IC memory card

Yamada , et al. October 25, 2

Patent Grant D510935

U.S. patent number D510,935 [Application Number D/208,276] was granted by the patent office on 2005-10-25 for ic memory card. This patent grant is currently assigned to Kabushiki Kaisha Toshiba, Matsushita Electric Industrial Co., Ltd., SanDisk Corporation. Invention is credited to Robert Miller, Yutaka Nakamura, Hiroyuki Sakamoto, Hem Takiar, Hiroyuki Yamada.


United States Patent D510,935
Yamada ,   et al. October 25, 2005

IC memory card

Claims

The ornamental design for an IC memory card, a shown and described.
Inventors: Yamada; Hiroyuki (Hirakata, JP), Nakamura; Yutaka (Kyoto, JP), Sakamoto; Hiroyuki (Oume, JP), Takiar; Hem (Fremont, CA), Miller; Robert (San Jose, CA)
Assignee: Matsushita Electric Industrial Co., Ltd. (Osaka, JP)
Kabushiki Kaisha Toshiba (Tokyo, JP)
SanDisk Corporation (Sunnyvale, CA)
Appl. No.: D/208,276
Filed: June 24, 2004

Related U.S. Patent Documents

Application Number Filing Date Patent Number Issue Date
169127 Oct 15, 2002

Current U.S. Class: D14/436
Current International Class: 1402
Field of Search: ;D14/135-8,478-80 ;361/736-7,686,752 ;257/678-9 ;40/124.01 ;283/75-6,901 ;235/487-95,441-3,375 ;439/135,140,76.1 ;D8/347

References Cited [Referenced By]

U.S. Patent Documents
D444473 July 2001 Okamoto et al.
D445111 July 2001 Okamoto et al.
D446525 August 2001 Okamoto et al.
D452243 December 2001 Wallace
D453934 February 2002 Wallace et al.
D457887 May 2002 Kadonaga
D467586 December 2002 Shimoda et al.
D475056 May 2003 Taniguchi et al.
D476011 June 2003 Taniguchi et al.
Primary Examiner: Tung; M. H.
Attorney, Agent or Firm: Brinks Hofer Gilson & Lione

Description



FIG. 1 is a perspective view of a first embodiment of an IC memory card showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof

FIG. 8 is a cross sectional view along line 8--8 of FIG. 2;

FIG. 9 is a cross sectional view along line 9--9 of FIG. 2;

FIG. 10 is a perspective view of a second embodiment of an IC memory card showing our new design;

FIG. 11 is a front elevational view thereof;

FIG. 12 is a rear elevational view thereof;

FIG. 13 is a left side view thereof;

FIG. 14 is a right side view thereof;

FIG. 15 is a top plan view thereof;

FIG. 16 is a bottom plan view thereof;

FIG. 17 is a cross sectional view along line 17--17 of FIG. 11; and,

FIG. 18 is a cross sectional view along line 18--18 of FIG. 11.

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