Processor package cover plate
Klinker August 24, 1
U.S. patent number D413,109 [Application Number D/062,471] was granted by the patent office on 1999-08-24 for processor package cover plate. This patent grant is currently assigned to Intel Corporation. Invention is credited to Thomas S. Klinker.
| United States Patent | D413,109 |
| Klinker | August 24, 1999 |
Processor package cover plate
Claims
The ornamental design for a processor package cover plate, as shown and described.
| Inventors: | Klinker; Thomas S. (San Francisco, CA) |
|---|---|
| Assignee: | Intel Corporation (Santa Clara,
CA) |
| Appl. No.: | D/062,471 |
| Filed: | November 15, 1996 |
| Current U.S. Class: | D14/432 |
| Current International Class: | 1402 |
| Field of Search: | ;D14/114,115,117,120 ;D13/182 ;D18/12 ;206/706,709 ;340/825.22 ;235/492 ;361/816,753,737,424 ;257/678 ;364/200,239.3,401.479,578 ;370/364 ;379/269,279,399 ;380/23,24 ;395/310,376,393,325,652,670,672,675,568,800 ;455/3.1 |
References Cited [Referenced By]
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Attorney, Agent or Firm: Blakely, Sokoloff, Taylor & Zafman
Description
FIG. 1 is a perspective view of a processor package cover plate on a processor package including an indented area on the surface of the processor package cover plate;
FIG. 2-4 are front, top, and back views, respectively, of the processor package cover plate on the processor package;
FIG. 5-7 are right, left, and bottom views, respectively, of the processor package cover plate on the processor package; and,
FIG. 8 is a cross sectional view of the processor package cover plate on the processor package taken along line 8--8 of FIG. 2.
The processor package is shown in broken lines in the views for illustrative purposes only and forms no part of the claimed design.
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