to equipment for manufacturing semiconductor devices, and it is possible to prevent this article from being misaligned when it is temporarily adhered to the back surface of the lead frame; reproduction 1.9 is a cross-sectional view taken along the line A-A of reproduction 1.7; the parts shown with solid lines in the drawings are parts for which a partial design registration is sought; the broken lines shown in the drawings are for the purpose of illustrating portions of the article that form no part of the claimed design; the parallel thin lines in the representation represent contours only and do not illustrate an ornamentation or decoration on the surface of the product.
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References
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