Semiconductor module

Kanda , et al. Ja

Patent Grant D873226

U.S. patent number D873,226 [Application Number D/666,187] was granted by the patent office on 2020-01-21 for semiconductor module. This patent grant is currently assigned to ROHM CO., LTD.. The grantee listed for this patent is ROHM CO., LTD.. Invention is credited to Masashi Hayashiguchi, Takumi Kanda.


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United States Patent D873,226
Kanda ,   et al. January 21, 2020

Semiconductor module

Claims

CLAIM The ornamental design for a semiconductor module, as shown and described.
Inventors: Kanda; Takumi (Kyoto, JP), Hayashiguchi; Masashi (Kyoto, JP)
Applicant:
Name City State Country Type

ROHM CO., LTD.

Kyoto-shi, Kyoto

N/A

JP
Assignee: ROHM CO., LTD. (Kyoto, JP)
Appl. No.: D/666,187
Filed: October 10, 2018

Foreign Application Priority Data

Apr 13, 2018 [JP] 2018-008228
Apr 13, 2018 [JP] 2018-008232
Current U.S. Class: D13/182
Current International Class: 1303
Field of Search: ;D13/182

References Cited [Referenced By]

U.S. Patent Documents
D394244 May 1998 Majumdar
D401912 December 1998 Majumdar
D448739 October 2001 Iwasaki
D505399 May 2005 Yoshida
D606951 December 2009 Soyano
D705184 May 2014 Takahashi
D717253 November 2014 Jo
D717254 November 2014 Jo
D717255 November 2014 Lim
D717256 November 2014 Sohn
D719113 December 2014 Sohn
D719537 December 2014 Kawase
D719926 December 2014 Sohn
Foreign Patent Documents
1145764 Jul 2002 JP
1146361 Jul 2002 JP
1146362 Jul 2002 JP
1146363 Jul 2002 JP
1305812 Jul 2007 JP
1551590 Jun 2016 JP
1565636 Dec 2016 JP
1578687 Jun 2017 JP
Primary Examiner: Davis; Antoine Duval
Attorney, Agent or Firm: Hamre, Schumann, Mueller & Larson, P.C.

Description



FIG. 1 is a front, top and right side perspective view of a first embodiment of a semiconductor module showing our new design;

FIG. 2 is a rear, bottom, and left side perspective view thereof;

FIG. 3 is a front view, the rear view being identical to FIG. 3;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a right side view thereof;

FIG. 7 is a left side view thereof;

FIG. 8 is a cross-sectional view taken along line 8-8 in FIG. 4;

FIG. 9 is a cross-sectional view taken along line 9-9 in FIG. 4;

FIG. 10 is a front, top and right side perspective view of a second embodiment of a semiconductor module showing our new design;

FIG. 11 is a rear, bottom, and left side perspective view thereof;

FIG. 12 is a front view, the rear view being identical to FIG. 12;

FIG. 13 is a top plan view thereof;

FIG. 14 is a bottom plan view thereof;

FIG. 15 is a right side view thereof;

FIG. 16 is a left side view thereof;

FIG. 17 is a cross-sectional view taken along line 17-17 in FIG. 13; and,

FIG. 18 is a cross-sectional view taken along line 18-18 in FIG. 13.

The member illustrated with fine, diagonal, parallel lines in FIG. 2 and FIG. 5 is translucent.

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