U.S. patent number D873,226 [Application Number D/666,187] was granted by the patent office on 2020-01-21 for semiconductor module.
This patent grant is currently assigned to ROHM CO., LTD.. The grantee listed for this patent is ROHM CO., LTD.. Invention is credited to Masashi Hayashiguchi, Takumi Kanda.
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United States Patent |
D873,226 |
Kanda , et al. |
January 21, 2020 |
Semiconductor module
Claims
CLAIM The ornamental design for a semiconductor module, as shown
and described.
Inventors: |
Kanda; Takumi (Kyoto,
JP), Hayashiguchi; Masashi (Kyoto, JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
ROHM CO., LTD. |
Kyoto-shi, Kyoto |
N/A |
JP |
|
|
Assignee: |
ROHM CO., LTD. (Kyoto,
JP)
|
Appl.
No.: |
D/666,187 |
Filed: |
October 10, 2018 |
Foreign Application Priority Data
|
|
|
|
|
Apr 13, 2018 [JP] |
|
|
2018-008228 |
Apr 13, 2018 [JP] |
|
|
2018-008232 |
|
Current U.S.
Class: |
D13/182 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/182 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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1145764 |
|
Jul 2002 |
|
JP |
|
1146361 |
|
Jul 2002 |
|
JP |
|
1146362 |
|
Jul 2002 |
|
JP |
|
1146363 |
|
Jul 2002 |
|
JP |
|
1305812 |
|
Jul 2007 |
|
JP |
|
1551590 |
|
Jun 2016 |
|
JP |
|
1565636 |
|
Dec 2016 |
|
JP |
|
1578687 |
|
Jun 2017 |
|
JP |
|
Primary Examiner: Davis; Antoine Duval
Attorney, Agent or Firm: Hamre, Schumann, Mueller &
Larson, P.C.
Description
FIG. 1 is a front, top and right side perspective view of a first
embodiment of a semiconductor module showing our new design;
FIG. 2 is a rear, bottom, and left side perspective view
thereof;
FIG. 3 is a front view, the rear view being identical to FIG.
3;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a right side view thereof;
FIG. 7 is a left side view thereof;
FIG. 8 is a cross-sectional view taken along line 8-8 in FIG.
4;
FIG. 9 is a cross-sectional view taken along line 9-9 in FIG.
4;
FIG. 10 is a front, top and right side perspective view of a second
embodiment of a semiconductor module showing our new design;
FIG. 11 is a rear, bottom, and left side perspective view
thereof;
FIG. 12 is a front view, the rear view being identical to FIG.
12;
FIG. 13 is a top plan view thereof;
FIG. 14 is a bottom plan view thereof;
FIG. 15 is a right side view thereof;
FIG. 16 is a left side view thereof;
FIG. 17 is a cross-sectional view taken along line 17-17 in FIG.
13; and,
FIG. 18 is a cross-sectional view taken along line 18-18 in FIG.
13.
The member illustrated with fine, diagonal, parallel lines in FIG.
2 and FIG. 5 is translucent.
* * * * *