Peripheral component interconnect card panel

Description

FIG. 1 is a right, front, top perspective view of a peripheral component interconnect card panel.

FIG. 2 is a top view of the PCI card panel of FIG. 1.

FIG. 3 is a bottom view of the PCI card panel of FIG. 1.

FIG. 4 is an enlarged front view of the PCI card panel of FIG. 1.

FIG. 5 is an enlarged rear view of the PCI card panel of FIG. 1.

FIG. 6 is a left side view of the PCI card panel of FIG. 1; and,

FIG. 7 is a right side view of the PCI card panel of FIG. 1.

The broken lines in the drawings depict portions of the PCI card panel that form no part of the claimed design.

Claims

CLAIM The ornamental design for a peripheral component interconnect card panel, as shown and described in FIGS. 1-7.

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Inventors:	Morgan; Wesley Brook (Olympia, WA), Magi; Aleksander (Portland, OR), Kong; Duck Young (Beaverton, OR), Hyde; Michael (San Francisco, CA)
Applicant:	Name City State Country Type Intel Corporation Santa Clara CA US
Assignee:	Intel Corporation (Santa Clara, CA)
Appl. No.:	D/633,235
Filed:	January 12, 2018

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Current U.S. Class:	D14/436
Current International Class:	1402
Field of Search:	;D14/356,357,358,432,433,434,435,435.1,436,437,300,301,313,257,388,454 ;D13/123,133,139.1,139.3,139.4,154,173,184 ;D8/349,364,366,381,404,499 ;D25/35,55,58,60

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References Cited [Referenced By]

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Primary Examiner: Fast Horse; Marie D.
Attorney, Agent or Firm: Hanley, Flight and Zimmerman, LLC

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