Power module device containing semiconductor elements
Umeda , et al. June 1, 2
U.S. patent number D920,937 [Application Number 35/508,564] was granted by the patent office on 2021-06-01 for power module device containing semiconductor elements. This patent grant is currently assigned to SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.. The grantee listed for this patent is SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.. Invention is credited to Atsushi Kyutoku, Soichiro Umeda.
| United States Patent | D920,937 |
| Umeda , et al. | June 1, 2021 |
Power module device containing semiconductor elements
Claims
CLAIM The ornamental design for a power module device containing semiconductor elements, as shown and described.
| Inventors: | Umeda; Soichiro (Saitama, JP), Kyutoku; Atsushi (Saitama, JP) | ||||||||||
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| Applicant: |
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| Assignee: | SHINDENGEN ELECTRIC MANUFACTURING
CO., LTD. (Tokyo, JP) |
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| Appl. No.: | 35/508,564 | ||||||||||
| Filed: | March 29, 2019 |
International Registration
| Int'l Reg. No. | Int'l Reg. Date | Int'l Reg. Publication Date |
Hague Int'l Filing Date |
|---|---|---|---|
| DM/205733 | Mar 29, 2019 | Feb 14, 2020 | Mar 29, 2019 |
| Current U.S. Class: | D13/182 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/182 |
References Cited [Referenced By]
U.S. Patent Documents
| 10103096 | October 2018 | Kamiyama |
| D847104 | April 2019 | Sawada |
| 10276466 | April 2019 | Sasaki |
| D853978 | July 2019 | Auer |
| D858467 | September 2019 | Sawada |
| D864132 | October 2019 | Sawada |
| D864884 | October 2019 | Yoneyama |
| D873227 | January 2020 | Yoneyama |
| D875058 | February 2020 | Sawada |
| 10615092 | April 2020 | Umeda |
| D883240 | May 2020 | Fathauer |
| D883241 | May 2020 | Beckedahl |
| D886072 | June 2020 | MacDonald |
| D887999 | June 2020 | Chen |
| D888673 | June 2020 | Furutani |
| D889423 | July 2020 | Beckedahl |
| D892754 | August 2020 | Beckedahl |
| 10770439 | September 2020 | Yuguchi |
| 10818496 | October 2020 | Arai |
| D900759 | November 2020 | Majima |
| 10832994 | November 2020 | Kamiyama |
| D903611 | December 2020 | Sannai |
| D903612 | December 2020 | Soyano |
| D903613 | December 2020 | Furutani |
| D904325 | December 2020 | Omichi |
| D904991 | December 2020 | Aoki |
| 2018/0367054 | December 2018 | Morinaga |
Attorney, Agent or Firm: Hauptman Ham, LLP
Description
1. Power module device containing semiconductor elements
1.1 : Front
1.2 : Back
1.3 : Top
1.4 : Bottom
1.5 : Right
1.6 : Left
1.7 : Perspective
The broken lines showing portions of the power module device containing semiconductor elements form no part of the claim.
This article is a power module device containing semiconductor elements; this product is used to control and/or supply electric power.
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