TOMORI; Naoki

Patent Applications and Registrations

Patent applications and USPTO patent grants for TOMORI; Naoki.The latest application filed is for "temporary protective film, reel body, packaging body, package body, temporary protective body, and method for producing semiconductor device".

Company Profile

3.9.9

TOMORI; Naoki - Chiyoda-ku Tokyo
Tomori; Naoki - Tokyo JP
Tomori; Naoki - Ichihara N/A JP
TOMORI; Naoki - Ichihara-shi JP
Tomori; Naoki - Chiba JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Temporary Protective Film, Reel Body, Packaging Body, Package Body, Temporary Protective Body, And Method For Producing Semiconductor Device App 20220285200 - KURODA; Takahiro ; et al.	2022-09-08
Temporary protective film for manufacturing semiconductor devices Grant D962,882 - Tomori September 6, 2	2022-09-06
Temporary protective film for manufacturing semiconductor devices Grant D962,883 - Tomori September 6, 2	2022-09-06
Temporary protective film for manufacturing semiconductor devices Grant D946,540 - Tomori March 22, 2	2022-03-22
Temporary protective film for semiconductor encapsulation molding, lead frame provided with temporary protective film, encapsulated molded body provided with temporary protective film, and method for manufacturing semiconductor device Grant 11,251,055 - Kuroda , et al. February 15, 2	2022-02-15
Temporary Protective Film For Semiconductor Encapsulation Molding, Lead Frame Provided With Temporary Protective Film, Encapsulated Molded Body Provided With Temporary Protective Film, And Method For Manufacturing Semiconductor Device App 20220020606 - KURODA; Takahiro ; et al.	2022-01-20
Temporary Protective Film For Producing Semiconductor Device, Reel Body, And Method For Producing Semiconductor Device App 20210395577 - KURODA; Takahiro ; et al.	2021-12-23
Temporary protective film for semiconductor sealing molding Grant 11,195,728 - Tomori , et al. December 7, 2	2021-12-07
Temporary Protective Film For Semiconductor Sealing Molding, Lead Frame With Temporary Protective Film, Sealed Molded Bodywith Temporary Protective Film, And Method For Producingsemiconductor Device App 20210050274 - TOMORI; Naoki ; et al.	2021-02-18
Temporary Protective Film For Semiconductor Encapsulationmolding, Lead Frame Provided With Temporary Protective Film, Encapsulated Molded Body Provided With Temporary Protectivefilm, And Method For Manufacturing Semiconductor Device App 20210020460 - KURODA; Takahiro ; et al.	2021-01-21
Temporary Protective Film For Semiconductor Sealing Molding App 20200118841 - TOMORI; Naoki ; et al.	2020-04-16
Sealing film and a semiconductor device using the same Grant 8,771,828 - Kawakami , et al. July 8, 2	2014-07-08
Sealing film and a semiconductor device using the same Grant 8,715,454 - Kawakami , et al. May 6, 2	2014-05-06
Sealing Film And A Semiconductor Device Using The Same App 20130093105 - KAWAKAMI; Hiroyuki ; et al.	2013-04-18
Sealing Film and a Semiconductor Device Using the Same App 20090189300 - Kawakami; Hiroyuki ; et al.	2009-07-30

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